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19147results about How to "Improve compactness" patented technology

High density integrated circuit packaging with chip stacking and via interconnections

Chip stacks with decreased conductor length and improved noise immunity are formed by laser drilling of individual chips, such as memory chips, preferably near but within the periphery thereof, and forming conductors therethrough, preferably by metallization or filling with conductive paste which may be stabilized by transient liquid phase (TLP) processes and preferably with or during metallization of conductive pads, possibly including connector patterns on both sides of at least some of the chips in the stack. At least some of the chips in the stack then have electrical and mechanical connections made therebetween, preferably with electroplated solder preforms consistent with TLP processes. The connections may be contained by a layer of resilient material surrounding the connections and which may be formed in-situ. High density circuit packages thus obtained may be mounted on a carrier by surface mount techniques or separable connectors such as a plug and socket arrangement. The carrier may be of the same material as the chip stacks to match coefficients of thermal expansion. High-density circuit packages may also be in the form of removable memory modules in generally planar or prism shaped form similar to a pen or as a thermal conduction module.
Owner:INT BUSINESS MASCH CORP

High density integrated circuit packaging with chip stacking and via interconnections

Chip stacks with decreased conductor length and improved noise immunity are formed by laser drilling of individual chips, such as memory chips, preferably near but within the periphery thereof, and forming conductors therethrough, preferably by metallization or filling with conductive paste which may be stabilized by transient liquid phase (TLP) processes and preferably with or during metallization of conductive pads, possibly including connector patterns on both sides of at least some of the chips in the stack. At least some of the chips in the stack then have electrical and mechanical connections made therebetween, preferably with electroplated solder preforms consistent with TLP processes. The connections may be contained by a layer of resilient material surrounding the connections and which may be formed in-situ. High density circuit packages thus obtained may be mounted on a carrier by surface mount techniques or separable connectors such as a plug and socket arrangement. The carrier may be of the same material as the chip stacks to match coefficients of thermal expansion. High-density circuit packages may also be in the form of removable memory modules in generally planar or prism shaped form similar to a pen or as a thermal conduction module.
Owner:IBM CORP

Computer graphic display visualization system and method

An improved human user computer interface system, providing a graphic representation of a hierarchy populated with naturally classified objects, having included therein at least one associated object having a distinct classification. Preferably, a collaborative filter is employed to define the appropriate associated object. The associated object preferably comprises a sponsored object, generating a subsidy or revenue.
Owner:RELATIVITY DISPLAY LLC

Transmit/receiver module for active phased array antenna

This invention relates to a transmit / receive module for a high power Active Phased Array Antenna system operating in L-band based upon a combination of Hybrid Microwave Integrated Circuit (MIC) as well as Monolithic Microwave Integrated Circuit (MMIC) technology. The transmit / receive module includes a power monitoring means, transmitter protector means, and a receiver protector means. The module comprises a signal transmit chain incorporating power conditioner and a signal receive chain incorporating control electronics and bias- sequencer modulator. The transmit chain has switching means for switching the module to transmit mode which is connected to the transmit amplifier chain through a shared digital phase shifter. The amplified signals from the transmit amplifier chain are conveyed to a duplexer means. In receive mode, the receive chain receives signal through drop-in circulator and high power switch and comprises of high power limiter, low noise amplifier means, and a digital attenuator means connected to the shared digital phase shifter through T / R switch means. Electronic means are connected through integrated control electronic., bias sequencer modulator and power conditioner for controlling the operation of the device.
Owner:CHIEF CONTROLLER RES & DEV MINIST OF DEFENCE GOVERNMENT OF INDIA THE

Polyether class polycarboxylic acid high-efficiency water reducing agent and preparation method thereof

The invention relates to a polyether class polycarboxylic acid high-efficiency water reducing agent and a preparation method thereof, belonging to the field of concrete materials, structures and engineering of building materials. The polyether class polycarboxylic acid high-efficiency water reducing agent raises the temperature of water solutions of 15-55 mass percent of allyl polyethenoxy ether and 0-6 mass percent of chain transfer agent is raised to 50-90 DEG C, one side is dropwise added with a water solution of 0.01-0.9 mass percent of an evocating agent, one side is dripwise added with miscible liquids of 3-15 mass percent of unsaturated acids and one or more than one derivative thereof, the temperature is kept unchanged, and the water solution and the miscible liquids are completely dropped within 2-6 hours, the temperature is preserved for 1-6 hours and naturally cooled to room temperature, and the mixed solution is neutralized by sig water till a PH value reaches 6.8-7.2 so as to obtain the polyether class polycarboxylic acid high-efficiency water reducing agent. The polyether class polycarboxylic acid high-efficiency water reducing agent and the preparation method thereof have simple technique, low cost and good property, can effectively reduce the water-cement ratio of concrete, improves the compaction rate of a pore structure of the concrete, enhances the strength and the durability of the concrete and has great significance on enhancing the engineering quality, prolonging the service life, reducing the engineering cost, reducing the environment pollution, and the like.
Owner:大连华健科技有限公司

Method and system for touch screen keyboard and display space sharing

A method and system in a portable computer having a display screen for increasing portable computer compactness. Data is displayed initially within the display screen. The display screen is then partitioned into a touch-sensitive input area and a display area, wherein data input at the touch-sensitive input area may be simultaneously displayed in the display area, in response to a particular user input. A test is performed to detect if a user's hands are positioned at the touch-sensitive input area. A touch-sensitive pad is thereafter graphically displayed at the touch-sensitive input area within the display screen, in response to detecting a user's hands positioned at the touch-sensitive area, wherein a user may enter data that may be simultaneously displayed in the display area. An additional test may then be performed to detect if the user's hands are no longer positioned at the touch-sensitive input area. The touch-sensitive pad is subsequently concealed from view, in response to detecting if the user's hands are no longer positioned at the touch-sensitive input area. The touch-sensitive pad graphically displayed at the touch-sensitive input area within the display screen may be composed of a touch-sensitive keyboard, which may in and of itself be an ergonomic keyboard.
Owner:IBM CORP

Rolling bearing fault diagnosis method in various working conditions based on feature transfer learning

The present invention provides a rolling bearing fault diagnosis method in various working conditions based on feature transfer learning, and relates to the field of fault diagnosis. The objective ofthe invention is to solve the problem that a rolling bearing, especially to various working conditions, is low in accuracy of diagnosis. The method comprise the steps of: employing a VMD (VariationalMode Decomposition) to perform decomposition of vibration signals of a rolling bearing in each state to obtain a series of intrinsic mode functions, performing singular value decomposition of a matrixformed by the intrinsic mode functions to solve a singular value or a singular value entropy, combining time domain features and frequency domain features of the vibration signals to construct a multi-feature set; introducing a semisupervised transfer component analysis method to perform multinuclear construction of a kernel function thereof, sample features of different working conditions are commonly mapped to a shared reproducing kernel Hilbert space so as to improve the data intra-class compactness and the inter-class differentiation; and employing the maximum mean discrepancy embedding to select more efficient data as a source domain, inputting source domain feature samples into a SVM (Support Vector Machine) for training, and testing target domain feature samples after mapping. Therolling bearing fault diagnosis method in various working conditions has higher accuracy in the rolling bearing multi-state classification in various working conditions.
Owner:HARBIN UNIV OF SCI & TECH
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