580 results about "Conductive paste" patented technology

The invention discloses multi-solvent synergistically activated low-temperature semi-sintered copper paste and a preparation method and application thereof, and belongs to the technical field of conductive paste. The multi-solvent synergistically activated low-temperature semi-sintered copper slurry comprises the following raw material components in percentage by mass: 82-88% of conductive filler, 2-3% of a resin carrier, 4-7% of an activating solvent, 4-7% of a dispersing solvent and 2-3% of a curing agent. Through cooperation of multiple solvents, full-stage activation of the copper particles is achieved, pre-connection and sintering of the copper particles before resin is completely crosslinked and cured are promoted, densification of the overall structure is improved, the insulation barrier effect of the resin is effectively avoided, the resistivity is reduced, meanwhile, inhibition of the resin on sintering of the copper particles is solved, and the service life of the copper particles is prolonged. And good balance between conductivity and interface adhesion is realized. Through resin curing, chemical bonding between the slurry and the substrate can be enhanced, a metal bond network among copper particles is expanded, and mechanical connection stability and electrical performance are guaranteed.

The invention relates to a conductive paste for a multiphase alloying photovoltaic cell, a preparation method and application thereof, and belongs to the technical field of photovoltaic device manufacturing, and the conductive paste comprises the following components by mass: 25-35% of silver-coated copper powder, 10-20% of silver-coated copper powder, 10-20% of copper powder, and 10-20% of copper powder. 45%-55% of composite tin alloy powder; 10%-20% of an organic carrier; the composite tin alloy powder is composed of at least two kinds of tin alloy powder with different melting points; in the sintering and curing process of the conductive paste, metallurgical bonding is formed between the silver-coated copper powder through gradient melting of the tin alloy powder with the different melting points. Silver-coated copper powder is adopted to replace pure silver to serve as a conductive main framework, and a large amount of tin alloy is combined to serve as a connecting base body. The low-cost advantage of the copper core and the excellent conductivity of the silver shell are utilized, so that the cost of the paste is greatly reduced, and meanwhile, the excellent electrical property is ensured.

The invention discloses high-conductivity low-temperature sintering composite copper paste and a preparation method and application thereof, and belongs to the technical field of conductive paste. The composite copper paste consists of the following components in percentage by mass: 70-90% of a conductive phase, 2-10% of a binding phase and the balance of an organic carrier. Wherein the conductive phase comprises cuprous hydride modified copper powder and a copper complex; the copper complex is formed by a copper compound and an organic ligand through a coordination reaction. The copper paste can be sintered to form an electrode or a circuit in a nitrogen atmosphere at a temperature of less than or equal to 300 DEG C, and has the advantages of low resistivity, good oxidation resistance, strong adhesion and the like, and the cost of the copper paste is obviously lower than that of silver paste. The invention also provides a preparation method of the composite copper paste and an application of the composite copper paste in preparation of an electronic component electrode or a conductive circuit.

The present invention discloses a tellurium-lead-lithium oxide glass powder for BC cell N-region conductive paste and its preparation method, belonging to the field of photovoltaic silver paste. The glass powder adopts components with high Pb, Te, and Li: aTeO2 - bPbO - cLi2O - dBi2O3 - eWO3 - fZnO - gSiO2 - hNa2O; where a + b + c + d + e + f + g + h = 1, 0.2 < a < 0.4, 0.1 < b < 0.4, 0.1 < c < 0.25, 0 < d < 0.1, 0 < e < 0.1, 0 < f < 0.1, 0 < g < 0.1, 0 < h < 0.05, and a + b > 0.5, and the ratio of c to h is (3 - 10):1. By controlling the specific Pb, Te, and Li contents and the specific Li / Na ratio in the present invention, a strong corrosion effect on the poly layer of the cell is achieved, enabling more silver ions dissolved in the glass liquid to recrystallize on the surface of the silicon wafer, thereby achieving good ohmic contact.

The invention discloses low-temperature anti-oxidation conductive copper paste, a preparation method and an RFID tag, and relates to the field of conductive paste. The modified copper powder comprises: copper powder; the cysteamine self-assembly molecular layer is formed by coupling sulfydryl of cysteamine with the surface of the copper powder; the metal phthalocyanine complex molecular layer is coordinated with central metal ions of metal phthalocyanine molecules through amino groups of cysteamine and is connected to the surface of the cysteamine self-assembled molecular layer; and the conductive copper paste is sintered at 140-170 DEG C. According to the low-temperature curing conductive copper paste, the problem of anti-oxidation defects of the copper powder can be effectively solved while the conductivity of the copper powder is ensured, and the low-temperature curing conductive copper paste with long-acting anti-oxidation performance and high conductivity is obtained.

The invention discloses a compensation printing method for resistance deviation of a vehicle-mounted optical glass printing heating wire, and relates to the technical field of functional material printing. On one hand, a prediction model based on individual physical characteristics of a vehicle-mounted optical glass substrate and conductive slurry is constructed before printing; according to the method, most printing deviation can be predicted and inhibited from the source, traditional passive error correction is converted into active prevention, the consistency and the qualified rate of resistance values of final products are improved, on one hand, actual measurement data of the final products are fed back to an initial prediction model for calibration, and on the other hand, the accuracy of the final products is improved; the whole printing method can be continuously optimized along with production, the adaptability to material batch fluctuation, environment change and small aging of equipment is enhanced, the dependence on artificial experience is reduced, the long-term stability of product quality is guaranteed, and on the other hand, through innovative combination of physical pre-compensation and energy fine adjustment, the production efficiency is improved. And a cooperative compensation effect is shown.

The invention provides an electrode grid line and a preparation method thereof and conductive slurry, the electrode grid line comprises a seed layer and a base metal layer superposed on the upper layer of the seed layer, the base metal proportion in the conductive phase of the base metal layer is greater than 68%, the seed layer comprises a main grid and a seed layer fine grid, the base metal layer comprises base metal layer fine grids electrically connected with the seed layer fine grids in a one-to-one correspondence mode, at least one of the seed layer fine grids and the base metal layer fine grids is further provided with a plurality of contact pins, and the contact pins are distributed in the length direction of the corresponding fine grids at intervals. And the width of the contact pin in the line width direction of the fine grid is greater than the line width of the fine grid. The electrode grid line with the preset height is formed in a grid stacking mode, base metal is utilized by the base metal layer, the overall silver consumption amount of the electrode grid line is effectively reduced, the part, exceeding the width of the thin grid line where the contact pin is located, of the contact pin arranged on the thin grid line can be used for compensating printing precision deviation, the precision requirement for printing operation is reduced, and the contact performance is improved.

The invention provides high-stability double-layer core-shell coated pure copper silver-substituted conductive paste and a preparation method thereof, and belongs to the technical field of electronic special materials. The copper-resistant coating comprises the following components in percentage by mass: 82%-90% of antioxidant copper powder with a double-layer core-shell structure, 3%-6% of bismuth-boron-zinc lead-free low-melting-point glass powder, 3%-7% of a modified epoxy resin compound organic carrier, 2%-5% of a gradient volatilization compound solvent and 0.5%-2% of a special compound additive for copper. Through the double-layer core-shell copper powder design of inner-layer nano-silver passivation and outer-layer organic composite coating and in cooperation with a liquid-phase synergistic anti-oxidation system, the volume resistivity after slurry curing is smaller than or equal to 3.5 * 10 <-5 > omega.cm, the resistivity change rate after 1000-hour damp-heat aging at 85 DEG C / 85% RH is smaller than or equal to 10%, the normal-temperature storage period without opening a tank is larger than or equal to 6 months, direct curing can be conducted in the conventional air atmosphere of 120-160 DEG C, and the high-temperature-resistant copper paste can be applied to the field of high-temperature storage. The silver paste is completely compatible with production and application production lines of existing silver paste, equipment transformation is not needed, the comprehensive cost is reduced by more than 80% compared with pure silver paste, and the silver paste can be widely applied to the fields of PCBs, membrane switches, flexible electronics, photovoltaic back electrodes, LED packaging and the like.

The invention relates to the technical field of flexible electronic sensors, in particular to a large-strain interdigital capacitive sensor based on liquid metal conductive paste, which comprises a flexible substrate, and the flexible substrate comprises a bottom packaging layer and a top packaging layer integrally connected to the upper surface of the bottom packaging layer. A liquid metal interdigital electrode is embedded between the bottom packaging layer and the top packaging layer, the liquid metal interdigital electrode is formed after liquid metal conductive paste is subjected to laser ablation patterning, the end of the liquid metal interdigital electrode is connected with a flexible wire, and one end of the flexible wire extends to the outside of the flexible substrate; the liquid metal conductive slurry is paste conductive slurry which is rich in oxide and is formed by mechanically stirring and oxidizing liquid metal; the liquid metal is gallium-based liquid metal; the problems that an existing flexible strain sensor cannot meet the large strain measurement requirement and is poor in stability and complex in preparation process are solved.

The invention relates to conductive paste and a preparation method thereof, a solar cell and a preparation method thereof, and a photovoltaic module. The conductive paste comprises 82%-88% of metal powder, 1%-5% of glass powder, 8%-15% of an organic carrier, 0.5%-3% of a wave-absorbing material and 0.1%-1% of a polymer pore-forming agent, and the wave-absorbing material can absorb laser and release heat. During laser-assisted sintering treatment, the wave-absorbing material can efficiently absorb laser energy and instantly release heat, so that the surrounding polymer pore-forming agent is quickly gasified. After the polymer pore-forming agent is gasified, a cavity structure is formed in the conductive slurry, a multi-reflection cavity of light is formed, laser which is subsequently transmitted in is reflected for multiple times in the cavity, a light path is prolonged, and the absorption rate of laser energy is greatly improved. Due to the high absorptivity of the laser, the laser power required by good ohmic contact is formed, the energy consumption is reduced, and the damage to the surface of the battery is reduced.

The invention relates to the technical field of electronic paste, and provides conductive paste and a preparation method thereof. The conductive paste comprises the following components in parts by weight: 60-85 parts of copper powder, 0.1-5 parts of a photothermal conversion aid, 0.5-3 parts of a ligand dispersant, 0.1-2 parts of an antioxidant aid and 10.5-28 parts of an organic carrier. According to the conductive paste provided by the invention, the copper powder is used as a conductive phase, and a conductive network is constructed after sintering; the photothermal conversion auxiliary agent can efficiently absorb light energy and convert the light energy into heat energy, sintering conditions are reduced, and the slurry is compatible with a flexible substrate; the ligand dispersant improves the dispersibility of each component and assists in obtaining a uniform and stable conductive film layer; the antioxidant additive forms a protective layer on the surface of the copper powder, dynamic antioxidant protection is provided, and air sintering is achieved; the slurry is endowed with good rheological property by the organic carrier, and uniform film formation is facilitated. Therefore, under the synergism of all the components, high-efficiency sintering can be performed in a low-temperature and air environment, and a copper-based film layer with high compactness, high conductivity and high stability is obtained.

The invention discloses graphene-copper composite conductive paste and a preparation method and application thereof. The paste comprises graphene coated copper composite powder, a low-melting-point alloy bonding agent, functional glass powder and an organic carrier. Wherein the graphene coated copper composite powder is prepared by growing few layers of graphene in situ on the surface of copper powder through a chemical vapor deposition method, and a core-shell enhanced conductive unit is formed. According to the invention, the complete replacement of copper to silver (the silver content is 1t, 1%) in a photovoltaic electrode material is realized for the first time, meanwhile, the performance loss of a pure copper system is made up through the enhancement effect of graphene, and the photoelectric conversion efficiency reaches 97% or more of that of commercial silver paste on the basis that the material cost is reduced to 1 / 60 of that of the silver paste. The slurry is suitable for electrode preparation of various efficient photovoltaic cells such as HJT, TOPCon and perovskite, and has remarkable economic benefits and strategic significance.

The invention provides a battery piece, a preparation method of the battery piece and a photovoltaic module, and the preparation method of the battery piece comprises the following steps: providing a semiconductor substrate which is provided with a first surface and a second surface which are opposite to each other; providing conductive slurry, coating the first surface and / or the second surface of the semiconductor substrate with the conductive slurry, and sintering to form an electrode; wherein the conductive paste comprises the following components in percentage by mass: 85%-92% of conductive powder, 2%-4% of glass powder and the balance of an organic carrier; the conductive powder comprises metal powder and at least one coating layer distributed on the surface of the metal powder, and the coating layer comprises an organic silicon material layer. The first surface and / or the second surface of the semiconductor substrate are / is coated with the conductive slurry, and the conductive slurry is sintered to form the electrode. High printing performance and electrical performance can be kept, the line width of the electrode is smaller than or equal to 25 micrometers, and the series resistance of the cell is controlled to be 1.0 m omega.cm < 2 > or below.

The application provides a wearable portable hairband for mental fatigue detection and intervention, a flexible conductive polymer dry electrode is embedded in the inner side of the hairband, the dry electrode is attached to the scalp through mechanical pressure, and thus inductive collection is realized without conductive paste; the output end of the dry electrode collection signal is directly connected to a collection front end located at the side edge of the hairband through FPC, the front end is integrated with an amplifier and an analog-to-digital converter, weak electrical signals on the cerebral cortex are amplified and converted into a data format; a SoC chip is selected as a processor to build a full-integrated edge computing platform inside the flexible fabric hairband, and the calculation task of mental fatigue detection is sunk to the hairband end; an ultrathin bone conduction unit is used as an acoustic output component, which is connected through a flexible circuit and embedded in the inner side of the hairband corresponding to the anatomical site of the user's temple, when the mental fatigue detection result triggers the fatigue warning threshold, a binaural rhythm intervention module is activated to perform binaural rhythm intervention. The application can perform mental fatigue detection and intervention.

To increase the density of metal in the repaired area. [Solution] The repair device is a device for repairing defects 94 in a pattern 93 formed on the upper surface 91 of a substrate 9. The substrate holding part holds the substrate 9 on which the pattern 93 is formed on the upper surface 91. The application part 32 applies droplet-shaped conductive paste to the defects 94 in the pattern 93. The hardening part 33 hardens the conductive paste by heating and drying it. The compression part 34 presses the hardened conductive paste toward the substrate 9 while heating it. This makes it possible to increase the density of metal in the repair part provided to fill the defects 94.

The application relates to the technical field of battery piece manufacturing, and particularly discloses a battery piece curing device. The battery piece curing device comprises a bearing device used for bearing a battery piece printed with conductive paste; a curing device used for pressing the battery piece and simultaneously heating the conductive paste on the battery piece; and a cooling device used for cooling the battery piece processed by the curing device. In the application, the curing device presses the battery piece to tightly contact with the conductive paste on the battery piece, so that the conductive paste is isolated from oxygen in the air, and the curing device directly heats the conductive paste while pressing the battery piece, thereby improving the sintering speed of the conductive paste, and the formed grid line can effectively avoid oxidation. After the conductive paste is cured, the grid line formed by curing is cooled, so that the grid line is prevented from reacting with oxygen in the air under high temperature, the appearance of the oxidation layer on the grid line is reduced, and the conductive performance of the grid line is further ensured.

A manufacturing method of a rigid-flex printed circuit board for a visual perception module comprises the following steps: manufacturing a flexible board layer with a conducting bonding pad on one side, and manufacturing a conductive prepreg filled with conductive slurry at a position corresponding to a buried hole; manufacturing a first laminated board, manufacturing a resin plug via hole at a position corresponding to the buried hole, and manufacturing a circuit pattern to form a first core board; a second semi-solidified layer and a second copper foil are taken, and the plates are sequentially stacked and laminated for the second time to form a second laminated plate; wherein the conduction bonding pad is adjacent to one end of the corresponding conductive hole, and the other end of the conductive hole is adjacent to the corresponding resin plug hole conduction hole, so that a buried hole in conduction connection is formed; manufacturing a via hole in the second laminated plate, and performing post-process processing to form the rigid-flex printed circuit board; the manufacturing of the buried holes is divided into three parts, and the buried holes connected through conduction are formed through stacking and pressing, so that the problems of polishing rupture, overlarge or non-uniform expansion and contraction and the like generated in the polishing process of the flexible layer are effectively avoided.

The invention relates to a novel substrate designed for a packaging redistribution layer in a semiconductor device and an innovative manufacturing method thereof. The substrate aims to improve electrical and heat dissipation performance in a semiconductor package by using materials such as glass, ceramic or high-temperature polymer, so as to achieve an effect of improving heat management. One characteristic of the invention is that the redistribution layer comprises the arc angle, so that smooth transition between redistribution lines is promoted, and the filling resistance of the conductive material is effectively reduced. The redistribution layer is filled with conductive adhesive, such as copper or silver adhesive, into channels formed by selective laser etching or a 3D line printing technology. The method of manufacturing the printed circuit board ensures accurate formation of the conductive vias having arcuate angles, and involves a subsequent annealing step to cure the conductive adhesive.

The invention discloses a method for industrially producing a micro-particle conductive aggregate. The method comprises the following steps: pretreating glass beads to obtain a micron-sized rough surface; preparing conductive paste containing large-particle graphene and water-based acrylic resin; at least three continuous spraying fluidized beds which are connected in series are adopted, and the surfaces of the microbeads are coated with bonding layers, conductive layers and protective layers in sequence; and finally, continuous curing and screening are carried out. According to the method, efficient, continuous and large-scale production of the conductive aggregate is achieved, and the problems that graphene is prone to agglomeration and uneven in dispersion and the coating binding force of a traditional process is poor are effectively solved. The obtained conductive aggregate is excellent in conductivity, good in solvent resistance, high in adhesive force and suitable for the fields of anti-static mortar, resin self-leveling materials, coatings and the like.

The invention belongs to the field of conductive material modification, and particularly relates to a modified composition for modifying nano conductive particles, which comprises a component A and a component B, wherein the component A comprises at least one compound with a structure as shown in a formula 1; the component B comprises at least one compound with a structure shown in a formula 2; wherein the melting point of the component A is below 50 DEG C; and the boiling point of the component B is 180 DEG C or less. The invention also comprises preparation of the composite material and application of the composite material in modification of nano conductive particles. Innovative research shows that the component A and the component B are combined, synergism can be achieved, when the component A and the component B are used for surface modification of the conductive nano-particles, the surface resistance of the conductive nano-particles can be reduced, in addition, the dispersity and the machinability of the conductive nano-particles can be improved, and the application scene of the conductive nano-particles can be improved.

DEPCT67 In one aspect, a semiconductor device includes a substrate, and the substrate includes the columns which are assembled together. With a conductive paste (122;222) penetrating a number of metal layers, a resin sheath (124;224) surrounds it. Column, shield ground (126;226) surrounding resin sheath (124;224) and a number of probes (120; 220 Know-how lines (120;220) including the first know-how line (120(1);220(1)) which is connected to the column. It consists of a conductive paste (122;222) and a second probe (120(2);220(2)) which is connected. With shield ground(126;226) resins are combined with dielectric material;

The invention discloses high-performance conductive paste based on compounding of carbon nanotubes and high-oil-absorption-value carbon black and a preparation method and application of the high-performance conductive paste. The high-performance conductive paste comprises a composite conductive agent, and the composite conductive agent is composed of low-specific-surface-area carbon nanotubes and high-oil-absorption-value conductive carbon black according to the mass ratio of (5-9): (1-5); the specific surface area of the low-specific-surface-area carbon nano tube is 220-270 m < 2 > / g; the DBP value of the conductive carbon black with the high oil absorption value is larger than or equal to 150 mL / 100 g. By carefully selecting raw material specifications which are matched with each other, the long-range conductivity advantage of the carbon nanotubes and the bridging filling effect of the high-structure-degree carbon black are fully played, and a perfect'macroscopic + microscopic 'three-dimensional conductive network is formed. The conductive paste prepared by the invention has the characteristics of excellent conductivity, good dispersion stability, excellent processability and the like.

The invention discloses an N-region conductive paste adaptive to a TBC solar cell, a preparation method of the N-region conductive paste and the TBC solar cell, the conductive paste comprises 85-88 wt% of conductive silver powder, 7-8 wt% of an organic carrier and 5.5-6 wt% of glass paste, the glass paste comprises glass powder, a first solvent, first resin and an additive, the first additive is nanoscale oxide powder or carbide powder, and the first additive accounts for 0.2-0.5 wt% of the conductive paste. The N-region conductive slurry provided by the invention can be matched with the co-firing condition of the P-region slurry, and can improve Voc and slightly increase cloud and mist on the avoiding surface of the alkaline metal oxide by weakening glass corrosion on the basis of the existing silicon wafer treatment scheme for thinning an N-Poly layer by 220-250 nm.

The utility model belongs to the technical field of storage equipment, and particularly relates to conductive paste storage equipment which comprises a storage shell and sealing end covers detachably connected to the two ends of the storage shell. The two bearing seats are respectively embedded above the side surfaces of the sealing end covers; the scraping mechanism comprises a screw rod which is in bearing connection with the two bearing seats; wherein the lead screw is located above the liquid level of the conductive slurry so as to avoid contact with the conductive slurry, according to the conductive slurry storage equipment, the bearing seat is embedded above the side face of the sealing end cover, and after the bearing seat is connected with the lead screw, the lead screw is located above the liquid level of the slurry all the time, slurry corrosion can be effectively avoided, and the service life is prolonged; even if the sealing at the joint fails, the slurry cannot leak from the joint, so that the loss of enterprises is reduced.

The utility model discloses a ceramic conduction slurry hole filling processing device, including seal cover, the even several air holes of seal cover top surface are equipped with, the both sides of seal cover top surface near edge all have the bonding of clamping block, the movable joint of seal cover top surface has the bottom plate, the vacuum chuck of being equipped with in the bottom plate inside the air hole top, the both sides of bottom plate surface all are fixed with the mounting of connecting plate, the one side of connecting plate surface is located the fixed mounting of lantern ring in the position of screw hole, the both sides of lantern ring and connecting plate all are installed with the screw press bar of penetrating, the gasket of movable installation of screw press bar other end, the fixed mounting of holding lever of connecting plate top surface, this device is equipped with the vacuum chuck of soft texture in the air hole top, can effectively solve the problem of poor adsorption effect caused by the uneven surface of ceramic base.

This conductive paste contains: a conductive powder containing copper as the main ingredient; a glass frit; a binder resin; and an organic solvent. The glass frit contains substantially no elemental Zn, and contains, in mass% in terms of the oxides, 40.0-65.0 BaO, 15.0-23.0% B2O3, 2.0-12.0% Al2O3, 4.0-8.0% SiO2, 3.0-7.5% CaO, 2.5-5.0% MnO2, and 10.0-14.0% CuO. The total content of MnO2 and CuO contained in the glass frit is 12.5-17.5%, and the mass ratio of CuO contained in the glass frit with respect to MnO2 contained in the glass frit is 2.0-4.0. The use of this conductive paste makes it possible to manufacture an electronic component that is provided with a highly dense terminal electrode and that has excellent flexural strength.

The utility model provides a conductive paste printing device, and relates to the technical field of electronic tag production, the conductive paste printing device is provided with a printing mechanism, the printing mechanism is provided with a paste tank, a mold roller, a paste passing roller, a compression roller and a scraper, the paste passing roller, the compression roller and the scraper are all attached to the outer side of the mold roller, the paste passing roller is arranged behind the compression roller, and the scraper is arranged between the paste passing roller and the compression roller. Printing paper passes through the space between the mold roller and the pressing roller; the mold roller is rotatably arranged above the slurry tank, and a printing tank is formed in the side face of the mold roller; the mold roller rotates to drive the paste passing roller to rotate, the conductive paste is fed between the paste passing roller and the mold roller, the printing groove is filled with the conductive paste, and the scraper evenly scrapes the conductive paste attached to the outer side face of the mold roller; the printing paper is tightly pressed on the mold roller by the pressing roller, and the conductive paste in the printing groove is attached to the printing paper; the slurry passing roller and the die roller rotate together, under the condition that the rotating speed of the slurry passing roller and the rotating speed of the die roller are high, it can be guaranteed that conductive slurry is well attached to the outer side face of the die roller, and the device can efficiently produce electronic tags.

A multilayer circuit board and a manufacturing method thereof. The manufacturing method comprises: providing a first circuit substrate comprising a first circuit layer, the first circuit layer comprising a connection pad, the first circuit substrate being provided with a first blind hole on a side of the first circuit layer, the blind hole being provided with a first conductive part formed by curing of conductive paste, the first conductive part comprising oppositely arranged first and second end parts, the first end part being used for electrically connecting the connection pad; providing a second circuit substrate comprising a second circuit layer and a third circuit layer, the second circuit layer comprising a signal line; and laminating and pressing the first and second circuit substrates, so that the second circuit layer is located between the first and third circuit layers, in a length direction of the first circuit substrate, the signal line is connected with part of the second end part, and in a thickness direction of the first circuit substrate, an orthogonal projection of a connection area of the second end part and the signal line on the connection pad is located in the connection pad.

The invention belongs to the technical field of conductive paste, and relates to conductive paste for an aluminum nitride matrix and a preparation method of the conductive paste. The conductive paste comprises the following components in percentage by mass: 1%-5% of glass powder, 15%-20% of an organic carrier and the balance of mixed silver powder. Wherein the glass powder contains 1%-4% of CeO2 and is used for enhancing the stability of a glass phase and interface bonding; the mixed silver powder is formed by mixing silver powder and 0.5%-2% of NiO in advance and used for forming a diffusion barrier layer on a silver particle interface and refining a silver crystal phase. The invention also provides a preparation method of the conductive paste, which comprises the following steps: uniformly grinding and mixing the mixed silver powder and the glass powder, adding the organic carrier, and grinding and mixing to obtain a mixture; and rolling and grinding the mixture to prepare the conductive paste.

A manufacturing method of a circuit board connecting structure and the circuit board connecting structure, the method comprising: providing a first circuit board comprising a first connecting pad; disposing conductive paste on the first connecting pad; disposing a conductive column on the conductive paste, so that the conductive paste flows and further covers the conductive column; providing a second circuit board comprising a second connecting pad; stacking the first circuit board and the second circuit board, so that the second connecting pad is located at an end of the conductive column away from the first connecting pad; and pressing the first circuit board and the second circuit board, so that the conductive paste flows and further covers the second connecting pad, the conductive paste comprising a first conductive paste layer covering the first connecting pad, a second conductive paste layer covering the conductive column, and a third conductive paste layer covering the second connecting pad, to obtain the circuit board connecting structure. The manufacturing method of the circuit board connecting structure simplifies the process and improves the yield of the circuit board connecting structure.