5 results about "Fragility" patented technology

According to the tensile strain germanium wafer on the glass substrate, the imaging chip and the forming method of the imaging chip, the acceptor substrate comprises the transparent glass substrate, the light transmittance of the short-wave infrared band is extremely high, light of the short-wave infrared band can reach the tensile strain germanium layer, the transparent glass substrate can also enable visible light to penetrate, and the imaging chip can be applied to the imaging chip. Visible light can also reach the tensile strain germanium layer. Light of more wavebands enters the tensile strain germanium wafer on the glass substrate through the transparent glass substrate, the tensile strain of the tensile strain germanium layer is further increased through direct wafer bonding operation, the response capacity to incident light is improved, and the wavelength response range of the tensile strain germanium wafer on the glass substrate is expanded to be within the range of 400 nm to 1700 nm. The wafer taking the transparent glass as the substrate is large in size and low in batch production cost, can be highly compatible with a CMOS (complementary metal oxide semiconductor) process production line, can overcome the defects of fragility, high cost and the like of a bulk germanium material, and improves the quality of the tensile strain germanium wafer on the glass substrate.

The application relates to a glass substrate inserting device, and belongs to the technical field of glass substrate production and manufacturing. The device solves the problem of thin plate damage by vertical insertion, adopts a support frame to bear multiple layers of glass substrates, and is provided with clamping assemblies on the left and right sides, the clamping plates are driven by torsional springs to realize self-adaptive clamping, and the damage caused by the shearing force of horizontal insertion is avoided; in addition, the top and bottom of the frame are respectively provided with buffer rubber strips to absorb vertical impact, and front and rear baffles provide physical protection; wherein, flexible contact parts are additionally arranged on the clamping contact surfaces to disperse the clamping stress. The application can solve the problem of fragility of the glass substrate thin plate, is compatible with substrates with different thicknesses, and realizes efficient and lossless insertion.

The utility model discloses a door leaf glass small frame installation structure, belongs to the field of glass doors, and aims to solve the problems of poor sealing performance and fragile glass caused by installation deviation and gaps of a glass small frame. The small glass frame is quickly disassembled and assembled through cooperation of the buckles and the clamping grooves, compared with conventional threaded connection, the small glass frame is more concise and convenient to assemble and disassemble, the installation efficiency is remarkably improved, the limiting buckle points arranged on the buckles can accurately fix and limit the positions of the buckles and the clamping grooves, and it is ensured that the small glass frame is accurately positioned in the installation process; the flat sealing strip is additionally arranged on the periphery, making contact with the small supporting piece, of the glass plate for wrapping, gaps generated due to machining errors are effectively filled up, the small glass frame and the door leaf steel plate are tightly matched through the special-shaped sealing strip wrapping the cover edge of the small glass frame, and unnecessary damage such as scratching is avoided.

Glass-based articles include a stress profile for providing improved drop performance. A glass-based substrate includes: a glass transition temperature (T g ), a liquid fragility index (m), and a fictive temperature (T f ), wherein T g is less than or equal to 650 °C, T f minus T g is greater than or equal to -30 °C, and m is greater than or equal to 25. The stress relaxation rate is greater than or equal to 10%, 20%, or more. The article can include a lithium-based aluminosilicate composition and a fracture toughness greater than or equal to 0.75 MPa*m 0 . 5 The stress profile includes: a spike region extending from the first surface to an inflection point; and a tail region extending from the inflection point to a center of the glass-based article, the tail region including: a negative curvature region, wherein a second derivative of a function of stress versus depth is negative; a depth of compression (DOC) greater than or equal to 0.22t, and a parabolic region originating from the DOC and extending to the center of the glass-based article.

This invention relates to the field of high-sensitivity radiation detection technology, specifically disclosing a method for preparing silver-doped boron phosphate glass sheets and their applications. The invention involves mixing, degassing, and melting the component raw material powders, pouring the molten glass into a preheated graphite mold, and then annealing, grinding, polishing, and cutting to obtain silver-doped boron phosphate glass sheets. By precisely controlling the P:B ratio and annealing process, this invention introduces B-O-P bridging and B-O-B structures at the glass network structure level, significantly improving the structural and environmental stability of the glass and overcoming the technical defects of existing silver-doped phosphate glasses, such as easy hydrolysis and fragility. The prepared glass sheets exhibit excellent photoluminescence properties, with a good linear relationship between luminescence intensity and radiation dose in the 0-50 Gy dose range, and possess neutron detection potential. They can be applied in fields such as radiation monitoring, high spatial resolution X-ray imaging, non-destructive testing, biomedical imaging, and encryption and anti-counterfeiting technologies.