12783results about "Non-macromolecular adhesive additives" patented technology

The invention discloses a pure bio-based polyhydroxyalkanoate adhesive as well as preparation and application thereof, and belongs to the technical field of degradable adhesives. According to the adhesive, polyhydroxybutyrate valerate or polyhydroxybutyrate hexanoate is used as a matrix, and the acid value reaches 2-15 mg KOH / g through molten end group activation; a reactive emulsifier with a hydrophilic-lipophilic balance value of 9-12 is introduced into a water phase, and the stable aqueous dispersion is prepared through phase inversion high-shear emulsification. The Z-average particle size of the dispersion is 0.12-0.30 [mu] m, and the content of the free surfactant is not higher than 30wt%. After the tackifying resin, the plasticizer and the vegetable wax are compounded, the bio-based carbon content of the obtained adhesive is not lower than 95%, and the volatile organic compound content is not higher than 100 mg / kg. The paper / paper heat sealing strength of the adhesive is not lower than 7.0 N / 15mm, the 180-degree peel strength is not lower than 7.5 N / 25mm, and the adhesive can pass repulping evaluation.

The invention relates to the technical field of folding screen supporting films, and particularly discloses a double-layer buffering supporting film for a flexible folding display screen and a preparation method of the double-layer buffering supporting film. The double-layer buffer supporting film for the flexible folding display screen sequentially comprises a release film layer, a first adhesive layer, a first stainless steel layer, a second adhesive layer, a second stainless steel layer and a protective film layer from top to bottom, the first adhesive layer and the second adhesive layer are prepared by curing the same pressure-sensitive adhesive composition; the pressure-sensitive adhesive composition is prepared from the following raw materials: acrylate copolymer, hydrogenated rosin glyceride, hyperbranched polyesteramide-dopamine conjugate, acylhydrazone bond modified siloxane, a curing agent and a silane coupling agent; the protective film layer comprises the following raw materials: PET particles, nano silicon dioxide, an ethylene-vinyl acetate copolymer and an antioxidant. The double-layer buffer supporting film has the advantages of being high in supporting rigidity and interlayer peel strength, and serious folds caused by long-term repeated folding of the folding screen can be relieved.

The invention discloses a nano-modified high-temperature-resistant adhesive tape and a preparation method thereof, and relates to the technical field of high polymer materials. The adhesive tape adopts a three-layer composite structure design, wherein a base material layer is a polyimide-boron nitride nanowire composite film, and an in-plane oriented three-dimensional heat-conducting network is formed through electrostatic spinning; the nano modified adhesive layer comprises an organic silicon prepolymer PDMS, epoxy resin E-51 and a surface aminated montmorillonite / hydroxylated silicon carbide nanowire composite system, and D90lt is realized through three-roller grinding; nano dispersion with the particle size of 200 nm; the functional coating is made of a plasma sprayed Al2O3 / graphene compound, and the porosity is 15-20%. The preparation method innovatively comprises the following steps: carrying out magnetron sputtering on a 5nm titanium transition layer to improve the interface bonding strength to be greater than or equal to 25N / cm; and a compact cross-linked shell layer is formed through a stepped curing process and electron beam radiation. After the adhesive tape is aged at 400 DEG C for 1000 hours, the peel strength retention rate is larger than or equal to 91.3%, the shear strength reaches 18.7 MPa, the in-plane thermal conductivity is improved by 43 times compared with pure polyimide, and the volume resistivity is gt after the adhesive tape is subjected to a salt spray test for 500 hours; the thickness is 1015 omega.cm.

A coating composition comprises: a fluoro-aliphatic group-containing copolymer comprising a repeating unit A corresponding to a fluoro-aliphatic group-containing monomer, and a repeating unit B corresponding to at least one monomer, wherein each of the I / O values of said at least one monomer constituting the repeating unit B is 1.0 or less.

The invention provides an epoxy resin composition and application thereof, and the epoxy resin composition comprises the following components in parts by weight: 100 parts of epoxy resin, 30-200 parts of a curing agent, 30-100 parts of a flexibilizer and 1-100 parts of a filler, the toughening agent at least comprises a first toughening agent and a second toughening agent, and the glass transition temperatures of the first toughening agent and the second toughening agent are different. According to the epoxy resin composition, an adhesive film containing the epoxy resin composition is good in normal-temperature storage stability and high-temperature reactivity and can react quickly; the damping loss factor of the adhesive film in the range of 0-100 DEG C is low, the stability of the damping loss factor is good, the elastic modulus is high, and meanwhile, the adhesive film also has high toughness and peel strength.

The invention relates to a mildew-proof silicone sealant with high curing rate and high adhesive strength, and belongs to the technical field of adhesives. The anti-mildew coating is prepared from alpha, omega-dihydroxy polydimethylsiloxane, dimethyl silicone oil, fumed silica, phenoxy resin coated nano calcium carbonate, a modified hydroxypropyl-gamma-cyclodextrin loaded mildew preventive, dibutyltin dilaurate, methyltrimethoxysilane and a curing accelerator. According to the mildew-proof silicone sealant with the high curing rate and the high adhesive strength, the surface drying time is 9-13 minutes, the 24-hour curing depth is 6.3-7.2 mm, the adhesive strength is 3.0-3.6 MPa, the tensile strength is 5.8-6.4 MPa, the shear strength is 3.0-3.9 MPa, the elongation at break is 410-457%, and the mildew-proof grade is 0 grade in 30 days, 60 days, 180 days and 360 days.

The invention provides a bio-based adhesive and a preparation method thereof. Inspired by a spider thread structure, biomass adhesive interface enhancement based on a tannic acid adhesion group is combined with construction of a differential phase separation structure by biomass-induced polylipoic acid depolymerization, and a brand new strategy of adhesion-cohesion synergistic enhancement of the adhesive strength of the adhesive is realized. According to the invention, tannic acid and carboxymethyl chitosan are introduced into a lipoic acid-based adhesive, so that the purpose of synergistically enhancing the bonding performance of the adhesive through adhesion-cohesion is achieved, and the defects of weak cohesion, low bonding strength, poor water resistance, poor moisture resistance and the like of the conventional biomass adhesive are overcome. Benefited from a new strategy of adhesion-cohesion synergistic enhancement, the biomass adhesive has good adhesive strength in various environments and materials. In addition, the biomass adhesive also has the characteristics of biological safety, antibacterial and mildew-proof properties and recoverability, so that the product has wider application and potential compared with the previous product, and has a good application prospect.

The invention discloses a waterproof heat-resistant adhesive and a preparation method thereof, and relates to the technical field of adhesives. Tetramethyltri-3-trifluoropropyl cyclotetrasiloxane is used as a raw material to prepare hydroxyl-terminated organic fluorosilicone oil and modified epoxy resin, fluorine atoms are closely arranged around a main chain of the hydroxyl-terminated organic fluorosilicone oil and modified epoxy resin in an umbrella shape, and the hydroxyl-terminated organic fluorosilicone oil and modified epoxy resin cooperate with organic silicon to improve the waterproof and heat-resistant effects; hydroxyl groups on the oxidized carbon nanofibers are reacted and combined with thiocyanate in vulcanized rubber powder, and hybrid filler is formed; residual active groups on the surface of the oxidized carbon fiber are combined and crosslinked with epoxy resin, so that the heat resistance of the epoxy resin is greatly improved; secondly, phenyl maleic anhydride is used as a cross-linking agent to form a three-dimensional cross-linked structure, and meanwhile, phenyl is introduced into the structure, so that the heat-resistant effect and the waterproof effect of the epoxy resin are further improved, and the adhesive prepared by taking the epoxy resin as the raw material has excellent waterproof and heat-resistant performance. The adhesive prepared by the invention has waterproof and heat-resistant effects.

The invention provides a low-warpage and high-stability film sealing adhesive, a preparation method thereof and a chip packaging method. The film sealing adhesive comprises the following components in percentage by mass: 80%-84% of epoxy modified silicon dioxide, 7%-9% of alicyclic epoxy resin, 8%-10% of an anhydride curing agent, 0.1%-0.2% of a dispersing agent, 0.4%-0.6% of a core-shell structure additive, 0.2%-0.3% of a flatting agent and 0.1%-0.2% of carbon black. The proportion of the epoxy modified silicon dioxide, the alicyclic epoxy resin and the anhydride curing agent is adjusted, and the dispersing agent, the core-shell structure additive and the flatting agent are combined, so that the sedimentation of the filler is reduced, and the internal stress of the film sealing adhesive is alleviated, so that the storage stability of the film sealing adhesive is improved, and the warping of the cured film sealing adhesive is reduced; the surface of the film sealing adhesive has good leveling performance after being printed, and the chip packaging yield can be improved.

The invention relates to the field of adhesives, in particular to a structural adhesive epoxy composition and a preparation method thereof. The structural adhesive epoxy composition is prepared from the following raw materials: epoxy resin, a toughening agent, a reinforcing agent, filler, a latent curing agent, a latent accelerant, a chemical foaming agent, a physical foaming agent and the like. Finally, the epoxy composition prepared by the invention can be used as a structural adhesive raw material, has ultrahigh expansion rate, low-temperature rapid curing capacity and structural adhesive property, and also has good mechanical properties and excellent comprehensive application effect, so that the complex requirements of the application field of the prior art on the structural adhesive raw material are met.

The invention provides a light conversion film composition. The light conversion film composition comprises the following components in percentage by weight: matrix resin, a light conversion agent and an auxiliary agent, the light conversion agent is a benzotriazole compound, and the auxiliary agent is an organic solvent. The structural general formula of the benzotriazole compound is as follows: # imgabs0 # R1 and R2 are respectively and independently selected from any one or more of H, C1-C20 alkyl and C1-C20 alkyl with at least one methylene substituted by a polyether chain segment, and R3 is independently a chain segment containing a carbon-carbon unsaturated double bond.

The invention relates to the technical field of automobile tires, and discloses a new energy automobile tire self-repairing sealing material adhered with mute cotton. The preparation method comprises the following steps: adding a modified polyurethane adhesive, C5 petroleum resin and a modified carbon nanotube filler into absolute ethyl alcohol, mixing to obtain a self-repairing liquid, adhering polyurethane cotton to the upper part of the self-repairing liquid, and drying to obtain the new energy automobile tire self-repairing sealing material adhered with the mute cotton. Disulfide bonds, boric acid ester bonds and imine bonds introduced into polyurethane through a chain extension reaction and diselenide bonds introduced into carbon nanotubes all belong to dynamic covalent bonds, so that the self-repairing performance of the material is improved; by introducing a rigid benzene ring and naphthyl aromatic structure, the mechanical property of the self-repairing sealing material is improved; the carbon nano tube can play a role in skeleton supporting in a polyurethane matrix, and the mechanical property of the material is further improved by introducing an adamantane rigid structure into the carbon nano tube.

The invention relates to the technical field of new materials, and mainly relates to a double-component low-viscosity ultralow-temperature adhesive as well as a preparation method and a use method thereof. The double-component low-viscosity ultralow-temperature adhesive comprises a component A and a component B. The component A comprises the following components in percentage by mass: 20-40% of bisphenol A epoxy resin, 4-8% of aromatic epoxy resin, 6-10% of polyurethane modified epoxy resin, 1-2% of a rubber toughening agent, 5-20% of a diluent and the balance of an additive. And the component B comprises the following components in percentage by mass: 10-40% of a polyether amine curing agent, 10-40% of a fatty amine curing agent, 10-40% of an aromatic amine curing agent and 10-40% of a phenolic aldehyde amine curing agent. The adhesive provided by the invention has relatively strong compressive strength and excellent toughness, can keep good toughness in a low-temperature environment, is not easy to cause brittle rupture, can bear relatively large mechanical load, and is suitable for various industrial applications.

The invention provides a self-repairing EVA adhesive film and a preparation method thereof, and relates to the technical field of solar photovoltaic module packaging. According to the self-repairable EVA adhesive film disclosed by the invention, through Diels-Alder reactive group grafting and silane coupling agent microencapsulation technologies, a dual self-repairing mechanism of a photovoltaic module packaging adhesive film is realized, and the dual self-repairing mechanism comprises physical rearrangement repairing and chemical bonding repairing; while high light transmittance (more than or equal to 90%) and bonding strength (more than or equal to 96 N / cm) are maintained, the aging resistance (delta YI is less than or equal to 3) of the EVA adhesive film is remarkably improved, the service life of the EVA adhesive film is remarkably prolonged, and the problems that a traditional EVA adhesive film is easy to age in an extreme environment and is easy to suffer from micro damage caused by mechanical stress are solved; the preparation process disclosed by the invention is compatible with the existing production line, and has a relatively high industrial application value.

The present invention provides an adjustable underfill adhesive and a preparation method therefor, and a chip packaging structure. The underfill adhesive comprises the following components in mass percentage: 21-28% of a trifunctional epoxy resin, 8-19% of an amine curing agent, 54-66% of a filler, 0.2-0.4% of an accelerator, 0.1-0.3% of a silane coupling agent, and 0.1-0.2% of carbon black, wherein the molar ratio of the trifunctional epoxy resin to the amine curing agent is 1:0.7 to 1:1.4; and by controlling the molar ratio of the trifunctional epoxy resin to the amine curing agent to be 1:0.7 to 1:1.4, the glass transition temperature of the underfill adhesive can be controlled between 90°C and 180°C. In addition, by introducing the silane coupling agent, the degree of bonding between the filler and a thermosetting epoxy resin is improved, and thus the stability of the underfill adhesive is improved; moreover, an organic matrix-silane coupling agent-inorganic matrix bonding layer can be formed between an inorganic interface and an organic interface, so that the bonding strength of the underfill adhesive is improved, and thus the protection effect on a chip is enhanced.

The present invention relates to the technical field of adhesives, and discloses a preparation method of a modified polyvinyl alcohol adhesive. The present invention adds 100 parts by weight of sulfonated polyvinyl alcohol and 0.3-1.5 parts by weight of modified carbon nanotubes to water, stirs and mixes, and then adds 4-9 parts by weight of isocyanate cross-linking curing agent to obtain the modified polyvinyl alcohol adhesive. Cross-linking curing agents such as toluene diisocyanate react with hydroxyl groups of polyvinyl alcohol and hydroxyl groups of modified carbon nanotubes respectively, and at the same time, sulfonate anions of polyvinyl alcohol react with quaternary ammonium salt cations of modified carbon nanotubes by electrostatic cross-linking, thereby forming a double network curing cross-linking system in the polyvinyl alcohol adhesive, improving the cohesion and bonding strength of the adhesive, and at the same time, enhancing the interfacial bonding force between carbon nanotubes and polyvinyl alcohol, improving the compatibility between the two, and improving the tensile properties of the adhesive.

Provided is a curable silicone composition and applications thereof. The curable silicone composition has superior hot-melt properties and moldability, where the flexibility, toughness, and stress relief properties of a cured product obtained therefrom are not impaired even if a large amount of functional inorganic filler is blended in. The curable silicone composition comprises an organopolysiloxane resin component with a weight average molecular weight in a range of 2,000 to 15,000 and that contains a siloxane unit represented by SiO4 / 2 making up at least 20 mol % or more of the total siloxane units, and one or more functional fillers. The silicone resin component comprises a curing reactive functional group containing a carbon-carbon double bond, and of that curing reactive functional group, 0.05 to 1.50 mol vinyl (CH2═CH—) group is contained per 100 g of the silicone component. The curable silicone composition generally has hot-melt properties as a whole.

The invention discloses a glue solution for a copper-clad plate and a preparation method of the glue solution, and relates to the technical field of copper-clad plates. According to the prepared glue solution for the copper-clad plate, the composite epoxy resin, the curing agent, the accelerant, the solvent, the flexibilizer and the inorganic filler, the composite epoxy resin comprises bisphenol A epoxy resin, epoxy phenyl polysiloxane, itaconic acid polyaryletherketone and hydroxyl-terminated fluorine-containing vinyl polysiloxane, so that the interface bonding force with the copper plate is enhanced; the dielectric constant and the dielectric loss are effectively reduced, the peel strength and the toughness of the material are also remarkably improved, and the toughening agent is modified polyether sulfone microspheres; the modified polyethersulfone microspheres are prepared by coating polyethersulfone microspheres with hexamethylenediamine tetrapropionamide diamine, the hexamethylenediamine tetrapropionamide diamine is prepared by carrying out acylation condensation reaction on hexamethylenediamine tetramethyl propionate and ethylenediamine, and the polyethersulfone microspheres are prepared by carrying out electrostatic spinning on a spinning solution of polyethersulfone and vinylpyridine, so that the peel strength of the glue solution is remarkably improved.

The invention discloses a high-refractive-index nano-composite optical adhesive and a preparation method thereof, and belongs to the technical field of optical transparent adhesives. The optical adhesive is prepared by taking a polyurethane acrylate oligomer with a specific structure as matrix resin, introducing surface-modified barium titanate and zirconium oxide core-shell nanoparticles as a functional filler, and matching with an active diluent, a photoinitiator and a silane coupling agent in a specific proportion. Through the design of the core-shell structure, the core problems that the high-refractive-index nanoparticles are easy to agglomerate in an organic resin matrix, the dispersion stability is poor and the bonding force with a matrix interface is weak are effectively solved. The prepared optical adhesive has a refractive index of more than 1.65, a light transmittance of more than 99% and a haze of less than 0.3% after being cured, has excellent bonding strength, weather resistance and long-term use stability, and is especially suitable for precise lamination of high-end display devices (such as OLEDs (Organic Light Emitting Diodes) and micro-lens arrays).

The invention discloses a shielding protection adhesive tape for semiconductor integrated circuit packaging and a preparation method thereof, and relates to the technical field of semiconductor integrated circuit packaging. The shielding protective adhesive tape for packaging the semiconductor integrated circuit is prepared by taking polyimide as a base material and coating a coating, and the coating comprises the following raw materials in parts by weight: 3-5 parts of modified nano silicon dioxide, 30-40 parts of N, N-dimethylformamide, 1-3 parts of a curing agent and 1-3 parts of a curing agent. The invention discloses a high-temperature-resistant epoxy resin coating which is prepared from the following components in parts by weight: 25-30 parts of N, N-dimethylformamide, 25-30 parts of a modified acrylate copolymer, 17-26 parts of ethyl acetate, 12-15 parts of epoxy resin, 1-2 parts of a silane coupling agent KH-550, 0.5-1 part of an antioxidant 1010, 0.3-0.8 part of an ultraviolet absorbent UV-327, 1-2 parts of carboxyl-terminated nitrile rubber, 2-4 parts of decabromodiphenyl ether, 0.1-0.3 part of an organic siloxane defoaming agent, 0.2-0.5 part of an acrylate flatting agent and 10-11 parts of diaminodiphenyl sulfone. The adhesive tape contains the modified nano silicon dioxide, the modified acrylate copolymer and other components, so that the performance of the adhesive tape is guaranteed; pretreatment is meticulous, preparation steps are standard, and mass production is easy; a finished product can be effectively shielded, and the packaging yield and the product stability can be improved.

The invention relates to the technical field of high polymer material chemistry, and discloses a high and low temperature resistant anti-yellowing optical adhesive and a preparation process thereof, the high and low temperature resistant anti-yellowing optical adhesive comprises the following components by weight: 40-60% of modified organic silicon resin, 20-30% of urethane acrylate, 10-15% of alicyclic epoxy resin, 0.5-5% of a nano inorganic filler, 0.8-2.5% of an anti-yellowing composite reagent, and the balance of a solvent. The coating is prepared from the following components in percentage by weight: 0.5 to 1.5 percent of 2-hydroxy-2-methyl-1-phenyl-1-acetone, 0.1 to 0.3 percent of fluorine modified polyacrylate flatting agent and 0.3 to 1.0 percent of chloroplatinic acid-divinyl tetramethyl disiloxane complex catalyst. The preparation method comprises the following steps: mixing alpha, omega-dihydroxy polydimethylsiloxane and phenyltrimethoxysilane according to a mass ratio of 8: 2-7: 3, adding 0.3-1.0% of a chloroplatinic acid-divinyl tetramethyl disiloxane complex catalyst, and raising the temperature by stages under the protection of nitrogen, so that the glass transition temperature of the adhesive can reach 120 DEG C below zero and 125 DEG C, and the temperature of the adhesive can reach 120 DEG C below zero and 125 DEG C below zero. And the long-term service requirement of the optical device in an extreme temperature environment is met.

The invention relates to the field of epoxy molding compounds, and discloses an epoxy molding compound as well as a preparation method and application thereof. The epoxy molding compound contains a heat-conducting filler, epoxy resin, a curing agent, a curing accelerator, a coupling agent, a bonding modifier, a flame retardant, a coloring agent, a release agent, hydroxyl-terminated silicone oil and a dispersing wetting agent. The heat-conducting filler contains aluminum oxide, crystalline silicon dioxide powder and molten spherical silicon dioxide powder; the bonding modifier is a triazole compound or a gallic acid compound; the weight ratio of the hydroxyl-terminated silicone oil to the heat-conducting filler to the bonding modifier is (1.5-4): (700-800): 1. The epoxy molding compound has the advantages of favorable molding process property, excellent heat-conducting property and high adhesive strength, and is suitable for being used as a packaging material of a fully-packaged power module.

The invention relates to the technical field of optical protective materials, in particular to an anti-dazzle full-ultraviolet-proof optical protective material and a preparation method thereof.The anti-dazzle full-ultraviolet-proof optical protective material is formed by sequentially compounding a scratch-resistant hardened layer, a PET film layer a, a composite adhesive layer, a PET film layer b, an installation adhesive layer and a PET release film layer from top to bottom; the preparation method comprises the following steps: mixing organic silicon modified polyurethane acrylate, a pigment, a reactive diluent, a flatting agent, a photoinitiator, a solvent and modified nano silicon dioxide to prepare a photocurable scratch-resistant hardening coating liquid; in order to endow the optical material with excellent infrared barrier property and heat insulation property, cesium tungsten bronze is introduced into a composite adhesive layer as a filler, and in order to improve the adhesive power and water resistance of a composite adhesive solution, epoxy resin is taken as a base material, organic silicon modified polyurethane acrylate is introduced as a water-resistant component, acrylic acid is taken as tackifying resin, and a curing agent is taken as a curing agent. And bisphenol A ethoxylate dimethacrylate is used as a diluent.

The invention belongs to the technical field of fiber metal laminates, and particularly discloses an anti-shearing fiber metal laminate and a preparation method thereof. A stainless steel ultra-thin belt, carbon fiber woven cloth and one-way carbon fiber prepreg are laid according to a laying scheme of [W / [G / 0 / G / 90] 2 / Gc] s, modified epoxy resin is coated between every two layers in the laying process, and the anti-shearing fiber metal laminate is obtained after curing; wherein W represents the carbon fiber woven cloth, G represents the stainless steel ultra-thin strip, 0 represents the unidirectional carbon fiber prepreg laid at 0 degree, 90 represents the unidirectional carbon fiber prepreg laid at 90 degrees, Gc represents the central layer, s represents the symmetrical laying layers along the central layer, and 2 represents the repetition frequency of [G / 0 / G / 90]. According to the prepared anti-shearing fiber metal laminate, the anti-shearing performance of the fiber metal laminate is greatly improved, and the possibility of damage such as layering damage, matrix fracture, fiber fracture and metal plastic deformation is reduced.

The embodiment of the invention provides a UV (ultraviolet) thermal dual-curing adhesive and a preparation method thereof. The UV thermal dual-curing adhesive comprises the following components in percentage by mass: 30-55% of a photocuring prepolymer; 5%-25% of an active diluent monomer; 1%-10% of a photoinitiator; 1%-20% of a thermal initiator; 10%-40% of a filler; 0.5%-5% of a coupling agent; 1%-10% of a thixotropic agent; 1%-10% of pigment; 2%-8% of an auxiliary agent; wherein the photocuring prepolymer comprises epoxy resin. According to the UV thermal dual-curing adhesive and the preparation method thereof provided by the embodiment of the invention, the dual-curing adhesive with low shrinkage and low thermal expansion coefficient is obtained by optimizing the structure of the photocuring prepolymer and matching the components, and the prepared adhesive can be rapidly cured under the irradiation of LED 365nm ultraviolet light, or can be thermally cured under the low-temperature condition of 80 DEG C, so that the UV thermal dual-curing adhesive can be widely applied to the field of ultraviolet curing. The product can resist high and low temperature cycle impact of-50 DEG C to 140 DEG C, and has a good application prospect.

The invention relates to a high-thermal-conductivity epoxy resin conductive adhesive containing a composite conductive filler and a preparation method of the high-thermal-conductivity epoxy resin conductive adhesive. The high-thermal-conductivity epoxy resin conductive adhesive containing the composite conductive filler comprises 6-16% of graphene oxide modified epoxy resin, 0.6-3% of a curing agent, 0-1% of a curing accelerator, 2-7% of epoxidized soybean oil modified single-layer / multi-layer carbon nanotubes, 3-7% of carbon fibers, 3-7% of nano silver powder, 40-70% of micron silver powder, 5.0-15.0% of a surface treating agent, 0.3-2.7% of a coupling agent, 0.5-1.5% of a dispersing agent, 0.1-0.3% of an antioxidant and 0.1-0.3% of a lubricant. 0.5% and the balance of a solvent. The graphene oxide modified epoxy resin and the epoxidized soybean oil modified single-layer / multi-layer carbon nanotubes are utilized to improve the dispersion stability of the filler, the modified single-layer / multi-layer carbon nanotubes are adopted as a short-range conductive additive, the carbon fibers are adopted as a long-range conductive additive, and the graphene oxide modified epoxy resin and the epoxidized soybean oil modified single-layer / multi-layer carbon nanotubes and the carbon fibers cooperate to improve the conductivity. The conductive adhesive disclosed by the invention is high in heat conductivity, low in volume resistivity and high in tensile strength and bending strength, and has a wide application prospect in the fields of automotive electronics, wind power photovoltaics, LEDs (Light Emitting Diode), LCDs (Liquid Crystal Display) and the like.

The invention belongs to the technical field of packaging adhesive films for photovoltaic modules, and particularly relates to a water-blocking and oxygen-blocking adhesive film for photovoltaic module packaging and a preparation method of the water-blocking and oxygen-blocking adhesive film for photovoltaic module packaging, and the water-blocking and oxygen-blocking adhesive film comprises a water-blocking layer and an oxygen-blocking layer which are adjacent to each other through co-extrusion; wherein the waterproof layer is prepared from the following materials in parts by mass: 100 parts of grafted polyolefin resin, 0.05 to 0.5 part of alkaline nano oxide and 0.1 to 1 part of antioxidant; the oxygen barrier layer is prepared from the following materials in parts by mass: 100 parts of oxygen barrier resin, 0.1-1 part of an oxygen absorbent, 0.1-1 part of a silane coupling agent and 0.05-0.5 part of a light conversion agent; the oxygen-resistant resin comprises any one or a combination of more of PS (polystyrene), PE (polyethylene), PET (polyethylene terephthalate), PB (polybutylene), PP (polypropylene), PVC (polyvinyl chloride), PVDC (polyvinyl dichloride), PA6 (polyamide 6) and EVOH (ethylene-vinyl alcohol).

To provide: an adhesive composition which has excellent low viscosity when adjusted to a predetermined non-volatile content, and which, when used in an adhesive sheet, exhibits excellent releasability and is less likely to cause lifting or peeling from an adherend even after exposure to a high-temperature environment or a high-temperature and high-humidity environment; and an adhesive sheet employing the same.SOLUTION: An adhesive composition comprises an acrylic polymer (A) and a curing agent (B). The acrylic polymer (A) is a copolymer of a monomer mixture containing respective specific amounts of specific monomers (a1) and (a2). The amount of the curing agent (B) added is 0.01-5 pts.mass based on 100 pts.mass of the acrylic polymer (A). The gel fraction of an adhesive layer composed of the adhesive composition is 55-90%.SELECTED DRAWING: Figure 1

The invention provides a manufacturing process of high-heat-insulation ray-proof antibacterial glass. The high-heat-insulation ray-proof antibacterial glass comprises outer-layer glass, a middle functional layer, inner-layer glass and an extensible layer, the manufacturing process comprises a PVB adhesive film preparation process and a laminated glass whole process, wherein the PVB adhesive film preparation process specifically comprises the steps of raw material mixing, melt extrusion, tape casting and coiling; the whole process of the laminated glass comprises the steps of glass pretreatment, interlayer assembly, high-temperature and high-pressure forming and post-treatment and quality inspection. According to the design scheme of the multi-film composite laminated glass, based on the structural characteristics of the laminated glass, a layered ray-blocking customized glass scheme is provided in combination with the combination of heat-insulating PVB films and other films with different functions, and the scheme is suitable for scenes such as sunlight rooms, agricultural planting or market curtain walls and the like.

The present invention discloses a low-temperature conductive adhesive, which is prepared by weight using raw materials including 70-80 parts of silver powder, 20-30 parts of resin matrix, 1-10 parts of curing agent, 0.1-0.5 parts of silane coupling agent, 0.1-0.5 parts of stabilizer, and 0.1-0.5 parts of metal salt. The present invention introduces an organic metal salt into the resin matrix to reduce the contact resistance of the colloid, and after wet heat aging, maintains a lower contact resistance increase rate. The present invention adopts a combination of epoxy resin, acrylate and modified epoxy acrylic resin, and the weight of epoxy resin and acrylate is less than or equal to the weight of modified epoxy acrylic resin, so that low-temperature curing can be achieved. The present invention can achieve 60-80 ° C, 20-40 min curing, and the conductive adhesive elongation at break obtained can reach more than 8%, and before and after wet heat aging, there is a more stable and relatively small contact resistance, which is particularly suitable for the electronic field with high requirements for contact resistance.