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3049 results about "Adhesive bonding" patented technology

Adhesive bonding (also referred to as gluing or glue bonding) describes a wafer bonding technique with applying an intermediate layer to connect substrates of different types of materials. Those connections produced can be soluble or insoluble. The commercially available adhesive can be organic or inorganic and is deposited on one or both substrate surfaces. Adhesives, especially the well-established SU-8, and benzocyclobutene (BCB), are specialized for MEMS or electronic component production.

Fully elastic nonwoven-film composite

This invention concerns an elastic multilayer composite, comprising an elastic film layer sandwiched between a first elastic nonwoven layer and an optional second elastic nonwoven layer, and a process for making the same. The laminate is stabilized via bonding according to either: adhesive bonding between the film and nonwoven layer(s), direct extrusion lamination of the film to one or more nonwoven layer(s), or attachment of the film to one or more of the nonwoven layers at a plurality of points via thermopoint bonding. This invention also concerns a process for manufacturing an elastic multilayer composite, comprising: bonding under neutral tension or substantially neutral tension at least one elastic film layer to at least one elastic nonwoven layer. This invention also concerns a process for manufacturing an elastic multilayer composite, comprising: bonding under differential tension or stretch at least one elastic film layer to at least one elastic nonwoven layer, where either the film or the nonwoven or both are stretched Further the invention relates to a process whereby the elastic nonwoven(s), the film, the composite or any combination is activated, especially stretch activated, to create or enhance elasticity or the touch of the nonwoven, to create pores in the elastic film, or to soften the composite.
Owner:ADVANCED DESIGN CONCEPTS GMBH

Composite material, high-frequency circuit substrate therefrom and manufacture method thereof

The invention relates to a composite material, a high-frequency circuit substrate therefrom and a manufacture method thereof. The composite material comprises thermoset mixture, glass fiber cloth, power filler, a fire retardant and a curing initiator, wherein the thermoset mixture comprises more than one kind of vinyl liquid resin and polyphenyl ether resin; the molecular weight of the vinyl liquid resin is below 10000, and the vinyl liquid resin is provided with a polar functional group; the molecular weight of the polyphenyl ether resin is less than 5000, and the molecular tail end of the polyphenyl ether resin is provided with unsaturated double bonds. The high-frequency circuit substrate manufactured with the composite material comprises multiple layers of semi-solidified sheets and copper foils, wherein the semi-solidified sheets are mutually overlaid, and the copper foils are respectively pressed on two sides. The composite material disclosed by the invention causes the semi-solidified sheets to be easily manufactured and have high adhesive bonding force with the copper foils. The high-frequency circuit substrate manufactured by the material has the advantages of low dielectric constant, low dielectric loss angle tangent, good heat resistance and simple technical operation. Thus, the composite material disclosed by the invention is suitable for manufacturing the circuit substrate of the high-frequency electronic equipment.
Owner:GUANGDONG SHENGYI SCI TECH
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