16809 results about "Sealant" patented technology

The disclosure relates to biocompatible components useful for forming compositions for use as medical / surgical synthetic adhesives and sealants. Biocompatible components of the present disclosure may include a multifunctional amine or multifunctional polyol core, with isocyanate and / or polyalkylene oxide arms, which may optionally be capped with electrophilic or nucleophilic groups. These biocompatible components may, in embodiments, be combined with optional cross linkers to form adhesive and / or sealant compositions.

A semiconductor component includes a base die and a secondary die stacked on and bonded to the base die. The base die includes conductive vias which form an internal signal transmission system for the component, and allow the circuit side of the secondary die to be bonded to the back side of the base die. The component also includes an array of terminal contacts on the circuit side of the base die in electrical communication with the conductive vias. The component can also include an encapsulant on the back side of the base die, which substantially encapsulates the secondary die, and a polymer layer on the circuit side of the base die which functions as a protective layer, a rigidifying member and a stencil for forming the terminal contacts. A method for fabricating the component includes the step of bonding singulated secondary dice to base dice on a base wafer, or bonding a secondary wafer to the base wafer, or bonding singulated secondary dice to singulated base dice.

An apparatus for applying sealant to a target tissue of a surgical site is provided. The apparatus includes a handle, conduit and an end effector. The handle has means configured and adapted for operating the end effector and dispensing biological sealant to the surgical site via the end effector. The conduit stores and / or carries sealant towards the end effector. The end effector is configured to clamp around a body organ or tissue and apply and confine biological sealant in a substantially uniform manner thereto.

A stacked package structure and a method for manufacturing the same are disclosed. The package structure comprises: a substrate having a first surface and a second surface in opposition to each other; at least one chip deposed on and electrically connected to the first surface of the substrate; a plurality of electrical connection devices deposed on the first surface and periphery of the substrate, wherein each electrical connection device is higher than the at least one chip in altitude; and an encapsulant covering the first surface of the substrate, the at least one chip and the electrical connection devices, wherein a top end of each electrical connection device is exposed at a surface of the encapsulant.

The present invention relates to novel bioabsorbable polymeric compositions based upon AB polyester polyether or related diblocks and triblocks. Compositions according to the present invention may be used in medical applications, for example, for reducing or preventing adhesion formation subsequent to medical procedures such as surgery, for producing surgical articles including stents and grafts, as coatings, sealants, lubricants, as transient barriers in the body, for materials which control the release of bioactive agents in the body, for wound and bum dressings and producing biodegradable articles, among numerous others.

A method of making a microelectronic package includes providing a sacrificial layer having a first surface and providing an optoelectronic element having a front face including one or more contacts and a rear surface and securing the rear surface of the optoelectronic element over the first surface of the sacrificial layer. The one or more contacts are then electrically interconnected with one or more conductive pads on the sacrificial layer and a curable and at least partially transparent encapsulant is provided over the first surface of the sacrificial layer so as to encapsulate the optoelectronic element and the conductive pads. The encapsulant is then cured the sacrificial layer is at least partially removed so as to leave said one or more conductive pads on a bottom surface of the encapsulant, the bottom surface of the encapsulant defining the bottom of the package. The optoelectronic element may include a light sensitive chip such as an ultraviolet-erasable programmable read-only memory (UV EPROM) or a light emitting chip, such as a light emitting diode (LED).

A lighting device comprises a solid state light emitter, first and second electrodes connected to the emitter, an encapsulant region comprising a silicone compound and a supporting region. The encapsulant region extends to an external surface of the lighting device. At least a portion of the first electrode is surrounded by the supporting region. The encapsulant region and the supporting region together define an outer surface which substantially encompasses the emitter. A method of making a lighting device, comprises electrically connecting first and second electrodes to an emitter; inserting the emitter into mold cavity; inserting an encapsulant composition comprising a one silicone compound; and then inserting a second composition to substantially surround at least a portion of the first electrode.

A device is described that may be positioned at a location in an intervertebral disc for diagnosis or treatment of the disc. Treatment may include, for example, applying energy or removing material, and may decrease intradiscal pressure. Radiofrequency energy may be applied. A percutaneous method of repairing a fissure in the annulus pulposus comprises placing an energy source adjacent to the fissure and providing sufficient energy to the fissure to raise the temperature to at least about 45-70° C. and for a sufficient time to cause the collagen to weld. An intervertebral fissure also can be treated by placing a catheter with a lumen adjacent to the fissure and injecting sealant into the fissure via the catheter, thereby sealing the fissure. An intervertebral fissure additionally can be treated by providing a catheter having a distal end, a proximal end, a longitudinal axis, and an intradiscal section at the catheter's distal end on which there is at least one functional element. The next step is applying a force longitudinally to the proximal of the catheter which is sufficient to advance the intradiscal section through the nucleus pulposus and around an inner wall of an annulus fibrosus, but which force is insufficient to puncture the annulus fibrosus. Next the functional element is positioned at a selected location of the disc by advancing or retracting the catheter and optionally twisting the proximal end of the catheter. Then the functional unit treats the annular fissure. Optionally, there is an additional step of adding a substance to seal the fissure. An externally guidable intervertebral disc apparatus also is disclosed.

Apparatus for delivering a sleeve into a puncture through tissue includes a tubular sheath including a lumen extending between its proximal end and an opening in its distal end. The sleeve includes a hub on a first end thereof disposed adjacent the distal end of the sheath, and a second end extending into the opening and lumen of the sheath. The hub is slidable along an exterior of the sheath for drawing the sleeve out of the opening and along an exterior of the sheath. During use, a guide wire is placed through the puncture into a blood vessel, and sealing compound is introduced into the puncture around the guide wire. The sheath is advanced into the puncture over the guidewire while maintaining the hub adjacent the patient's skin, causing the sleeve to be deployed from the sheath and line the puncture as the sheath is advanced into the puncture.

Sealant and potting formulations are provided which are prepared from components including ungelled mercapto-terminated polymer(s) prepared by reacting reactants comprising polyvinyl ether monomer(s) and polythiol material(s); curing agent(s) reactive with a mercapto group of the mercapto-terminated polymer; and additive(s) selected from the group consisting of fillers, adhesion promoters, plasticizers and catalysts.

A package structure including a first lead, a second lead, an encapsulant, a light-emitting device and an electrostatic discharge (ESD) protection device is provided. The second lead is disposed beside the first lead, and parts of the first lead and the second lead are encapsulated by the encapsulant. The encapsulant has a first cavity and a second cavity. Parts of the first lead and the second lead are exposed by the first cavity and the other parts of the first lead and the second lead are exposed by the second cavity. The light-emitting device is disposed inside the first cavity and electrically connected to the first lead and the second lead. The ESD protection device is disposed inside the second cavity and electrically connected to the first lead and the second lead.

A light emitting apparatus has a radiation source for emitting short wavelength radiation. A down conversion material receives and down converts at least some of the short wavelength radiation emitted by the radiation source and back transfers a portion of the received and down converted radiation. An optic device adjacent the down conversion material at least partially surrounds the radiation source. The optic device is configured to extract at least some of the back transferred radiation. A sealant substantially seals a space between the radiation source and the optic device.

Devices for implantation into an intervertebral disc can include a membrane support member to augment a disc having a defect. A defect in the anulus of a disc can be repaired using a prosthesis such as a barrier. The barrier can include a sealant and an enlarger. The barrier can be implanted into the disc using a delivery cannula, an advancer and at least one control filament to control the positioning of the barrier. A stiffening element can be included within the barrier to impart stiffness to the barrier. The support member can also be connected to an anchor.

Described is an oil-degradable ball sealer for use in the oil and gas industry. The ball seal comprises a particular composition including ethylene and one or more alpha-olefins, prepared by an injection molding technique to provide a ball sealer which will dissolve in stimulation or wellbore fluids after stimulation operations are complete. The composition, when dissolved into wellbore fluids, does not pose a hazard or problem to aqueous wellbore fluids or further wellbore stimulations.

A semiconductor package and method of producing the same has a semiconductor die having a first face and a second face. A coating material is coupled to the second face of the semiconductor die. A substrate having a cavity is provided wherein the semiconductor die is placed within the cavity. An encapsulant is used to encapsulate the second face of the semiconductor die placed in the cavity. Connection members are provided to couple the semiconductor die and the substrate in order to transfer signals between the semiconductor die and the substrate. Terminal members are couple to the substrate to connect the semiconductor package to an external device. In the semiconductor package, a thermal expansion coefficient of the coating material C and a thermal expansion coefficient of the encapsulant E should be approximately equal in value in order to limit the problems associated with warpage.

A method of making a microelectronic assembly includes providing a microelectronic package having a substrate, a microelectronic element overlying the substrate and at least two conductive elements projecting from a surface of the substrate, the at least two conductive elements having surfaces remote from the surface of the substrate. The method includes compressing the at least two conductive elements so that the remote surfaces thereof lie in a common plane, and after the compressing step, providing an encapsulant material around the at least two conductive elements for supporting the microelectronic package and so that the remote surfaces of the at least two conductive elements remain accessible at an exterior surface of the encapsulant material.

A sealant composition for servicing a wellbore comprising at least one gel system, a leak off prevention material and water.

Disclosed are particles that have an exterior surface coated with a thin polymeric coating, such as a coating that includes a sulfur-containing polymer. Also disclosed are compositions, such as fuel-resistant sealant and coating compositions, which include such particles. Aerospace vehicles having an aperture at least partially sealed with a sealant deposited from such a sealant composition are also disclosed.

An improved moisture management system for installation over doors and windows in buildings that included exterior, stucco-covered, curtain walls comprising an integrally formed, three sided, elongated track including a base, an upright front wall that includes at its base weep holes for the removal of entrained moisture as well as a longitudinal forward extending finish stop above the weep holes, and an upright rear wall at opposing elongated edges of the base, and, extending angularly downward from the outside of the base, and integrally formed therewith, a drip plate that permits ready drainage of water exiting the moisture management system through the weep holes in the upright front wall. Preferably, elongated striations in the front faces of both the front and rear upright walls as well as holes in the upright front wall above the finish stop provide improved adherence of sealants and adhesives used in the installation process.

Sealant compositions comprising an alkali swellable latex and a pH increasing material and methods of using the same to service a wellbore are provided. In one embodiment, the sealant composition can be used in a wellbore and includes an alkali swellable latex and a pH increasing material. The sealant composition can have a pH of from about 7 to about 14. In other embodiments, the pH increasing material includes a base-producing material. The base-producing material can include alkali and alkali earth metal carbonates, alkali and alkali earth metal bicarbonates, alkali and alkali earth metal hydroxides, alkali and alkali earth metal oxides, alkali and alkali earth metal phosphates, alkali and alkali earth metal hydrogen phosphates, alkali and alkaline earth metal sulphides, alkali and alkaline earth metal salts of silicates, alkali and alkaline earth metal salts of aluminates, water soluble or water dispersible organic amines, polymeric amine, amino alcohols, or combinations thereof.

This invention relates generally to a design of lung devices for safely performing a transthoracic procedure. In particular, the invention provides devices and methods of using these devices to access the thoracic cavity with minimal risk of causing pneumothorax or hemothorax. More specifically, the invention enables diagnostic and therapeutic access to a thoracic cavity using large bore instruments. This invention also provides a method for diagnostic and therapeutic procedures using a device capable of sealing the wound upon withdrawal of the device. The invention includes a device comprising an elongated body adapted to make contact with a tissue of a subject through an access hole, and a sealant delivery element. The invention also includes a method of performing tissue treatment or diagnosis in a subject.

The invention relates to a high power LED package, in which a package body is integrally formed with resin to have a recess for receiving an LED chip. A first sheet metal member is electrically connected with the LED chip, supports the LED chip at its upper partial portion in the recess, is surrounded by the package body extending to the side face of the package body, and has a heat transfer section for transferring heat generated from the LED chip to the metal plate of the board and extending downward from the inside of the package body so that a lower end thereof is exposed at a bottom face of the package body thus to contact the board. A second sheet metal member is electrically connected with the LED chip spaced apart from the first sheet metal member for a predetermined gap, and extends through the inside of the package body to the side face of the package body in a direction opposite to the first sheet metal member. A transparent sealant is sealingly filled up into the recess. The LED package raises thermal radiation efficiency with a simplified structure in order to reduce the size and thickness thereof.

An organic light emitting diode (OLED) display and a method of manufacturing the same, the OLED display including a flexible substrate, a driving circuit unit on the flexible substrate, the driving circuit unit including a thin film transistor (TFT), an organic light emission element on the flexible substrate, the organic light emission element being connected to the driving circuit unit, an encapsulating thin film on the flexible substrate, the encapsulating thin film covering the organic light emission element and the driving circuit unit, a first protection film facing the encapsulating thin film, a second protection film facing the flexible substrate, a first sealant disposed between the encapsulating thin film and the first protection film, and a second sealant disposed between the flexible substrate and the second protection film.

The present invention relates to novel hexa-arm polyethylene glycol (6-arm PEG) and its derivatives. The core of 6-arm PEG derivatives is sorbitol and the end groups can be derivatized into many different reactive functionalities that are useful in conjugating with many different targets. The present invention also provides a biodegradable polymeric hydrogel-forming composition comprising the 6-arm PEG and its derivatives, and methods of using such 6-arm PEG derivatives as surgical or biological implants or sealants.

An integrated circuit package with a fully-exposed heat sink is provided. The integrated circuit package includes a substrate having a first side being formed with first conductive traces and a second side being formed with second conductive traces. At least one chip is mounted on the substrate and electrically connected to the first conductive traces. A plurality of solder balls are provided at the terminal ends of the second conductive traces to allow external connection of the chip. The fully-exposed heat sink is mounted on the substrate. The heat sink is formed with a plurality of supportive legs arranged in such a manner as to allow a bottom surface of the heat sink to be separated from the chip and a top surface of the heat sink to be tightly attached to a cavity in a mold used to form an encapsulant for enclosing the chip. A plurality of positioning tongues are formed on the heat sink for securing the heat sink in position when performing a molding process for forming the encapsulant. With this integrated circuit package, no jig is required in the assembly of the integrated circuit package. Moreover, since there is no need to use adhesives to adhere the supportive legs onto the substrate, the integrated circuit package would not suffer from delamination as in the case of the prior art. The fully-exposed heat sink allows an increased heat-dissipating efficient as compared to the prior art.