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Non-cylindrical prosthetic valve system for transluminal delivery

InactiveUS20070043435A1Preventing substantial migrationEliminate the problemBalloon catheterHeart valvesCoronary arteriesProsthesis
A prosthetic valve assembly for use in replacing a deficient native valve comprises a replacement valve supported on an expandable prosthesis frame. If desired, one or more expandable anchors may be used. The prosthesis frame, which entirely supports the valve annulus, valve leaflets, and valve commissure points, is configured to be collapsible for transluminal delivery and expandable to contact the anatomical annulus of the native valve when the assembly is properly positioned. Portions of the prosthesis frame may expand to a preset diameter to maintain coaptivity of the replacement valve and to prevent occlusion of the coronary ostia. The prosthesis frame is compressible about a catheter, and restrained from expanding by an outer sheath. The catheter may be inserted inside a lumen within the body, such as the femoral artery, and delivered to a desired location, such as the heart. When the outer sheath is retracted, the prosthesis frame expands to an expanded position such that the valve and prosthesis frame expand at the implantation site and the anchor engages the lumen wall. The prosthesis frame has a non-cylindrical configuration with a preset maximum expansion diameter region about the valve opening to maintain the preferred valve geometry. The prosthesis frame may also have other regions having a preset maximum expansion diameter to avoid blockage of adjacent structures such as the coronary ostia.

Marking and guidance method and system for flexible fixation of a spine

A method and system for marking and guiding the insertion of securing members (e.g., pedicle screws) of a spinal fixation device. In one embodiment, the marking and guidance method and system includes the use of a guide tube configured to be inserted into a patient's back until a first end reaches an entry point on or near a vertebral bone of the patient's spinal column, wherein the guide tube includes a hollow cylindrical channel along its longitudinal center axis; a penetrating device configured to be positioned within the cylindrical channel of the guide tube and having a sharp tip configured to protrude outwardly from the first end of the guide tube so as to allow the first end of the guide tube to penetrate through the patient's back muscle and tissue and reach the vertebral bone at the entry point; a marking pin configured to be inserted through the cylindrical channel of the guide tube, after removal of the penetrating device, until a first end of the marking pin having a sharp tip reaches the entry point; and a pushing device configured to be inserted through the cylindrical channel of the guide tube and provide a driving force at a second end of the marking pin, opposite the first end, so as to drive and secure the first end of the marking pin into the vertebral bone, wherein the marking pin identifies the location of the entry point on the vertebral bone for subsequent implantation of a securing member of a spinal fixation device.

Composite interconnection element for microelectronic components, and method of making same

Interconnection elements for electronic components, exhibiting desirable mechanical characteristics (such as resiliency, for making pressure contacts) are formed by shaping an elongate element (core) of a soft material (such as gold) to have a springable shape (including cantilever beam, S-shape, U-shape), and overcoating the shaped elongate element with a hard material (such as nickel and its alloys), to impart a desired spring (resilient) characteristic to the resulting composite interconnection element. A final overcoat of a material having superior electrical qualities (e.g., electrical conductivity and / or solderability) may be applied to the composite interconnection element. The elongate element may be formed from a wire, or from a sheet (e.g., metal foil). The resulting interconnection elements may be mounted to a variety of electronic components, including directly to semiconductor dies and wafers (in which case the overcoat material anchors the composite interconnection element to a terminal (or the like) on the electronic component), may be mounted to support substrates for use as interposers and may be mounted to substrates for use as probe cards or probe card inserts. In one embodiment, a hybrid composite interconnection element is formed by mounting a core to an end of an flat elongate element formed from a sheet, and overcoating at least the core, the flat elongate element providing a "floating" support for the overcoated core, capable of absorbing non-planarities (tolerances) of an electronic component. Methods of fabricating interconnection elements on sacrificial substrates are described. Methods of fabricating tip structures and contact tips at the end of interconnection elements are described.
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