The invention provides an
epoxy resin packaging bonding material with high bonding stability and a preparation method thereof. The packaging bonding material is prepared from the following
raw material components: 8 to 18 percent of
graphene oxide modified
epoxy resin, 0.8 to 4.0 percent of a curing agent, 0 to 1 percent of a curing accelerator, 0.4 to 2.0 percent of a
silane coupling agent, 2 to 7 percent of
nano carbon black, 2 to 7 percent of carbon
fiber, 40 to 60 percent of flaky silver
powder, 4 to 8 percent of spherical silver
powder, 4.4 to 13.6 percent of a surface treating agent, 4 to 6 percent of a
reactive diluent, 0.5 to 1.5 percent of a
toughening agent, 0.5 to 1.5 percent of a dispersing agent, 0.1 to 0.5 percent of a lubricating agent and the balance of a non-
reactive diluent.
Graphene oxide is utilized to modify
epoxy resin, the
dispersion stability of the filler is improved,
modified carbon black is adopted as a short-range conductive additive,
carbon fibers are adopted as a long-range conductive additive, the
modified carbon black and the
carbon fibers synergistically improve the
conductivity, and the reinforcing effect is achieved. The packaging bonding material disclosed by the invention has the characteristics of
low volume resistivity, high tensile strength and bending strength, high bonding stability and the like, and has wide application prospects in the fields of
automotive electronics,
wind power photovoltaics, LEDs (
Light Emitting Diode), LCDs (
Liquid Crystal Display) and the like.