423results about "Adhesive processes with adhesive heating" patented technology

The invention discloses a supramolecular host-guest photoinitiator with an adjustable curing rate and an epoxy adhesive, the supramolecular host-guest photoinitiator comprises a supramolecular host compound and a guest photoinitiator included in the supramolecular host compound, the supramolecular host compound has a macrocyclic structure with a repeating unit number of 2-30, the guest photoinitiator comprises a cationic photoinitiator; in the supramolecular host-guest photoinitiator, the molar ratio of the supramolecular host compound to the guest photoinitiator is (0.8-1.5): 1, and the mass percentage of carbon element to hydrogen element is (40-75): (3-8). The UV epoxy adhesive comprises the supramolecular host-guest photoinitiator with the adjustable curing rate, a delayed curing window period is formed after UV light irradiation initiation, the adhesive is excellent in flowing and coating performance, the adhesive can continue to initiate polymerization curing without depending on illumination after the window period, heat input can be controlled, and the curing rate can be adjusted.

A sticky tape that can be heated and separated in a short time and can effectively prevent thermal damage to an adherend is provided. The sticky tape separable by heating, includes: an intermediate layer A containing a heating element and an adhesive agent; an adhesive agent layer B1 disposed on one surface side of the intermediate layer A and containing an adhesive agent; and an adhesive agent layer B2 disposed on the other surface side of the intermediate layer A and containing an adhesive agent. At least one of the adhesive agent layer B1 and the adhesive agent layer B2 is a heat-insulating layer C further having heat-insulating properties, or a heat-insulating layer C with heat-insulating properties is further provided at least one of between the intermediate layer A and the adhesive agent layer B1 and between the intermediate layer A and the adhesive agent layer B2.

Provided are: polyurethane elastic fibers that achieve heat resistance, adhesiveness, and reelability and that are suitable for a gather member; a winding body therefor; a gather member; and a sanitary material. The present invention relates to: polyurethane elastic fibers that are multifilaments and that contain urethane bonds and urea bonds, the polyurethane elastic fibers being characterized in that the ratio of the urea bonds with respect to the urethane bonds is 0.05 to 5%; a winding body of said polyurethane elastic fibers, wherein the elongation rate of the polyurethane elastic fibers on the winding body is 0.05 to 10%; a gather member; and a sanitary material.

To provide a printing apparatus and a control method for the printing apparatus that can reduce the time required to form an adhesive layer with a simple structure. [Solution] A printing apparatus comprising an endless conveyor belt for transporting a recording medium, a drive unit for circulating rotation of the conveyor belt, a heating unit, a printing unit for printing on the recording medium, and a control unit, wherein the control unit can select between a first mode in which, when the conveyor belt is not holding the recording medium and is circulating rotation, the heating unit heats the aqueous adhesive applied to the conveyor belt to form an adhesive layer on the conveyor belt, and a second mode in which, when the conveyor belt is circulating rotation, the heating unit heats the adhesive layer and the printing unit prints on the recording medium held by the conveyor belt.

The present invention relates to a flame retardant fire extinguishing tape containing a flame retardant and fire extinguishing fluid microcapsules, and a method for manufacturing same. More specifically, the present invention relates to: a flame retardant fire extinguishing tape in which a fire extinguishing pad layer in which an acrylate oligomer, fire extinguishing fluid microcapsules, and a flame retardant are mixed is formed on a flame retardant adhesive layer; and a method for manufacturing same. The present invention relates to: a flame retardant fire extinguishing tape containing a flame retardant and fire extinguishing fluid microcapsules, wherein the fire spreading prevention effect of the fire extinguishing fluid microcapsules is improved by preventing the fire extinguishing fluid microcapsules from being rapidly gasified; and a method for manufacturing same.

A method for curing adhesive during assembly of a glass syringe comprises the following steps a.) to d.): a.) providing an adhesive, a glass barrel and a needle; b.) dispensing the adhesive onto the glass barrel and / or needle; c.) arranging the needle onto the barrel; d.) curing the adhesive by means of radiation; and the method further comprises: heating at least one of the glass barrel, needle and adhesive by means of hot air.

The present disclosure relates to an adhesive containing a polyester (A) satisfying the following requirements (1) to (4): (1) the polyester (A) has a structural site derived from a polyvalent carboxylic acid (a1) and a structural site derived from a polyhydric alcohol (a2); (2) the polyester (A) has an ester bond concentration of 10.00 mmol / g or less; (3) the polyester (A) has a melting point of 30° C. or higher; and (4) the polyester (A) has a mass-average molecular weight of 25000 or more.

A transparent adhesive composition including an epoxy resin (A), an epoxy resin-curing agent (B), and a phenoxy resin (C), wherein the epoxy resin-curing agent (B) satisfies the following (1) and (2):(1) the epoxy resin-curing agent (B) is in a powdery form and has a particle diameter (d90) at 90% cumulative distribution frequency of 2.0 μm or less; and(2) the epoxy resin-curing agent (B) has solubility in 100 g of methyl ethyl ketone at 25° C. of 0.1 g or less;a film-shaped transparent adhesive processed therefrom;a method of producing a transparent adhesive cured layer-attached member by using the film-shaped transparent adhesive;a method of producing an electronic component; andan electronic component.

A polyolefin bonding adhesive film includes a support base layer and a bonding adhesive layer formed on a side surface of the support base layer by co-extrusion. The support base layer is a polypropylene film. The bonding adhesive layer is formed of a first polyolefin copolymer modified by maleic anhydride. The first polyolefin copolymer is formed by copolymerization of at least two kinds of C2 to C4 olefin molecules, a first graft ratio of the maleic anhydride grafted onto the first polyolefin copolymer is between 0.5% and 5%, and a first melt index of the first polyolefin copolymer is between 3 g / 10 min and 5 g / 10 min.

A dual-curing adhesive comprises multifunctional epoxy resin, thermal curing agent, photoinitiator, and a compound having an epoxy group and a radically-polymerisable group. The compound may be presen

According to an aspect of the invention, a method of fastening a second object to a fiber composite part comprising a structure of fibers embedded in a matrix material is provided, the method comprising - Providing the fiber composite part comprising an attachment surface, with a portion of the structure of fibers being exposed at the attachment surface; - Providing the second object; - Placing the second object relative to the fiber composite part, with a resin in a flowable state between the attachment surface and the connector; - Pressing the second object and the fiber composite part against each other and causing mechanical vibration to act on the second object or the fiber composite part or both, thereby causing the resin to infiltrate the exposed structure of fibers and activating the resin to cross-link; - Whereby the resin, after cross-linking, secures the second object to the fiber composite part. In the step of causing mechanical vibration to act and thereby activating the resin to cross-link, only a portion of the resin is activated to cross link, whereas a further portion of the resin remains essentially uninfluenced by the mechanical vibration.

A moisture curable hot melt adhesive composition that includes isocyanate-terminated polyurethane prepolymer that includes the reaction product of a crystalline polyester polyol, a polyether polyol, and di isocyanate, clay, polyester / polyether elastomer, a first thermoplastic polymer selected from the group consisting of ethylene vinyl acetate copolymer, ethylene (alkyl)acrylate copolymer, and combinations thereof a tackifying agent, and optionally a second thermoplastic polymer selected from the group consisting of thermoplastic polyurethane, thermoplastic polycaprolactone, and combinations thereof.

The present invention relates to a two-component polyurethane adhesive composition for film lamination in hot-fill applications. The present invention further relates to a method for producing a laminate using said two-component polyurethane adhesive composition, and to the laminate obtained by said method.

The present invention relates to a thermosetting epoxy resin composition comprising a dihydrazide as curing agent, in combination with an accelerator of an imidazolium salt as curing agent, the molar ratio of curing agent to accelerator being 6-120. The compositions are characterized by good storage stability and low cure temperature. The epoxy resin composition is particularly suitable for use as a vehicle body adhesive.

The present invention is a temporary adhesive material for wafer processing, used for temporarily bonding a support and a wafer having a circuit-forming surface on a front side and a backside to be processed, including a composite temporary adhesive material layer having a two-layered structure that includes a first temporary adhesive layer including a thermoplastic resin layer (A) capable of peelably adhering to the front side of the wafer, and a second temporary adhesive layer including a thermosetting siloxane polymer layer (B) laminated on the first temporary adhesive layer. Accordingly, the present invention provides a temporary adhesive material for wafer processing that has, irrespective of the surface treatment of the wafer substrate, stable wafer processability, excellent peelability of the support, and easy cleaning removability of the temporary adhesive material layer after peeling of the support, can be formed with uniform film thickness even on a substrate with a large step height, exhibits high process compatibility with TSV formation and wafer backside wiring processes, and furthermore exhibits excellent resistance to wafer thermal processes such as chemical vapor deposition (CVD), thereby enhancing the productivity of thin wafers.

An article includes a substrate, and a film-based article comprising a non-crosslinked thermoplastic rubber. At least a portion of the film-based article is fixed to the substrate. In particular, said portion of the film-based article is firmly fixed to the substrate by heat sealing at a temperature of 190 to 250° C. for at least 1 second, without using a glue, an adhesive coating, or a corona discharge treatment.

A method for preparing a retreaded tire, the method comprising (a) providing a tire casing; (b) providing a pre-cured tire tread; (c) applying a primer composition to the tire casing, the pre-cured tread, or both the tire casing and the pre-cured tread therefore form at least one primer layer, where the primer composition includes a halogenating agent and a solvent; (d) applying a urethane-based adhesive composition to at least one of the tire casing, an adhesive layer, the pre-cured tread, or the at least one primer layer; (e) mating the pre-cured tread to the tire casing to thereby sandwich the adhesive layer between the pre-cured tread and the tire casing and form a pre-cured composite: and (f) allowing the adhesive layer of the pre-cured composite to cure and thereby form a retreaded tire.

This adhesive resin film is provided with a base material layer, a concavo-convex absorptive resin layer, and an adhesive resin layer in this order, and is used to protect a circuit forming surface of an electronic component. The concavo-convex absorptive resin layer has a minimum value G'bmin of a storage elastic modulus G'b of 0.001 MPa or more and less than 0.1 MPa at 25°C or more and less than 250°C and has a storage elastic modulus G'b250 of 0.005 MPa to 0.3 MPa, inclusive, at 250°C.

The present invention provides an embodiment of a reactive hot melt adhesive. In an embodiment, the reactive hot melt adhesive may include at least one isocyanate compound, at least one polyester polyol, at least one polyether polyol, and at least one thermoplastic polymer. The at least one thermoplastic polymer may have a viscosity of less than 75,000 cP at 177°C. The thermoplastic polymer may be an ethylene-acrylic-carbon monoxide terpolymer, an ethylene-(C3-C 12 ) alkylene-acrylic-carbon monoxide tetrapolymer, or both.

The present invention features a hot melt adhesive composition for disposable absorbent articles comprising 5 to 40 wt% of an unmodified styrenic block copolymer, 0.5 to 30 wt% of a modified styrenic block copolymer, 30 to 65 wt% of a tackifier, and 10 to 45 wt% of a plasticizer, wherein the hot melt adhesive composition comprises less than 5% by weight of wax.

The present disclosure provides a method of manufacturing a bonding structural test block with defects. The method of manufacturing the bonding structural test block with defects includes: providing a first plate and a second plate; applying an adhesive on an upper surface of the first plate to form an adhesive layer; heating and curing at least partial region of the adhesive layer for the first time; placing the second plate on the adhesive layer; and heating and curing the adhesive layer for the second time to form a boding structural test block. According to the present disclosure, the at least partial region of the adhesive layer is heated and cured for the first time and chemical reaction occurs, so that the at least partial region forms a defect, and controllable manufacturing of the defect is realized. The test block with the defect is subjected to mechanical detection to simulate the actual defective product. Furthermore, according to the method provided by the present disclosure, weak bond defect and kiss-bonds defect with different bonding strength are simulated by controlling the percentage of the at least partial region in the entire region of the adhesive layer.

Disclosed is a method for reinforcement in laminar materials consisting of plates of cementitious or porcelain material, which comprises a series of steps consisting in: placing and attaching a reinforcement mesh, coated with an adhesive material, on the upper surface of the laminar material, using a meshing device, and subsequently solidifying the adhesive material by applying radiation in an oven, thereby rigidly and solidly joining the reinforcement mesh to the laminar material. In addition to the method, the invention also relates to a system for reinforcing laminar construction elements, which is suitable or designed for carrying out the method, wherein the system comprises: a first applicator device for applying adhesive material; a meshing device that places a reinforcement mesh on the upper surface of the laminar material; a second applicator device; and an oven for solidifying the adhesive material, thereby stiffening the material and rigidly attaching the reinforcement mesh to the laminar material.

The present invention relates to a joining method for metal-metal and metal-plastic bonds and to parts produced therewith. For example, the parts may be a cooling element, through which a fluid can flow, for accumulators of electric or hybrid vehicles. The joining method comprises a preparation of the parts and subsequent integral bonding of the parts by means of a powder coating.

A method for producing a laminate that is obtained by bonding an adherend with a cured product having a high elastic modulus in a high-temperature environment even in a case where low-temperature curing is carried out, is provided. The method for producing a laminate includes the steps of applying a curable resin composition having a specific composition to a first adherend and bonding the first adherend with a second adherend, and subjecting the curable resin composition to low-temperature curing. The laminate has a ratio of a thickness of the cured product and an average thickness of those adherends in a specific range.

A printing apparatus includes an endless transport belt configured to transport a recording medium, a drive unit configured to circulate and rotate the transport belt, a heating unit, a printing unit configured to perform printing on the recording medium, and a control unit, in which the control unit is selectable between a first mode where an aqueous pressure-sensitive adhesive applied to the transport belt is heated by the heating unit to form a pressure-sensitive adhesive layer at the transport belt in a state where the transport belt is being circulated and rotated without holding the recording medium, and a second mode where the pressure-sensitive adhesive layer is heated by the heating unit and printing is performed by the printing unit on the recording medium held by the transport belt in a state where the transport belt is being circulated and rotated.

A heating device for activating a pressure-sensitive adhesive tape and a thermoplastic or thermosetting adhesive tape includes a microwave heating head, a microwave emitting component, and a motion driving component. The microwave emitting component is connected to the microwave heating head, and used to output microwaves to the microwave heating head. The motion driving component is connected to the microwave heating head for achieving the alignment and motion of the microwave heating head and a heated component. The microwave heating head is driven by the motion driving component to heat the heated component. Through the cooperation of the microwave emitting component and the motion driving component, the flexible heating of the pressure-sensitive adhesive tape and the thermoplastic or thermosetting adhesive tape according to a set motion trajectory is achieved by deploying microwaves with appropriate power. A heating object is the pressure-sensitive adhesive tape and the thermoplastic or thermosetting adhesive tape.

The present disclosure relates generally to materials including cyclic compounds that are adhesive below the temperature at which pyrolysis occurs, and which are also adhesive at higher temperatures including the temperatures used in the regime for growing SiC crystals, which may be above 2000° C, or for SiC or GaN epitaxy, which may be above 1500° C.

The present disclosure provides a heat-initiated debondable attachment article, comprising (i) a first debondable layer having a first major surface and a second major surface and comprising at least one first thermoplastic polymer; (ii) a second debondable layer having a first major surface and a second major surface and comprising at least one second thermoplastic polymer; (iii) a porous support layer between the first surface of the first debondable layer and the first surface of the second debondable layer; (iv) optionally, a first adhesive layer covering the second major surface of the first debondable layer; (v) optionally, a second adhesive layer covering the second major surface of the second debondable layer; (vi) optionally, a first liner atop the outer surface of the first adhesive layer or the first debondable layer; and (vii) optionally, a second liner atop the outer surface of the second adhesive layer or the second debondable layer.

The present invention relates to a slip tape for automotive weatherstrips that improves slipperiness while lowering the coefficient of friction and appropriately preventing or minimizing the generation of abnormal noise by forming a ring in the shape of a smooth circular loop on the outer surface, and fundamentally prevents the ring from coming off by knitting so that the loop-shaped ring is attached. The slip tape of the present invention is attached to the outer surface of the door belt weatherstrip and door glass weatherstrip of an automobile and includes a base film made of an olefin resin, an adhesive layer formed by applying an adhesive to the upper surface of the base film, and a ring knitted layer formed by attaching the lower surface to the upper surface of the adhesive layer and being made of multifilament yarn of polyester or nylon material, with a number of upper rings in the shape of a circular loop knitted on the upper surface so as to adhere closely to the outer surface of the automobile glass and protruding upward, and a lower ring knitted flat on the lower surface so as to attach to and support the upper ring.

The present invention relates to the technical field of packaging leathers, specifically a very thin electronic packaging leather and preparation method thereof. In the present invention, by attaching a dry PU coating on a very thin woven fabric and using the polycarbonate resin which is solvent free, requirements on high physical performance phone cases are satisfied, in the meanwhile, the phones are light-weighted, and protection performance of the entire phones is improved. By printing a layer of organic silicone antifouling coating, while the texture is smooth and nice, the pollution cleaning and chemical resistance requirements for phones in daily use have been satisfied.