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3118results about How to "Lower surface energy" patented technology

Method for preparing super-hydrophobic antireflex micron and nano composite structure surface

The invention belongs to the technical field of preparing the surface of a composite structure, and in particular relates to a method for preparing super-hydrophobic antireflective silicon surface with a micron and nanometer composite structure. The method comprises the following steps: cleaning a silicon chip; preparing a micron-level silicon island and a gridding structure on the surface of the silicon chip; carrying out catalytic etching taking silver or aurum nanoparticles as blockage; obtaining the surface of the micron and nanometer composite structure; and carrying out chemical modification of the surface of the composite structure. A static contact angle between the super-hydrophobic antireflective material surface prepared by the method and water is more than 150 degrees, and a static rolling angle of water is less than 3 degrees. The surface has superior antireflective performance, and in particular, the light reflectivity within the wavelength range between 800 and 1,100 nm is less than 3 percent. With application of the method, the super-hydrophobic antireflective silicon surface of the micron and nanometer composite structure can be produced on scale, can be widely applied to a solar cell, a microfluidic chip, a photoelectric device, and the like, and has good industrial application prospect.
Owner:JILIN UNIV

Filler masterbatch used for increasing polarity of polypropylene and preparation method thereof

The invention discloses a filler masterbatch used for increasing the polarity of polypropylene and a preparation method thereof. The filler masterbatch is characterized by comprising the following components by weight percent: 50%-79% of inorganic filler, 15%-30% of carrier, 5%-17% of polar additive and 1%-3% of processing additive; and the polar additive is one or more of thermoplastic polyurethane resin (TPU), maleic anhydride grafted polypropylene, epoxy resin, ethylene acrylate, ethylene vinyl acetate, polyether amine and polybutylene polyol. In the preparation method of the invention, the added carrier can not improve the polarity of polypropylene, the inorganic filler is used to increase the rigidity of the material; the key is to introduce the polar additive with high unipolarity, thus the filler masterbatch used for increasing the polarity of polypropylene can be prepared; when the filler masterbatch is combined with the polypropylene material for production, the surface polarity of the filled and modified polypropylene material can be increased, the surface energy of the filled and modified polypropylene can be reduced, the dimension stability can be increased, the modified polypropylene material can have good paint adhesion and the material can be used to form exterior trimming parts such as bumpers and interior trimming parts such instrument panels.
Owner:KINGFA SCI & TECH CO LTD +3

Diamond wire saw production method of surface modified diamond

InactiveCN101812710AAchieve electroplating depositionEasy to operateElectrophoretic coatingsElectrophoresisDiamond wire saw
The invention relates to a diamond wire saw production method of a surface modified diamond, which comprises the following steps: 1. removing surface grease and surface metal oxides on the surface of the diamond; 2. placing diamond micropowder into a cationic surfactant solution, applying positive potential and forming a layer of positive charge film on the surface of the diamond under the electrophoretic action by action of a cationic surfactant; and 3. carrying out composite electroplating of a diamond wire saw. In the invention, conductive processing is carried out on the diamond, so that diamond grains can orderly move in a plating solution under the action of an electric field to realize the electroplating deposition on the surface of a metal wire without the influence of the size of the diamond grains; the surfactant is adsorbed on the surface of the diamond, so that a plating layer and the diamond present an infiltrative type interface, and a Ni plating layer has strong holding capability on the diamond; and the diamond micropowder has high utilization ratio. The invention has simple process method and convenient operation, the diamond grains have rapid deposition speed, good deposition uniformity and high deposition density on the metal wire, an electroplating layer has high holding force on the diamond grains, and the diamond micropowder has high utilization ratio. The invention can realize industrialized production and provides a method for efficiently and rapidly producing the diamond wire saw.
Owner:CHANGSHA DIAT NEW MATERIAL SCI & TECH
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