UV-thermal dual-curing adhesive and preparation method thereof

Abstract

The invention relates to the technical field of adhesives, in particular to a UV-thermal dual-curing adhesive and a preparation method thereof. The UV-thermal dual-curing adhesive provided by the invention comprises the following components in parts by weight: 10-30 parts of an acrylate monomer; 5-15 parts of epoxy resin; 5 to 15 parts of epoxy modified N substituted maleimide resin; 1-4 parts of a photoinitiator; 10-25 parts of a latent curing agent; 0.5-2 parts of a stabilizer; 15 to 30 parts of thiol; 1-3 parts of a silane coupling agent; 1-5 parts of a thixotropic agent; and 15-30 parts of a filler. By adding the epoxy modified N-substituted maleimide resin, on one hand, excellent flexibility can be brought to a system; on the other hand, the maleimide ring can enable the system to have excellent humidity and heat resistance, and the prepared adhesive can be applied to adhesion of camera modules in various application scenes.

Description

Technical Field

[0001] The invention relates to the technical field of adhesives, and in particular to a UV-heat dual-curing adhesive and a preparation method thereof. Background Art

[0002] With the rapid progress of modern science and technology, various electronic and electrical products such as smart phones, electric vehicles, PCs and other intelligent terminal products are also constantly upgraded and updated, and higher requirements are also put forward for the bonding and other properties of glue in the field of cameras. Ultraviolet light curing (UV curing) is widely used in industrial production and various electronic product fields due to its high efficiency curing, low production cost and environmental friendliness. However, UV curing technology itself also has certain defects, such as opaque or partially opaque materials, thick adhesives and colored coatings. Application is limited. In order to overcome these defects and broaden the application field of UV curing technology, dual-curing systems have emerged in recent years. Dual-curing technology is a curing technology that combines UV curing with other curing methods. The cross-linking and polymerization reactions in the system are completed through two independent stages with different reaction principles.

[0003] The UV-heat dual-curing system has been studied more. Its curing process is divided into two stages. The first stage is to achieve the purpose of preliminary positioning through ultraviolet light irradiation reaction; the second stage is to further complete the post-curing reaction through heating, which can cure the unirradiated part on the one hand, and further improve the bonding strength on the other hand. In recent years, part of the research direction of UV-heat dual-curing adhesives is based on epoxy resin modified materials, which have the characteristics of fast curing speed, high hardness, good adhesion, etc. However, in the bonding requirements of camera modules, there are still problems such as insufficient bonding strength, poor flexibility, and high temperature and high humidity aging attenuation. Summary of the invention

[0004] In order to solve the above technical problems existing in the prior art, the present invention provides a UV-heat dual-curing adhesive and a preparation method thereof.

[0005] The technical solution of the present invention to solve the above technical problems is as follows:

[0006] The first aspect of the present invention is to provide a UV-heat dual-curing adhesive, which comprises the following components in parts by weight:

[0007] 10-30 parts of acrylate monomer;

[0008] Epoxy resin 5-15 parts;

[0009] 5-15 parts of epoxy-modified N-substituted maleimide resin;

[0010] 1 to 4 parts of photoinitiator;

[0011] 10-25 parts of latent curing agent;

[0012] Stabilizer 0.5-2 parts;

[0013] 15-30 parts of mercaptan;

[0014] 1 to 3 parts of silane coupling agent;

[0015] 1 to 5 parts of thixotropic agent;

[0016] 15 to 30 parts of filler.

[0017] The UV-heat dual-curing adhesive provided by the present invention has improved bonding strength and good flexibility and moisture and heat resistance. Specifically, the maleimide ring has excellent moisture and heat resistance, and the double bond therein can undergo multiple reactions, which can be polymerized with acrylate monomers and can also undergo Michael addition reaction with the thiol group in the thiol; by epoxy-modifying the maleimide resin to introduce epoxy groups, the acrylate monomers and the epoxy groups are connected, further increasing the crosslinking degree of the system and improving the bonding strength; at the same time, the use of alkyl chains increases the flexibility of the system. Therefore, the present invention introduces the epoxy-modified N-substituted maleimide resin into the adhesive system and cooperates with other components to comprehensively improve the various properties of the system.

[0018] On the basis of the above technical solution, the present invention can also make the following improvements:

[0019] Furthermore, the epoxy-modified N-substituted maleimide resin has a structural formula shown in Formula I:

[0020]

[0021] Among them, n=2~6.

[0022] The value of n is limited to 2-6, and the value of n cannot be too large or too small. If the value of n is less than 2, the molecular chain length of the resin is too short, which will increase the brittleness and reduce the flexibility of the glue after curing; if the value of n is greater than 6, the resin raw material is expensive, the cost increases significantly, and it is not convenient for production.

[0023] Further, the synthesis of the epoxy-modified N-substituted maleimide resin comprises the following steps:

[0024] S1, preparing compound 1 by reacting maleimide with furan;

[0025] S2, preparing compound 2 by reacting compound 1 with 2-(n-bromoalkyl)ethylene oxide (n=2-6);

[0026] S3, post-treating the compound 2 to obtain the epoxy-modified N-substituted maleimide resin.

[0027] The synthesis steps of the epoxy-modified N-substituted maleimide resin are as follows:

[0028]

[0029] Furthermore, the step S1 comprises the following process: dissolving the maleimide in toluene, and then reacting with furan at 90-110° C. with stirring for 6-12 hours, cooling to room temperature, and filtering to obtain the compound 1; wherein the molar ratio of the maleimide to furan is 1:2-2.5.

[0030] Further, the step S2 includes the following process: dissolving the compound 1 with N,N-dimethylformamide, adding potassium carbonate and protecting with argon, adding 2-(n-bromoalkyl)ethylene oxide (n=2-6) at 50-60° C., stirring the reaction for 12-24 hours, filtering, washing and concentrating to obtain compound 2; wherein the molar ratio of the compound 1, potassium carbonate and 2-(n-bromoalkyl)ethylene oxide is 1:1.5-2:1.2-1.5.

[0031] Furthermore, the 2-(n-bromoalkyl)ethylene oxide is 2-(6-bromohexyl)ethylene oxide.

[0032] Furthermore, the post-treatment of step S3 includes the following process: dissolving compound 2 in toluene, reacting at 100-120° C. for 6-12 hours, and removing toluene by rotary evaporation after cooling to obtain epoxy-modified N-substituted maleimide resin.

[0033] Furthermore, the acrylate monomer is a monofunctional acrylate monomer, a difunctional acrylate monomer or a mixture of the two, preferably a mixture of one or more of isobornyl acrylate, tetrahydrofuran acrylate, lauryl acrylate, acryloylmorpholine, 1,6-hexanediol diacrylate, and dipropylene glycol diacrylate; the epoxy resin is a mixture of one or more of bisphenol A epoxy resin, bisphenol F epoxy resin, and hydrogenated bisphenol A epoxy resin; the thiol is a thiol compound with a functionality greater than 2, preferably one or more of trimethylolpropane-tris(3-mercaptopropionate), pentaerythritol-tetrakis(3-mercaptobutyrate), and tris[2-(3-mercaptopropionyl)ethyl]isocyanurate, or a combination of two or more thereof.

[0034] Further, the photoinitiator is a mixture of one or more of photoinitiator 184, photoinitiator 369, and photoinitiator 651; the latent curing agent is a mixture of one or more of imidazole curing agents, tertiary amine adducts, and modified amine curing agents, preferably a mixture of one or two of Ajinomoto PN-23, PN-23J, MY-24, MY-25, Asahi Kasei HXA3922HP, HXA3932HP, ADEKAEH-5011S, and ADEKAEH-5031S; the silane coupling agent is a mixture of one or two of KH-560 (γ-glycidyloxypropyltrimethoxysilane) and KH-570 (γ-methacryloxypropyltrimethoxysilane); the stabilizer is a barbituric acid stabilizer; the filler is spherical silica; and the thixotropic agent is fumed silica.

[0035] Another aspect of the present invention is to provide a method for preparing the above-mentioned UV-heat dual-curing adhesive, comprising the following steps:

[0036] (1) Weighing acrylate monomer, photoinitiator, and epoxy-modified N-substituted maleimide resin according to weight parts and adding them into a container, stirring for 0.5 to 1 hour until the photoinitiator is completely dissolved;

[0037] (2) Weigh epoxy resin, stabilizer, thiol, and silane coupling agent according to weight and add them into a container, stirring for 1 to 2 hours until the mixture is uniformly mixed;

[0038] (3) Weigh the filler and thixotropic agent according to their weight and add them into a container, stirring for 1 to 2 hours under vacuum until the mixture is uniform;

[0039] (4) Weigh the latent curing agent according to the weight ratio and add it into the container, control the system temperature not to exceed 30° C., stir for 1 to 2 hours under vacuum, and mix well to obtain the UV-heat dual-curing adhesive.

[0040] The container is a high-speed planetary agitator. The entire preparation process of the above UV-heat dual-curing adhesive needs to be carried out in the dark or under yellow light conditions.

[0041] Compared with the prior art, the present invention has the following technical effects:

[0042] The UV-heat dual-curing adhesive provided by the present invention has improved bonding strength and good flexibility and moisture and heat resistance. Specifically, the maleimide ring has excellent moisture and heat resistance, and the double bond therein can undergo multiple reactions, which can be polymerized with acrylate monomers and can also undergo Michael addition reaction with the thiol group in the thiol; by epoxy-modifying the maleimide resin to introduce epoxy groups, the acrylate monomers and the epoxy groups are connected, further increasing the crosslinking degree of the system and improving the bonding strength; at the same time, the use of alkyl chains increases the flexibility of the system. Therefore, the present invention introduces the epoxy-modified N-substituted maleimide resin into the adhesive system and cooperates with other components to comprehensively improve the various properties of the system. DETAILED DESCRIPTION

[0043] The following specific embodiments illustrate the implementation of the present invention, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. Although the description of the present invention will be introduced in conjunction with the preferred embodiment, this does not mean that the features of this invention are limited to this implementation. On the contrary, the purpose of introducing the invention in conjunction with the implementation is to cover other options or modifications that may extend based on the claims of the present invention. In order to provide a deep understanding of the present invention, the following description will include many specific details. The present invention can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present invention, some specific details will be omitted in the description. It should be noted that the embodiments of the present invention and the features in the embodiments can be combined with each other without conflict.

[0044] Example 1

[0045] A preparation method of a UV-heat dual curing adhesive, the preparation steps are as follows:

[0046] (1) Preparation of epoxy-modified N-substituted maleimide resin: S1. Add 40 g of maleimide to a 500 ml round-bottom flask, dissolve it in 300 ml of toluene, add 65 ml of furan, stir and react at 90° C. for 12 h, cool to room temperature after the reaction, and filter to obtain compound 1 in the form of white powder; S2. Add 40 g of compound 1 to a 500 ml round-bottom flask, dissolve it in 200 ml of solvent, and then add 65 ml of furan. Stir and react at 90° C. for 12 h. After the reaction is completed, cool to room temperature, and filter to obtain compound 1 in the form of white powder; S3. N, N-dimethylformamide (DMF) was dissolved, and then 64g potassium carbonate was added and protected with argon. At 60°C, 62g of 2-(6-bromohexyl)ethylene oxide was added thereto, and the reaction was stirred for 16h. After filtration, washing and concentration, compound 2 was obtained; S3, 30g of compound 2 was added to a 500ml round-bottom flask, and 250ml of toluene was added to dissolve and disperse it. The reaction was carried out at 110°C for 12h. After the system was cooled, toluene was removed by rotary evaporation at a negative pressure of -0.1MPa to obtain epoxy-modified N-substituted maleimide resin.

[0047] (2) Preparation of UV-heat dual-curing adhesive: Under yellow light, weigh 10 g of isobornyl acrylate, 10 g of tetrahydrofuran acrylate, 1 g of photoinitiator 184, and 1 g of photoinitiator 651. 1.5g of bisphenol A epoxy resin, 5g of epoxy-modified N-substituted maleimide resin, were placed in a high-speed planetary stirrer and stirred at a speed of 400r / min for 1h until the photoinitiator was completely dissolved; 10g of bisphenol A epoxy resin, 1g of barbituric acid stabilizer, 20g of pentaerythritol-tetrakis(3-mercaptobutyrate), and 1.5g of γ-glycidyloxypropyltrimethoxysilane were weighed, and placed in a high-speed planetary stirrer and stirred at a speed of 400r / min for 1h until the mixture was uniformly mixed; 20g of spherical silica filler and 4g of thixotropic agent fumed silica were weighed, and placed in a high-speed planetary stirrer and stirred at a speed of 400r / min for 1h while maintaining a vacuum degree of not less than -0.08Mpa to mix uniformly; (4) ADEKA latent curing agent was weighed. EH-5031S18g was put into a high-speed planetary stirrer. The system temperature was controlled not to exceed 30°C. Under the condition of maintaining the vacuum degree not lower than -0.08Mpa, the speed was 400r / min and stirred for 1h to mix evenly. The UV-heat dual-curing adhesive was obtained after mixing evenly.

[0048] Example 2

[0049] A preparation method of a UV-heat dual curing adhesive, the preparation steps are as follows:

[0050] (1) Preparation of epoxy-modified N-substituted maleimide resin: Same as Example 1.

[0051] (2) Preparation of UV-heat dual-curing adhesive: Under yellow light, weigh 10 g of isobornyl acrylate, 10 g of tetrahydrofuran acrylate, 1 g of photoinitiator 184, and 1 g of photoinitiator 651. 1.5g, 10g of epoxy-modified N-substituted maleimide resin, put them into a high-speed planetary stirrer and stir at a speed of 400r / min for 1h until the photoinitiator is completely dissolved; weigh 10g of bisphenol A epoxy resin, 1g of barbituric acid stabilizer, 20g of pentaerythritol-tetrakis (3-mercaptobutyrate), and 1.5g of γ-glycidyloxypropyltrimethoxysilane, put them into a high-speed planetary stirrer, stir at a speed of 400r / min for 1h until the mixture is uniform; weigh 20g of filler spherical silica and 4g of thixotropic agent fumed silica, put them into a high-speed planetary stirrer, control the speed to 400r / min and stir for 1h while keeping the vacuum degree not lower than -0.08Mpa, and mix them uniformly; weigh the latent curing agent ADEKA EH-5031S18g, put it into a high-speed planetary stirrer, control the system temperature not to exceed 30°C, put it into a high-speed planetary stirrer, keep the vacuum degree not lower than -0.08Mpa, control the speed to 400r / min and stir for 1h until the mixture is uniform, and the UV-heat dual-curing adhesive is obtained.

[0052] Example 3

[0053] A preparation method of a UV-heat dual curing adhesive, the preparation steps are as follows:

[0054] (1) Preparation of epoxy-modified N-substituted maleimide resin: Same as Example 1.

[0055] (2) Preparation of UV-heat dual-curing adhesive: Under yellow light, weigh 10 g of isobornyl acrylate, 10 g of tetrahydrofuran acrylate, 1 g of photoinitiator 184, and 1 g of photoinitiator 651. 1.5g, 15g of epoxy-modified N-substituted maleimide resin, put them into a high-speed planetary stirrer, control the speed at 400r / min and stir for 1h, until the photoinitiator is completely dissolved; weigh 10g of bisphenol A epoxy resin, 1g of barbituric acid stabilizer, 20g of pentaerythritol-tetrakis (3-mercaptobutyrate), and 1.5g of γ-glycidyloxypropyltrimethoxysilane, put them into a high-speed planetary stirrer, control the speed at 400r / min and stir for 1h to mix evenly; weigh 20g of filler spherical silica and 4g of thixotropic agent fumed silica, put them into a high-speed planetary stirrer, control the speed at 400r / min and stir for 1h while keeping the vacuum degree not less than -0.08Mpa, and mix evenly; weigh the latent curing agent ADEKA EH-5031S18g, put it into a high-speed planetary stirrer, control the system temperature not to exceed 30°C, put it into a high-speed planetary stirrer, keep the vacuum degree not lower than -0.08Mpa, control the speed to 400r / min and stir for 1h to mix evenly, and then obtain UV-heat dual-curing adhesive.

[0056] Example 4

[0057] A preparation method of a UV-heat dual curing adhesive, the preparation steps are as follows:

[0058] (1) Preparation of epoxy-modified N-substituted maleimide resin: S1. Add 35 g of maleimide to a 500 ml round-bottom flask, dissolve it in 300 ml of toluene, add 65 ml of furan, stir and react at 90° C. for 12 h. After the reaction is completed, cool to room temperature and filter to obtain compound 1 in the form of white powder;

[0059] S2. Add 40g of compound 1 into a 500ml round-bottom flask, dissolve it with 200ml DMF solvent, then add 64g of potassium carbonate and protect it with argon. At 60°C, add 48g of 2-(3-bromopropyl)ethylene oxide, stir and react for 16h, filter, wash and concentrate to obtain compound 2; S3. Add 30g of compound 2 into a 500ml round-bottom flask, add 250ml of toluene to dissolve and disperse it, react at 110°C for 12h, cool the system and remove toluene by rotary evaporation at a negative pressure of -0.1MPa to obtain epoxy-modified N-substituted maleimide resin.

[0060] (2) Preparation of UV-heat dual-curing adhesive: Under a yellow light throughout the process, weigh 10 g of isobornyl acrylate, 10 g of tetrahydrofuran acrylate, 1 g of photoinitiator 184, 1.5 g of photoinitiator 651, and 10 g of epoxy-modified N-substituted maleimide resin, put them into a high-speed planetary stirrer and stir at a speed of 400 r / min for 1 h until the photoinitiator is completely dissolved; weigh 10 g of bisphenol A epoxy resin, 1 g of stabilizer, 20 g of pentaerythritol-tetrakis (3-mercaptobutyrate), and 1.5 g of γ-glycidyloxypropyltrimethoxysilane, put them into a high-speed planetary stirrer and stir at a speed of 400 r / min for 1 h to mix evenly; weigh 20 g of spherical silica filler , 4g of thixotropic agent fumed silica is put into a high-speed planetary stirrer, and stirred at 400r / min for 1h while maintaining the vacuum degree not lower than -0.08Mpa to mix evenly; 18g of latent curing agent ADEKAEH-5031S is weighed, and put into a high-speed planetary stirrer. The system temperature is controlled not to exceed 30°C, and it is put into a high-speed planetary stirrer, and stirred at 400r / min for 1h to mix evenly to obtain a UV-heat dual-curing adhesive.

[0061] Comparative Example 1

[0062] Preparation of UV-heat dual curing adhesive: Under yellow light throughout the process, weigh 10 g of isobornyl acrylate, 10 g of tetrahydrofuran acrylate, 1 g of photoinitiator 184, and 1 g of photoinitiator 651. 1.5g, put it into a high-speed planetary stirrer and stir at a speed of 400r / min for 1h until the photoinitiator is completely dissolved; weigh 10g of bisphenol A epoxy resin, 1g of stabilizer, 20g of pentaerythritol-tetrakis (3-mercaptobutyrate), and 1.5g of γ-glycidyloxypropyltrimethoxysilane, put them into a high-speed planetary stirrer, stir at a speed of 400r / min for 1h to mix evenly; weigh 20g of spherical silica filler and 4g of thixotropic agent fumed silica, put them into a high-speed planetary stirrer, stir at a speed of 400r / min for 1h while keeping the vacuum degree not lower than -0.08Mpa, and mix evenly; weigh 18g of latent curing agent ADEKAEH-5031S, put it into a high-speed planetary stirrer, control the system temperature not to exceed 30°C, put it into a high-speed planetary stirrer, stir at a speed of 400r / min for 1h to mix evenly, and obtain a UV-heat dual-curing adhesive.

[0063] Comparative Example 2

[0064] Preparation of UV-heat dual-curing adhesive: Under a yellow light throughout the process, weigh 10g of isobornyl acrylate, 10g of tetrahydrofuran acrylate, 1g of photoinitiator 184, 1.5g of photoinitiator 651, and 10g of Yuelai New Materials TRD-A150, put them into a high-speed planetary stirrer and stir at a speed of 400r / min for 1h until the photoinitiator is completely dissolved; weigh 10g of bisphenol A epoxy resin, 1g of stabilizer, 20g of pentaerythritol-tetrakis (3-mercaptobutyrate), and 1.5g of γ-glycidyloxypropyltrimethoxysilane, put them into a high-speed planetary stirrer, stir at a speed of 400r / min for 1h to mix evenly; weigh 20g of filler spherical silica and 4g of thixotropic agent fumed silica, put them into a high-speed planetary stirrer, stir at a speed of 400r / min for 1h while keeping the vacuum degree not less than -0.08Mpa, and mix evenly; weigh the latent curing agent ADEKA EH-5031S18g, put it into a high-speed planetary stirrer, control the system temperature not to exceed 30°C, put it into a high-speed planetary stirrer, stir at a speed of 400r / min for 1h to mix evenly, and mix evenly to obtain UV-heat dual-curing adhesive.

[0065] test

[0066] The UV-heat dual-curing adhesive obtained in Examples 1-4 and Comparative Examples 1-2 was applied to a dumbbell-shaped mold made according to GB / T 1040, cured for 3s with a 365nm UV lamp at 1000mw, and then placed in an oven at 80°C for 60min. After cooling to room temperature, the adhesive was tested according to GB / T 1040; the tensile shear strength was tested for mechanical properties according to the standard (GB / T2792-2014); the high temperature and high humidity aging conditions were 85°C, 85%RH, and 500h. The test data are shown in Table 1.

[0067] Table 1 Performance test results of embodiments and comparative examples

[0068]

[0069] Through comparative tests, it is found that after the content of the epoxy-modified N-substituted maleimide resin in Examples 1-3 is gradually increased, due to the increase in crosslinking density, the elongation at break of the adhesive after curing gradually decreases, the tensile strength gradually increases, the tensile shear strength gradually increases, and the tensile shear strength attenuation after high temperature and high humidity gradually decreases. In Example 4, the epoxy-modified N-substituted maleimide resin is synthesized using a raw material with an alkyl chain of 3 carbon atoms, which is shorter than the 6-carbon atom alkyl chain used in Examples 1-3. Therefore, compared with Example 2 with the same amount of epoxy-modified N-substituted maleimide resin added, its elongation at break is slightly lower, but the tensile strength, tensile shear strength and high temperature and high humidity strength attenuation are close to Example 2. In Comparative Example 1, since a bifunctional resin containing double bonds and epoxy groups is not added, its elongation at break, tensile strength, tensile shear strength and moisture and heat resistance are all poor. Comparative Example 2 uses a commercially available conventional difunctional resin containing double bonds and epoxy groups, which has a good elongation at break, but low tensile strength and tensile shear strength, and also exhibits significant attenuation at high temperature and high humidity.

[0070] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A UV-heat dual-curing adhesive, characterized in that: By weight, it includes the following components: 10-30 parts of acrylate monomer; Epoxy resin 5-15 parts; 5-15 parts of epoxy-modified N-substituted maleimide resin; 1 to 4 parts of photoinitiator; 10-25 parts of latent curing agent; Stabilizer 0.5-2 parts; 15-30 parts of mercaptan; 1 to 3 parts of silane coupling agent; 1 to 5 parts of thixotropic agent; 15 to 30 parts of filler.

2. The UV-heat dual-curing adhesive according to claim 1, characterized in that: The epoxy-modified N-substituted maleimide resin has a structural formula shown in Formula I: Among them, n=2~6.

3. The UV-heat dual-curing adhesive according to claim 2, characterized in that: The synthesis of the epoxy-modified N-substituted maleimide resin comprises the following steps: S1, preparing compound 1 by reacting maleimide with furan; S2, preparing compound 2 by reacting compound 1 with 2-(n-bromoalkyl)ethylene oxide (n=2-6); S3, post-treating the compound 2 to obtain the epoxy-modified N-substituted maleimide resin.

4. The UV-heat dual-curing adhesive according to claim 3, characterized in that: The step S1 comprises the following process: dissolving the maleimide in toluene, and then reacting with furan under stirring at 90-110° C. for 6-12 hours, cooling to room temperature, and filtering to obtain the compound 1; wherein the molar ratio of the maleimide to furan is 1:2-2.

5.

5. The UV-heat dual-curing adhesive according to claim 3, characterized in that: The step S2 includes the following process: The compound 1 is dissolved in N,N-dimethylformamide, potassium carbonate is added and protected by argon, 2-(n-bromoalkyl)ethylene oxide (n=2-6) is added at 50-60° C., the reaction is stirred for 12-24 hours, and the compound 2 is obtained after filtration, washing and concentration; wherein the molar ratio of the compound 1, potassium carbonate and 2-(n-bromoalkyl)ethylene oxide is 1:1.5-2:1.2-1.

5.

6. The UV-heat dual-curing adhesive according to any one of claims 3 to 5, characterized in that: The 2-(n-bromoalkyl)oxirane is 2-(6-bromohexyl)oxirane.

7. The UV-heat dual-curing adhesive according to claim 3, characterized in that: The post-treatment of step S3 includes the following process: dissolving compound 2 in toluene, reacting at 100-120° C. for 6-12 hours, and removing toluene by rotary evaporation after cooling to obtain epoxy-modified N-substituted maleimide resin.

8. The UV-heat dual-curing adhesive according to claim 1, characterized in that: The acrylate monomer is a monofunctional acrylate monomer, a difunctional acrylate monomer or a mixture of the two; the epoxy resin is a mixture of one or more of bisphenol A epoxy resin, bisphenol F epoxy resin, and hydrogenated bisphenol A epoxy resin; and the thiol is a thiol compound with a functionality greater than 2.

9. The UV-heat dual-curing adhesive according to claim 1, characterized in that: The photoinitiator is a mixture of one or more of photoinitiator 184, photoinitiator 369, and photoinitiator 651; the latent curing agent is a mixture of one or more of imidazole curing agents, tertiary amine adducts, and modified amine curing agents; the silane coupling agent is one or a mixture of two of KH-560 and KH-570; the stabilizer is a barbituric acid stabilizer; the filler is spherical silica; and the thixotropic agent is fumed silica.

10. A method for preparing the UV-heat dual-curing adhesive according to any one of claims 1 to 9, characterized in that: The following steps are involved: (1) Weighing acrylate monomer, photoinitiator, and epoxy-modified N-substituted maleimide resin according to weight parts and adding them into a container, stirring for 0.5 to 1 hour until the photoinitiator is completely dissolved; (2) Weigh epoxy resin, stabilizer, thiol, and silane coupling agent according to weight and add them into a container, stirring for 1 to 2 hours until the mixture is uniformly mixed; (3) Weigh the filler and thixotropic agent according to their weight and add them into a container, stirring for 1 to 2 hours under vacuum until the mixture is uniform; (4) Weigh the latent curing agent according to the weight ratio and add it into the container, control the system temperature not to exceed 30° C., stir for 1 to 2 hours under vacuum, and mix well to obtain the UV-heat dual-curing adhesive.

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