736results about "Adhesive processes with adhesive heating" patented technology

Disclosed are a high-barrier inflatable cushion and a preparation process therefor, which related to the technical fields of high-barrier inflatable cushions. The preparation process includes the following steps: material feeding, heating, vacuum counter-pressure molding, spray cooling, air cooling and drying, die-cutting, and thermal bonding. The high-barrier inflatable cushion comprises an airbag forming material and an airbag base material. The airbag forming material is prepared by laminating a TPU-EVOH composite with Lycra fabric, the TPU-EVOH composite has a total thickness of 0.4-0.8 mm, and the Lycra fabric has a gram weight of 150-230 g / m2. The airbag base material is prepared by laminating the TPU-EVOH composite with non-woven fabric, the TPU-EVOH composite has a total thickness of 0.1-0.3 mm, and the non-woven fabric has a gram weight of 60-80 g / m2.

An adhesive gripper for pick-and-place maneuvers comprises one or more legs, where each leg terminates in a foot rotatably connected to the respective leg. Each foot includes a SMP dry adhesive comprising a shape memory polymer, and a rigid backing layer attached to a back side of the SMP dry adhesive, such that a front side of the SMP dry adhesive is available for attachment and release of objects. The adhesive gripper further includes a handle portion connected to the one or more legs, a release mechanism comprising a release ring within the handle portion, and one or more releasing rods integrated with the one or more legs for release of an object onto a substrate.

Hot melt adhesive including a polar group-containing olefin copolymer has: number average molecular weight (Mn) between 10 to 50 kg / mol, crystallinity (Xc) content below 30%, enthalpy (ΔH) between 5 to 65 J / g, polydispersity index (PDI) from 2 to 6, melting temperature (Tm) between 40 and 120° C., and including at least 80 mol % of a constituent unit of formula (1), optionally a constituent unit of formula (2), and between 0.1 to 1 mol %, of a constituent unit of formula (3):wherein R1 is H or CH3; R2 is a hydrocarbyl group having 0 to 10 carbon atoms; R3 is a hydrocarbyl group having 2 to 10 carbon atoms, when X is hydroxyl functionality or a hydrocarbyl group having 0 to 10 carbon atoms, when X is polar organic group containing at least one carboxylic acid functionality and 0 to 6 carbon atoms.

The invention discloses a supramolecular host-guest photoinitiator with an adjustable curing rate and an epoxy adhesive, the supramolecular host-guest photoinitiator comprises a supramolecular host compound and a guest photoinitiator included in the supramolecular host compound, the supramolecular host compound has a macrocyclic structure with a repeating unit number of 2-30, the guest photoinitiator comprises a cationic photoinitiator; in the supramolecular host-guest photoinitiator, the molar ratio of the supramolecular host compound to the guest photoinitiator is (0.8-1.5): 1, and the mass percentage of carbon element to hydrogen element is (40-75): (3-8). The UV epoxy adhesive comprises the supramolecular host-guest photoinitiator with the adjustable curing rate, a delayed curing window period is formed after UV light irradiation initiation, the adhesive is excellent in flowing and coating performance, the adhesive can continue to initiate polymerization curing without depending on illumination after the window period, heat input can be controlled, and the curing rate can be adjusted.

The invention discloses a dual-curing solvent-free high-temperature-resistant epoxy resin structural adhesive as well as a preparation method and application thereof. The structural adhesive comprises the following components in percentage by weight: 1.5-5% of a latent curing agent, 2-5% of a high-heat-resistant curing agent, 1-5% of nano filler, 0.1-0.3% of a curing accelerator and the balance of epoxy resin. By accurately screening epoxy resin monomers, optimizing a dual curing agent system and introducing the high-temperature-resistant nanofiller, room-temperature stability, medium-temperature rapid curing and gelling and high-temperature complete curing are realized, and the final heat-resistant temperature is greater than or equal to 300 DEG C. Through the synergistic effect of the epoxy resin, the medium-temperature curing agent and the high-temperature curing agent, the crosslinking stability at different temperature stages is ensured. In addition, through introduction of the inorganic nano filler, the high-temperature mechanical property and the heat-resistant stability of the material are further improved. The preparation method does not need to use a solvent, and the prepared epoxy resin structural adhesive has excellent heat resistance and mechanical strength and is suitable for the fields of high-temperature structural adhesives, aerospace composite materials, high-temperature-resistant coatings and the like.

A sticky tape that can be heated and separated in a short time and can effectively prevent thermal damage to an adherend is provided. The sticky tape separable by heating, includes: an intermediate layer A containing a heating element and an adhesive agent; an adhesive agent layer B1 disposed on one surface side of the intermediate layer A and containing an adhesive agent; and an adhesive agent layer B2 disposed on the other surface side of the intermediate layer A and containing an adhesive agent. At least one of the adhesive agent layer B1 and the adhesive agent layer B2 is a heat-insulating layer C further having heat-insulating properties, or a heat-insulating layer C with heat-insulating properties is further provided at least one of between the intermediate layer A and the adhesive agent layer B1 and between the intermediate layer A and the adhesive agent layer B2.

An adhesive film for use in a power storage device, wherein: the power storage device has a structure wherein a power storage device element is accommodated in a package body formed of a power storage device exterior material; the exterior material is composed of a laminate including at least a base layer, a barrier layer, and thermally fusible resin layers; the power storage device element is accommodated in the package body by thermally fusing together the resin layers of the exterior material; the adhesive film is used so as to be interposed between the resin layers, at a position where the resin layers are thermally fused; the adhesive film includes at least a resin layer A and an adhesive layer P; the melting peak temperature of the resin layer A is at least 135° C.; and the melting peak temperature of the adhesive layer P is no more than 100° C.

Provided are: polyurethane elastic fibers that achieve heat resistance, adhesiveness, and reelability and that are suitable for a gather member; a winding body therefor; a gather member; and a sanitary material. The present invention relates to: polyurethane elastic fibers that are multifilaments and that contain urethane bonds and urea bonds, the polyurethane elastic fibers being characterized in that the ratio of the urea bonds with respect to the urethane bonds is 0.05 to 5%; a winding body of said polyurethane elastic fibers, wherein the elongation rate of the polyurethane elastic fibers on the winding body is 0.05 to 10%; a gather member; and a sanitary material.

A reactive hot melt adhesive composition comprising: (A) at least one polyurethane prepolymer obtained by reacting a reactant mixture comprising (A1) a polyol mixture comprising: (a) at least one liquid polyester polyol, (b) at least one crystalline polyester polyol, and (c) at least one amorphous polyester polyol, (A2) at least one polyisocyanate having at least two isocyanate groups in one molecule; (B) at least one vinyl acetate polymer, and (C) at least one thermal plastic polyurethane. The reactive hot melt adhesive composition could be used as hot melt adhesive, for example, in furniture industrial applications, which provides very good initial bonding strength and fast setting property simultaneously.

To provide a printing apparatus and a control method for the printing apparatus that can reduce the time required to form an adhesive layer with a simple structure. [Solution] A printing apparatus comprising an endless conveyor belt for transporting a recording medium, a drive unit for circulating rotation of the conveyor belt, a heating unit, a printing unit for printing on the recording medium, and a control unit, wherein the control unit can select between a first mode in which, when the conveyor belt is not holding the recording medium and is circulating rotation, the heating unit heats the aqueous adhesive applied to the conveyor belt to form an adhesive layer on the conveyor belt, and a second mode in which, when the conveyor belt is circulating rotation, the heating unit heats the adhesive layer and the printing unit prints on the recording medium held by the conveyor belt.

Conventionally, for anaerobically curable compositions that were used in assembly of a stacked steel sheet, fast curability was required for the efficiency of productivity. Recently, diversification of assembly methods has made not only curing acceleration by a primer but also curing acceleration by heating possible. In order for improvement in durability of stacked steel sheets, there has been a demand for improvement in shear adhesive strength and peeling adhesive strength of anaerobically curable compositions. The present invention relates to an anaerobically curable composition containing the following components (A) to (D): component (A): (meth)acryloyl compound, component (B): hydroperoxide, component (C): saccharin, and component (D): sodium salt, potassium salt or calcium salt of saccharin.

The present invention relates to a flame retardant fire extinguishing tape containing a flame retardant and fire extinguishing fluid microcapsules, and a method for manufacturing same. More specifically, the present invention relates to: a flame retardant fire extinguishing tape in which a fire extinguishing pad layer in which an acrylate oligomer, fire extinguishing fluid microcapsules, and a flame retardant are mixed is formed on a flame retardant adhesive layer; and a method for manufacturing same. The present invention relates to: a flame retardant fire extinguishing tape containing a flame retardant and fire extinguishing fluid microcapsules, wherein the fire spreading prevention effect of the fire extinguishing fluid microcapsules is improved by preventing the fire extinguishing fluid microcapsules from being rapidly gasified; and a method for manufacturing same.

A method for curing adhesive during assembly of a glass syringe comprises the following steps a.) to d.): a.) providing an adhesive, a glass barrel and a needle; b.) dispensing the adhesive onto the glass barrel and / or needle; c.) arranging the needle onto the barrel; d.) curing the adhesive by means of radiation; and the method further comprises: heating at least one of the glass barrel, needle and adhesive by means of hot air.

A heat-curable adhesive composition containing: a photocleavable compound that generates an amine compound through cleavage induced by irradiation; and a heat-curable resin that cures upon heating in a presence of the amine compound. A layered film including: a substrate film; and an adhesive layer provided on a surface of the substrate film; wherein the adhesive layer is composed of the heat-curable adhesive composition.

The present disclosure relates to an adhesive containing a polyester (A) satisfying the following requirements (1) to (4): (1) the polyester (A) has a structural site derived from a polyvalent carboxylic acid (a1) and a structural site derived from a polyhydric alcohol (a2); (2) the polyester (A) has an ester bond concentration of 10.00 mmol / g or less; (3) the polyester (A) has a melting point of 30° C. or higher; and (4) the polyester (A) has a mass-average molecular weight of 25000 or more.

The utility model discloses a heating device for quickly activating a pressure-sensitive adhesive tape and a thermoplastic or thermosetting adhesive tape. The heating device comprises a microwave heating head, a microwave transmitting assembly and a motion driving assembly, the microwave emission assembly is connected with the microwave heating head and is used for outputting microwaves to the microwave heating head; the motion driving assembly is connected with the microwave heating head and used for achieving alignment and motion of the microwave heating head and the heated assembly. The microwave heating head is driven by the motion driving assembly to heat the heated assembly. According to the utility model, through the cooperation of the microwave emission assembly and the motion driving assembly, a pressure-sensitive adhesive tape and a thermoplastic or thermosetting adhesive tape are flexibly heated according to a set motion trail by allocating microwaves with appropriate power, and the heating objects applied by the device are the pressure-sensitive adhesive tape and the thermoplastic or thermosetting adhesive tape.

A transparent adhesive composition including an epoxy resin (A), an epoxy resin-curing agent (B), and a phenoxy resin (C), wherein the epoxy resin-curing agent (B) satisfies the following (1) and (2):(1) the epoxy resin-curing agent (B) is in a powdery form and has a particle diameter (d90) at 90% cumulative distribution frequency of 2.0 μm or less; and(2) the epoxy resin-curing agent (B) has solubility in 100 g of methyl ethyl ketone at 25° C. of 0.1 g or less;a film-shaped transparent adhesive processed therefrom;a method of producing a transparent adhesive cured layer-attached member by using the film-shaped transparent adhesive;a method of producing an electronic component; andan electronic component.

A polyolefin bonding adhesive film includes a support base layer and a bonding adhesive layer formed on a side surface of the support base layer by co-extrusion. The support base layer is a polypropylene film. The bonding adhesive layer is formed of a first polyolefin copolymer modified by maleic anhydride. The first polyolefin copolymer is formed by copolymerization of at least two kinds of C2 to C4 olefin molecules, a first graft ratio of the maleic anhydride grafted onto the first polyolefin copolymer is between 0.5% and 5%, and a first melt index of the first polyolefin copolymer is between 3 g / 10 min and 5 g / 10 min.

A dual-curing adhesive comprises multifunctional epoxy resin, thermal curing agent, photoinitiator, and a compound having an epoxy group and a radically-polymerisable group. The compound may be presen

According to an aspect of the invention, a method of fastening a second object to a fiber composite part comprising a structure of fibers embedded in a matrix material is provided, the method comprising - Providing the fiber composite part comprising an attachment surface, with a portion of the structure of fibers being exposed at the attachment surface; - Providing the second object; - Placing the second object relative to the fiber composite part, with a resin in a flowable state between the attachment surface and the connector; - Pressing the second object and the fiber composite part against each other and causing mechanical vibration to act on the second object or the fiber composite part or both, thereby causing the resin to infiltrate the exposed structure of fibers and activating the resin to cross-link; - Whereby the resin, after cross-linking, secures the second object to the fiber composite part. In the step of causing mechanical vibration to act and thereby activating the resin to cross-link, only a portion of the resin is activated to cross link, whereas a further portion of the resin remains essentially uninfluenced by the mechanical vibration.

To provide a method for manufacturing a thin processed glass which can suppress occurrence of a void wall between a support and a thin glass, thereby can temporarily and uniformly fix the thin glass when processing the thin glass, and can prevent contamination of the thin processed glass.SOLUTION: A method for manufacturing a thin processed glass includes the steps of: preparing an adhesive film 10 having a base material layer 12, an adhesive resin layer 14 provided on a first surface 12a side of the base material layer 12, an adhesive resin layer 16 provided on a second surface 12b side of the base material layer 12, and an intermediate layer 18 which contains thermally expandable microspheres (a) on at least one of the adhesive resin layer 14 and the adhesive resin layer 16, and is provided between the adhesive resin layer and the base material layer 12 containing thermally expandable microspheres (a); bonding the adhesive film 10 onto a support 20 through the adhesive resin layer 16; temporarily fixing thin glass 30 onto the surface of the adhesive resin layer 14; and processing the thin glass 30.SELECTED DRAWING: Figure 1

A moisture curable hot melt adhesive composition that includes isocyanate-terminated polyurethane prepolymer that includes the reaction product of a crystalline polyester polyol, a polyether polyol, and di isocyanate, clay, polyester / polyether elastomer, a first thermoplastic polymer selected from the group consisting of ethylene vinyl acetate copolymer, ethylene (alkyl)acrylate copolymer, and combinations thereof a tackifying agent, and optionally a second thermoplastic polymer selected from the group consisting of thermoplastic polyurethane, thermoplastic polycaprolactone, and combinations thereof.

The present invention relates to a two-component polyurethane adhesive composition for film lamination in hot-fill applications. The present invention further relates to a method for producing a laminate using said two-component polyurethane adhesive composition, and to the laminate obtained by said method.

The present invention relates to a thermosetting epoxy resin composition comprising a dihydrazide as curing agent, in combination with an accelerator of an imidazolium salt as curing agent, the molar ratio of curing agent to accelerator being 6-120. The compositions are characterized by good storage stability and low cure temperature. The epoxy resin composition is particularly suitable for use as a vehicle body adhesive.

The present invention is a temporary adhesive material for wafer processing, used for temporarily bonding a support and a wafer having a circuit-forming surface on a front side and a backside to be processed, including a composite temporary adhesive material layer having a two-layered structure that includes a first temporary adhesive layer including a thermoplastic resin layer (A) capable of peelably adhering to the front side of the wafer, and a second temporary adhesive layer including a thermosetting siloxane polymer layer (B) laminated on the first temporary adhesive layer. Accordingly, the present invention provides a temporary adhesive material for wafer processing that has, irrespective of the surface treatment of the wafer substrate, stable wafer processability, excellent peelability of the support, and easy cleaning removability of the temporary adhesive material layer after peeling of the support, can be formed with uniform film thickness even on a substrate with a large step height, exhibits high process compatibility with TSV formation and wafer backside wiring processes, and furthermore exhibits excellent resistance to wafer thermal processes such as chemical vapor deposition (CVD), thereby enhancing the productivity of thin wafers.

An article includes a substrate, and a film-based article comprising a non-crosslinked thermoplastic rubber. At least a portion of the film-based article is fixed to the substrate. In particular, said portion of the film-based article is firmly fixed to the substrate by heat sealing at a temperature of 190 to 250° C. for at least 1 second, without using a glue, an adhesive coating, or a corona discharge treatment.

To provide a technique for increasing adhesive strength between a glass component and a resin component.SOLUTION: A bonding method bonds a glass component 210 having a first surface and a second surface facing an opposite side to the first surface, and a resin component 230. Printing by acrylic ink is performed on the first surface 212 of the glass component 210, the first surface 212 of the glass component 210 and the resin component 230 are made to face each other, and the glass component 210 and the resin component 230 are overlapped. An IR laser beam 300 is emitted toward a print 216 from the first surface 212 of the glass component 210, and the glass component 210 and the resin component 230 are welded by melting heat of the print 216.SELECTED DRAWING: Figure 3

The present invention relates to a composite comprising a layer (LL) and an adhesive layer (LA) which are at least partially in contact, wherein the layer (LL) comprises a polymer composition with a softening temperature in the range of from -15 °C to less than 40 °C or 40 °C to 200 °C. Furthermore, the present invention relates to a process for preparing said composite and a process comprising separating said composite into its parts by applying debonding conditions (CD).

A method for preparing a retreaded tire, the method comprising (a) providing a tire casing; (b) providing a pre-cured tire tread; (c) applying a primer composition to the tire casing, the pre-cured tread, or both the tire casing and the pre-cured tread therefore form at least one primer layer, where the primer composition includes a halogenating agent and a solvent; (d) applying a urethane-based adhesive composition to at least one of the tire casing, an adhesive layer, the pre-cured tread, or the at least one primer layer; (e) mating the pre-cured tread to the tire casing to thereby sandwich the adhesive layer between the pre-cured tread and the tire casing and form a pre-cured composite: and (f) allowing the adhesive layer of the pre-cured composite to cure and thereby form a retreaded tire.

A laminate containing: a layer (I) mainly composed of an acrylic resin; a layer (II) mainly composed of a polyolefin resin; and an adhesive layer (III) provided between the layer mainly composed of an acrylic resin and the layer mainly composed of a polyolefin resin,wherein the adhesive layer (III) is formed from an adhesive component mainly composed of a hydrogenated conjugated diene block copolymer having two or more polymer blocks selected from the group consisting of a polymer block (A) mainly composed of vinyl aromatic monomer units, a polymer block (B) mainly composed of conjugated diene monomer units, and a polymer block (C) having vinyl aromatic monomer units and conjugated diene monomer units, in which unsaturated bonds in conjugated diene monomer units are hydrogenated, andthe hydrogenated conjugated diene block copolymer satisfies predetermined requirements.