7789 results about "Copper foil" patented technology

The invention provides a control method of composite copper foil thickness control equipment, which comprises the following steps: calculating the deposition thickness of each abnormal concentration group at a future moment according to a deposition rate change rule diagram to obtain the copper layer thickness distribution of an abnormal region, and comparing the copper layer thickness distribution of the abnormal region with the thickness distribution of a normal region to obtain the thickness distribution of the abnormal region. Calculating a thickness deviation value of the abnormal area; according to the thickness deviation value, a deviation compensation algorithm is adopted, electroplating process parameters of the abnormal area are adjusted according to the size and the sign of the deviation value, and the electroplating process parameters comprise the current density and the electrolyte flow speed; and according to the optimized electroplating process parameters, performing parameter setting and adjustment on a power supply system and an electrolyte circulation system of the composite copper foil thickness control equipment, so that the composite copper foil thickness control equipment performs production according to the optimized electroplating process parameters.

The invention provides a control method of tension adjusting equipment on a composite copper foil continuous production line, which comprises the following steps: acquiring a tension set value and a tension actual value of adjacent stations on the composite copper foil continuous production line, and calculating a difference value between the tension set value and the tension actual value to obtain tension deviation data; in the process of adjusting the tension between the adjacent stations, judging whether the copper foil snakes or not, and if yes, feeding back snaking offset data of the copper foil to a feed-forward compensation function and a feedback controller so as to cooperatively adjust the control of the tension; on the basis of tension balance between adjacent stations, operation parameters of all stations of the composite copper foil continuous production line are collected in real time, and a production line operation mathematical description function is established; and optimizing control parameters of production line operation in combination with a preset rule in the preset knowledge base.

The invention belongs to the technical field of copper-clad plates, and relates to a low-dielectric high-heat-resistance copper-clad plate and a preparation method thereof. By introducing the POSS resin, the dielectric constant of the copper-clad plate is effectively reduced, which is crucial for reducing signal delay and improving signal transmission efficiency. The introduction of the POSS resin not only improves the dielectric properties of the material, but also improves the glass transition temperature (Tg) of the material, which means that the physical and chemical properties of the material can be kept unchanged at a higher temperature, and the material is suitable for wider environmental conditions. By using the resin and the inorganic filler in a specific ratio, the copper-clad plate shows excellent copper foil peel strength, and ensures that the bonding force between the copper foil and the base material is not easily weakened under long-term use or severe conditions. Meanwhile, the material also has excellent CAF (conductive anode wire) resistance, can effectively prevent internal short circuit caused by moisture, and prolongs the service life of an electronic product.

The invention provides a secondary battery, a preparation method thereof and an electric device. The secondary battery comprises a copper foil, the copper foil comprises copper crystal grains with different particle sizes, the copper crystal grains comprise copper crystal grains with the particle size smaller than or equal to 0.5 mu m and copper crystal grains with the particle size larger than 0.5 mu m, the number of the copper crystal grains with the particle size smaller than or equal to 0.5 mu m accounts for 70%-95% of the total number of the copper crystal grains, and the number of the copper crystal grains with the particle size larger than 0.5 mu m accounts for 10%-20% of the total number of the copper crystal grains. And the amount of the copper grains with the grain size larger than 0.5 mu m accounts for 5%-30% of the total amount of the copper grains. The current collector has excellent mechanical strength and plasticity.

The invention discloses an intelligent detection system for the surface quality of a copper foil. The intelligent detection system comprises an acquisition module, a construction module and a detection module, the acquisition module is used for acquiring a multi-angle multi-spectral image of the surface of the copper foil and preprocessing the multi-angle multi-spectral image; the construction module is used for carrying out automatic identification and positioning on the surface of the copper foil by utilizing a defect detection algorithm based on deep learning based on the preprocessed multi-angle multispectral image, and constructing a copper foil surface defect identification model; and the detection module is used for comprehensively detecting the surface defects of the copper foil to be detected by using the copper foil surface defect identification model. According to the invention, comprehensive and accurate detection of surface defects of the copper foil can be realized, and the quality control level of the copper foil is improved.

The invention provides a circuit board electrical performance test and diagnosis method, which comprises the following steps of: constructing a structured process-electrical data set by collecting process parameters such as etching time, pressing temperature, drilling precision, copper foil thickness and the like and electrical test indexes such as impedance deviation, leakage current, signal attenuation and the like; screening key process variables by adopting mutual information analysis and a maximum correlation-minimum redundancy criterion; through modeling of a three-layer causal diagram and a structural equation, quantitative influence evaluation of process parameters on electrical performance and fault types is realized; when a fault is detected, the system can automatically perform reverse reasoning, identify a main manufacturing deviation item and generate attribution diagnosis and process optimization suggestions, so that the accuracy of fault diagnosis and the pertinence of process adjustment are improved, and the fault occurrence rate is reduced and the product quality is improved.

The invention discloses a preparation method of a low-internal-resistance copper foil for a lithium ion battery, which comprises the following specific steps of: 1, grinding a titanium cathode roller by using a grinding wheel of 50-600 meshes, removing an oxide layer, foreign matter points and the like on the surface of the cathode roller, and grinding by using a grinding wheel of 1000-1500 meshes; 2, the cathode roller falls into an electrolytic bath provided with an anode plate, and copper sulfate electrolyte is introduced into the electrolytic bath; and 4, a direct-current power supply is switched on, the current density of the power supply is 60-70 A / dm < 2 >, copper foil is subjected to electrolytic deposition on the arc-shaped cathode roller surface according to the Faraday principle, then the copper foil is subjected to acid pickling, water washing and passivation, and the lithium battery copper foil with the low internal resistance is obtained. On one hand, the problems of coating wrinkling and tab collapse in the battery preparation process are solved, on the other hand, the safety problem caused by excessive internal resistance and heating in the battery using process of an existing copper foil serving as a current collector is solved, and the performance such as the energy density and the rate characteristic of the battery is improved.

The invention relates to a thermoplastic polyimide resin with a block structure and a preparation method thereof, and a polyimide adhesive film and polyimide composite copper foil composed of the thermoplastic polyimide resin with the block structure. The polyimide adhesive film is formed by coating thermoplastic polyimide resin and thermosetting polyimide resin on a polyimide base film and mixing the thermoplastic polyimide resin and the thermosetting polyimide resin. Wherein the thermoplastic resin is composed of a hard segment containing a benzimidazole or amide unit and a soft segment containing a flexible ether bond. The polyimide adhesive film composite copper foil is prepared through rolling, mold pressing and other processing modes. The thermoplastic polyimide resin is of a soluble structure and does not need precursor processing, so that the formation of bubbles is effectively inhibited, and an IPN interpenetrating network structure is formed between the cured thermoplastic resin and thermosetting resin, so that the copper foil has excellent mechanical property, adhesive property and dimensional stability after being compounded; therefore, the method can be applied to the fields of semiconductor packaging, flexible copper-clad plates and the like.

The invention relates to the technical field of lithium ion batteries, in particular to a copper foil, a preparation method thereof, a negative electrode containing the copper foil and a lithium ion battery. The copper foil comprises ultra-fine grains and nano twin crystals, the average grain size is 0.2-0.4 mu m, the area weighted average grain size is 0.3-0.8 mu m, and the proportion of the nano twin crystals in the copper foil is larger than 50%. The copper foil is prepared through a pulse electroplating technology, and the technology can control the average grain size and the proportion of nano twin crystals in the copper foil, so that the copper foil has high tensile strength and high ductility. According to the preparation method of the copper foil, a specific electrolyte is adopted at the same time, the tensile strength of the copper foil can reach 600-900 MPa, and the ductility is larger than 5%. When the copper foil is applied to the lithium ion battery, the volume expansion rate of a negative electrode material after charge-discharge circulation can be reduced, copper foil breakage caused by repeated volume change of the negative electrode material in the charge-discharge process is prevented, the cycle life of the battery is prolonged, and the safety of the battery is improved.

The invention relates to the technical field of composite copper foils, in particular to a production process of a multifunctional composite copper foil, the composite copper foil and application of the composite copper foil. The invention provides a production process of a multifunctional composite copper foil. The production process comprises the following steps: S1, baking a carrier layer; s2, performing surface treatment through plasma treatment; s3, coating a film on the baked carrier layer through magnetron sputtering to form a bottom layer; s4, evaporating a vacuum evaporation layer on the base layer through vacuum evaporation; s5, plating a copper layer on the vacuum evaporation layer through water electroplating; and S6, slitting the sample. According to the production process, by optimizing the baking conditions, the sputtering technology and the evaporation parameters and introducing the plasma surface treatment technology, the binding force of the copper film and the base material is improved, the pinhole rate is reduced, the production efficiency and the coating uniformity are remarkably improved, and the product quality is improved. The problems that in the existing composite copper foil production process, the binding force between a copper film and a base material is poor, the pinhole rate of the copper film is high, the deposition speed is low, and the coating uniformity is poor are solved.

The invention discloses a copper-clad plate for a printed circuit board and a preparation method of the copper-clad plate, and relates to the technical field of printed circuit board materials. The invention discloses a preparation method of a copper-clad plate for a printed circuit board, which comprises the following steps of: soaking a reinforcing material in a glue solution, and drying to obtain a prepreg; carrying out hot-pressing treatment on the prepreg and copper foil to obtain a copper-clad plate; the glue solution comprises the following raw materials in parts by weight: 15-20 parts of vinyl-terminated polyphenyl ether, 20-25 parts of epoxy resin, 20-25 parts of difunctional silicon dioxide, 15-25 parts of an organic solvent, 0.3-0.6 part of a curing agent and 0.05-0.1 part of a curing accelerator; the difunctional silicon dioxide cross-linked polyphenyl ether and epoxy resin prepared by the preparation method disclosed by the invention are used as a resin material of a glue solution, and have the characteristics of good heat resistance and excellent mechanical properties.

The invention discloses a PDMS / MWCNTs flexible resistive pressure sensor with a double-layer corrugated structure and a preparation method of the PDMS / MWCNTs flexible resistive pressure sensor, and belongs to the technical field of flexible piezoresistive sensors. The PDMS / MWCNTs flexible resistive pressure sensor with the double-layer corrugated structure sequentially comprises a silica gel packaging layer, a copper foil, a PDMS / MWCNTs conductive thin film with a high-amplitude corrugated structure, a PDMS / MWCNTs conductive thin film with a low-amplitude corrugated structure, a copper foil and a silica gel packaging layer from top to bottom, the cross section of the PDMS / MWCNTs conductive thin film with the high-amplitude corrugated structure and the cross section of the PDMS / MWCNTs conductive thin film with the low-amplitude corrugated structure are both in a wave shape, and the wave length of the wave shape of the PDMS / MWCNTs conductive thin film with the high-amplitude corrugated structure is the same as that of the wave shape of the PDMS / MWCNTs conductive thin film with the low-amplitude corrugated structure. And the wave height of the wave shape of the PDMS / MWCNTs conductive thin film with the high-amplitude corrugated structure is higher than that of the wave shape of the PDMS / MWCNTs conductive thin film with the low-amplitude corrugated structure. The flexible resistance type pressure sensor realizes high linearity and good sensitivity in a wide pressure range, has excellent mechanical stability, rapid responsiveness and good durability, and has great potential in the fields of human wearable health monitoring, motion detection and the like.

The invention relates to a carrier copper foil and a preparation method of a copper-clad plate thereof, which are different from a conventional carrier copper foil structure, the carrier copper foil only comprises a carrier copper layer, a stripping layer and a roughening treatment layer, the carrier copper foil is stripped after being laminated with a resin plate, only roughening copper nodules embedded in the resin are reserved, and the stripping layer and the carrier copper layer are separated from the resin. According to the method, the compatibility of the same carrier copper foil is expanded, the step of separating the ultrathin copper layer from the carrier copper layer is avoided, surface defects caused by separation of the ultrathin copper layer are reduced, and the method has a good application prospect.

The invention relates to a flexible aqueous binder for a lithium battery negative electrode and a preparation method thereof. The preparation method comprises the following steps: firstly, preparing a flexible polyurethane prepolymer containing vinyl by taking hydroxyl-terminated polybutadiene, isocyanate and hydroxyl acrylate as main raw materials; vinyl-containing compounds such as water-soluble acrylic acid (salt) or acrylamide, oil-soluble acrylic ester or acrylonitrile and the like are used as monomers and are combined with a flexible polyurethane prepolymer to prepare the negative water-based binder with flexible cross-linking points through free radical polymerization. The aqueous binder prepared by the technical method provided by the invention can realize point-to-point and point-to-line bonding modes with a pole piece active substance on a microstructure, so that the bonding strength of the active layer material and a copper foil is improved on the premise of not influencing the electrolyte resistance of the binder; and the flexibility of the negative pole piece and the subsequent processing stability are obviously improved.

The invention relates to a laser drilling method for a thin copper HDI circuit board. The laser drilling method comprises the following steps that a circuit board to be machined is positioned and installed on a machining station of laser machining equipment; a first section of laser drilling is carried out, a first laser parameter is adopted, uncovering drilling is carried out on a preset machining area of the outer copper foil layer, and an initial hole structure is formed; performing second-section laser drilling, namely performing compensation drilling on the dielectric layer exposed at the bottom of the initial hole structure by adopting a second laser parameter of which the energy is lower than that of the first laser parameter to form a transition hole structure; and in the third section of laser drilling, a third laser parameter with energy lower than that of the second laser parameter is adopted, the bottom of the transition hole structure is trimmed, and a final hole channel is formed. According to the method, drilling is conducted in three sections, namely the first section of uncovering drilling, the second section of compensation drilling and the third section of finishing treatment. Therefore, the bottom cushion copper cannot absorb a large amount of heat in a short time, the base material layer below the bottom cushion copper can be protected from being burnt, and the product quality is improved.

The invention relates to a cooling structure for an ultraprecise linear motor and belongs to the technical field of linear motors. The cooling structure solves the problem of proneness to heat exchange with environment caused by high side temperature of two-side surface-mounted cooling structures of existing linear motors. The cooling structure comprises a winding supporting portion, a winding and a heat conductive portion, wherein the winding is fixed on the surface of the winding supporting portion, the heat conductive portion is arranged on the surface on the outer side and fixedly connected with the winding supporting portion, the heat conductive portion is a copper foil ring which fits the outer profile of the winding and is sleeved and fixed on the surface on the outer side of the winding, or the heat conductive portion is a copper foil heat conductive ring formed by arraying multiple copper foil sections in a dispersed manner, the copper coil heat conductive ring fits the outer profile of the winding, and each copper coil section is fixed on the surface on the outer side of the winding. The cooling structure for the ultraprecise linear motor is suitable for cooling of linear motors.

The invention provides a current collector, a pole piece, a secondary battery, an electric device, a copper foil and a preparation method of the copper foil. The current collector comprises a copper foil, the average particle size of crystal grains in the copper foil is 50-400 nm, and based on the total number of the crystal grains in the copper foil, the number ratio of the crystal grains of the nano twin crystals is larger than or equal to 60%. Under the combined action of the high-proportion nano twin crystal structure and the small grain size, the mechanical strength of the current collector is improved while the high plasticity of the current collector is maintained, and a material basis is provided for further improvement of the energy density and the safety of the battery.

The embodiment of the invention relates to the technical field of electrolytic copper foil testing, and particularly discloses a continuous testing method and system for warping of an electrolytic copper foil. The method comprises the following steps: periodically cutting an electrolytic copper foil sample; adjusting a test environment, and carrying out leveling positioning and reference calibration on the electrolytic copper foil sample; performing three-dimensional panoramic scanning and multi-point scanning supplement on the electrolytic copper foil sample; reconstructing a three-dimensional surface model, carrying out reference comparison, and calculating a plurality of warping key indexes; and performing qualification judgment and trend analysis on the plurality of warping key indexes, generating a warping test report, and performing feedback control of a continuous test. According to the method, the defect evolution rule is visually presented by automatically generating the three-dimensional surface diagram and the distribution curve visual report; the electroplating parameters are dynamically adjusted by triggering the process feedback control module, a test-analysis-regulation closed loop is formed, the warping degradation trend is inhibited from the source, and the product yield and the production continuity are improved.

The present invention belongs to the technical field of electrolytic copper foil. The present invention provides an electrolyte for ultra-thin electrolytic copper foil, in which the mass concentration of copper sulfate is 175-260 g / L, the mass concentration of inorganic acid is 80-100 g / L, the mass concentration of additive is 1-5 g / L, the mass concentration of complexing agent is 3-8 g / L, the mass concentration of conductive polymer is 0.5-3 g / L, and the mass concentration of hydrolyzed collagen is 0.1-0.5 g / L. The present invention also provides an ultra-thin electrolytic copper foil and a preparation method thereof. The present invention significantly reduces the thickness and roughness of the copper foil by controlling the components of the electrolyte and their concentrations and the electrodeposition process parameters, while improving the mechanical properties, antioxidant properties and electrochemical properties of the copper foil. The ultra-thin copper foil of the present invention can be produced continuously without tearing, achieving a double breakthrough in the ultra-thin thickness and mechanical properties of the copper foil.

The invention discloses a Br-COFs material and a preparation method thereof as well as a preparation method of a covalent organic framework material interface film of a lithium metal battery. The preparation method comprises the following steps: dissolving 1, 3, 5-tri (4-aminophenyl) benzene and 2, 5-dibromobenzene-1, 4-dicarboxaldehyde in an organic solvent, dropwise adding acetic acid into the solution, reacting the reaction mixture under stirring, filtering, washing and drying to obtain the covalent organic framework material; and dissolving the obtained Br-COFs material and a PVdF adhesive in an organic solvent to obtain a mixed solution, coating the surface of a copper foil with the mixed solution according to a certain thickness, and forming the Br-COFs artificial interfacial film on the surface of a copper foil electrode after the solvent is volatilized. The preparation method is simple, the preparation process is green and environment-friendly, and the prepared product is high in purity, controllable in structure and high in mechanical strength, can be directly used as an artificial interface film of a lithium metal battery, and shows excellent stability when being used for a Li / Cu battery.

The invention discloses a double-sided semi-embedded packaging substrate and a processing method thereof, and the processing method comprises the steps: carrying out the N times of double-sided circuit manufacturing and the N-1 times of double-sided layer adding of a multi-layer substrate alternately, and obtaining an operation board with two groups of symmetrical circuit structures; the circuit structure is provided with an outer circuit layer and (N-1) inner circuit layers which are communicated with each other, and the inner circuit layer located on the innermost side is provided with a bonding pad. Performing laser groove burning on the working board, and processing a blind groove which is provided with an opening at the outer circuit layer and takes the other inner circuit layer adjacent to the innermost inner circuit layer as the groove bottom locally on each group of circuit structure; removing the copper foil on the bottom of the blind groove; the bonding pads are completely exposed in the blind grooves corresponding to the bonding pads, the blind grooves in the two sets of circuit structures are communicated, and a through groove structure is obtained; and cleaning the surface of the bonding pad to obtain the double-sided semi-embedded packaging substrate. The processing method is simple and reasonable, the processing cost is low, the processing efficiency is high, and the reliability of the obtained double-sided semi-embedded packaging substrate is very high.

The invention discloses an online composite coating system for an ultrathin copper foil and a modified resin film, and relates to the field of composite coating. The unwinding pretreatment module accurately controls tension and speed of a copper foil and a resin film and cleans and activates the copper foil; the coating liquid preparation and supply module adopts a neural network and other liquid control performance and conveying; the precision coating module controls film thickness by combining a bionic runner coating head with temperature; the composite pressing module intelligently controls a temperature roller and performs gradient cooling; the on-line detection and feedback control module carries out multi-modal detection and fusion data high-speed linkage adjustment on each module. Parameters of the ultrathin copper foil and modified resin film composite coating link are accurately controlled, defects are reduced, the film layer quality and adhesive force are improved, the system environment adaptability and stability are enhanced, the production efficiency and the product percent of pass are improved, and the cost is reduced.

The invention relates to the technical field of copper-clad plates, in particular to a copper-clad plate edge cutting and tearing mechanism and a method thereof. The laser cutting assembly is installed at one end of a working plate of the vacuum platform assembly. The upper pressing assembly is mounted at the other end of the working plate of the vacuum platform assembly; the bottom supporting assembly is matched with the upper pressing assembly. The vacuum adjusting assembly is mounted on a working plate of the vacuum platform assembly between the laser cutting assembly and the upper pressing assembly; the camera transferring assembly is installed on the right side of the upper pressing assembly. A camera is used for positioning an aluminum plate and confirming the cutting position, a laser cutting assembly is used for pre-cutting, the cutting depth is controlled, the aluminum plate cannot be damaged, then an upper pressing assembly and a bottom supporting assembly are used for vertically positioning and clamping a base plate, a clamping and lifting assembly is used for clamping the edge of a copper foil and then lifting and tearing a part of the copper foil, and finally an edge tearing and transferring assembly is inserted and pushes a shifting rod forwards. The whole plate edge tearing is completed, manual cutting is not needed, a reference is provided, the cutting size and the cutting quality are guaranteed, and the cutting efficiency is greatly improved.

The invention provides a method for reducing electrolyte impurities based on copper foil production equipment, which comprises the following steps: identifying a pressure fluctuation abnormal region from a pressure time-frequency distribution map, taking the pressure fluctuation abnormal region as the input of a pre-constructed high-deposition region distribution model, outputting to obtain the position distribution of the high-deposition region, and determining potential high-risk nodes of impurity deposition in a pipeline; according to the determined potential high-risk node of impurity deposition in the pipeline, a filtering device is deployed at the potential high-risk node of impurity deposition, impurity particle size separation is carried out through a multi-stage filtering structure arranged in the filtering device, separated impurities with different particle sizes are directionally collected, and impurity data are obtained.

The invention discloses processing equipment of a printed circuit board, which is applied to the technical field of printed circuit board processing, and comprises a conveying mechanism, the conveying mechanism comprises a shell, a support frame is arranged at the top of the shell, and a positioning mechanism is arranged at the bottom of the support frame; the positioning mechanism comprises an adjusting assembly, a first positioning assembly and a second positioning assembly, when the processing equipment of the printed circuit board is used, the positions of the first moving block body and the second moving block body can be adjusted by being matched with the sizes of a copper foil plate and a substrate, and the use flexibility and compatibility of the mechanism are improved. The second abutting block and the first abutting block make contact with and abut against one end and the two sides of the copper foil plate and one end and the two sides of the base plate respectively, so that alignment is achieved, and the second abutting block and the first abutting block can be matched with an external pin machine to conduct pin positioning on the aligned copper foil plate and the base plate. Through the arrangement, the complexity and inconvenience of existing manual positioning can be distinguished, the workshop production efficiency can be improved, and the manual operation cost is reduced.

The invention relates to the technical field of image enhancement, in particular to a surface process defect detection method and system for copper foil production, and the method comprises the steps: collecting a copper foil image in a production process; obtaining each image block in the copper foil image; performing edge detection on the copper foil image to obtain each edge line in the copper foil image; determining a texture feature coefficient of each image block, constructing an illumination contrast coefficient of each image block, correcting a standard deviation parameter in a Gaussian filter, and performing image enhancement on each image block by using the Gaussian filter after parameter correction and a local Retinex algorithm; and carrying out surface defect detection on the copper foil through the enhanced copper foil image. Therefore, the precision of copper foil surface process defect detection is improved.

The invention belongs to the technical field of electrolytic copper foils, and particularly relates to application of an additive for coarsening an electrolytic raw foil in coarsening the electrolytic raw foil, a coarsening solution and a preparation method of an electrolytic copper foil. The additive for coarsening the electrolytic raw foil, which is provided by the invention, is selected from one or more of 1-hydroxyethyl-3-methylimidazole polystyrene sulfonate, 1-butyl-3-methylimidazole polystyrene sulfonate, poly (1-butyl (3-hydroxyl)-3-methylimidazole chloride salt and guar gum. By introducing the polyion liquid, a large amount of uniform and fine nano-scale copper teeth can be generated on the rough surface of the copper foil, so that the specific surface area of the surface of the copper foil is increased, the high peel strength between the copper foil and a resin substrate is realized while the low profile tolerance is ensured, and the obtained copper foil has the properties of low surface roughness and high peel strength; and the performance requirements of high PCB transmission frequency, high speed and low loss under 5G communication can be met.

The invention discloses a negative electrode interface modification material, a negative electrode plate, a positive electrode interface functional layer, a positive electrode plate, a solid-state battery and a power utilization device, and relates to the technical field of batteries, the negative electrode interface modification material comprises a first polymer matrix, a reinforcing filler, a conductive agent and a lithium salt, the modulus of the reinforcing filler is greater than 50 GPa. The tensile strength of the negative electrode interface modification material can be improved through the first polymer matrix, breakage of a negative electrode interface modification layer is reduced, interface impedance is reduced, meanwhile, the first polymer matrix can be matched with the expansion coefficient of a silicon-based material, and bulging of a negative electrode plate is reduced. The modulus of the reinforcing filler is greater than 50GPa, so that the modulus of the negative electrode interface modification layer can be improved, the expansion of the silicon-based active material is further inhibited, the conductive agent can relieve the problem that the flexible substrate interface of the copper foil and the negative electrode interface modification layer possibly causes unsmooth electron transmission, and the lithium salt can improve the ion conduction capability and reduce the interface impedance.

The invention discloses a composite copper foil current collector and a preparation method thereof, a negative electrode, a lithium ion battery and electric equipment, and belongs to the technical field of batteries. The composite copper foil current collector comprises a polymer composite layer which comprises a polymer layer and a conductive material layer, the polymer layer has two opposite surfaces, and the conductive material layer is attached to at least one surface of the polymer layer; the polymer composite layer is provided with a first surface and a second surface which are opposite; and the copper layer is attached to the first surface and the second surface of the polymer composite layer. The conductive material is introduced to the surface of the polymer base material and then copper plating is performed, so that the binding force is stronger compared with the binding force between the polymer and copper; meanwhile, the conductive material is compounded on the polymer base material and replaces part of the polymer insulating material to form a coherent conductive network, so that the composite copper foil current collector has higher conductivity; volume expansion hardly occurs in the charging and discharging process, active substances are prevented from falling off from the current collector, and the cycling stability of the battery is improved.

The invention discloses a copper foil double-sided glossiness synchronous detection device, and belongs to the technical field of copper foil detection equipment. Comprising a first transmission roller and a second transmission roller which are arranged at the output end of a foil forming machine and used for transmitting copper foil, the first transmission roller and the second transmission roller are arranged on the lower side of the copper foil in parallel and at intervals, the first transmission roller and the second transmission roller are connected to a rotation driving device, and a tension detection assembly is installed on the upper side of the copper foil close to the first transmission roller. The second transmission roller is connected to the speed reducing mechanism. The tension detection assembly is connected to the speed reducing mechanism. An upper glossiness detector and a lower glossiness detector are respectively mounted on the upper side and the lower side of the copper foil close to the second driving roller; an additive control end is installed in the crude foil machine at the same time, and the upper glossiness detector and the lower glossiness detector synchronously detect the glossiness of the two faces of the copper foil and monitor the change condition of the glossiness in real time. According to the device, the problem that the detection result is inaccurate due to insufficient tension when the copper foil is conveyed can be solved.