71 results about "Automated optical inspection" patented technology

The invention provides an intelligent electronic assembly quality control system based on AOI (automatic optical inspection) and SPI (solder paste printing inspection) integration, and belongs to the field of electronic information equipment flexible production lines. Comprising an AOI module, an SPI module, a data integration module, a feedback control module and a data storage and transmission module. All the modules carry out high-frequency data transmission through an industrial Ethernet; according to the system provided by the invention, the precision of quality detection is improved, and the accurate recognition of defects is realized through the data association of the AOI and the SPI module and the anomaly detection of the SVM and the CNN algorithm. Real-time process optimization is achieved, the feedback control module automatically adjusts printing and mounting process parameters according to the quality data model, and the product consistency is remarkably improved. The method improves the traceability and safety of the data, achieves the efficient storage and safety access of the detection data through distributed cloud storage and data encryption transmission, and supports the quality problem traceability.

The invention relates to dispensing detection integrated equipment, and belongs to the technical field of IGBT packaging, and the dispensing detection integrated equipment comprises a feeding and discharging conveying line which extends in the X-axis direction; the transplanting conveying line is arranged on one side of the feeding and discharging conveying line and extends in the Y-axis direction; the NG conveying line is arranged on one side of the transplanting conveying line and extends in the Y-axis direction; the dispensing mechanism is erected above the transplanting conveying line and is far away from the loading and unloading conveying line; the AOI visual inspection mechanism is erected above the transplanting conveying line and located between the feeding and discharging conveying line and the dispensing mechanism; the carrying mechanism is erected above the area where the feeding and discharging conveying line, the transplanting conveying line and the NG conveying line are located. By reasonably arranging the positions of the conveying line and the mechanism, the movable line of product production is optimized, the physical path of the production process is shortened, a complete quality closed loop is constructed, and the automation efficiency of the dispensing procedure and the product yield are effectively improved.

A method, apparatus, and system for automatic detection and measurement of fracture defects on a diced wafer includes receiving an image of at least a portion of the diced wafer, aligning the received image of at least the portion of the diced wafer, determining an edge of at least the portion of the diced wafer depicted in the aligned received image, and detecting the fracture defects on the diced wafer. At least one baseline is automatically determined from the determined edge, a fracture defect on at least the portion of the diced wafer is measured from the at least one baseline, and a fracture defect on at least the portion of the diced wafer is measured using the at least one determined respective baseline. In some embodiments, the methods, apparatus, and systems may further include applying a machine learning model to a measured fracture defect to determine whether there is a critical fault on the diced wafer.

Some implementations herein provide a semiconductor substrate including a multi-layer alignment mark structure and methods of formation. The multi-layer alignment mark structure may include concentric rings (e.g., a multi-ring bond mark structure) and a dummy pad structure below the concentric rings. For a light source of a given wavelength, the dummy pad structure may create an optical contrast between the concentric rings and annular regions of a dielectric region in which the concentric rings are formed. The optical contrast may improve a detectability of the multi-layer alignment mark structure by an automated optical inspection system relative to another alignment mark structure not including the dummy pad structure. The improved detectability, may in turn, reduce an amount of recognition errors by the automated optical inspection system detecting the multi-layer alignment mark structure to improve an efficiency of a semiconductor processing tool including the automated optical inspection system.

Systems and methods are provided for inline process monitoring (e.g., remote inline process monitoring) for scalable and precision high-yield manufacturing. Antenna probes, such as millimeter (mm) wave (mmWave) antenna (mWA) probes, can be introduced into fabrication equipment to reveal the nature of hidden conductor and / or dielectric defects, as well as via-pad and / or device pad-trace misalignments, going beyond automated optical inspection (AOI) or contact probing.

This invention discloses a circuit board surface mount correction method, apparatus, system, and medium. The circuit board surface mount correction method includes: acquiring basic accuracy data of the bare circuit board state and solder paste association data after solder paste has been printed on the circuit board; generating a D data stream based on the basic accuracy data, the solder paste association data, and corresponding component information, and sending the D data stream to a pick-and-place machine and a pre-reflow AOI (Automated Optical Inspection) unit; the pick-and-place machine completing component placement based on the D data stream; the pre-reflow AOI acquiring placement result information for each component on the circuit board after placement, and calculating offset data for each component based on the D data stream to generate an H data stream; and the pick-and-place machine performing surface mount correction based on the H data stream. This circuit board surface mount correction method achieves the effect of improving component placement correction accuracy and yield.

The present invention discloses an auxiliary edge patrol device for an automated optical inspection machine for polarizing plates. The device comprises an image processing module, two movable robots, a U-shaped bracket, an edge patrol camera, an LED light source for edge patrol, and a limit sensor. The U-shaped brackets, located on either side of the polarizing plate reel, are connected to the axis arms of the movable robots and move synchronously with them. The edge patrol camera and the LED light source are fixed to either side of the U-shaped bracket, with the line connecting the camera and the LED light source perpendicular to the central axis of the U-shaped bracket. The limit sensor is mounted on the U-shaped bracket and located on the same side as the edge patrol camera. As an auxiliary mechanism of the automated optical inspection machine, the edge patrol device avoids width errors caused by abnormal waveforms in the automated optical inspection machine's cameras as the machine opens and closes, resulting in higher stability.

This invention proposes a wiring harness for AOI (Automated Optical Inspection) equipment, comprising a connector assembly, a cable assembly, a branch protection assembly, an identification assembly, and a termination assembly. The connector assembly includes a D-SUB connector and a housing. The cable assembly includes a multi-core wire electrically connected to the D-SUB connector, and the multi-core wire, from the inside out, includes a core wire bundle, a braided layer, and a sheath layer. The branch protection assembly is disposed at the branching point of the multi-core wire, the identification assembly is disposed on each branch wire, and the termination assembly is disposed at the end of each branch wire. The termination assembly includes a pin terminal, which, along its length, includes a insertion section, a limiting transition section, and a crimping section. By providing a branch protection assembly at the branching point and a pin terminal with a limiting transition section at the termination point, the connection stability and vibration resistance of the wiring harness can be improved, as well as the branch circuit identification and termination correspondence effects can be enhanced.

The present invention provides an automated optical inspection method, system, and recording medium. The method acquires an original image of an object under test via an optical lens, wherein the original image includes multiple first images; performs edge detection on the original image to obtain an edge image having an edge pattern, wherein the edge image includes multiple second images; calculates at least one of the maximum, minimum, and average values of pixel values in the second images; divides the edge image into multiple image blocks based on unit area, and calculates multiple eigenvalues based on at least one of the maximum, minimum, and average values corresponding to the multiple second images included in the image blocks; and trains a regression model corresponding to the defects of the object under test based on the eigenvalues and the object under test data to obtain an optimal regression model.

This invention relates to an AOI (Automated Optical Inspection) device and method for display panels. The inspection device includes a mounting frame with a fixed fork, an optical film moving mechanism, and an AOI inspection mechanism mounted on it. The fixed fork carries the product to be inspected. The optical film moving mechanism is located on one side of the fixed fork and includes an optical film carrier and a moving component. The moving component and the optical film carrier are fixedly connected, and the moving component drives the optical film carrier to move above the fixed fork. The AOI inspection mechanism is fixedly mounted on one side of the fixed fork and includes an AOI optical engine and an optical engine moving component. By placing the AOI optical engine on a moving component with a long travel distance, AOI inspection of large-sized products is achieved. Simultaneously, the optical film moving mechanism enables the switching of optical films, effectively improving the imaging effect.

The invention relates to the technical field of PCBA (printed circuit board assembly) welding, in particular to PCBA selective welding equipment with reinspection AOI (automatic optical inspection), which comprises a frame body, a feeding device movably arranged on the frame body, a visual positioning device matched with the feeding device for use and a welding device matched with the feeding device for use, the feeding device is used for feeding PCBA boards to be machined, the visual positioning device is used for conducting visual positioning on the PCBA boards to be machined borne by the feeding device, the welding device is used for conducting welding treatment on the PCBA boards subjected to visual positioning, the frame body is provided with a control system, and the feeding device, the visual positioning device and the welding device are all electrically connected with the control system. Automatic visual inspection is achieved, welding parameters are adjusted in a targeted mode, the welding requirement of a high-quality circuit board is met, the situation of poor welding is avoided, the production cost is reduced, and the welding efficiency and the welding quality are improved.

A device of integrating production line data as auxiliary data for abnormality analysis and a method thereof are disclosed. A repair / repairable system obtains defect repair information generated by an inspection station sited behind an automated optical inspection device and determining that a target material is abnormal, material data of the target material is read based on defect location information from an optical test data sheet generated by integrating an optical inspection data generated by the AOI device and a control management data generated by control management systems on a production line. A component location image is extracted from a material image of the target material based on the defect location information of the defect repair information, and the material data. The defect repair information and the component location image are integrated to generate integration information of the target material.

The utility model relates to the field of optical detection, and discloses a positioning structure of automatic optical detection equipment, which comprises a base station, the top of the base station is fixedly connected with an installation assembly for installing the positioning structure, the inner wall of the installation assembly is fixedly connected with a sliding groove frame, and the inner wall of the sliding groove frame is provided with a first air cylinder. A sliding groove plate is slidably connected to the inner wall of the sliding groove frame, the driving end of the first air cylinder is fixedly connected to the outer portion of the sliding groove plate, a second air cylinder is installed on the inner wall, away from the first air cylinder, of the sliding groove frame, a sliding way is formed in the inner wall of the sliding groove plate, and a movable plate is slidably connected to the inner wall of the sliding way. According to the utility model, the position change of the pulley drives the position of the detection head at the bottom of the pulley to change, and positioning detection is carried out by moving the detection head, so that an object to be detected is prevented from moving or vibrating in the detection process, and the accuracy and consistency of a detection result are ensured.

A method, apparatus, and system for the automatic detection and measurement of chipping defects on a diced wafer includes receiving an image of at least a portion of the diced wafer; aligning the received image of at least a portion of the diced wafer; determining the edges of at least a portion of the diced wafer represented in the aligned received image; automatically determining at least one baseline from the determined edges for measuring chipping defects on at least a portion of the diced wafer; and measuring chipping defects on at least a portion of the diced wafer using each of the at least one determined baseline. In some embodiments, the method, apparatus, and system may further include applying a machine learning model to the measured chipping defects to determine whether a critical defect is present on the diced wafer.

The invention relates to a method and a device for monitoring and evaluating a calibrated image classification model, in particular for automated optical inspection, for example in the field of component production, for identifying defects.

This invention discloses a method for inspecting horizontal lines for foreign matter contamination, comprising three steps: PCB board fabrication, PCB horizontal line production, and horizontal line inspection. The horizontal line inspection uses a solder resist ink exposure and development method to create a loop-shaped circuit. AOI (Automated Optical Inspection) equipment is used to compare the inspected board with the design drawings for analysis. The ink is resistant to chemical attacks and recyclable. By using a solder resist ink exposure and development method to create a loop-shaped circuit (copper is replaced by ink), and because the ink is resistant to chemical attacks and recyclable, AOI equipment is used to compare the inspected board with the design drawings, replacing manual inspection. If there is a discrepancy with the design drawings, it indicates the presence of foreign matter between the lines on the inspected board, requiring further inspection and maintenance of the horizontal lines. If there is a match with the design drawings, it indicates the absence of foreign matter between the lines on the inspected board.

The application relates to a method for manufacturing an electronic device, and in particular, to a method for manufacturing an electronic device with a carrier substrate. The method includes: providing a carrier substrate; forming a first base layer on the carrier substrate; forming a working unit on the first base layer, performing a detection step on the working unit to identify whether a defect is present, wherein the detection step includes automated optical inspection (AOI), electrical detection, or a combination thereof; and repairing the electronic device.

A package with a side-wettable structure formed on via walls has a composite substrate covered with a molding layer; an upper redistribution layer is formed on the molding layer, and an edge of the upper redistribution layer is uncovered with a solder mask to form at least one edge bonding surface; at least one conductive contact formed by cutting at least one conductive via is located adjacent to an edge of the composite substrate, and each edge bonding surface is connected with a cutting surface of each conductive contact; an anti-oxidation conductive layer is mounted on each cutting surface and a side wall of each conductive contact. The anti-oxidation conductive layer is adopted for a solder adsorption, so that an Automated Optical Inspection instrument can determine contacting situations between the package of the present invention and another component.

A pick and place machine includes a gantry system, a pick and place head movable by the gantry system, an automated optical inspection (AOI) camera mounted within the pick and place machine and configured to capture images of an entire printed circuit board assembly (PCBA), and a processor. The processor is configured to analyze the images to detect placement defects and calculate accuracy offsets for components placed on the PCBA, and modify a placement recipe of the pick and place machine based on the calculated accuracy offsets to improve placement accuracy.

This invention discloses a collision avoidance method and system for detection windows in automated optical inspection software, relating to the field of automated optical inspection technology. The method includes: acquiring the start and end points of the window to be moved, the corresponding window polygon, and simultaneously acquiring the polygons of sibling windows and the boundary polygon of the parent window; performing compliance verification on the starting point position, iteratively adjusting non-compliant positions to compliance; constructing an axis-aligned bounding rectangle and a convex hull of the movement path, and filtering the geometric elements to be detected; completing collision detection by moving line segments through convex points and moving quadrilaterals through edges, respectively, and obtaining the effective movement distance; filtering the shortest effective movement distance, and outputting the final compliant position of the window after integer correction. This invention can adapt to various convex and concave polygon detection windows, eliminating the need for convex hull transformation or decomposition processing, balancing detection accuracy and real-time performance, significantly reducing window layout costs, and improving the efficiency and accuracy of window layout in AOI software.

Apparatuses, systems, and techniques to facilitate feature detection of a manufactured object such as a PCB using combined images of said manufactured object. In at least one embodiment, an automated optical inspection system (AOI) comprising one or more neural networks can infer based, at least in part, on combined images of a PCB the existence of defects on said PCB.

This invention relates to the field of automated optical inspection technology, and discloses an automated optical inspection method, apparatus, and storage medium for PCB panelization. The invention obtains a complete image of the PCB panelization by stitching together partial images, which saves costs. Secondly, the invention identifies components in the image to be tested. For each component: based on the component, its soldering information and detection rules are read from a preset relational database; the image of the component in the image to be tested is matched with its soldering information to obtain the detection area of ​​the component in the image to be tested; the detection area is then inspected based on the preset detection rules to obtain the detection result. Compared to inspecting the entire PCB panelization, the method of reading each component and performing targeted inspection in this invention is more efficient and takes less time.

The invention provides an automatic optical detection method and system for visible foreign matters in a midazolam buccal mucosa solution, and relates to the technical field of drug detection.The automatic optical detection method comprises the steps that the midazolam buccal mucosa solution is controlled to flow in a transparent flow cell, and suspended particles in the solution are dynamically observed and recognized by means of an optical imaging system; controlling a polarized light source of the optical imaging system to rotate relative to the transparent flow cell, and collecting optical response data of each suspended particle at a plurality of rotation angles; then, according to the data, determining the change information of the light intensity along with the relative rotation angle, synchronously extracting color distribution information, and generating key feature data representing the optical response characteristics of the particles; and finally, comparing the key characteristic data with preset standard characteristic data of the raw material medicines and the auxiliary materials, so that the suspended particles are judged as raw material medicine crystals, auxiliary material precipitates or visible foreign matters, and automatic and accurate classification of the suspended particles in the midazolam buccal mucosa solution is realized.

A component image acquisition system and method applicable to automatic optical inspection are disclosed. The image processing server uses an object recognition model to identify electronic components in the image to be processed, finds the four unique electronic components on the board, and calculates the center image coordinates of the four electronic components. The center image coordinates of the components are then grouped with the standard coordinates of the centers of nearby components into four coordinate groups. A coordinate transformation algorithm is used to calculate four sets of coordinate transformation coefficients. The maximum and minimum values ​​of each coordinate transformation coefficient group are removed and then averaged to calculate the coordinate transformation coefficient. The image to be processed is converted into a transformed image using the coordinate transformation algorithm of the coordinate transformation coefficients. At least one component image is acquired based on the center coordinates and acquisition range of each acquired information. This achieves the technical effect of providing component images with the correct acquisition range.

A method, product, and system for automated optical inspection (AOI) using a hybrid imaging system. The method includes obtaining a predictive model configured to predict an improved quality image of a product based on a low quality image of the product, the predictive model being generated based on images obtained by a dual scanning system including a low quality scanning system and a high quality scanning system. Based on the low quality image of the product captured using the low quality scanning system, the predictive model is used to predict an improved quality image of the product and utilized for defect detection.

This invention relates to a tube lens compatible with high-NA objectives, a rapid automated optical inspection system and method. The tube lens includes a lens assembly comprising a first cemented lens with positive optical power, a second cemented lens with negative optical power, and a third cemented lens with positive optical power, arranged sequentially along the principal optical axis. The first cemented lens is disposed on one side of the object being tested. The first cemented lens comprises a first lens and a second lens cemented together; the second cemented lens comprises a third lens and a fourth lens cemented together; and the third cemented lens comprises a fifth lens and a sixth lens cemented together. The design of this invention enables a 1.4X tube lens, compatible with high-NA objectives. Its lens assembly includes multiple cemented lenses forming a positive-negative-positive structure, which improves the pixel resolution, optical resolution, and minimum defect size detection capability. It also has a long front working distance, adaptable to both vertical and horizontal inspection optical paths.

The utility model discloses a multispectral automatic optical defect detector, which relates to the technical field of detectors, and comprises an operation table, the top end of the operation table is fixedly connected with two electric sliding rails, the outer surfaces of the two electric sliding rails are respectively sleeved with two electric sliding blocks, the outer surface of a screw rod is in threaded sleeve connection with a moving block, and the moving block is in threaded sleeve connection with a sliding block. One end of the moving block is slidably attached to one end of the supporting frame, one end of the moving block is fixedly connected with a sliding rail, the outer surface of the sliding rail is slidably sleeved with a sliding block, one end of the sliding block is fixedly connected with an optical detection head, and a first motor is fixedly installed on the upper portion of one end of the supporting frame. According to the utility model, through the cooperation of the adjusting mechanism, the U-shaped base and the fixing device, the purposes of conveniently carrying out multi-angle adjustment on the detection workpiece and the detection head and fixing the detection workpiece are achieved.

1. Name of the product in this design: Three-axis motion platform of an automatic optical inspection machine. 2. Purpose of this design: To support wafers for three-dimensional (XYZ axis) motion positioning, as well as scanning and maintenance during wafer inspection. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: 3D view 1.

The invention discloses a surface defect detection method and device, electronic equipment and a medium, and relates to the field of machine vision detection. The surface defect detection method comprises the following steps: obtaining a first color image under annular light illumination at a first angle, and obtaining an R channel grey-scale image of the first color image; obtaining a second color image under ring light illumination at a second angle, and obtaining a G-channel grey-scale image of the second color image; obtaining a third color image under annular light illumination at a third angle, and obtaining a B-channel grey-scale image of the third color image; modifying the gray value of the R-channel gray-scale map into a first target gray value, modifying the gray value of the G-channel gray-scale map into a second target gray value, and modifying the gray value of the B-channel gray-scale map into a third target gray value; and synthesizing the R channel grey-scale map, the G channel grey-scale map and the B channel grey-scale map to obtain a target color map. The synthesized target color image can have an effect similar to that of AOI (Automated Optical Inspection) ring light irradiation.