18 results about "Solderability" patented technology

The application discloses a rare earth high-strength dual-phase steel and a forming method and application thereof, and belongs to the technical field of dual-phase steel. The forming method of the rare earth high-strength dual-phase steel comprises the following steps: converter smelting, LF refining, RH refining, adding cerium iron and yttrium iron at the end of the RH refining or before continuous casting, continuous casting, three-stage hot rolling, cold rolling and three-stage annealing. The rare earth high-strength dual-phase steel has good cold stamping formability, high weldability, no rare earth element segregation, no cracking of steel forming, high yield, and can be directly used to prepare automobile bodies after cold stamping forming at normal temperature. There is no rare earth inclusion or coarse carbon nitride brittle bulk agglomerate on the surface layer of the weld, the rare earth element is in a dispersed distribution state, has excellent dispersion strengthening effect, the weld is not prone to cracking, and the mechanical properties of the weld are superior to those of the base material.

This invention discloses a conductive paste for metallization of electronic ceramics, belonging to the field of electronic materials technology. The conductive paste for metallization of electronic ceramics of this invention includes copper alloy powder, glass powder, and an organic carrier. By controlling the ratio of copper, aluminum, and zinc in the copper alloy, the thermal expansion coefficient of the alloy is adjusted, making it compatible with electronic ceramic substrates such as alumina ceramics and zinc oxide varistors, achieving metallization through sintering under air conditions. The addition of tin improves the solderability of the metallized layer, meeting the process requirements of electronic components. The glass powder added in this invention has a low initial melting temperature, high bonding strength with the copper alloy, and strong adhesion to the ceramic substrate; combined with a specific ratio of organic carrier, it effectively improves the conductivity of the metallized layer after sintering.

This invention relates to the field of intelligent manufacturing technology and provides a deep learning-based adaptive optimization method for welding process parameters. The method includes: acquiring the weld path and quality target of the parts to be welded; dividing the weld path into a set of weld segment units; collecting pre-welding geometric data and in-welding process data for each weld segment unit to obtain segment welding state characteristics; constructing a local weldability risk field to obtain segment risk field results; generating a segment parameter candidate set based on the welding parameter safety working window as a constraint and the segment risk field results; inputting the segment welding state characteristics, segment risk field results, and segment parameter candidate set into a pre-constructed physical constraint deep learning model to obtain segment quality prediction results; and performing rolling parameter optimization based on the segment quality prediction results to obtain a segment welding parameter sequence and sending it to the welding execution end.

The application provides a flexible printed circuit board prepared based on a weldable silver paste and a preparation method, and relates to the technical field of flexible printed circuit boards.The flexible printed circuit board comprises a substrate shielding composite layer, a weldable silver paste layer is arranged on the substrate shielding composite layer, a protective layer is arranged on the weldable silver paste layer, a pad area and a non-pad area are divided on the protective layer, the pad area forms a weak curing structure after light-heat synchronous curing, and the pad area is exposed after weak alkali treatment, and the non-pad area forms a complete curing structure;the weldable silver paste system is used to improve the line conductivity, the silver surface is directly exposed, the weak alkali treatment breaks through the weldability bottleneck of a traditional metal plating layer, the screen printing process is used to replace multi-step plating, and the production process is greatly simplified.Compared with an aluminum plating process, a copper plating process and a gold plating process, the application has significant advantages in conductivity, weldability and process simplification.

The application discloses a rare earth high-strength dual-phase steel and a forming method and application thereof, and belongs to the technical field of dual-phase steel. The forming method of the rare earth high-strength dual-phase steel comprises the following steps: converter smelting, LF refining, RH refining, adding cerium iron and yttrium iron at the end of the RH refining or before continuous casting, continuous casting, three-stage hot rolling, cold rolling and three-stage annealing. The rare earth high-strength dual-phase steel has good cold stamping formability, high weldability, no rare earth element segregation, no cracking of steel forming, high yield, and can be directly used to prepare automobile bodies after cold stamping forming at normal temperature. There is no rare earth inclusion or coarse carbon nitride brittle bulk agglomerate on the surface of the weld, the rare earth element is in a dispersed distribution state, has excellent dispersion strengthening effect, the weld is not prone to cracking, and the mechanical properties of the weld are superior to those of the base material.

This invention discloses a thin-film capacitor, including a housing, a capacitor core, and an electrode assembly. The electrode assembly includes an external electrode and an internal electrode, with the internal electrode integrating solder pins. When the internal electrode is made of low-cost non-pure copper materials such as aluminum, aluminum alloy, or steel, the solder pins are partially coated to ensure the solderability of the electrode and the core, and to ensure reliable connection. When the external electrode is entirely made of low-cost non-pure copper materials such as aluminum, aluminum alloy, or steel, the exposed terminals are also coated to ensure the conductivity of the non-copper electrodes and the terminals, and to reduce contact resistance.

This invention belongs to the field of metallurgical materials technology and relates to a composite material of weldable steel matrix reinforced with ultra-wear-resistant tungsten carbide particles and its preparation method. The method uses medium-carbon low-alloy steel of a specific composition as the matrix and tungsten carbide particles with a particle size of 4-6 mm as the wear-resistant reinforcing phase. The composite material is prepared through steps including sand mold preparation, directional particle laying, smelting and casting in an 1800℃ / 5h resistance furnace, temperature-controlled solidification and demolding, and segmented air-cooling hardening heat treatment. During the process, high temperature is used to achieve interfacial metallurgical bonding between the matrix and the tungsten carbide particles, forming a gradient transition layer. The wear-resistant layer of the composite material prepared by this invention exhibits improved Rockwell hardness, wear resistance, and interfacial shear strength, while also possessing excellent toughness and field weldability. The preparation process is mature, cost-controllable, and suitable for industrial mass production. It is applicable to wear-resistant parts for dredging equipment, significantly extending service life and reducing maintenance costs, and has extremely high engineering application value.

This invention relates to a solderable low-temperature conductive silver paste, its preparation method, and its applications. The silver paste comprises, by weight percentage, 60%-80% silver powder, 6%-9% resin, 0.5%-3% soldering aid, 1%-2% dispersant, 0.5%-1% curing agent, 0.1%-1% accelerator, and 10%-40% organic solvent. The preparation method includes steps such as silver powder surface treatment, functional filler preparation, organic carrier formulation, mixing and grinding, and vacuum degassing. Compared with existing technologies, this invention has advantages such as excellent conductivity, good solderability, and adhesion, and is suitable for flexible electronics, membrane switches, RFID tags, and low-temperature electronic packaging. The process is simple and suitable for large-scale production.

The application provides a method for improving the anti-oxidation performance of Sn-Cu lead-free solder, and belongs to the technical field of electronic packaging lead-free solder. The application improves the anti-oxidation performance and interface reliability of Sn-Cu lead-free solder through raw material selection and process cooperation. First, Ni and / or Co are added to Sn-Cu alloy for micro-alloying treatment to form intermetallic compound nucleation cores; then CeO2 particles are added and ultrasonic cavitation treatment is carried out to uniformly disperse the particles and induce heterogeneous nucleation; subsequently, rapid solidification process is used for casting forming, so that Ni / Co is preferentially solid-solved into Cu6Sn5 intermetallic compound to form refined (Cu,Ni,Co)6Sn5 structure, and CeO2 particles are driven to segregate to the interface region to form an oxygen diffusion inhibition layer; the interface cooperative structure can stabilize the intermetallic compound interface and inhibit oxygen diffusion. The Sn-Cu lead-free solder prepared by the method has excellent weldability, high-temperature oxidation resistance and mechanical stability, and is suitable for electronic packaging processes such as wave soldering and reflow soldering.

The application belongs to the technical field of photovoltaic welding strips, and particularly relates to a low-density photovoltaic flat welding strip and a preparation method thereof, the preparation steps being as follows: S1, melting metal copper into liquid form in a furnace, adding silica aerogel into the furnace, and stirring and casting to obtain an ingot; the mass ratio of the metal copper and the silica aerogel is 1:(0.002-0.003); S2, repeatedly rolling to obtain a refined copper strip, removing burrs and flash, and performing multi-pass drawing-annealing treatment through an oval-like flat die to obtain an oval-like processed flat copper wire; S3, surface treatment; S4, pulling the surface-treated flat copper wire out of molten solder alloy, controlling the thickness of the solder alloy layer on the surface of the flat copper wire through an air knife, cooling, and obtaining the low-density photovoltaic flat welding strip. The low-density photovoltaic flat welding strip has low weight per meter, low resistance per meter, and low resistivity, and has a yield strength of 60-70 MPa after annealing, high weldability, high welding utilization rate, and high light utilization rate.

The application discloses a solderability test device and test method suitable for BGA devices, and belongs to the technical field of destructive physical analysis and failure analysis of electronic components and devices. The device solves the technical problems of poor applicability of existing clamps to BGA devices with large size span and difficulty in adjusting the clamping size. The solderability test device comprises a clamp body and a connecting piece. The clamp body is fixedly connected with the connecting piece. The clamp body comprises a fixed block and first and second side clamps arranged in parallel. The first and second side clamps each comprise a clamping end and a fixed end, and are connected with the fixed block through the respective fixed ends. The first and second side clamps are arranged perpendicularly to the fixed block. The first and second side clamps are used for clamping the BGA device. The fixed block is arranged perpendicularly to the connecting piece and is connected with the connecting piece in a sliding mode. The connecting piece is fixedly connected with a solderability tester. The device can stably clamp BGA devices of different sizes and provide support for smooth solderability test.

This invention provides a high-temperature conductive silver paste for a microcrystalline glass thick-film heating plate, its preparation method, and sintering process. The high-temperature conductive silver paste for the microcrystalline glass thick-film heating plate, by mass percentage, comprises: silver powder: 75-85%; composite glass powder: 1-5%; organic carrier: 10-24%. The composite glass powder comprises component A and component B in a mass ratio of 1-3:1. Component B is silicon micropowder. Component A, by mass percentage, comprises: silicon oxide: 35-50%; boric acid: 20-30%; magnesium oxide: 10-15%; aluminum oxide: 5-10%; titanium oxide: 3-5%; and zirconium oxide: 1-2%. The high-temperature conductive silver paste for the microcrystalline glass thick-film heating plate prepared by this invention has high solderability, strong adhesion, a maximum operating temperature exceeding 450℃, strong resistance to high current impact, high re-firing stability, and excellent overall performance.

This invention discloses a method and apparatus for determining the weldability parameter range of magnetic pulse welding. The method includes: acquiring the structural parameters, material performance parameters, and preset welding quality requirements of the target welding part; establishing a numerical simulation model of the target welding part based on the structural and material performance parameters; adjusting the simulation conditions to ensure the simulation results meet the preset welding quality requirements; and extracting the collision process deformation information of the target welding part at the welding interface when the requirements are met; matching and retrieving the extracted collision process deformation information with a pre-constructed magnetic pulse welding database; determining the welding process parameters; and obtaining the weldability parameter range. The apparatus includes a welding fixture module and a pulse discharge module, and the collision angle can be adjusted with multiple degrees of freedom by changing the control pad. This invention significantly shortens the magnetic pulse welding process development cycle by constructing a highly versatile and expandable database.

The application relates to the technical field of conductive paste, and discloses a lead-free environment-friendly silver paste suitable for high-temperature co-fired ceramic and a preparation method, aiming to solve the technical problem that the components introduced for inhibiting silver ion migration of the lead-free silver paste in the prior art can easily cause the interface electric contact performance and weldability of the lead-free silver paste and a ceramic substrate to be deteriorated, a composite glass phase containing a specific interface buffer unit and a migration inhibition unit is designed, the mass ratio of the two is controlled, the buffer unit preferentially forms a benign interface layer, a stable working environment is provided for the inhibition unit, the silver paste can realize excellent silver ion migration resistance reliability, low resistance ohmic contact between the silver paste and the ceramic substrate and good welding wettability under the premise of being lead-free and environment-friendly, and the comprehensive performance meets the application requirements of the high-temperature co-fired ceramic.

Provided are an ultra-high strength galvanized steel sheet having excellent weldability and a method of manufacturing the same. According to an embodiment of the present invention, the ultra-high strength galvanized steel sheet includes: a steel sheet base material including, in weight percent, carbon (C): 0.1% to 0.3%, silicon (Si): 1.0% to 2.0%, manganese (Mn): 2.5% to 3.5%, aluminum (Al): 0.05% or less (including 0%), chromium (Cr): 1.0% or less (including 0%), molybdenum (Mo): 0.2% or less (including 0%), titanium + niobium + vanadium (Ti+Nb+V): 0.05% or less (including 0%), and the balance of iron (Fe) and other inevitable impurities; an iron coating layer formed on a surface of the steel sheet base material; and a hot-dip galvanized layer formed on a surface of the iron coating layer, wherein an internal oxide is formed at an interface between the steel sheet base material and the iron coating layer, thereby inhibiting the formation of an oxide at an interface between the iron coating layer and the hot-dip galvanized layer, and the internal oxide is spherical.

This invention discloses an axisymmetric solderability fixture device and solderability testing method for BGA devices, belonging to the field of electronic component technology. It solves the problem that existing fixtures rely entirely on the metal elasticity of the fixture for clamping effectiveness, making it impossible to adjust for BGA devices of different sizes, and easily causing metal fatigue and eventual failure. The axisymmetric solderability fixture device includes a fixture body and a connector; the fixture body and the connector are fixedly connected; the fixture body includes a slide rail and a first side clamp and a second side clamp arranged axially symmetrically about the connector; both the first and second side clamps include a clamping end and a fixed end, both slidably connected to the slide rail through their respective fixed ends; the first and second side clamps are used together to clamp the BGA device; the slide rail and the connector are perpendicularly arranged and fixedly connected; the connector is used for fixed connection to a solderability tester. This invention achieves stable clamping of BGA devices, providing support for successful solderability testing.

A composite material and method for producing said composite material are disclosed, with a support layer composed of a wrought aluminum alloy and with an external solder layer composed of an aluminum solder alloy provided on one or both flat sides of the support layer, wherein the solder layer has partially exposed silicon particles on its surface, which constitute a first area fraction of the total area of the surface of the solder layer. In order to reliably ensure flux-free solderability, it is proposed for the solder layer to have a rolled surface and for its aluminum solder alloy to contain at least 0.1 wt % bismuth (Bi), wherein the first area fraction is greater than 2.5%.