1007 results about "Solderability" patented technology

Interconnection elements for electronic components, exhibiting desirable mechanical characteristic (such as resiliency, for making pressure contacts) are formed by using a shaping tool (512) to shape an elongate core element (502) of a soft material (such as gold or soft copper wire) to have a springable shape (including cantilever beam, S-shape, U-shape), and overcoating the shaped core element with a hard material (such as nickel and its alloys), to impart to desired spring (resilient) characteristic to the resulting composite interconnection element. A final overcoat of a material having superior electrical qualities (e.g., electrical conductivity and/or solderability) may be applied to the composite interconnection element. The resulting interconnection elements may be mounted to a variety of electronic components, including directly to semiconductor dies and wafers (in which case the overcoat material anchors the composite interconnection element to a terminal (or the like) on the electronic component), may be mounted to support substrates for use as interposers and may be mounted to substrates for use as probe cards or probe card inserts. The shaping tool may be an anvil (622) and a die (624), and may nick or sever successive shaped portions of the elongate elements, and the elongate element may be of an inherently hard (springy) material. Methods of fabricating interconnection elements on sacrificial substrates are described. Methods of fabricating tip structures (258) and contact tips at the end of interconnection elements are also described.

The invention provides 1,000 MPa cold-rolled hot-dip galvanized dual-phase steel and a manufacturing method thereof, belonging to the technical field of cold-rolled hot-dip galvanized high-strength steel plates. The chemical components in mass percentage of the cold-rolled hot-dip galvanized dual-phase steel are: 0.06 to 0.18 percent of C, less than or equal to 0.1 percent of Si, 1.2 to 2.5 percent of Mn,0.05 to 0.5 percent of Mo, 0.05 to 0.6 percent of Cr, 0.005 to 0.05 percent of Al, 0.01 to 0.06 percent of Nb, 0.01 to 0.05 percent of Ti, less than or equal to 0.02 percent of P, less than or equal to 0.01 percent of S, less than or equal to 0.005 percent of N, the balance being Fe and inevitable impurities. The manufacturing method adopts Cr or Mo to replace Si, so as to enlarge an austenitic and ferritic two-phase region and improve the hardenability of the dual-phase steel, and meanwhile, the manufacturing method improves the strength of toughness of the steel by adding Nb or Ti refined grains, so as to ensure that the steel has good weldability and usability, and the strength grade of the steel can reach over 1,000 Mpa.

The invention relates to a lead free soldering clean free soldering flux with the mass percentage of organic acid activating agent 1. 5-3. 5%, surface active agent 0. 04-0. 6%, organic amine and derivant 2. 0-5. 0%, with the rest being film forming matter. The said organic acid could be one or more of the aliphatic acid mono acid or bi-acid, aromatic acid, or amino acid. The said surface active agent is one or more of the nonion surface active agent, and the said organic amine and the derivant being ethanediamine, tetramethylenediamine, diethyl ethanolamine and so on, with the said film forming material being diethyl ethanolamine or resin. The soldering flux does not have halogen, being environmental protective, good in welding, welding spot being full and luminous, without residue, no corrosion, high in isolation resistance.

The invention relates to the technical field of soldering pastes, in particular to a halogen-free tin-bismuth-copper soldering paste and a preparation method thereof. A soldering flux of the halogen-free tin-bismuth-copper soldering paste consists of the following components in percentage by weight: 20 to 40 percent of polymerized rosin, 1 to 6 percent of rosin amine, 4 to 8 percent of thixotropic agent, 5 to 10 percent of organic acid, 5 to 10 percent of organic amine, 1 to 5 percent of antioxidant, 0.5 to 3 percent of surfactant and an organic solvent. The halogen-free tin-bismuth-copper soldering paste is mainly characterized by adopting the organic acid and the organic amine serving as activating agents and comprising no halogens at all, so not only the solderability is not reduced, but also the expansion rate and the insulation resistance value of the soldering paste are improved, and simultaneously the corrosivity of residues after soldering to a base material is reduced and the service life of the soldering paste is prolonged; and particularly, the peak temperature of the soldering paste during soldering is lower in favor of reducing the thermal damages to electronic components.

The invention discloses enamel steel for a cold rolling water heater and a manufacturing process thereof. The enamel steel for cold rolling water heater comprises components as follows in percentage by weight: C: 0.01%-0.08%. Si: less than or equal to 0.03%, Mn: 0.10%-0.60%, P: less than or equal to 0.02%, S: 0.003%-0.02%, N: 0.001%-0.006%, AIs: less than or equal to 0.04%, Ti: 0.02%-0.12%, and the balance of ferrum and unavoidable impurities, wherein excess Ti content in steel is equal to Ti-(4*C+3.43*N=1.5S) which is less than or equal to 0. The manufacturing process is characterized in that the heating temperature of billet steel is 1160-1300 DEG C; the hot rolling finish rolling temperature is 850-950 DEG C; the coiling temperature of steel plates is 660-760 DEG C; the cold rolling draft is 60%-80%; the annealing temperature is 760-880 DEG C; the temperature preservation time is 60-200s; rapid cooling speed rate is 15-45 DEG C/s, planishing elongation is 0.7%-1.8%; and surface roughness is 0.7-1.9 micrometres. The invention has the advantages of excellent formability, enamel-spreadable property, pressing resistance, weldability and fish-scaling resistance, stable yield strength after enamelfiring, less cost increase, stable effect and significant economic benefits.

Compositions and methods for silver plating onto metal surfaces such as PWBs in electronics manufacture to produce a silver plating which is greater than 80 atomic % silver, tarnish resistant, and has good solderability.

In a method of packaging a semiconductor IC, a tape is attached to a back surface of a lead frame array, and the lead frame array is held between an upper mold chase and a lower mold chase of a mold, with the back surface of the lead frame array upward. The upper and lower mold chases form an upper cavity and a lower cavity with respect to the lead frame array respectively. A mold compound is injected into the upper and lower cavities respectively. With respect to clearances between leads, between die pads and/or between the leads and the die pads, the mold compound injected into the upper cavity covers the portion of the tape over the clearances before the mold compound injected into the lower cavity fills the clearances, so that the tape is depressed. After curing the mold compound, removing the mold and de-taping, the mold compound filled in the clearances is recessed inward from the back surface, which increases the solderability in the subsequent surface mount process and decreases the possibility of the occurrence of lead short-circuits.

A flux-cored nickel-based alloy wire contains, based on the total mass of the wire, 3 to 11 percent by mass of TiO₂, 0.2 to 1.3 percent by mass of SiO₂, 1 to 3 percent by mass of ZrO₂, and 0.3 to 1.0 percent by mass of manganese oxides in terms of MnO₂, contains of a total of 0.2 to 1.0 percent by mass in terms of Na, K and Li of sodium compounds, potassium compounds, and lithium compounds. The flux has a ratio (([TiO₂]+[ZrO₂])/[SiO₂]) of the total of the TiO₂ and ZrO₂ contents to the SiO₂ content of 5.0 to 14.5, in which [TiO₂], [SiO₂] and [ZrO₂] represent TiO₂, SiO₂ and ZrO₂ contents. The wire shows excellent weldability in welding of all positions typically on 9% nickel steels and nickel-based alloy steels and gives a weld metal having good pitting resistance, bead appearance, and resistance to hot cracking.

The present invention is to provide a method of manufacturing a circuit layout on a touch panel by utilizing metal plating technology, comprising uniformly coating a conductive metal or conductive oxidized metal on predetermined areas proximate edges of a transparent conductive layer on a transparent glass substrate for forming a circuit by utilizing metal plating technology, which has the advantages of uniform thickness of circuit, higher hardness, better adhesion of the plated material to the underlying substrate, whether it is a resistive film or bare glass, improved weathering and chemical properties, and solderability.

There is disclosed a multilayer insulated wire which comprises a conductor and solderable extrusion-insulating layers made up of two or more layers for covering the conductor, wherein at least one insulating layer is formed by a mixture comprising 100 parts by weight of a resin (A), of at least one selected from the group consisting of polyetherimide resins and polyethersulfone resins, 10 parts by weight or more of a resin (B), of at least one selected from the group consisting of polycarbonate resins, polyarylate resins, polyester resins, and polyamide resin, and 15 to 200 parts by weight of an inorganic filler (C). There is also disclosed a transformer which utilizes the multilayer insulted wire. The multilayer insulated wire is excellent in heat resistance, solderability, high-frequency characteristic, and coilability, and it is favorably suitable for industrial production. Further, the transformer utilizing the multilayer insulated wire is excellent in electrical properties and high in reliability, since when used at high frequencies, electric properties are not lowered and influence by the generation of heat can be prevented.

To provide an improved solderability for mounting an electronic component onto a circuit board, a package of an electronic component (1) is formed by bonding together a base (3) made of glass and a lid (2). Outer electrodes (8) and (18) are formed on a bottom surface of the base (3), and the outer electrodes (8) and (18) are respectively connected to through electrodes (7) and (17). The outer electrodes (8) and (18) each have a laminated structure of three CrAu layers, that is, from a Cr layer (first layer) to an Au layer (sixth layer). When the outer electrodes (8) and (18) are soldered onto a circuit board, the Au layers as the second, fourth, and sixth layers are dissolved into solder, whereas the Cr layers as the third and fifth layers, which hardly form an intermetallic compound with solder, are separated to remain in solder.

A steel strip for J55 petroleum casing with high strength and high toughness petroleum casing and a manufacture method thereof belong to the field of micro-alloyed steel production technology. The method comprises converter smelting, LF refining, medium-thin slab continuous slab, heating, high-pressure water descaling, hot rolling and laminar cooling, and reeling, wherein the chemical components of steel comprise (wt%) C 0.15 to 0.20, Si 0.15-0.30, Mn 1.00 to 1.45, P not larger than 0.020, S not larger than 0.010, Nb 0.020 to 0.040, Ti 0.015 to 0.040, Al 0.020 to 0.050, and allowance Fe and other in inevitable impurities. A J55 petroleum casing with a yield strength of 420 MPa can be produced by combining Nb and Ti, micro-alloying and reasonable production process, and the product has the advantages of high strength, high toughness and good solderability.

A lead free soft tin features in the composition of Cu 0.1-5.0%,Ni 0.01-2.0%,Ge 0.01-1.0%,In 0.01-1.5 %,Sb O005-2.0% and the rest being Sn with 0.05-1.0%Bi and or 0.001-1.0 %Ti to strengthen the anti oxidation to add 0.01-0.1%P and Ga, with good soldering effect, glaze on the surface, anti fatigue, anti oxidation, low soldering degree, good humidity, and fine crystallization.

The invention discloses a process for resisting ferrous metal corrosion of a zinc nickel diffusion layer. The process comprises the steps of alkaline degreasing, shot blasting, heating diffusion layer, water washing dust removal and colorful closing according to the requirement of a customer, wherein in the heating diffusion layer step, the zinc nickel diffusion layer and a metal matrix are put in a sealed metallic container and heated; the zinc nickel diffusion layer is prepared by evenly mixing the following powders in mass proportion: 20 to 30 percent of Zn powder, 0.5 to 1.4 percent of Ni powder, 3 to 12 percent of Al powder, 2 to 6 percent of rare earth, 1 to 4 percent of NH4Cl ammonium chloride, the balance being Al2O3 powder. The diffusion layer has the advantages of high rigidity, good wear resistance, unchangeableness of original mechanical performances of products, high adhesion strength, bumping and rolling resistance, good solderability, moisture and heat resistance and acid and alkali resistance; the diffusion layer has uniform thickness and compactness, and appearances of finished products have good uniformity; and no three-waste emission occurs during the course of processing, so the process belongs to the clean production process and is environment-friendly.

A window pane has a substrate formed from glass and includes an electrical device. The electrical device includes an electrical conductor and an electrical connector. A layer of solderable metal is bonded to the connector. A layer of solder is bonded to the layer of solderable metal and the conductor, with the connector and the conductor in electrical communication through the layer of solderable metal and the layer of solder. The substrate has a first coefficient of expansion and the connector has a second coefficient of thermal expansion. A difference between the first and second coefficients of thermal expansion is equal to or less than 5×10⁻⁶/° C. for minimizing mechanical stress between the connector and the substrate due to thermal expansion of the connector and the substrate resulting from changes in temperature. The solder is comprised of less than 70 parts by weight of Sn along with a greater than 30 parts by weight of a reaction rate modifier. The reaction rate modifier increases the solderability of the solder to the conductor.

A hot press-formed article having improved corrosion resistance and coating adhesion when coated is obtained by hot press forming of a zinc-based plated steel material. It has a zinc-based plating layer comprising an iron-zinc solid solution phase and atop it a zinc oxide layer. The average thickness of the zinc oxide layer which is the outermost layer is at most 2 μm. A hot press-formed article having a good appearance and excellent corrosion resistance, coating adhesion, post-coating corrosion resistance, and weldability has a layer (2) consisting essentially of an iron-zinc solid solution phase atop a base material steel sheet (1). It also has a zinc oxide layer (3) with an average thickness of at most 5 μm as an uppermost layer, but it does not have a substantial amount of an iron-zinc intermetallic compound phase. The total amount of Al contained in the iron-zinc solid solution layer (2) and the zinc oxide layer (3) is at most 0.5 g/m², and/or the total amount of Al oxides contained in these layers is at most 5 mg/m².

A high-reliability electronic component without reduction in insulation resistance under high-temperature and high-humidity conditions has satisfactory solderability of external electrodes. The electronic component includes a main body and external electrodes disposed on surfaces of the main body, the external electrodes include underlying electrode layers each containing a metal, alloy layers each disposed on the corresponding underlying electrode layer, Ni plating layers each disposed on the corresponding alloy layer, Ni oxide layers each disposed on the corresponding Ni plating layers, and upper plating layers each disposed on the corresponding Ni oxide layer, each Ni oxide layer having a thickness of about 150 nm or less, and each Ni plating layer having an average particle size of Ni particles of about 2 μm or more. To form the Ni plating layers having reduced grain boundaries, heat treatment is performed at about 500° C. to about 900° C. inclusive in a reducing atmosphere having an oxygen concentration of about 100 ppm or less.

The invention provides a solar cell back silver slurry which can reduce the cost, and guarantee better conductivity of a silver layer and great adhesive force with a silicon substrate, and a preparing device thereof. The solar cell back silver slurry is composed of: 65%-75% of powdery mixed materials, 8%-10% of ethyecellulose, 8%-10% of butyl carbitol, 5%-8% of terpilenol, 2%-4% of thixotropic agents and remaining weight ratio of auxiliary agents, wherein the powdery mixed materials are the mixed materials of silver-coated copper powder and glass powder, and the weight ratio between the silver-coated copper powder and the glass powder is (7-12):1. The content of pure silver in the back silver slurry is only about 35%, which is much lower than the heavy silver content of present back silver slurry, so that the usage amount of silver powder is substantially reduced, the cost of the back silver slurry is greatly reduced, and the cost pressure caused by silver cost increase can be alleviated; in addition, greater adhesive force exists between a finally prepared silver layer and the silicon substrate, and the binding property, solderability and soldering resistance are greater. The solar cell back silver slurry and the preparing device thereof are suitable for popularization in the electronic material technical field.

The invention relates to a preparation method of a high-intensity magnesium alloy soldering wire, which adopts alloy agent magnesium, aluminum, zinc, yttrium, magnesium-manganese intermediate alloy and aluminium-silicon intermediate alloy as raw materials. In a vertical melting furnace, through being melted at 700 DEG C, rare-earth element yttrium is added at 800 DEG C and is refined at 760 DEG C, with a covering agent and a refine agent being added, through constant temperature, thermal retardation and stewing, then magnesium alloy molten liquid is made; through casting a mould, magnesium alloy ingot is made; through cooling, cutting and forming, and then thermoplastic extruding, in the end, the high-intensity magnesium alloy soldering wire is made; the yttrium element, the magnesium-manganese intermediate alloy and aluminium-silicon intermediate alloy can greatly improve the intensity, the malleability and the solderability of the magnesium alloy soldering wire; the preparation technology is refined, the mixture ratio is reasonable, the environment pollution does not exist; the outcome of a magnesium alloy soldering wire metallic phase has uniform structure and good compactability, the average grain size is 25microns, the tensile strength can reach 330MPa, the elongation percentage can reach 25 percent and can be improved by 18 to 28 percent compared with the prior art, and the solderability is good.

The invention discloses halogen-free cleaning-free soldering flux for lead-free solder, which comprises the compositions in percentage by weight: 1.5 to 4.5 percent of organic acid activator, 0.5 to 8.5 percent of high-quality abietic resin, 0.3 to 1.5 percent of activated reinforcer, 0.2 to 0.8 percent of surfactant, 3.0 to 15.0 percent of wet strengthening agent, and the balance being solvent isopropanol, absolute ethyl alcohol or deionized water. The soldering flux fully meets various regulation requirements for limiting halogen. The soldering flux developed by using a novel material which does not contain the halogen can scientifically reduce the surface tension of the lead-free solder, strengthen the wetting power of the lead-free solder, improve the solderability, can be compatible with a plurality of welding materials, and has no corrosion effect on lead-free solder alloy; composing materials are volatilized by stages during the welding process, so after the welding, the surface of a PCB board has less residue, even spread, less ion residue, and reliable electrical insulating property, and does not need to be washed; and the soldering flux is a novel environment-friendly halogen-free cleaning-free soldering flux for the lead-free solder.