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2009 results about "Adhesive materials" patented technology

Cement - something that hardens to act as adhesive material. library paste, paste - an adhesive made from water and flour or starch; used on paper and paperboard. rubber cement - an adhesive made by dissolving unvulcanized rubber in a solvent like benzene or naphtha.

Medical device for delivering patches

The present invention relates to a medical device and method for treating the body tissue of a patient. The present invention is also directed to a method of making the medical device and a method of using the medical device. More particularly, the invention relates to a medical device which is inserted into the body for delivery of therapeutic patches to the surface of a body lumen, organ or cavity. Specifically, the medical device has an umbrella-like or a basket-like expandable assembly; and a therapeutic patch. The expandable assembly is capable of changing from a retracted position to an expanded position. The expandable assembly can be self-expanding or non-self-expanding. In one embodiment, the medical device comprises an elongated member; an umbrella-like expandable assembly which has a plurality of wire elements; and a therapeutic patch. The therapeutic patch comprises a sheet having two opposing surfaces wherein one of the surface comprises an adhesive material and at least one biologically active material. The other opposing surface is disposed onto the plurality of wire elements of the umbrella-like expandable assembly. In another embodiment, the medical device comprises an elongated member, a basket-like expandable assembly having a plurality of wire elements; and a therapeutic patch. The therapeutic patch is disposed onto the plurality of wire elements of the basket-like expandable assembly.

Hermetic wafer scale integrated circuit structure

A wafer scale semiconductor integrated circuit packaging technique provides a hermetic seal for the individual integrated circuit die formed as part of the wafer scale structure. A semiconductor wafer is manufactured to include a number of individual semiconductor die. Each individual die formed on the wafer includes a number of bond pads that are exposed on the die surface in various locations to provide electrical connections to the circuitry created on the die. The wafer further includes a planar glass sheet that is substantially the same size as the wafer, the glass sheet being adhered to the wafer using a suitable adhesive. The glass sheet has a number of pre-formed holes in it, the arrangement of the pre-formed holes corresponding to the location of the bond pads at each of the individual semiconductor die formed as part of the wafer structure. Following adherence of the glass sheet to the semiconductor wafer utilizing the intermediate adhesive material, metal connections are made between pads formed on the glass sheet and the bond pads formed on the integrated circuit die. Solder balls are then attached to the pads on the glass sheet to provide a conductive flow between the solder balls and the bond pads. After the solder balls are attached, trenches are cut around each of the individual die on the wafer. The trenches are cut at an angle and extend through the glass sheet and the intermediate adhesive material and into the semiconductor substrate in which the integrated circuits are formed. After the trenches are cut around each individual semiconductor die, a noble metal is deposited on the sidewalls of the trench to extend over the interface between the glass sheet, the adhesive material and the semiconductor die. The wafer is then cut along the noble metal lined trenches to provide individual, hermetically sealed packaged integrated circuit die.

Modified secondary backing fabric, method for the manufacture thereof and carpet containing the same

InactiveUS6060145AIncrease delamination strengthGood dimensional stabilityLayered productsWoven fabricsFiberYarn
A modified secondary backing fabric (20) for carpet (50) comprises a secondary backing scrim fabric (15) and a fiber batt (21) integrated with the secondary backing fabric forming the modified fabric, providing a soft face (51) opposite the face (52) presented by the scrim fabric, uninterrupted by the scrim fabric. A carpet (50) comprises a face yarn (11); a primary backing fabric (12), the face yarn being tufted into the primary backing fabric; a modified secondary backing fabric (20) attached to the primary backing fabric; and an adhesive material (14) binding the face yarn to the primary backing fabric and the primary backing fabric to the secondary backing fabric. The modified secondary backing fabric (20) comprises a secondary backing scrim fabric (15) and a fiber batt (12) integrated as a unitary scrim, providing a soft face (51) forming the underside of the carpet, the soft face forming a barrier uninterrupted by the scrim fabric and blocking exudation of any of the adhesive material from the underside of the carpet. A method for the manufacture of a modified secondary carpet backing (20) comprises selecting a secondary backing scrim fabric (15) and a fiber batt (21); joining the two fabrics to form the modified secondary carpet backing (20), providing a soft face (51) opposite the face (52) presented by the scrim fabric, uninterrupted by the scrim fabric; and subjecting the modified fabric to heat sufficient to remove substantially all loose fibers (45) projecting from the soft surface. The present invention also provides a method for the manufacture of carpet.

Device for surface stimulation of acupuncture points

A device, which is preferably disc shaped, has two primary layers. A first layer has one side, which is the lower side in use, for adhering to a patient's skin surface, a second, upper layer on the underside of which electrical circuitry is printed or affixed so that the electrical circuitry is sandwiched between the layers. The device can be made in several sizes to accommodate patient size and location of the acupuncture point to be stimulated. Two distinct forms of the device are presented: a single use and a reusable device for. In the single use device, the first, lower layer is preferably a foam with non-conductive adhesive on both sides: the bottom side for adhering to the skin and the top side for adhering to the upper polyester disc. The holes through this lower foam layer include, preferably, eight holes spaced concentrically about one central hole in the middle of the lower foam layer. All these holes are, preferably, overfilled with an electrically conductive gel that projects from the lower foam layer. The conductive circuitry preferably printed on the underside of the upper layer provides a series connection to the gel in each of the eight concentric holes and a separate connection to the gel in the center hole when the upper layer is adhered to the lower layer. The printed circuitry may be a silver/silver chloride polymer film, also provides for a tab(s) which can be permanently or temporarily affixed to an integral or remote simulator through direct contact or wire leads. In the reusable device a pressure-sensitive adhesive material forms the lower layer which allows for multiple applications to a patient's skin. The adhesive lower layer is transparent to show the circular central electrode the annular electrode. The electrodes are preferably silver/silver chloride polymer film. In either configuration, metal core insulated leads can be use for electrical connection with the opposite ends of the leads connected to jacks for connection to an impulse stimulator or can end in electrically conductive tabs.
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