Ceramic slurry preparation and 3D (three dimensional) printing light curing molding method

A ceramic slurry and photocuring technology, which is applied in ceramic molding machines, ceramic material production, manufacturing tools, etc., can solve problems such as cracks or deformation, differences in photocuring molding parameters, and high shrinkage of ceramic products, so as to improve molding Efficiency, improvement of molding accuracy, improvement of density and density

Active Publication Date: 2017-06-09
重庆摩方科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0017] 1. The viscosity of the ceramic slurry is not mentioned;
[0018] 2. Due to the different refractive index of different ceramic powders, for systems with a large difference in refractive index between ceramic powder and photosensitive resin, the photocuring molding parameters will be very different;
[0019] 3. The solid content of the ceramic body obtained by light-curing the ceramic slurry is not high, resulting in a high shrinkage rate of the final ceramic product, which is prone to cracks or deformation
Among them, photocuring rapid prototyping is relatively mature in the production of photosensitive resin prototypes, but the application of this process to the molding of ceramic materials is still in the preliminary research stage

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0052] 1. Ceramic powder (40 vol%): select 5 μm alumina and 2 μm magnesium oxide (volume ratio 5:1), in the photosensitive resin premix (60 vol%): select 30 wt% polyurethane acrylate and 25 wt% % pure acrylate as oligomer, 20 wt% HDDA, 20 wt% TMPTMA as reactive diluent, 1 wt% phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide photoinitiator , 3 wt% polyvinylpyrrolidone dispersant, 0.8 wt% m-tetrahydroxyphenyl chlorin photosensitizer, 0.2 wt% tertiary amine benzoate sensitizer.

[0053] 2. Preparation of photosensitive resin premix: Mix the oligomer, reactive diluent, photoinitiator, dispersant, photosensitizer and sensitizer, then stir at a medium speed for 0.5h to fully mix all components evenly.

[0054] 3. Put the above-mentioned photosensitive resin premix and ceramic powder in a ball mill, and ball mill for 15 hours, so that the components are uniformly dispersed, and a ceramic slurry is prepared. The viscosity of the ceramic slurry is 850cp.

[0055] 4. Place the obtained...

Embodiment 2

[0062] 1. Select ceramic powder (60 vol%): select 2 μm boron nitride and 4 μm silicon carbide (volume ratio 1:3), in the photosensitive resin premix (40 vol%): select 25 wt% epoxy acrylate and 25 wt% polyester acrylate as oligomer, 20 wt% TPGDA, 20 wt% IBOMA as reactive diluent, 2 wt% 2,4,6-trimethylbenzoyl ethyl phosphonate photoinitiated agent, 6wt% sodium hexametaphosphate dispersant, 1.6wt% benzoporphyrin derivative photosensitizer and 0.4wt% tertiary amine benzoate sensitizer.

[0063] 2. Preparation of photosensitive resin premix: Mix the oligomer, reactive diluent, photoinitiator, dispersant, photosensitizer and sensitizer, then stir at a medium speed for 3 hours to fully mix the components evenly.

[0064] 3. Put the above-mentioned photosensitive resin premix and ceramic powder in a ball mill, and ball mill for 8 hours, so that each component is uniformly dispersed, and a ceramic slurry is prepared. The viscosity of the ceramic slurry is 1200cp.

[0065] 4. Place the...

Embodiment 3

[0072] 1. Select ceramic powder (80 vol%): select 2 μm ATZ and 1 μm YTZ (volume ratio 1:3), photosensitive resin premix (20 vol%): select 25 wt% silane acrylate and 30 wt% Polyurethane acrylate as oligomer, 15 wt% EGDMA, 15 wt% DPHA as reactive diluent, 3 wt% 4-phenylbenzophenone photoinitiator, 10 wt% sodium polyacrylate dispersant , 1.7 wt% benzoporphyrin derivative monoacid photosensitizer, 0.3 wt% ethanolamine tertiary amine sensitizer.

[0073] 2. Preparation of photosensitive resin premix: Mix the oligomer, reactive diluent, photoinitiator, dispersant, photosensitizer and sensitizer, and then stir at a medium speed for 1 hour to fully mix the components evenly.

[0074] 3. Put the above-mentioned photosensitive resin premix and ceramic powder in a ball mill, and ball mill for 10 hours, so that the components are uniformly dispersed, and a ceramic slurry is prepared. The viscosity of the ceramic slurry is 1850cp. .

[0075] 4. Place the obtained ceramic slurry under a 4...

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Abstract

The invention provides a ceramic slurry preparation and 3D (three dimensional) printing light curing molding method. 25-85vol% of ceramic powder and 15-75vol% of an optical resin premix solution are mainly involved, and the method includes: A), preparation of the optical resin premix : namely stirring a low polymer, a reactive diluent, a photoinitiator, a dispersing agent, a photosensitizer and a sensitizer according to a certain proportion under intermediate speed for 0.5-3 hours to enable the components to be mixed evenly; B), placing the premix solution and the ceramic powder in a ball mill according to certain volume for ball-milling for 5-15 hours to prepare the ceramic slurry high in solid content and low in viscosity; subjecting the ceramic slurry to curing molding layer by layer gradually on a 3D light curing molding machine to obtain a ceramic green body prior to aftertreatment of drying, degreasing, sintering and the like to obtain ceramic part. The method is high in preparation molding precision and free of molds to prepare complex structure parts, the ceramic product can reach more than 92% in density, 320-1750MPa in flexural strength and 1800-4500MPa in compression strength.

Description

technical field [0001] The invention belongs to the field of ceramic material preparation, and relates to the preparation of light-cured ceramic slurry and its 3D printing light-cured molding method. Background technique [0002] Ceramic materials, together with metal materials and polymer materials, are listed as the three major solid materials today. They have the advantages of high hardness, high wear resistance, high temperature resistance, oxidation resistance, corrosion resistance, and good chemical stability. However, due to the extremely high The characteristics of hardness, good wear resistance and corrosion resistance, and high brittleness make the cost of machining high and the processing efficiency low. Therefore, the traditional molding process limits the application and development of ceramic parts, especially ceramic parts with complex structures. . [0003] The direct manufacturing process of ceramic parts based on rapid prototyping does not require molds, w...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/10C04B35/48C04B35/565C04B35/622C04B35/632B33Y70/00B28B1/00B28B11/24B33Y10/00
CPCC04B35/10C04B35/48C04B35/565C04B35/622C04B35/632B28B1/001B28B11/243B33Y10/00B33Y70/00C04B2235/3246C04B2235/386C04B2235/6026C04B2235/96C04B2235/77C04B2235/3206Y02P40/60C04B2235/658C04B2235/6581C04B2235/6562C04B35/63456
Inventor 冯玉林贺晓宁张丽于法猛王焱华杨波
Owner 重庆摩方科技有限公司
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