1928results about "Adhesive processes with adhesive heating" patented technology

A susceptor composition that can bond two or more layers or substrates to one another and that can be used to coat or cut a substrate. The susceptor composition is activated in the presence of radio frequency (RF) energy. In one embodiment, the susceptor composition of the present invention comprises a susceptor and a carrier. The carrier and susceptor are blended with one another and form a mixture, preferably a uniform mixture. The susceptor is present in an amount effective to allow the susceptor composition to be heated by RF energy. In a preferred embodiment, the susceptor also functions as an adhesive. The susceptor is an ionic or polar compound and acts as either a charge-carrying or an oscillating / vibrating component of the susceptor composition. The susceptor generates thermal energy in the presence of an RF electromagnetic or electrical field (hereafter RF field).

The invention is a composition comprising applying to a substrate a stream of an adhesive comprising: one or more epoxy resins; one or more rubber modified epoxy resins; one or more toughening compositions comprising the reaction product of one or more isocyanate terminated prepolymers and one or more capping compounds having one or more phenolic, benzyl alcohol, aminophenyl, or, benzylamino groups wherein the reaction product is terminated with the capping compounds; one or more curing agents for epoxy resins and one or more catalysts which initiate cure at a temperature of about 100° C. or greater; and optionally; fillers adhesion promoters, wetting agents or rheological additives useful in epoxy adhesive compositions; wherein the adhesive composition has a viscosity at 45° C. of about 20 Pa.s to about 400 Pa.s. The composition can be used as an adhesive and applied as a stream using a high speed streaming process.

An RF heating system for bonding a first element to a second element. In one embodiment, the RF heating system includes: (a) a composition, which functions as an adhesive, interposed between the first and second elements, the composition including an ionomer and a polar carrier, wherein the ionomer and / or the carrier are present in amounts effective to allow the composition to be headed by a fringe RF field; and (b) a radio frequency (RF) heating apparatus for producing the fringe RF field.

An improved cushioned carpet fabric is provided. The cushioned carpet comprises a primary carpet having a primary base and a plurality of pile-forming yarns projecting outwardly from one side. A layer of reinforcement material is bonded to the primary base on the side opposite the pile forming yarns. The reinforcement layer is adjacent to and embedded in, a cushion layer of a polymer such as a polyurethane. There is preferably no additional adhesive between the cushion layer and the layer of reinforcement material since the primary carpet fabric is mated in-situ to the polyurethane-forming composition without preheating the polyurethane-forming composition. An apparatus and process for forming the cushioned carpet fabric of the present invention are also provided.

The determination of analyte concentration in physiological samples is of ever increasing importance to today's society. Such assays find use in a variety of applications, including clinical laboratory testing, home testing, etc., where the results of such testing play a prominent role in the diagnosis and management of a variety of disease conditions. An apparatus is described herein which may be used for the manufacture of medical devices which include an integrated lancet and sensor.

In one embodiment the invention is An adhesive composition comprisinga) a polymer having a flexible backbone and a reactive moiety capable of cross-linking,b) a particle comprising an active agent encapsulated in an encapsulating agent wherein the active agent comprises a catalyst for cross-linking of the reactive moiety, a curing agent for the reactive moiety, an accelerator for the curing reaction or a mixture thereof; and the encapsulating agent comprises a side chain crystallizable polymer wherein the active agent is not substantially extractable from the particle at ambient conditions in a first extraction after particle formation.This composition is used in binding two subtracters together.

A susceptor composition that can bond two or more layers or substrates to one another and that can be used to coat or cut a substrate. The susceptor composition is activated in the presence of radio frequency (RF) energy. In one embodiment, the susceptor composition of the present invention comprises at least one ionomer and a polar carrier. The ionomer and polar carrier are blended with one another and form a mixture, preferably a uniform mixture. The ionomer and polar carrier are present in an amount effective to allow the susceptor composition to be heated by RF energy. Also disclosed are RF induction heating systems.

The determination of analyte concentration in physiological samples is of ever increasing importance to today's society. Such assays find use in a variety of applications, including clinical laboratory testing, home testing, etc., where the results of such testing play a prominent role in the diagnosis and management of a variety of disease conditions. In the present application, a method is described which may be used for the manufacture of medical devices which include an integrated lancet and sensor.

Two-component systems are described which are suitable for underlining, adhesive bonding of the crimped fold and sealing of auto body sections, particularly for crimped fold sealing of add-on vehicle parts. The two-component systems attain the requisite grip strength for mounting the add-on parts on the body as well as the requisite strength and dimensional stability for the production process up to and with the CIP passage, within the predetermined cycle time, on the basis of cross-linking of the sealant composition twice. In one embodiment, the surface of the two-component system is pre-cross-linked by a UV-induced reaction and by the cross-linking of the two-component system to the extent of portability. In addition, two-component systems are described which cross-link intentionally only partially up to a consistency that permits a rugged course of the process through cleaning baths and which harden completely only by means of a further hardening process, for instance in the CIP forced circulation oven.

Electromagnetic interference (EMI) shielding structure and methods of making such structures are provided. In one case, a method is provided for making a lightweight composite structure for electromagnetic interference shielding, including the steps of providing a nanoscale fiber film which comprises a plurality of nanoscale fibers; and combining the nanoscale fiber film with one or more structural materials to form a composite material which is effective as an electromagnetic interference shielding structure. In another case, a method is provided for shielding a device which includes an electrical circuit from electromagnetic interference comprising the steps of providing a nanoscale fiber film which comprises a plurality of nanoscale fibers; and incorporating the nanoscale fiber film into an exterior portion of the device to shield an interior portion of the device from electromagnetic interference.

An inventive composition and process for formation of a conductive bonding film are disclosed. The invention combines adhesive bonding sheet technologies (e.g. die attach films, or DAFs) with the electrical and thermal conductivity performance of transient liquid phase sintered paste compositions. The invention films are characterized by high bulk thermal and electrical conductivity within the film as well as low and stable thermal and electrical resistance at the interfaces between the inventive film and metallized adherends.

An improved cushioned carpet fabric is provided. The cushioned carpet comprises a primary carpet having a primary base and a plurality of pile-forming yarns projecting outwardly from one side. A layer of reinforcement material is bonded to the primary base on the side opposite the pile forming yarns. The reinforcement layer is adjacent to and embedded in, a cushion layer of a polymer such as a polyurethane. There is preferably no additional adhesive between the cushion layer and the layer of reinforcement material since the primary carpet fabric is mated in-situ to the polyurethane-forming composition without preheating the polyurethane-forming composition. An apparatus and process for forming the cushioned carpet fabric of the present invention are also provided.

Hot-curing structural adhesives with multiphase polymer morphology, wherein the binder matrix of the cured chemically reactive adhesive displays (a) a continuous phase containing a polymer P1 having a glass transition temperature of over 100° C.; (b) a heterodisperse phase consisting of individual continuous domains of a thermoplastic or elastomeric polymer P2 having a glass transition temperature of below −30° C. and an average particle size of between 0.5 and 50 μm, which itself contains separate phases of another thermoplastic or elastomeric polymer P3 having a glass transition temperature of below −30° C. and a size of between 1 nm and 100 nm, parts of which can be in aggregated form as larger agglomerates; and (c) another heterodisperse phase embedded in the continuous phase and consisting of domains of the polymer P3, at least parts of which have an average particle size of between 1 nm and 50 nm, wherein P3 is not identical to P2; are suitable as high-strength, impact resistant structural adhesives, for internal stiffeners for cavities in automobile construction and for the production of reinforcing coatings for thin-wall sheet components.

Surface modification layers and associated heat treatments, that may be provided on a sheet, a carrier, or both, to control both room-temperature van der Waals (and / or hydrogen) bonding and high temperature covalent bonding between the thin sheet and carrier. The room-temperature bonding is controlled so as to be sufficient to hold the thin sheet and carrier together during vacuum processing, wet processing, and / or ultrasonic cleaning processing, for example. And at the same time, the high temperature covalent bonding is controlled so as to prevent a permanent bond between the thin sheet and carrier during high temperature processing, as well as maintain a sufficient bond to prevent delamination during high temperature processing.

An adhesive material and articles incorporating the same is disclosed. The adhesive material includes at least three of epoxy resin; impact modifier; flexibilizer, blowing agent; curing agent; and filler. The adhesive material is preferably used for structural adhesion but may be used for sealing, baffling or reinforcing an article of manufacture such as an automotive vehicle.

The invention relates to a process for producing a bond between a first and a second substrate (2, 4), comprising:a) a step of preparing surfaces (6, 8) to be assembled,b) an assembly of these two surfaces, by direct molecular bonding,c) a heat treatment step involving at least maintaining the temperature within the range of 50° C. to 100° C. for at least one hour.

A semiconductor chip module uses a silicone adhesive between the semiconductor chip and a cap, said adhesive having sufficient bond strength to secure said cap to said chip without additional mechanical constraint while providing a direct thermally conductive path and permitting sufficient heat flow from said chip to said cap to maintain steady state operation of said semiconductor chip. The preferred silicone adhesive comprises a primerless, two-part polysiloxane-based adhesive made by reacting polydimethyl siloxane, an organosilicon compound, a polysiloxane, and a silane, in the presence of a catalyst.

A high-quality solar battery module having an excellent adhesive property, weathering resistance, and reliability of battery function and a method of assembling the same are disclosed. The solar battery module is constituted of a solar cell panel provided with solar cell elements arranged on the back said of a transmitting panel opposite to the light-receiving surface of the light-transmitting panel; and a frame provided with plate or flange projecting therefrom and arranged over the entire periphery of the panel in order to support the back side of the light-transmitting panel and keeps the light-receiving surface in open. The solar cell panel is bonded to the projecting plate of the frame with a moisture curing hot-melt adhesive composed mainly of a polymer containing at least two hydrolytic silyl group in one molecule.

Electrically conductive workpieces with facing surfaces are bonded with an adhesive that is filled with conductive metal particles that are reactive with the surfaces of the workpieces. In the bonding process the surfaces are coated with the adhesive, pressed together and an electric current passed between them to momentarily melt the conductive particles. The molten droplets agglomerate and wet the facing surfaces. When the molten clusters re-solidify, electrically conductive paths are formed between the workpieces. For example, the practice is useful for bonding ferrous-based or aluminum-based alloy sheets, strips or plates in making products such as bipolar plates for fuel cells.

Laminated composites such as noise damping sheet metal sandwiches with viscoelastic adhesive cores are strengthened against delamination during forming and made more conductive for welding. Electrically conductive, metal-element containing particles, wires, wire meshes, or the like conductive bonding elements are included in the core material and fused to facing surfaces of the metal sheets to provide many mechanical bonding connections and electrical connections over the bonded area of the composites.

The invention concerns an adhesive composition for producing thermoset products, capable of being heated by means of an electric field, a magnetic field, an electromagnetic field or an alternating electromagnetic field, and containing filler particles which are metallic, ferromagnetic, ferrimagnetic, superparamagnetic or paramagnetic. Said adhesive composition can be hardened under the action of heat to form a high-resistance stable adhesive assembly, said resulting adhesive assemblies capable of being likewise dissociated under the action of heat.

The invention provides derivatives of poly(styrene-co-allylalcohol). These materials are useful as thermosetting monomers that can be incorporated into adhesive compositions. In some embodiments, the adhesive compositions are useful in the microelectronic packaging industry.

A handling layer and adhesive parts having the handling layer are formed according to the present invention along with used therefore.

A first substrate may be joined to a second substrate using an adhesive body. The adhesive body is formed from an adhesive composition containing at least one epoxy resin, at least one heat-activatable curing agent, and at least one radiation-curable compound. A first surface of the adhesive body is exposed to an amount of radiation effective to cure at least a portion of the at least one radiation-curable compound present in proximity to such first surface, thereby rendering said first surface less tacky and / or more resistant to deformation. A second surface of the adhesive body is then applied to a surface of said first substrate. A surface of the second substrate is thereafter positioned proximate to or in contact with the first surface of the adhesive body and the adhesive body heated to a temperature effective to activate the heat-activated curing agent and induce curing of the at least one epoxy resin.

The present invention provides a paper-based lidding material, which includes a paper layer and a layer containing a cyclic olefin copolymer. The material is useful for blister packaging and particularly suitable for push-through pharmaceutical and food blister packaging. In one embodiment, the lidding material is formed by extrusion coating and includes at least one paper layer, at least one primer layer, at least one tie layer, at least one barrier layer containing one or more cyclic olefin copolymers, and at least one sealant layer in that order. In another embodiment, the paper-based lidding material includes a paper layer laminated to one or more barrier layers containing one or more cyclic olefin copolymers adjacent to one or more sealant layers. Embodiments of the invention can be sealed to a variety of blister films, including films that are chloride-free, to provide environmentally benign blister packages having good moisture properties.

When heat or UV radiation is applied to an adhesive tape (130) which bonds a semiconductor wafer (110) to a carrier (120), the appropriate lift-off time for separating the wafer from the carrier is determined by monitoring the thickness (T or ΔT) of the wafer / tape / carrier sandwich. When the thickness or the thickness change has reached a predefined value or range of values, independently moveable driving members (510R) drive the wafer or the carrier with small forces at a plurality of spaced-apart locations along the periphery. As a result, the lift-off is initiated at the location of the weakest adhesion.

The present invention is directed to a method for improving the adhesion between a conductive laminate and a substrate material. In a preferred embodiment of the present invention, the conductive laminate is a copper film and the substrate material comprises polyphenylene ether resin. The method involves admixing a copolymer of a vinyl aromatic compound and an alpha , beta -unsaturated cyclic anhydride with the polyphenylene ether resin. The copolymer of a vinyl aromatic compound and an alpha , beta -unsaturated cyclic anhydride is preferably a polystyrene maleic anhydride copolymer or a rubber modified polystyrene maleic anhydride copolymer.

New spin-on, bonding compositions and methods of using those compositions are provided. The cured bonding compositions comprise a crosslinked oxazoline (either crosslinked with another oxazoline or with a crosslinking agent), and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can be thermally decomposed at 285° C. or higher to allow the wafers to slide apart at the appropriate stage in the fabrication process.