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139 results about "Automated optical inspection" patented technology

Automated optical inspection (AOI) is an automated visual inspection of printed circuit board (PCB) (or LCD, transistor) manufacture where a camera autonomously scans the device under test for both catastrophic failure (e.g. missing component) and quality defects (e.g. fillet size or shape or component skew). It is commonly used in the manufacturing process because it is a non-contact test method. It is implemented at many stages through the manufacturing process including bare board inspection, solder paste inspection (SPI), pre-reflow and post-reflow as well as other stages.

Step circuit board with gold-masking copper-plating hybrid surface process and manufacture method thereof

InactiveCN102946693ASolve the problem of burning boardThe plated area is stablePrinted circuit detailsPrinted circuit manufactureElectricityScreen printing
The invention discloses a manufacture method for a step circuit board with a gold-masking copper-plating hybrid surface process. The manufacture method comprises the steps of cutting materials, transferring an inner pattern, browning and pressing a plate, drilling, plating copper, electroplating the whole plate, adhering a thick gold dry film, achieving pattern transfer for the first time through exposing and developing, exposing a local electrical thick gold part, plating copper, nickel gold and electrical thick gold on the electrical thick gold part, removing the film, adhering a dry film, achieving pattern transfer for the second time through exposing and developing, exposing a part needing plating copper, plating copper, removing the film, silk-screen printing a wet film, achieving pattern transfer for the third time through exposing and developing, exposing a needed outer circuit, adhering a dry film to completely cover a PTH (Plated Through Hole) through exposing and developing, etching an outer circuit, removing the film, carrying out AOI (Automated Optical Inspection) to the outer layer, silk-screen printing and resistance-welding, lettering, forming, electrically testing, carrying out an OSP (Organic Solderability Preservatives) surface process, carrying out final inspection, packaging and shipping. The gold-masked copper-plated step circuit board manufactured by the method disclosed by the invention can achieve more compact assembling needs and a better adhering effect.
Owner:GUILIN UNIV OF ELECTRONIC TECH

AOI (Automated Optical Inspection)-based macroscopic defect detection device and method

The invention provides an AOI (Automated Optical Inspection)-based macroscopic defect detection device used for detecting macroscopic display defects of a flat panel display module. The macroscopic defect detection device comprises a light source, a camera group, and an image acquisition and processing unit interacting with the camera group, and is characterized in that the camera group comprises at least one group of front view camera components and at least two groups of symmetrically arranged side view camera components, wherein the front view camera components and the side view camera components are positioned above a to-be-detected display panel and are used for photographing display images of the to-be-detected display panel; the photographing angle of the front view camera group is perpendicular to the to-be-detected display panel; an included angle exists between the photographing angle of the side view camera group and the to-be-detected display panel; and the to-be-detected display panel is positioned in a photographing range of the front view camera group and the side view camera group. According to the macroscopic defect detection device disclosed by the invention, the defects during defect detection by industrial front view cameras are overcome, and the type and capability of AOI defect detection are greatly enriched.
Owner:WUHAN JINGCE ELECTRONICS GRP CO LTD

Automated optical inspection device and method for defect inspection of LCD (liquid crystal display) module

The invention relates to the technical field of automated optical inspection of LCD (liquid crystal display) modules, in particular to an automated optical inspection device for defect inspection of an LCD module and an automated optical inspection method for the defect inspection of the LCD module. The device comprises a central control processing unit, an image acquisition module, an image processing module and a PG (Pattern Generate) module. The method comprises the following steps of receiving a PG configuration parameter and a camera configuration parameter, lighting up modules according to the PG configuration parameter, configuring a camera according to the camera configuration parameter, controlling the camera to shoot an module image and collect the shot image, performing image processing and defect inspection on the collected original image, and outputting a defect inspection result and processed image data. The device and the method provided by the invention have the advantages that the image acquisition module, the PG module and the image processing module are integrated on an FPGA (Field Programmable Gate Array), and the whole testing process is performed based on the FPGA, so that the system integration degree is improved, the interaction complexity is lowered, the real-time processing performance is improved, the defect inspection time is shortened, the system stability is greatly improved, the inspection time is shortened, and the factory production efficiency is improved.
Owner:WUHAN JINGCE ELECTRONICS GRP CO LTD

Night image characteristic extraction method in intelligent vehicle-mounted anti-collision pre-warning system

The invention belongs to the field of a photoelectric technology, and specifically discloses a night image characteristic extraction method in an intelligent vehicle-mounted anti-collision pre-warning system. The night image characteristic extraction method comprises the following steps of: selecting an automobile tail light as characteristics to be extracted, and then canceling noises of images, carrying out image edge clearness, selecting threshold value and carrying out threshold segmentation by using a series of image processing methods; and selecting an interested region AOI (Automated Optical Inspection) when the characteristics of the automobile tail light are extracted and paired, and expressing a target automobile by a rectangular frame and deducing a distance measuring formula through modeling and a series of transformations after extracting and paring the characteristics of the automobile tail light. According to the night image characteristic extraction method, the characteristics of the automobile tail light are highlighted, extracted and paired by a series of image processing methods so as to locate the special location of a front automobile in a lane and provide reliable data for the intelligent vehicle-mounted anti-collision pre-warning system which calculates the distance between the front automobile and the automobile.
Owner:中国航天科工集团第二研究院二〇七所

Automatic plate feeding and discharging system for double-faced AOI (Automated Optical Inspection) of circuit board and technological process of automatic plate feeding and discharging system

The invention discloses an automatic plate feeding and discharging system for double-faced AOI (Automated Optical Inspection) of a circuit board. The automatic plate feeding and discharging system comprises a robot device, a feeding and discharging device, a double-faced dust sticking machine, a transferring device, an AOI machine, a butt joint device and a general control system for controlling the equipment to work, wherein the robot device is provided with robot mechanical arms; the double-faced dust sticking machine is located beside the feeding and discharging device; the transferring device is arranged above the feeding and discharging device and the double-faced dust sticking machine; the AOI machine comprises a face A detection and a face B detection machine; detection openings of the face A detection and the face B detection machine are opposite to the feeding and discharging device and the double-faced dust sticking machine; the robot device is located between the face A detection and the face B detection machine; and the butt joint device is located on one side of the face B detection machine and can be in up-down butt joint with the robot mechanical arms. The butt joint device can be in up-down butt joint with the robot mechanical arms so that time consumed by a plate overturning procedure is saved, and furthermore, a whole production process has relatively rapid efficiency; and the structure is compact so that the occupied area of equipment is reduced.
Owner:GUANGZHOU TAILI ELECTRICAL & MECHANICAL EQUIP CO LTD

Copper foil clad laminated board with UV shielding function, adhesive and preparation methods thereof

The invention discloses a copper foil clad laminated board with UV shielding function and a preparation method thereof, and a copper foil clad laminated board adhesive and a preparation method thereof. The copper foil clad laminated board adhesive disclosed by the invention comprises the following components in parts by mass: 125-150 parts of resin, 25-42 parts of solvent, 2.1-3.6 parts of curing agent, 0.2-1.0 part of UV absorbent, 0.2-1.0 part of fluorescent whitening agent and 25-75 parts of auxiliary packing. The copper foil clad laminated board disclosed by the invention has various natural colors, and can satisfy diversified options for high-performance UV-shielding copper foil clad laminated boards; and meanwhile, the copper foil clad laminated board has excellent UV shielding function (the UV absorptivity exceeds 99.99%) and weather resistance, and is completely suitable for the development process of the PCB (printed circuit board) processing procedure and the AOI (automated optical inspection) detection technique of high-density integrated circuits. The preparation method of the copper foil clad laminated board has the characteristics of simple technique, favorable controllability, cost saving and the like.
Owner:SHANGHAI GUOJI ELECTRONICS MATERIALS CO LTD

Detection mechanism with side light source configured for annular light source and backlight source for AOI (Automated Optical Inspection) visual inspection

The invention discloses a detection mechanism with a side light source configured for an annular light source and a backlight source for AOI (Automated Optical Inspection) visual inspection. The detection mechanism comprises a stand and a CCD (Charge Coupled Device) camera. The stand is provided with a support frame, wherein the top of the stand is provided with a mounting rack for fixing a product to be detected, the backlight source is arranged under the product to be detected relative to the stand, the CCD camera comprises a central view CCD camera positioned right above a detection area and a side view CCD camera positioned on the side surface of the detection area, the annular light source is fixedly installed below a camera lens of the center view CCD camera, the stand is provided with high-angle strip-shaped light sources for lighting towards the detection area respectively above the left and right sides of the support frame, and the heights of the center view CCD camera and the side view CCD camera can be adjusted up and down relative to the stand through a corresponding up-and-down sliding mechanism. The detection mechanism can solve the problem that the lighting is insufficient and uneven during AOI visual inspection.
Owner:苏州富鑫林光电科技有限公司

System and method for detecting defects of blind holes in PCB (Printed Circuit Board) bare board based on AOI (Automated Optical Inspection)

The invention provides a system and a method for detecting defects of blind holes in a PCB (Printed Circuit Board) bare board based on AOI (Automated Optical Inspection). The system and the method are used for solving the technical problem of low detection accuracy of blind holes in dark in the existing detection system and method. The detection system comprises an image acquisition unit, an image preprocessing unit, a file preprocessing unit, a parameter reading unit, a blind hole detection unit and an error calculation unit; and the method comprises the steps of firstly, acquiring a scan image of a PCB bare board to be detected, preprocessing the scan image to obtain a binary image, then reading design file information of a standard PCB bare board, detecting coordinates and radii of all blind holes in the binary image according to the design file information of the standard PCB bare board, and finally calculating errors of all blind holes on the scan image of the PCB bare board to be detected. The detection accuracy in dark is high, the cost of the system is low, and the system and the method can be used for detecting defects of blind holes in circuit board machining environments.
Owner:XIDIAN UNIV
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