5079 results about "Copper foil" patented technology

Stationary and on-board battery chargers, methods of charging batteries, electric-vehicle chargers, and vehicles with chargers, including electric vehicles and hybrid electric vehicles. Chargers may automatically charge at the correct battery voltage for various types of batteries. Chargers have variable AC power supplies controlled by digital controllers, isolation transformers, and rectifiers. Transformers may be foil-type, and may have copper foil. Power supplies may be variable-frequency generators and the controllers may control the frequency. Electric vehicle chargers may have card readers, and vehicles may have batteries and a charger. Methods of charging include identifying the battery type and gradually increasing the charging at different rates of increase while monitoring charging voltage, charging current, or both, until a current lid is reached. Charging may occur at constant current and then at constant voltage.

Stationary and on-board battery chargers, methods of charging batteries, electric-vehicle chargers, and vehicles with chargers, including electric vehicles and hybrid electric vehicles. Chargers may automatically charge at the correct battery voltage for various types of batteries. Chargers have variable AC power supplies controlled by digital controllers, isolation transformers, and rectifiers. Transformers may be foil-type, and may have copper foil. Power supplies may be variable-frequency generators and the controllers may control the frequency. Use of the variable frequency generator supply facilitates reduced component size and weight and better battery charging performance. Electric vehicle chargers may have card readers, and vehicles may have batteries and a charger. Methods of charging include identifying the battery type and gradually increasing the charging at different rates of increase while monitoring charging voltage, charging current, or both, until a current lid is reached. Charging may occur at constant current and then at constant voltage.

Disclosed are a printed wiring board having micro-via holes highly reliable for conduction and a method of making the micro-via hole by providing a coating or sheet of an organic substance containing 3 to 97% by volume of at least one selected from a metal compound powder, a carbon powder or a metal powder having a melting point of at least 900° C. and a bond energy of at least 300 kJ/mol on a copper foil as an outermost layer of a copper-clad laminate having at least two copper layers, or providing a coating or sheet of the same after oxidizing a copper foil as an outermost layer, irradiating the coating or sheet with a carbon dioxide gas laser at an output of 20 to 60 mJ/pulse, thereby removing a micro-via-hole-forming portion of at least the copper foil as the outermost layer, then irradiating micro-via-hole-forming portions of the remaining layers with a carbon dioxide gas laser at an output of 5 to 35 mJ/pulse to make a micro-via hole which does not penetrate through the copper foil in a bottom of the micro-via hole, and electrically connecting the copper foil as the outermost layer and the copper foil in the bottom of the micro-via hole with a metal plating or an electrically conductive coating composition.

A circuit with embedding components (13) is produced by placing the components (13) on a substrate (14) and applying sheets (15) of prepreg. The prepreg sheets (15) have apertures to accommodate the -components, the number of sheets and arrangement of apertures being chosen to accommodate a variety of component X, Y and Z dimensions. A top layer with Cu foil (16(b)) is applied. The assembly is pressed in an operation analogous to conventional multilayer board lamination pressing. This causes all of the prepreg resin to flow to completely embed the components without raids or damage. Electrical connections are made by drilling and plating vias.

The display filter is constituted by laminating a transparent adhesive layer (C) 31 containing dye, a polymer film (B) 20, a transparent electrically conductive layer (D) 10, a transparent adhesive layer (E) 40, and a functional transparent layer (A) 60 having an anti-reflection property, a hard coat property, a gas barrier property, an antistatic property and an anti-fouling property sequentially in this order, adhered on a display area 00; on this occasion, the transparent electrically conductive layer (D) 10 is grounded to a ground terminal of the display via an electrode 50 and an electrically conductive copper foil adhesive tape 80.

The invention relates to a composite material, a high-frequency circuit substrate therefrom and a manufacture method thereof. The composite material comprises thermoset mixture, glass fiber cloth, power filler, a fire retardant and a curing initiator, wherein the thermoset mixture comprises more than one kind of vinyl liquid resin and polyphenyl ether resin; the molecular weight of the vinyl liquid resin is below 10000, and the vinyl liquid resin is provided with a polar functional group; the molecular weight of the polyphenyl ether resin is less than 5000, and the molecular tail end of the polyphenyl ether resin is provided with unsaturated double bonds. The high-frequency circuit substrate manufactured with the composite material comprises multiple layers of semi-solidified sheets and copper foils, wherein the semi-solidified sheets are mutually overlaid, and the copper foils are respectively pressed on two sides. The composite material disclosed by the invention causes the semi-solidified sheets to be easily manufactured and have high adhesive bonding force with the copper foils. The high-frequency circuit substrate manufactured by the material has the advantages of low dielectric constant, low dielectric loss angle tangent, good heat resistance and simple technical operation. Thus, the composite material disclosed by the invention is suitable for manufacturing the circuit substrate of the high-frequency electronic equipment.

A light-emitting device having the quality of an image high in homogeneity is provided. A printed wiring board (second substrate) (107) is provided facing a substrate (first substrate) (101) that has a luminous element (102) formed thereon. A PWB side wiring (second group of wirings) (110) on the printed wiring board (107) is electrically connected to element side wirings (first group of wirings) (103, 104) by anisotropic conductive films (105a, 105b). At this point, because a low resistant copper foil is used to form the PWB side wiring (110), a voltage drop of the element side wirings (103, 104) and a delay of a signal can be reduced. Accordingly, the homogeneity of the quality of an image is improved, and the operating speed of a driver circuit portion is enhanced.

Dielectrics are formed having high dielectric constants, low loss tangents, and other desirable electrical and physical properties. The dielectrics are annealed at temperatures allowing the use of copper foil substrates, and at low oxygen partial pressures.

The invention discloses a method for preparing single-layer or multi-layer graphene through chemical vapor deposition, and relates to a method for preparing a graphene material. The method comprises the following steps of: placing a metal substrate in a vacuum tubular furnace or a vacuum atmosphere furnace; injecting hydrogen into a vacuum cavity under the situation of removing the oxygen in the vacuum cavity; heating to 800-1,100 DEG C; and injecting a carbon source gas into the vacuum cavity to obtain the metal substrate for depositing graphene. According to the method disclosed by the invention, a graphene film is deposited by cracking methane or other carbon source gases on the metal substrate (such as a copper foil or a nickel foil and the like) at a high temperature by using the chemical vapor deposition method; and therefore, the invention provides a method for preparing the single-layer or multi-layer graphene with an ultra-large area.

The present invention provides a substrate for flexible wiring comprises a liquid crystalline polyester layer and a copper foil with a thickness of 5 μm or less. The substrate has a large adhesion between the resin layer and the copper foil, and is sufficient in water absorbing property and electrical properties.

The invention relates to a high-performance lithium ion battery. According to the battery, an electrode material is subjected to a nano-composite treatment of grapheme and polyaniline; an anode current collector comprises aluminium foil; a cathode current collector comprises copper foil; a conductive agent comprises superconducting carbon black, conductive graphite or acetylene black; a binding agent comprises styrene butadiene rubber, carboxymethylcellulose sodium, polytetrafluoroethylene, polyvinylidene difluoride or hydroxy propyl methylcellulose; a electrolyte comprises liquid electrolyte or a polymer electrolyte containing a conductive polymer, a nano-material, or a mixture comprising the conductive polymer and the nano-material; a membrane is subjected to a high temperature resistant insulation coating treatment, or directly adopts a high temperature resistant insulating porous polymer matrix. A preparation process for the high-performance lithium ion battery comprises: material preparing, coating, drying, rolling, slicing, coil winding or sheet stacking, assembling, liquid injecting, formation and capacity distributing. The lithium ion battery provided by the present invention has characteristics of excellent charge and discharge performance at the large rate, small capacity fading, good heat stability, good safety performance and long electrode cycle life, and can be widely applicable for the fields of electric bicycles, electric motorcycles, electric cars and the like.

The present invention relates to a wiring member including: a copper foil layer having a smooth surface with a surface roughness Rz of 2 μm or less; a noise suppressing layer containing a metallic material or a conductive ceramic and having a thickness of 5 to 200 nm; and an insulating resin layer provided between the smooth surface of the copper foil layer and the noise suppressing layer, and also relates to a printed wiring board equipped with the wiring member. Moreover, the present invention relates to a noise suppressing structure including: a first conductive layer; a second conductive layer; a noise suppressing layer provided between the first conductive layer and the second conductive layer, the noise suppressing layer being to be electromagnetically-coupled with the first conductive layer, the noise suppressing layer comprising a metallic material or a conductive ceramic, and the noise suppressing layer having a thickness of 5 to 300 nm; a first insulating layer provided between the first conductive layer and the noise suppressing layer; and a second insulating layer provided between the second conductive layer and the noise suppressing layer; wherein the noise suppressing structure has: a region (I) in which the noise suppressing layer and the first conductive layer face each other; and a region (II) in which the noise suppressing layer and the first conductive layer do not face each other but the noise suppressing layer and the second conductive layer face each other, the regions (I) and (II) neighboring each other.

The invention discloses a three-dimensional porous current collector which is used as a negative current collector of a metal secondary battery. At least one surface of the three-dimensional porous current collector is provided with a porous structure, sufficient in pore volume and moderate in thickness. Compared with a flat current collector, a metal negative electrode loaded on the three-dimensional porous current collector can be used for effectively restraining the formation of dendritic crystals, so that the safety of the metal negative electrode is improved, the cycle life of the metal negative electrode is long, and the voltage polarization of the metal negative electrode is small. The three-dimensional porous current collector can be prepared from a flat copper foil, and can be prepared through simple steps. The method for preparing the three-dimensional porous current collector is simple, suitable for large-scale production and very high in practicability, and the raw materials are easily available.

The invention provides halogen-free resin composition, and a copper clad laminate and a printed circuit board applying the halogen-free resin composition. The halogen-free resin composition comprises, by weight, (A) 100 parts of epoxy resin, (B) 1 part -100 parts of benzoxazine resin, (C) 1part -100 parts of styrene maleic anhydride, (D) 0.5 part -30 parts of amine curing agents, and (E) 5-150 parts of halogen-free flame retardants. By means of the specified constituents and ration, the halogen-free resin composition achieves the purposes of low dielectric constant, low dielectric loss, high heat resistance, and high flame resistance, can be manufactured into semi-solidified rubber pieces or resin films, and then achieves the purposes of being applied to the copper clad laminate and the printed circuit board.

Semiconductor device 3 comprises semiconductor chip 11, Au ball bumps 21 formed on pad electrodes 12 with a stud bump method, and thermoplastic adhesive layer 22 provided on the surface of semiconductor chip 11 on which pad electrodes 12 are formed, in which the tops of Au ball bumps 21 project from the surface of adhesive layer 22. Reliable bonding can be realized by forming the bumps for electrical connection and the adhesive resin having an adhesion function on the semiconductor chip. In addition, the present invention provides a method of bonding a copper foil to a semiconductor wafer to form a wiring pattern, a multi chip module in which electrical connection is established by bumps bonded to each other through an adhesive layer, and the like.

A process for producing an electrodeposited copper foil with its surface prepared, comprising the steps of: subjecting an electrodeposited copper foil having a shiny side and a matte side whose average surface roughness (Rz) is in the range of 2.5 to 10 mum to at least one mechanical polishing so that the average surface roughness (Rz) of the matte side becomes in the range of 1.5 to 3.0 mum; and subjecting the matte side having undergone the mechanical polishing to a selective chemical polishing so that the average surface roughness (Rz) of the matte side becomes in the range of 0.8 to 2.5 mum. The invention further provides an electrodeposited copper foil with its surface prepared, produced by the above process, and still further provides PWBs and a multilayer laminate of PWBs, produced with the use of the above electrodeposited copper foil with its surface prepared. The mechanical polishing followed by chemical polishing of the matte side enables obtaining an electrodeposited copper foil with its surface prepared, the matte side of which exhibits excellent properties, and hence enables obtaining PWBs and a multilayer PWBs which have excellent properties.

The present invention provides an article comprising: a substrate having a surface and comprising electrodeposited copper foil or copper alloy foil; an adherent layer serving to promote adhesion, comprising at least one organophosphonate or salt thereof covalently bound to the surface; and a functional layer, comprising at least one polymer bound to the adherent layer. The present invention further provides devices comprising a heat source or electronic component and the article described above, wherein the heat source is in thermal contact with the substrate and the electronic component is in electrical contact with the substrate.

Also provided is a method of producing the above-described article.

A resin composition, substrate material, sheet, laminated board, resin-bearing copper foil, copper-clad laminate, TAB tape, printed board, prepreg and adhesive sheet are provided which exhibit improved mechanical properties, dimensional stability, heat resistance and flame retardance, particularly high-temperature physical properties.

A resin composition containing 100 parts by weight of a thermosetting resin and 0.1-65 parts by weight of an inorganic compound, the resin composition having a mean linear expansion coefficient (α2) of up to 17×10⁻³ [° C.⁻¹] over the temperature range from a temperature 10° C. higher than a glass transition temperature of the resin composition to a temperature 50° C. higher than the glass transition temperature of the resin composition.

A semiconductor package substrate is provided, which can meet the move toward high integration of semiconductors. A nickel layer is plated on an electroplated copper foil to form a wiring pattern. An LSI chip is mounted on the copper foil, and terminals of the LSI chip and the wiring pattern are connected by wire bonding, followed by sealing with a semiconductor-sealing epoxy resin. Only the copper foil is dissolved away with an alkali etchant to expose nickel. With a nickel stripper having low copper-dissolving power, the nickel layer is removed to expose the wiring pattern. A solder resist is coated, and a pattern is formed in such a way that connecting terminal portions are exposed. Solder balls are placed at the exposed portions of the wiring pattern and are then fused. The wiring pattern is connected to an external printed board via the solder balls.

An antenna useful in an antenna array of a man-portable buried utility locator includes a flexible bobbin made of copper foil. The bobbin has a plurality of axially spaced grooves and an axially extending gap formed therein. A layer of insulation surrounds an outer surface of the bobbin. A conductive wire is disposed in the grooves and wound around the bobbin over the layer of insulation to form a plurality of axially spaced sub-coils. A layer of copper-foil tape having an insulating backing is wound about the conductive wire and has a second gap aligned with the gap in the bobbin. A layer of a low dielectric material is wound about the copper-foil tape. The antenna provides more antenna wire surface for an equivalent coil cross-sectional area, compared to prior art antennas, thus yielding greater sensitivity. The construction of the antenna provides a series of Faraday-shielded sub-coils, which yield a greater useful antenna bandwidth by moving the inherent resonance of each coil to a higher frequency. The construction of the antenna also reduces inherent winding capacitance and provides a self-shielding effect that further improves sensitivity.

The invention can make separation for all kinds of components in wasted Li-ion battery such as: case, electrolyte, anode material, cathode material, adhesive, copper foil, and aluminum foil. The process includes: breaking wasted batteries by mechanical process; separating metal case from others; washing out electrolyte using organic solvent, and filtering it from remaining solid; processing the remaining component where the electrolytes are removed using organic solvent to make all electrode active component eluted from current collector, and separated from diaphragm, copper foil, and aluminum foil. The solvent and adhesive can be reused.

This invention discloses a method for preparing phenolic hydroxyl-containing polyimide adhesive. The method comprises: (1) reacting phenolic hydroxyl-containing aromatic diamine, or its mixture with other aromatic diamines, with aromatic dianhydride at a mol ratio of 1:1 in strongly polar non-proton organic solvent at 0-10 deg.C for 4-8 h to obtain uniform, transparent and viscose polyhydroxyamic acid solution; (2) adding azeotropic dehydrator in nitrogen atmosphere, heating, performing imidization reaction under refluxing and dehydration at 120-160 deg.C for 1-6 h, and cooling to room temperature to obtain phenolic hydroxyl-containing polyimide adhesive. The volume ratio of azeotropic dehydrator to strongly polar non-proton organic solvent is 1 :( 1-5). The method has such advantages as easy operation, no special requirement for equipment, and high product quality. The phenolic hydroxyl-containing polyimide adhesive has such advantages as short adhesion and curing time, low energy consumption, and high adhesiveness to copper foil and polyimide thin film, and can be used to produce bi-layer flexible printed circuit boards.

A vinyl-compound-based resin composition containing a terminal vinyl compound (a) of a bifunctional phenylene ether oligomer having a polyphenylene ether structure, a naphthol aralkyl type cyanate ester resin (b), a bisphenol A cyanate ester resin (c), a brominated flame retardant (d) and an inorganic filler (e), which resin composition is for use in a printed wiring board for high multilayer and high frequency and is improved in moldability and copper foil peel strength, which are conventional problems, without any decrease in electric characteristics and heat resistance after moisture absorption while keeping flame retardancy, a prepreg comprising the above resin composition and a glass woven fabric, a metal-foil-clad laminate obtained by disposing a metal foil on one side or both sides of a stack of at least one prepreg and laminate-molding the resultant set, and a resin sheet obtained by applying a solution of the above resin composition to a surface of a metal foil or a film.

An aluminum substrate is drilled to form a first through hole, and is then laminated with copper foils on upper and lower surfaces of the aluminum substrate via a binder. Due to the pressure of the lamination, the binder is partially forced to flow into and fill the first through hole, and the binder is then solidified. Concentric with the first through hole, a second through hole having a smaller aperture than the first through hole is drilled. By a non-electrical and electrical plating method, a copper conductive layer is formed on the side wall of the second through hole to complete the through hole wire. Because of the isolation effect of the binder, the aluminum substrate is not electrically connected to the copper foils and the copper conductive layer.

The invention discloses a method for comprehensively recycling waste lithium ion batteries, and belongs to the field of recycling of regeneration resource. The method comprises the following steps: a, performing discharging processing on waste lithium ion batteries; b, fragmenting waste lithium ion batteries into sheets with a diameter of 10-20 mm in a closed shearing-type crusher, and spraying during fragmentation to dissolve lithium hexafluorophosphate in the waste lithium ion batteries into a spraying solution; c, peeling carbon powder on the surface of aluminium foils through stirring, dissolving electrolyte into the spraying solution, and recovering carbon powder; d, sending the sheets into a sodium hydroxide solution, peeling lithium cobalt oxide powder on the surface of aluminium foils through stirring, and recovering lithium cobalt oxide powder; e, cleaning the sheets, and recovering lithium cobalt oxide powder; and f, separating and recovering plastic and a copper-aluminium mixture. The method realizes recovery of carbon powder, lithium cobalt oxide powder, the copper-aluminium mixture and plastic through a simple environment-friendly process, and has certain economic benefit and social benefit.

The invention discloses a lithium ion battery with superhigh multiplying power, which comprises a positive plate, a negative plate, a membrane, an electrolyte solution, a plate lug and a packing shell. The positive plate is manufactured by coating the mixed slurry of a positive active material, a conducting agent and a cementing agent on both sides of an aluminium foil; the negative plate is manufactured by coating the mixed slurry of a negative active material, the conducting agent and the cementing agent on both sides of a copper foil; and the electrolyte solution is a mixed solution of lithium and an organic solvent. The lithium ion battery is capable of discharging continually at a superhigh multiplying power and the discharge multiplying power can reach 35C-50C. The discharge capacity of the discharge multiplying power at 35C, 40C, 45C, 50C can respectively reach 96.3 percent, 95.6 percent, 95.1 percent and 94.5 percent of the discharge capacity at 1C.

The invention provides a halogen-free resin composition which comprises (A) 100 parts of cyanate ester resin, (B) 5-50 parts of styrene maleic anhydride, (C), 5-100 parts of polyphenyl ether resin, (D) 5-100 parts of maleimide resin, (E) 10-150 parts of nitrogenous compound, and (F) 10-1000 parts of inorganic filler. As the composition comprises components in special proportion, the halogen-free resin composition is low in dielectric constant, low in dielectric loss, high in heat resistance and high in flame resistance. The halogen-free resin composition can be prepared as a semi-cured film or a resin film, so that the composition can be applied to a copper foil substrate and a printed circuit board.

The invention relates to a development method of a flexible pressure-sensitive element based on a carbon nano-tube filled high polymer composite material, which belongs to the technical field of sensors. The method comprises the following steps of: 1. pressure-sensitive material preparation: dispersing carbon nano-tubes into polydimethylsiloxane by utilizing ultrasonic vibration and mechanical stirring methods, and preparing a thin and flexible pressure-sensitive material by using tetraethoxysilane as a crosslinking agent and dibutyltin dilaurate as a catalyst with a spin coating method; 2. pressure-sensitive element packaging, wherein a two-stage sandwich structure is adopted, the first-stage sandwich structure comprises two layers of packaging films and the pressure-sensitive material positioned in the middle; and in the second-stage sandwich structure, each layer of packaging film comprises two layers of polyimide films as well as a copper foil electrode and a lead which are embedded in the two layers of polyimide films. The pressure-sensitive element developed by the invention has good flexibility, high precision, thin thickness, simple process and low cost and is applicable to the fields of pressure monitoring of structures between narrow curved surface layers in the fields of military industry and civil use and artificial electronic skin development and the like.

The invention provides a preparation method of large-size Cu(111) monocrystal copper foil and ultra-large-size monocrystal graphene. The method includes the steps that polycrystal copper foil doped with metal elements serves as a raw material, ultra-large-size monocrystal Cu(111) is prepared through a special annealing technology, and then the ultra-large-size high-quality monocrystal graphene is obtained with the Cu(111) monocrystal as a substrate through a normal-pressure chemical vapor deposition method. The method solves the problem that monocrystal Cu(111) is expensive, the ultra-large-size monocrystal graphene is prepared through the regulation and control effect of the substrate, the technical problems that the monocrystal size is small during growth of graphene and the growing process is complicated are solved, and the copper foil monocrystal and high-quality and large-size monocrystal graphene samples are prepared through a very simple method.

The invention relates to a halogen-free low dielectric resin composition and a prepreg and copper clad laminate made of the same. The halogen-free low dielectric resin composition comprises the following components in part by weight of organic solid content: 5 to 90 parts by weight of epoxidized polybutadiene resin, 10 to 90 parts by weight of benzoxazine resin, 10 to 90 parts by weight of epoxy resin, 1 to 50 parts by weight of curing agent, 10 to 50 parts by weight of organic flame retardant, 0.001 to 1 part by weight of curing accelerator, 0.1 to 10 parts by weight of initiator and 10 to 100 parts by weight of fillings. Due to the adoption of the epoxidized polybutadiene in the halogen-free low dielectric resin composition disclosed by the invention, not only are the defects of polybutadiene improved, but also the advantages on the aspects of dielectric and flexibility are well kept and the adhesion force between the halogen-free low dielectric resin composition and a copper foil is improved; and the prepreg and copper clad laminate for a printed circuit board, which is made of the resin composition, has excellent dielectric performance, good heat resistance and high glass transition temperature and the requirements on the high frequency of transmission of an electronic signal and high speed of information processing in the industry of the printed circuit copper clad laminate can be met.