7022results about "Macromolecular adhesive additives" patented technology

The invention discloses a pure bio-based polyhydroxyalkanoate adhesive as well as preparation and application thereof, and belongs to the technical field of degradable adhesives. According to the adhesive, polyhydroxybutyrate valerate or polyhydroxybutyrate hexanoate is used as a matrix, and the acid value reaches 2-15 mg KOH / g through molten end group activation; a reactive emulsifier with a hydrophilic-lipophilic balance value of 9-12 is introduced into a water phase, and the stable aqueous dispersion is prepared through phase inversion high-shear emulsification. The Z-average particle size of the dispersion is 0.12-0.30 [mu] m, and the content of the free surfactant is not higher than 30wt%. After the tackifying resin, the plasticizer and the vegetable wax are compounded, the bio-based carbon content of the obtained adhesive is not lower than 95%, and the volatile organic compound content is not higher than 100 mg / kg. The paper / paper heat sealing strength of the adhesive is not lower than 7.0 N / 15mm, the 180-degree peel strength is not lower than 7.5 N / 25mm, and the adhesive can pass repulping evaluation.

The invention relates to the technical field of folding screen supporting films, and particularly discloses a double-layer buffering supporting film for a flexible folding display screen and a preparation method of the double-layer buffering supporting film. The double-layer buffer supporting film for the flexible folding display screen sequentially comprises a release film layer, a first adhesive layer, a first stainless steel layer, a second adhesive layer, a second stainless steel layer and a protective film layer from top to bottom, the first adhesive layer and the second adhesive layer are prepared by curing the same pressure-sensitive adhesive composition; the pressure-sensitive adhesive composition is prepared from the following raw materials: acrylate copolymer, hydrogenated rosin glyceride, hyperbranched polyesteramide-dopamine conjugate, acylhydrazone bond modified siloxane, a curing agent and a silane coupling agent; the protective film layer comprises the following raw materials: PET particles, nano silicon dioxide, an ethylene-vinyl acetate copolymer and an antioxidant. The double-layer buffer supporting film has the advantages of being high in supporting rigidity and interlayer peel strength, and serious folds caused by long-term repeated folding of the folding screen can be relieved.

The invention discloses a nano-modified high-temperature-resistant adhesive tape and a preparation method thereof, and relates to the technical field of high polymer materials. The adhesive tape adopts a three-layer composite structure design, wherein a base material layer is a polyimide-boron nitride nanowire composite film, and an in-plane oriented three-dimensional heat-conducting network is formed through electrostatic spinning; the nano modified adhesive layer comprises an organic silicon prepolymer PDMS, epoxy resin E-51 and a surface aminated montmorillonite / hydroxylated silicon carbide nanowire composite system, and D90lt is realized through three-roller grinding; nano dispersion with the particle size of 200 nm; the functional coating is made of a plasma sprayed Al2O3 / graphene compound, and the porosity is 15-20%. The preparation method innovatively comprises the following steps: carrying out magnetron sputtering on a 5nm titanium transition layer to improve the interface bonding strength to be greater than or equal to 25N / cm; and a compact cross-linked shell layer is formed through a stepped curing process and electron beam radiation. After the adhesive tape is aged at 400 DEG C for 1000 hours, the peel strength retention rate is larger than or equal to 91.3%, the shear strength reaches 18.7 MPa, the in-plane thermal conductivity is improved by 43 times compared with pure polyimide, and the volume resistivity is gt after the adhesive tape is subjected to a salt spray test for 500 hours; the thickness is 1015 omega.cm.

The invention relates to a mildew-proof silicone sealant with high curing rate and high adhesive strength, and belongs to the technical field of adhesives. The anti-mildew coating is prepared from alpha, omega-dihydroxy polydimethylsiloxane, dimethyl silicone oil, fumed silica, phenoxy resin coated nano calcium carbonate, a modified hydroxypropyl-gamma-cyclodextrin loaded mildew preventive, dibutyltin dilaurate, methyltrimethoxysilane and a curing accelerator. According to the mildew-proof silicone sealant with the high curing rate and the high adhesive strength, the surface drying time is 9-13 minutes, the 24-hour curing depth is 6.3-7.2 mm, the adhesive strength is 3.0-3.6 MPa, the tensile strength is 5.8-6.4 MPa, the shear strength is 3.0-3.9 MPa, the elongation at break is 410-457%, and the mildew-proof grade is 0 grade in 30 days, 60 days, 180 days and 360 days.

The invention provides a bio-based adhesive and a preparation method thereof. Inspired by a spider thread structure, biomass adhesive interface enhancement based on a tannic acid adhesion group is combined with construction of a differential phase separation structure by biomass-induced polylipoic acid depolymerization, and a brand new strategy of adhesion-cohesion synergistic enhancement of the adhesive strength of the adhesive is realized. According to the invention, tannic acid and carboxymethyl chitosan are introduced into a lipoic acid-based adhesive, so that the purpose of synergistically enhancing the bonding performance of the adhesive through adhesion-cohesion is achieved, and the defects of weak cohesion, low bonding strength, poor water resistance, poor moisture resistance and the like of the conventional biomass adhesive are overcome. Benefited from a new strategy of adhesion-cohesion synergistic enhancement, the biomass adhesive has good adhesive strength in various environments and materials. In addition, the biomass adhesive also has the characteristics of biological safety, antibacterial and mildew-proof properties and recoverability, so that the product has wider application and potential compared with the previous product, and has a good application prospect.

The invention relates to the technical field of adhesives, in particular to a UV-thermal dual-curing adhesive and a preparation method thereof. The UV-thermal dual-curing adhesive provided by the invention comprises the following components in parts by weight: 10-30 parts of an acrylate monomer; 5-15 parts of epoxy resin; 5 to 15 parts of epoxy modified N substituted maleimide resin; 1-4 parts of a photoinitiator; 10-25 parts of a latent curing agent; 0.5-2 parts of a stabilizer; 15 to 30 parts of thiol; 1-3 parts of a silane coupling agent; 1-5 parts of a thixotropic agent; and 15-30 parts of a filler. By adding the epoxy modified N-substituted maleimide resin, on one hand, excellent flexibility can be brought to a system; on the other hand, the maleimide ring can enable the system to have excellent humidity and heat resistance, and the prepared adhesive can be applied to adhesion of camera modules in various application scenes.

To provide an ultraviolet curable adhesive composition which has excellent ultraviolet curability in the presence of oxygen, and excellent waterproof and dustproof properties, while exhibiting excellent shape stability after printing, and an ultraviolet curable adhesive composition which exhibits excellent curability when irradiated with ultraviolet light with high illuminance in the presence of oxygen, while achieving excellent adhesion and retention performance after curing, and also to provide a method for producing a multilayer body using the ultraviolet curable adhesive composition.SOLUTION: The present invention provides an ultraviolet curable adhesive composition which is used for printing and contains a radically polymerizable monomer, a photopolymerization initiator and a thickening agent, wherein the radically polymerizable monomer contains a compound with a cyclic structure containing a nitrogen atom, and the viscosity as determined using an E-type viscometer at 25°C and 10 rpm is 3 Pa s to 100 Pa s inclusive.SELECTED DRAWING: None

The invention discloses a low-density low-viscosity polyurethane pouring sealant containing plastic microspheres and a preparation method thereof. The pouring sealant comprises a component A and a component B, the component A comprises the following components in parts by weight: 25-40 parts of castor oil polyol and 9-24 parts of modified castor oil polyol containing a benzene ring structure; 15 to 22 parts of polyester polyol; 10 to 17 parts of plastic microspheres; 12-16 parts of a liquid flame retardant; 0.2 to 0.3 part of an amine catalyst; 0.3 to 0.4 part of a metal catalyst; 0.1 to 0.4 part of a coupling agent; 0.1 to 0.4 part of a defoaming agent; 2-6 parts of a dewatering agent; wherein the ester polyol is Zibo charge beauty CM-1830 polyester polyol. The two-component polyurethane pouring sealant with low viscosity, low density and better mechanical property is prepared by selecting the polyester polyol in the component A and selecting and proportioning other components.

The invention discloses a waterproof heat-resistant adhesive and a preparation method thereof, and relates to the technical field of adhesives. Tetramethyltri-3-trifluoropropyl cyclotetrasiloxane is used as a raw material to prepare hydroxyl-terminated organic fluorosilicone oil and modified epoxy resin, fluorine atoms are closely arranged around a main chain of the hydroxyl-terminated organic fluorosilicone oil and modified epoxy resin in an umbrella shape, and the hydroxyl-terminated organic fluorosilicone oil and modified epoxy resin cooperate with organic silicon to improve the waterproof and heat-resistant effects; hydroxyl groups on the oxidized carbon nanofibers are reacted and combined with thiocyanate in vulcanized rubber powder, and hybrid filler is formed; residual active groups on the surface of the oxidized carbon fiber are combined and crosslinked with epoxy resin, so that the heat resistance of the epoxy resin is greatly improved; secondly, phenyl maleic anhydride is used as a cross-linking agent to form a three-dimensional cross-linked structure, and meanwhile, phenyl is introduced into the structure, so that the heat-resistant effect and the waterproof effect of the epoxy resin are further improved, and the adhesive prepared by taking the epoxy resin as the raw material has excellent waterproof and heat-resistant performance. The adhesive prepared by the invention has waterproof and heat-resistant effects.

The invention relates to the technical field of lithium batteries, in particular to a composite binder aqueous solution, a silicon-based negative pole piece and a preparation method and application of the silicon-based negative pole piece. The preparation method of the composite binder aqueous solution comprises the following steps: dissolving a water-based polymer binder and a micromolecular physical crosslinking agent in water, adding pyrrole, stirring, adding an initiator, and mixing to obtain the composite binder aqueous solution. A small molecule physical cross-linking agent is introduced into the water-based polymer binder, and a large number of hydrogen bond binding sites are increased, so that the mechanical property of the binder is remarkably enhanced, and the machinability of the pole piece is further improved. Meanwhile, polypyrrole can be generated in the binder through in-situ polymerization, and the polypyrrole can be tightly coated on the surfaces of the silicon particles through strong interaction between the binder and the silicon particles to form a stable conductive network, so that the charge transfer capability of the electrode is remarkably improved. In addition, the composite binder is also beneficial to formation of a solid electrolyte layer rich in Li-N and participates in formation of a solid electrolyte interface layer, so that the lithium ion transmission capability of the composite binder is further improved.

The invention belongs to the technical field of road engineering materials, and discloses a wide-temperature-range crack pouring adhesive based on rubber modified asphalt and a preparation method thereof.The wide-temperature-range crack pouring adhesive is prepared by taking the rubber modified asphalt as a matrix through a response surface method and adding SBS, basalt fibers and a modifier. The performance of the material is tested through a conventional test, and meanwhile, a test with more characteristics in northeast regions is provided, and the performance of the material is detected through injection depth, viscosity, low-temperature stretching after aging and freeze-thaw cycle stretching. Results show that a test designed by a response surface method has very strong reliability, and the modified heating type crack pouring adhesive added with the basalt fiber can significantly improve the high and low temperature performance of the crack pouring adhesive, and also has good anti-aging performance and freeze-thaw cycle resistance. And the filling depth and the viscosity of the sealant are not obviously lower than those of the same type of sealant.

The invention discloses an IPN multi-element heat-conducting structural adhesive resistant to high and low temperature damp heat and a preparation method thereof, and belongs to the field of IPN multi-element structural adhesives. The structural adhesive is prepared by matching a component A and a component B according to a volume ratio of 0.9: 1.1-1, the component A is prepared from the following raw materials in parts by weight: 10 to 20 parts of silane modified polyether resin A, 10 to 20 parts of silane modified polyether resin B, 2 to 5 parts of amino-containing silane coupling agent, 0.1 to 0.5 part of catalyst, 1 to 2 parts of epoxy curing agent A, 0.5 to 1 part of self-made epoxy curing agent B, 0.1 to 1 part of catalyst, 1 to 3 parts of first aid, 0.01 to 0.03 part of color paste and 50 to 70 parts of first heat-conducting filler; the component B is prepared from the following raw materials: 10 to 20 parts of epoxy resin A, 5 to 10 parts of self-made epoxy resin B, 5 to 10 parts of reactive diluent, 50 to 70 parts of second heat-conducting filler, 0.1 to 1 part of second aid, 0.01 to 0.03 part of color paste and 1 to 1.5 parts of water. The adhesive is environment-friendly in component, has excellent heat-conducting property and excellent operation performance, is smooth in construction, and can be used for firmly bonding a base material.

The invention provides a low-warpage and high-stability film sealing adhesive, a preparation method thereof and a chip packaging method. The film sealing adhesive comprises the following components in percentage by mass: 80%-84% of epoxy modified silicon dioxide, 7%-9% of alicyclic epoxy resin, 8%-10% of an anhydride curing agent, 0.1%-0.2% of a dispersing agent, 0.4%-0.6% of a core-shell structure additive, 0.2%-0.3% of a flatting agent and 0.1%-0.2% of carbon black. The proportion of the epoxy modified silicon dioxide, the alicyclic epoxy resin and the anhydride curing agent is adjusted, and the dispersing agent, the core-shell structure additive and the flatting agent are combined, so that the sedimentation of the filler is reduced, and the internal stress of the film sealing adhesive is alleviated, so that the storage stability of the film sealing adhesive is improved, and the warping of the cured film sealing adhesive is reduced; the surface of the film sealing adhesive has good leveling performance after being printed, and the chip packaging yield can be improved.

The invention relates to an epoxy resin composition and an adhesive film and an LED device containing the epoxy resin composition, and the epoxy resin composition comprises the following components in parts by weight: 5-25 parts of epoxy resin, 2-5 parts of a flexibilizer, 8-20 parts of a curing agent and 1-5 parts of a diffusant, the epoxy resin comprises a combination of organosilicon epoxy resin, alicyclic epoxy resin and other epoxy resin; the content of the alicyclic epoxy resin is 25-50% of the total mass of the epoxy resin; the organic silicon epoxy resin is organic silicon epoxy resin with a specific structure. By adopting the epoxy resin composition with specific composition, the adhesive film with more excellent toughness and thermal shock resistance is prepared, when the adhesive film is applied to LED device packaging, the product yield can be improved, the problems of lamp panel deformation, lamp failure, interlayer cracking and the like caused by warping in the packaging and curing process are avoided, the process stability is improved, and the production cost is reduced. And an effective scheme is provided for large-scale commercial application of the Mini LED.

The invention relates to the field of adhesives, in particular to a structural adhesive epoxy composition and a preparation method thereof. The structural adhesive epoxy composition is prepared from the following raw materials: epoxy resin, a toughening agent, a reinforcing agent, filler, a latent curing agent, a latent accelerant, a chemical foaming agent, a physical foaming agent and the like. Finally, the epoxy composition prepared by the invention can be used as a structural adhesive raw material, has ultrahigh expansion rate, low-temperature rapid curing capacity and structural adhesive property, and also has good mechanical properties and excellent comprehensive application effect, so that the complex requirements of the application field of the prior art on the structural adhesive raw material are met.

The invention relates to the technical field of automobile tires, and discloses a new energy automobile tire self-repairing sealing material adhered with mute cotton. The preparation method comprises the following steps: adding a modified polyurethane adhesive, C5 petroleum resin and a modified carbon nanotube filler into absolute ethyl alcohol, mixing to obtain a self-repairing liquid, adhering polyurethane cotton to the upper part of the self-repairing liquid, and drying to obtain the new energy automobile tire self-repairing sealing material adhered with the mute cotton. Disulfide bonds, boric acid ester bonds and imine bonds introduced into polyurethane through a chain extension reaction and diselenide bonds introduced into carbon nanotubes all belong to dynamic covalent bonds, so that the self-repairing performance of the material is improved; by introducing a rigid benzene ring and naphthyl aromatic structure, the mechanical property of the self-repairing sealing material is improved; the carbon nano tube can play a role in skeleton supporting in a polyurethane matrix, and the mechanical property of the material is further improved by introducing an adamantane rigid structure into the carbon nano tube.

The invention relates to the technical field of new materials, and mainly relates to a double-component low-viscosity ultralow-temperature adhesive as well as a preparation method and a use method thereof. The double-component low-viscosity ultralow-temperature adhesive comprises a component A and a component B. The component A comprises the following components in percentage by mass: 20-40% of bisphenol A epoxy resin, 4-8% of aromatic epoxy resin, 6-10% of polyurethane modified epoxy resin, 1-2% of a rubber toughening agent, 5-20% of a diluent and the balance of an additive. And the component B comprises the following components in percentage by mass: 10-40% of a polyether amine curing agent, 10-40% of a fatty amine curing agent, 10-40% of an aromatic amine curing agent and 10-40% of a phenolic aldehyde amine curing agent. The adhesive provided by the invention has relatively strong compressive strength and excellent toughness, can keep good toughness in a low-temperature environment, is not easy to cause brittle rupture, can bear relatively large mechanical load, and is suitable for various industrial applications.

The invention provides a self-repairing EVA adhesive film and a preparation method thereof, and relates to the technical field of solar photovoltaic module packaging. According to the self-repairable EVA adhesive film disclosed by the invention, through Diels-Alder reactive group grafting and silane coupling agent microencapsulation technologies, a dual self-repairing mechanism of a photovoltaic module packaging adhesive film is realized, and the dual self-repairing mechanism comprises physical rearrangement repairing and chemical bonding repairing; while high light transmittance (more than or equal to 90%) and bonding strength (more than or equal to 96 N / cm) are maintained, the aging resistance (delta YI is less than or equal to 3) of the EVA adhesive film is remarkably improved, the service life of the EVA adhesive film is remarkably prolonged, and the problems that a traditional EVA adhesive film is easy to age in an extreme environment and is easy to suffer from micro damage caused by mechanical stress are solved; the preparation process disclosed by the invention is compatible with the existing production line, and has a relatively high industrial application value.

The invention relates to the technical field of pressure-sensitive adhesives, in particular to a high-temperature-resistant high-impedance pressure-sensitive adhesive, a supporting film and a preparation method of the supporting film. A styrene-butadiene-styrene block copolymer (SBS) is used as a main body material, an acrylic copolymer with high carboxyl content is grafted in a solvent in a thermal initiation mode, the high-temperature-resistant and high-impedance pressure-sensitive adhesive is obtained after the high-temperature-resistant and high-impedance pressure-sensitive adhesive is compounded with tackifying resin, a curing agent and an antioxidant, and after optical-grade PET is coated with the high-temperature-resistant and high-impedance pressure-sensitive adhesive, the high-temperature-resistant and high-impedance pressure-sensitive adhesive is obtained. According to the novel supporting film, the polarity of the SBS main body material is low, the excellent electrical insulation performance is provided, the supporting film body has the characteristic of high impedance, and therefore the requirement for high impedance of the supporting film in a copper bar friction experiment is met; in addition, after the acrylic copolymer with high carboxyl content is grafted, a large number of crosslinking points can be provided, and the overall crosslinking degree is greatly increased after thermocuring, so that the high-temperature modulus of the adhesive layer is improved, and the adhesive layer is endowed with the characteristic of high-temperature deformation resistance.

Provided are: a window material and a light-transparent roof material which can autonomously change white turbidity in accordance with the temperature, and which have a simple structure and are easy to manufacture; and a vehicle, a ship, or an airplane, and a building comprising the window material and / or the light-transparent roof material. A window material or a light-transparent roof material according to the present invention comprises at least one light-transparent base material layer and at least one pressure-sensitive adhesive layer. The pressure-sensitive adhesive layer is formed from a pressure-sensitive adhesive composition containing, with respect to 100 parts by mass of a pressure-sensitive adhesive agent, 1-20 parts by mass of a thermosensitive noncrosslinked polymer and 1-100 parts by mass of thermosensitive crosslinked fine particles. The refractive index of the thermosensitive crosslinked fine particles is reduced as the temperature increases, and the reduction rate of the refractive index is larger in the vicinity of the melting temperature of the thermosensitive crosslinked fine particles than in a temperature range other than the vicinity of the melting point. The adhesive power of the pressure-sensitive adhesive composition is reduced as the temperature increases, and the reduction rate of the adhesive power is larger in the vicinity of the melting temperature of the thermosensitive non-crosslinked polymer than in the temperature range other than the vicinity of the melting point.

The invention discloses an acrylate conductive composite pressure-sensitive adhesive and a preparation method thereof. The acrylate conductive composite pressure-sensitive adhesive comprises a raw material A and a raw material B, wherein the raw material A comprises 5-15 parts of acrylate polymer; 0.10 to 1.00 parts of epoxy resin; 1.0 to 10.0 parts of aniline; 0.1 to 1.0 part of an initiator; 1-5 parts of conductive particles; and 0.010 to 0.100 part of an amine curing agent. The acrylate conductive composite pressure-sensitive adhesive disclosed by the invention has excellent conductivity and capacitance sensing performance, and shows excellent capacitance stability and relatively high sensitivity in a pressure cycle test; on the basis of containing the conductive filler, the pressure-sensitive adhesive still has better hardness, adhesion strength and tensile strength, and the conductive filler is well dispersed and combined in a pressure-sensitive adhesive system.

The invention relates to an EPE type three-layer co-extrusion adhesive film as well as a preparation method and application thereof. The EPE type three-layer co-extrusion adhesive film comprises a first transparent EVA outer layer, a transparent POE middle layer and a second transparent EVA outer layer which are sequentially arranged from top to bottom, the first transparent EVA outer layer and the second transparent EVA outer layer are prepared from an EVA resin composition, and the EVA resin composition comprises the following components: EVA resin, an anti-PID auxiliary agent, a first main cross-linking agent and a second auxiliary cross-linking agent; the transparent POE middle layer is prepared from a POE resin composition, and the POE resin composition comprises the following components: POE resin, a hydrolysis-resistant auxiliary agent, a first main cross-linking agent and a second auxiliary cross-linking agent. According to the EPE type three-layer co-extrusion adhesive film provided by the invention, the preparation method is simple, and the PID resistance and long-term aging resistance of a TOPCON battery photovoltaic single-glass assembly are remarkably improved.

The invention provides a pouring sealant and a preparation method thereof. The pouring sealant comprises a component A, a component B, a component C and a component D, wherein the component A comprises hydroxyl-terminated polydimethylsiloxane, inorganic filler, phase change microcapsules and surface-modified hexagonal boron nitride nanosheets; the component B comprises dimethyl silicone oil, a silane cross-linking agent, a silane coupling agent and an organic tin catalyst. The pouring sealant provided by the invention can effectively prevent corrosive ions and the like in salt mist from entering a diode area of the junction box while ensuring the sealing performance of the diode of the junction box, prevents the phenomenon of corroding the diode, and controls the temperature rise of the junction box in operation through effective thermal management, so that the service life of the junction box is prolonged. And the service performance and the service life of the photovoltaic module junction box in an offshore environment are improved and prolonged.

The invention discloses a glue solution for a copper-clad plate and a preparation method of the glue solution, and relates to the technical field of copper-clad plates. According to the prepared glue solution for the copper-clad plate, the composite epoxy resin, the curing agent, the accelerant, the solvent, the flexibilizer and the inorganic filler, the composite epoxy resin comprises bisphenol A epoxy resin, epoxy phenyl polysiloxane, itaconic acid polyaryletherketone and hydroxyl-terminated fluorine-containing vinyl polysiloxane, so that the interface bonding force with the copper plate is enhanced; the dielectric constant and the dielectric loss are effectively reduced, the peel strength and the toughness of the material are also remarkably improved, and the toughening agent is modified polyether sulfone microspheres; the modified polyethersulfone microspheres are prepared by coating polyethersulfone microspheres with hexamethylenediamine tetrapropionamide diamine, the hexamethylenediamine tetrapropionamide diamine is prepared by carrying out acylation condensation reaction on hexamethylenediamine tetramethyl propionate and ethylenediamine, and the polyethersulfone microspheres are prepared by carrying out electrostatic spinning on a spinning solution of polyethersulfone and vinylpyridine, so that the peel strength of the glue solution is remarkably improved.

The invention discloses a shielding protection adhesive tape for semiconductor integrated circuit packaging and a preparation method thereof, and relates to the technical field of semiconductor integrated circuit packaging. The shielding protective adhesive tape for packaging the semiconductor integrated circuit is prepared by taking polyimide as a base material and coating a coating, and the coating comprises the following raw materials in parts by weight: 3-5 parts of modified nano silicon dioxide, 30-40 parts of N, N-dimethylformamide, 1-3 parts of a curing agent and 1-3 parts of a curing agent. The invention discloses a high-temperature-resistant epoxy resin coating which is prepared from the following components in parts by weight: 25-30 parts of N, N-dimethylformamide, 25-30 parts of a modified acrylate copolymer, 17-26 parts of ethyl acetate, 12-15 parts of epoxy resin, 1-2 parts of a silane coupling agent KH-550, 0.5-1 part of an antioxidant 1010, 0.3-0.8 part of an ultraviolet absorbent UV-327, 1-2 parts of carboxyl-terminated nitrile rubber, 2-4 parts of decabromodiphenyl ether, 0.1-0.3 part of an organic siloxane defoaming agent, 0.2-0.5 part of an acrylate flatting agent and 10-11 parts of diaminodiphenyl sulfone. The adhesive tape contains the modified nano silicon dioxide, the modified acrylate copolymer and other components, so that the performance of the adhesive tape is guaranteed; pretreatment is meticulous, preparation steps are standard, and mass production is easy; a finished product can be effectively shielded, and the packaging yield and the product stability can be improved.

The invention relates to the technical field of building waterproof materials, and provides a multi-layer self-protection self-adhesion waterproof roll and a preparation method thereof. The multi-layer self-protection self-adhesion waterproof roll sequentially comprises an isolating membrane, a self-adhesion glue layer, an elastic polyester felt buffer layer, an adhesive layer and a polymeric membrane layer from top to bottom, and the self-adhesion glue layer is prepared from, by weight, 65-75 parts of butyl rubber, 15-20 parts of SBS modifier, 8-12 parts of tackifying resin I, 0.5-1.5 parts of anti-aging agent, 8-15 parts of filler, 1-3 parts of polyethylene and 1-2 parts of flexibilizer. The tackifying resin I comprises rosin resin. According to the technical scheme, the problems that the self-adhesive waterproof roll does not have the self-protection capability, the peel strength is low and the holding power is poor in the prior art are solved.

The invention relates to the field of epoxy molding compounds, and discloses an epoxy molding compound as well as a preparation method and application thereof. The epoxy molding compound contains a heat-conducting filler, epoxy resin, a curing agent, a curing accelerator, a coupling agent, a bonding modifier, a flame retardant, a coloring agent, a release agent, hydroxyl-terminated silicone oil and a dispersing wetting agent. The heat-conducting filler contains aluminum oxide, crystalline silicon dioxide powder and molten spherical silicon dioxide powder; the bonding modifier is a triazole compound or a gallic acid compound; the weight ratio of the hydroxyl-terminated silicone oil to the heat-conducting filler to the bonding modifier is (1.5-4): (700-800): 1. The epoxy molding compound has the advantages of favorable molding process property, excellent heat-conducting property and high adhesive strength, and is suitable for being used as a packaging material of a fully-packaged power module.

The invention relates to composite resin for packaging a Topcon component as well as a preparation method and application of the composite resin. Comprising an acrylate monomer, an aliphatic polyurethane acrylate oligomer, hydroxyl acrylate, bisphenol A acrylate, maleic anhydride modified epoxy acrylate, a light curing agent, a latent curing agent, a flame retardant A, a flame retardant B, a thixotropic agent, an anti-aging agent, a UV absorbent and a light stabilizer. The composite resin has the comprehensive performance of high viscosity, low shrinkage, super weather resistance and flame retardance, the aluminum-containing backboard prepared from the composite resin is high in water resistance and super weather resistance, due to the fact that light-heat double-stage curing is adopted for curing, the resin collapses and is cured to generate a solid phase, and in the follow-up aluminum foil hot-pressing curing process, the solid phase is solidified to form a solid phase; the resin is further infiltrated and cured, the porosity of the resin can be greatly reduced through a dual-curing system, water cannot enter the interior in the long-term use process, and voltage breakdown reduction of the aluminum-containing back plate under the long-term damp and hot condition is completely eradicated.

The invention provides a leather product and a method for manufacturing the leather product. The leather article comprises a substrate and a coating comprising a cellulose derivative with improved color fastness to rubbing, the cellulose derivative may be methylcellulose, ethylcellulose, ethylmethylcellulose, carboxymethyl cellulose, hydroxyethyl cellulose, hydroxypropyl cellulose, hydroxyethyl methylcellulose, hydroxypropyl methylcellulose, carboxymethyl cellulose, carboxymethyl cellulose, carboxymethyl cellulose, carboxymethyl cellulose, carboxymethyl cellulose, carboxymethyl cellulose, carboxymethyl cellulose, carboxymethyl cellulose, carboxymethyl cellulose, carboxymethyl cellulose, carboxymethyl cellulose, carboxymethyl cellulose, carboxymethyl cellulose, carboxymethyl cellulose, carboxymethyl cellulose, carboxymethyl cellulose, carboxymethyl cellulose, carboxymethyl cellulose, carboxymethyl cellulose, carboxymethyl cellulose, carboxymethyl cellulose, carboxymethyl cellulose, carboxymethyl cellulose, carboxymethyl cellulose, or carboxymethyl cellulose. The cellulose acetate-cellulose acetate composite material is prepared from ethyl hydroxyethyl cellulose, cellulose acetate, cellulose triacetate, cellulose propionate, cellulose acetate propionate, cellulose acetate butyrate, microcrystalline cellulose, cellulose nitrate or cellulose sulfate.

The invention relates to the technical field of chip packaging, and particularly discloses a high-thermal-conductivity epoxy adhesive for chip packaging and a chip packaging method. The epoxy adhesive comprises a component A and a component B. Based on the total weight of the component A, the component A comprises the following raw materials in parts by weight: 28-44 parts of polyethylene glycol grafted epoxy resin, 15-20 parts of polyamide coated nano filler, 4-7 parts of a flame retardant, 3-4 parts of a diluent and 12-15 parts of a flexibilizer, and the component B comprises an epoxy curing agent and a curing accelerator in a weight ratio of 10: (0.5-1). According to the epoxy adhesive for chip packaging, the dispersity of all components in the epoxy adhesive for chip packaging can be improved, so that the epoxy adhesive has good heat-conducting property and mechanical property, and the chip packaging quality can be improved.