5557 results about "Copper foil" patented technology

The invention provides a control method of composite copper foil thickness control equipment, which comprises the following steps: calculating the deposition thickness of each abnormal concentration group at a future moment according to a deposition rate change rule diagram to obtain the copper layer thickness distribution of an abnormal region, and comparing the copper layer thickness distribution of the abnormal region with the thickness distribution of a normal region to obtain the thickness distribution of the abnormal region. Calculating a thickness deviation value of the abnormal area; according to the thickness deviation value, a deviation compensation algorithm is adopted, electroplating process parameters of the abnormal area are adjusted according to the size and the sign of the deviation value, and the electroplating process parameters comprise the current density and the electrolyte flow speed; and according to the optimized electroplating process parameters, performing parameter setting and adjustment on a power supply system and an electrolyte circulation system of the composite copper foil thickness control equipment, so that the composite copper foil thickness control equipment performs production according to the optimized electroplating process parameters.

The invention provides a control method of tension adjusting equipment on a composite copper foil continuous production line, which comprises the following steps: acquiring a tension set value and a tension actual value of adjacent stations on the composite copper foil continuous production line, and calculating a difference value between the tension set value and the tension actual value to obtain tension deviation data; in the process of adjusting the tension between the adjacent stations, judging whether the copper foil snakes or not, and if yes, feeding back snaking offset data of the copper foil to a feed-forward compensation function and a feedback controller so as to cooperatively adjust the control of the tension; on the basis of tension balance between adjacent stations, operation parameters of all stations of the composite copper foil continuous production line are collected in real time, and a production line operation mathematical description function is established; and optimizing control parameters of production line operation in combination with a preset rule in the preset knowledge base.

The invention provides a secondary battery, a preparation method thereof and an electric device. The secondary battery comprises a copper foil, the copper foil comprises copper crystal grains with different particle sizes, the copper crystal grains comprise copper crystal grains with the particle size smaller than or equal to 0.5 mu m and copper crystal grains with the particle size larger than 0.5 mu m, the number of the copper crystal grains with the particle size smaller than or equal to 0.5 mu m accounts for 70%-95% of the total number of the copper crystal grains, and the number of the copper crystal grains with the particle size larger than 0.5 mu m accounts for 10%-20% of the total number of the copper crystal grains. And the amount of the copper grains with the grain size larger than 0.5 mu m accounts for 5%-30% of the total amount of the copper grains. The current collector has excellent mechanical strength and plasticity.

The invention provides a circuit board electrical performance test and diagnosis method, which comprises the following steps of: constructing a structured process-electrical data set by collecting process parameters such as etching time, pressing temperature, drilling precision, copper foil thickness and the like and electrical test indexes such as impedance deviation, leakage current, signal attenuation and the like; screening key process variables by adopting mutual information analysis and a maximum correlation-minimum redundancy criterion; through modeling of a three-layer causal diagram and a structural equation, quantitative influence evaluation of process parameters on electrical performance and fault types is realized; when a fault is detected, the system can automatically perform reverse reasoning, identify a main manufacturing deviation item and generate attribution diagnosis and process optimization suggestions, so that the accuracy of fault diagnosis and the pertinence of process adjustment are improved, and the fault occurrence rate is reduced and the product quality is improved.

The invention discloses a copper-clad plate for a printed circuit board and a preparation method of the copper-clad plate, and relates to the technical field of printed circuit board materials. The invention discloses a preparation method of a copper-clad plate for a printed circuit board, which comprises the following steps of: soaking a reinforcing material in a glue solution, and drying to obtain a prepreg; carrying out hot-pressing treatment on the prepreg and copper foil to obtain a copper-clad plate; the glue solution comprises the following raw materials in parts by weight: 15-20 parts of vinyl-terminated polyphenyl ether, 20-25 parts of epoxy resin, 20-25 parts of difunctional silicon dioxide, 15-25 parts of an organic solvent, 0.3-0.6 part of a curing agent and 0.05-0.1 part of a curing accelerator; the difunctional silicon dioxide cross-linked polyphenyl ether and epoxy resin prepared by the preparation method disclosed by the invention are used as a resin material of a glue solution, and have the characteristics of good heat resistance and excellent mechanical properties.

The invention discloses a PDMS / MWCNTs flexible resistive pressure sensor with a double-layer corrugated structure and a preparation method of the PDMS / MWCNTs flexible resistive pressure sensor, and belongs to the technical field of flexible piezoresistive sensors. The PDMS / MWCNTs flexible resistive pressure sensor with the double-layer corrugated structure sequentially comprises a silica gel packaging layer, a copper foil, a PDMS / MWCNTs conductive thin film with a high-amplitude corrugated structure, a PDMS / MWCNTs conductive thin film with a low-amplitude corrugated structure, a copper foil and a silica gel packaging layer from top to bottom, the cross section of the PDMS / MWCNTs conductive thin film with the high-amplitude corrugated structure and the cross section of the PDMS / MWCNTs conductive thin film with the low-amplitude corrugated structure are both in a wave shape, and the wave length of the wave shape of the PDMS / MWCNTs conductive thin film with the high-amplitude corrugated structure is the same as that of the wave shape of the PDMS / MWCNTs conductive thin film with the low-amplitude corrugated structure. And the wave height of the wave shape of the PDMS / MWCNTs conductive thin film with the high-amplitude corrugated structure is higher than that of the wave shape of the PDMS / MWCNTs conductive thin film with the low-amplitude corrugated structure. The flexible resistance type pressure sensor realizes high linearity and good sensitivity in a wide pressure range, has excellent mechanical stability, rapid responsiveness and good durability, and has great potential in the fields of human wearable health monitoring, motion detection and the like.

The invention relates to a flexible aqueous binder for a lithium battery negative electrode and a preparation method thereof. The preparation method comprises the following steps: firstly, preparing a flexible polyurethane prepolymer containing vinyl by taking hydroxyl-terminated polybutadiene, isocyanate and hydroxyl acrylate as main raw materials; vinyl-containing compounds such as water-soluble acrylic acid (salt) or acrylamide, oil-soluble acrylic ester or acrylonitrile and the like are used as monomers and are combined with a flexible polyurethane prepolymer to prepare the negative water-based binder with flexible cross-linking points through free radical polymerization. The aqueous binder prepared by the technical method provided by the invention can realize point-to-point and point-to-line bonding modes with a pole piece active substance on a microstructure, so that the bonding strength of the active layer material and a copper foil is improved on the premise of not influencing the electrolyte resistance of the binder; and the flexibility of the negative pole piece and the subsequent processing stability are obviously improved.

The invention relates to a laser drilling method for a thin copper HDI circuit board. The laser drilling method comprises the following steps that a circuit board to be machined is positioned and installed on a machining station of laser machining equipment; a first section of laser drilling is carried out, a first laser parameter is adopted, uncovering drilling is carried out on a preset machining area of the outer copper foil layer, and an initial hole structure is formed; performing second-section laser drilling, namely performing compensation drilling on the dielectric layer exposed at the bottom of the initial hole structure by adopting a second laser parameter of which the energy is lower than that of the first laser parameter to form a transition hole structure; and in the third section of laser drilling, a third laser parameter with energy lower than that of the second laser parameter is adopted, the bottom of the transition hole structure is trimmed, and a final hole channel is formed. According to the method, drilling is conducted in three sections, namely the first section of uncovering drilling, the second section of compensation drilling and the third section of finishing treatment. Therefore, the bottom cushion copper cannot absorb a large amount of heat in a short time, the base material layer below the bottom cushion copper can be protected from being burnt, and the product quality is improved.

The invention relates to a cooling structure for an ultraprecise linear motor and belongs to the technical field of linear motors. The cooling structure solves the problem of proneness to heat exchange with environment caused by high side temperature of two-side surface-mounted cooling structures of existing linear motors. The cooling structure comprises a winding supporting portion, a winding and a heat conductive portion, wherein the winding is fixed on the surface of the winding supporting portion, the heat conductive portion is arranged on the surface on the outer side and fixedly connected with the winding supporting portion, the heat conductive portion is a copper foil ring which fits the outer profile of the winding and is sleeved and fixed on the surface on the outer side of the winding, or the heat conductive portion is a copper foil heat conductive ring formed by arraying multiple copper foil sections in a dispersed manner, the copper coil heat conductive ring fits the outer profile of the winding, and each copper coil section is fixed on the surface on the outer side of the winding. The cooling structure for the ultraprecise linear motor is suitable for cooling of linear motors.

The invention provides a current collector, a pole piece, a secondary battery, an electric device, a copper foil and a preparation method of the copper foil. The current collector comprises a copper foil, the average particle size of crystal grains in the copper foil is 50-400 nm, and based on the total number of the crystal grains in the copper foil, the number ratio of the crystal grains of the nano twin crystals is larger than or equal to 60%. Under the combined action of the high-proportion nano twin crystal structure and the small grain size, the mechanical strength of the current collector is improved while the high plasticity of the current collector is maintained, and a material basis is provided for further improvement of the energy density and the safety of the battery.

The embodiment of the invention relates to the technical field of electrolytic copper foil testing, and particularly discloses a continuous testing method and system for warping of an electrolytic copper foil. The method comprises the following steps: periodically cutting an electrolytic copper foil sample; adjusting a test environment, and carrying out leveling positioning and reference calibration on the electrolytic copper foil sample; performing three-dimensional panoramic scanning and multi-point scanning supplement on the electrolytic copper foil sample; reconstructing a three-dimensional surface model, carrying out reference comparison, and calculating a plurality of warping key indexes; and performing qualification judgment and trend analysis on the plurality of warping key indexes, generating a warping test report, and performing feedback control of a continuous test. According to the method, the defect evolution rule is visually presented by automatically generating the three-dimensional surface diagram and the distribution curve visual report; the electroplating parameters are dynamically adjusted by triggering the process feedback control module, a test-analysis-regulation closed loop is formed, the warping degradation trend is inhibited from the source, and the product yield and the production continuity are improved.

The invention discloses a double-sided semi-embedded packaging substrate and a processing method thereof, and the processing method comprises the steps: carrying out the N times of double-sided circuit manufacturing and the N-1 times of double-sided layer adding of a multi-layer substrate alternately, and obtaining an operation board with two groups of symmetrical circuit structures; the circuit structure is provided with an outer circuit layer and (N-1) inner circuit layers which are communicated with each other, and the inner circuit layer located on the innermost side is provided with a bonding pad. Performing laser groove burning on the working board, and processing a blind groove which is provided with an opening at the outer circuit layer and takes the other inner circuit layer adjacent to the innermost inner circuit layer as the groove bottom locally on each group of circuit structure; removing the copper foil on the bottom of the blind groove; the bonding pads are completely exposed in the blind grooves corresponding to the bonding pads, the blind grooves in the two sets of circuit structures are communicated, and a through groove structure is obtained; and cleaning the surface of the bonding pad to obtain the double-sided semi-embedded packaging substrate. The processing method is simple and reasonable, the processing cost is low, the processing efficiency is high, and the reliability of the obtained double-sided semi-embedded packaging substrate is very high.

The invention discloses an online composite coating system for an ultrathin copper foil and a modified resin film, and relates to the field of composite coating. The unwinding pretreatment module accurately controls tension and speed of a copper foil and a resin film and cleans and activates the copper foil; the coating liquid preparation and supply module adopts a neural network and other liquid control performance and conveying; the precision coating module controls film thickness by combining a bionic runner coating head with temperature; the composite pressing module intelligently controls a temperature roller and performs gradient cooling; the on-line detection and feedback control module carries out multi-modal detection and fusion data high-speed linkage adjustment on each module. Parameters of the ultrathin copper foil and modified resin film composite coating link are accurately controlled, defects are reduced, the film layer quality and adhesive force are improved, the system environment adaptability and stability are enhanced, the production efficiency and the product percent of pass are improved, and the cost is reduced.

The invention provides a method for reducing electrolyte impurities based on copper foil production equipment, which comprises the following steps: identifying a pressure fluctuation abnormal region from a pressure time-frequency distribution map, taking the pressure fluctuation abnormal region as the input of a pre-constructed high-deposition region distribution model, outputting to obtain the position distribution of the high-deposition region, and determining potential high-risk nodes of impurity deposition in a pipeline; according to the determined potential high-risk node of impurity deposition in the pipeline, a filtering device is deployed at the potential high-risk node of impurity deposition, impurity particle size separation is carried out through a multi-stage filtering structure arranged in the filtering device, separated impurities with different particle sizes are directionally collected, and impurity data are obtained.

The invention relates to the technical field of image enhancement, in particular to a surface process defect detection method and system for copper foil production, and the method comprises the steps: collecting a copper foil image in a production process; obtaining each image block in the copper foil image; performing edge detection on the copper foil image to obtain each edge line in the copper foil image; determining a texture feature coefficient of each image block, constructing an illumination contrast coefficient of each image block, correcting a standard deviation parameter in a Gaussian filter, and performing image enhancement on each image block by using the Gaussian filter after parameter correction and a local Retinex algorithm; and carrying out surface defect detection on the copper foil through the enhanced copper foil image. Therefore, the precision of copper foil surface process defect detection is improved.

The invention discloses a negative electrode interface modification material, a negative electrode plate, a positive electrode interface functional layer, a positive electrode plate, a solid-state battery and a power utilization device, and relates to the technical field of batteries, the negative electrode interface modification material comprises a first polymer matrix, a reinforcing filler, a conductive agent and a lithium salt, the modulus of the reinforcing filler is greater than 50 GPa. The tensile strength of the negative electrode interface modification material can be improved through the first polymer matrix, breakage of a negative electrode interface modification layer is reduced, interface impedance is reduced, meanwhile, the first polymer matrix can be matched with the expansion coefficient of a silicon-based material, and bulging of a negative electrode plate is reduced. The modulus of the reinforcing filler is greater than 50GPa, so that the modulus of the negative electrode interface modification layer can be improved, the expansion of the silicon-based active material is further inhibited, the conductive agent can relieve the problem that the flexible substrate interface of the copper foil and the negative electrode interface modification layer possibly causes unsmooth electron transmission, and the lithium salt can improve the ion conduction capability and reduce the interface impedance.

The invention discloses a composite copper foil current collector and a preparation method thereof, a negative electrode, a lithium ion battery and electric equipment, and belongs to the technical field of batteries. The composite copper foil current collector comprises a polymer composite layer which comprises a polymer layer and a conductive material layer, the polymer layer has two opposite surfaces, and the conductive material layer is attached to at least one surface of the polymer layer; the polymer composite layer is provided with a first surface and a second surface which are opposite; and the copper layer is attached to the first surface and the second surface of the polymer composite layer. The conductive material is introduced to the surface of the polymer base material and then copper plating is performed, so that the binding force is stronger compared with the binding force between the polymer and copper; meanwhile, the conductive material is compounded on the polymer base material and replaces part of the polymer insulating material to form a coherent conductive network, so that the composite copper foil current collector has higher conductivity; volume expansion hardly occurs in the charging and discharging process, active substances are prevented from falling off from the current collector, and the cycling stability of the battery is improved.

The invention discloses a circuit board etching device and method, and the method comprises the steps: S1, providing a substrate, forming a laser activation micro-channel on the surface of the substrate, carrying out the plasma cleaning of the substrate, and pressing a gradient copper foil layer; s2, based on the thickness distribution data of the gradient copper foil layer, establishing an etching parameter prediction model, and generating a pressure-temperature dynamic regulation and control curve; s3, preparing a first-stage etching solution, carrying out spraying treatment, and etching the surface layer of the gradient copper foil layer under the assistance of ultrasonic waves to form a porous layer; s4, switching to a second-stage etching solution to directionally etch the porous layer of the gradient copper foil layer to a target residual thickness; s5, performing surface leveling treatment on the etched circuit board, and verifying the etching precision based on a high-frequency impedance test result; gradient copper layer dynamic parameter regulation and control are combined with a two-stage etching process, high-frequency impedance verification and surface leveling have a synergistic effect, signal transmission loss can be reduced, and the method is suitable for manufacturing high-frequency and high-speed circuit boards.

The invention relates to the technical field of batteries, in particular to a copper foil and a preparation method thereof, a current collector, a pole piece and an energy storage device. A connection degree gamma exists between the surface density of the copper foil and the size and arrangement of the through holes, the formula of the connection degree gamma is # imgabs0 #, and the value range of gamma is 1 + / -0.1; the copper foil is prepared through an electrolytic method, and an insulating acid-resistant coating is dispensed on the surface of a cathode of the electrolytic method to form an insulating acid-resistant layer; according to the electrolytic method, an active layer is formed on the surface of an anode by coating a mixed active substance solution and sintering, an inert substance is coated on the surface of the active layer opposite to a point coating position of a cathode to form an inert layer, and the range of the inert layer is smaller than 70% of the area of a pore region. The porous copper foil prepared by the method has a porous structure, the pore size distribution is more uniform, the size is consistent, meanwhile, the parts except the pores are dense copper layers, and the mechanical property of the material is good.

The invention relates to the technical field of data simulation processing, in particular to a thermal simulation method and system for a circuit board and a medium. The method comprises the following steps: acquiring circuit board layer data; extracting board layer material thermal resistance parameters of the circuit board layer data, wherein the board layer material thermal resistance parameters comprise copper foil thermal resistance parameters and insulating medium thermal resistance parameters; identifying the layered structure of the circuit board layer data, and recording as layered structure data; component layout characteristics are determined according to the layered structure data, interlayer thermal resistance distribution calculation is carried out on the board layer material thermal resistance parameters based on the component layout characteristics, and layered structure thermal resistance distribution data are generated. Through a data processing technology and an analogue simulation technology, heat transfer interaction analysis is carried out on the copper foil layer and the insulating medium layer of the circuit board, and the heat transfer direction and the heat accumulation effect of the circuit board are evaluated so as to construct a heat simulation model of the circuit board.

The invention provides a functional copper foil current collector and a preparation method and application thereof, the functional copper foil current collector comprises a polymer film, first copper layers and second copper layers, the first copper layers are arranged on two sides of the polymer film, and the second copper layers are arranged on the surfaces of the first copper layers; the residual stress of the functional copper foil current collector is not higher than 5.5 MPa; the thickness d1 of the first copper layer is 50-140 nm, and the grain size a1 of the first copper layer is 20-60 nm; the thickness d2 of the second copper layer ranges from 100 nm to 200 nm, and the grain size a2 of the second copper layer ranges from 100 nm to 200 nm. The functional copper foil current collector has relatively low residual stress, so that the functional copper foil current collector has relatively good mechanical property and stability, the service life of the functional copper foil current collector is prolonged, and the cycle performance and the safety performance of the battery are further improved.

The invention relates to a platform-based intelligent manufacturing MES system, and the system comprises a plan management module which is used for generating a production plan; the planning and scheduling module decomposes the production plan into specific operation tasks and generates an operation plan scheduling instruction; the document management module is responsible for managing and maintaining various documents involved in the production process; the operation management module converts an operation plan scheduling instruction of the planning and scheduling module into a specific production operation instruction; the automatic acquisition module acquires data of production equipment in real time and transmits the data to the plan management module in real time; the operation information module sends a control instruction to the automatic acquisition module, automatically acquires equipment working information, and feeds back the equipment working information acquired by the automatic acquisition module to the plan management module; and the material management module performs data interaction with the planning and scheduling module. Intelligent, automatic and fine management of the production process can be realized, and the system has important significance for improving the competitiveness of lithium battery copper foil production enterprises.

The invention discloses a substrate with a non-metallization step blind slot and a processing method thereof, and the processing method comprises the steps: providing a laminated plate, manufacturing an inner-layer circuit, an inner-layer target and a first window on an outer-layer copper foil of the laminated plate, and then arranging an insulation adding layer and a copper foil adding layer on the outer-layer copper foil in a laminated manner; a second window is manufactured on the copper foil added layer in the mode of grabbing the inner layer target for alignment; laser groove burning is carried out based on the second window and the first window in sequence, a first-order blind groove with the second window as a groove opening and the local part of the outer-layer copper foil as the groove bottom and a second-order blind groove with the first window as the groove opening and the local part of the inner-layer copper foil of the laminated plate as the groove bottom are manufactured, and the first-order blind groove and the second-order blind groove form a stepped blind groove together; and preparing an outer circuit on the copper foil added layer, and removing the bottoms of the first-order blind groove and the second-order blind groove to prepare a non-metallization step blind groove, thereby obtaining the substrate. The processing method is simple and reasonable, the processing cost is low, the obtained substrate is high in size precision and good in appearance quality, and the production requirements in the field of circuit boards are met.

The embodiment of the invention discloses a double-sided packaging structure, a power supply device and electronic equipment. The power devices are arranged on the two side plate surfaces of the PCB substrate of the double-face packaging structure, and the heat conduction piece is inserted into the PCB substrate and packaged to form a packaging body. The packaging body comprises a heat dissipation surface, and the heat dissipation surface is opposite to one side plate surface of the PCB substrate. The PCB substrate is provided with a via hole and a through hole which are connected through a copper foil, the via hole is at least connected with a power device arranged on the other side plate surface of the PCB substrate, the heat conduction piece is inserted into the through hole, and one end of the heat conduction piece extends to the heat dissipation surface of the packaging body. Through the arrangement, the power device on the non-heat-dissipation surface side can be led out through a low-heat-resistance heat dissipation path formed by the via hole, the copper foil, the through hole and the heat conduction piece in sequence, and the heat dissipation performance of the power device on the non-heat-dissipation surface side is effectively improved; meanwhile, based on the structural characteristics of the inserted heat conduction piece, the packaging width can be reduced, and the trend requirement of high-density layout is met.

The invention discloses a method for recovering a valuable material from a waste ternary lithium battery, which directly uses a lithium battery inner core as a roasting raw material, simplifies a pretreatment process flow, improves the overall recovery process efficiency, and performs low-temperature reduction roasting by using pyrolysis tail gas generated by pyrolysis of a battery material (the lithium battery inner core) to realize waste reutilization. The organic binder in the organic diaphragm and the positive electrode material can be effectively removed, meanwhile, metal elements in the positive electrode material can be reduced, high-valence metal oxide can be reduced into metal elementary substances, in the subsequent leaching process, use of a reducing agent can be avoided, the metal ion leaching rate in the subsequent water leaching and acid leaching process is increased, and the leaching efficiency is improved. Efficient separation and recovery of lithium, nickel, cobalt, manganese, copper foil, aluminum foil and graphite are realized, and maximization of economic benefits and environmental benefits is realized.

The invention relates to the field of copper-clad plates, and discloses a low-dielectric-constant high-performance copper-clad plate and a preparation method thereof.The preparation method comprises the specific steps that epoxy resin, phenolic resin, polyphenyl ether modified resin, modified nano silicon dioxide and the like are taken and mixed to obtain a resin glue solution; impregnating glass fabric in the resin glue solution to obtain a prepreg; laminating prepregs, and covering copper foil for hot pressing; the polyphenyl ether modified resin comprises epoxy resin, diallyl cyanate and fluorine-containing polyphenyl ether resin prepared by reaction of polyphenyl ether, bisphenol AF and benzoyl peroxide; the modified nano silicon dioxide is prepared by reacting allyl glycidyl ether, vinyltriethoxysilane and phenyltris (dimethylsiloxane) silane, then grafting with a phosphorus-containing intermediate to prepare a modified additive, and grafting with nano silicon dioxide, and the phosphorus-containing intermediate is prepared by reacting phenylphosphoryl dichloride and eugenol. The copper-clad plate with high flame retardance, high peel strength, heat resistance and low dielectric constant is prepared.

The invention discloses a reinforced composite PCB and a preparation method thereof, and belongs to the technical field of PCB preparation. The preparation method of the reinforced composite PCB comprises the following steps: step 1, processing an inner-layer core board to obtain a preprocessed inner-layer core board; 2, cutting, drilling and activating the modified composite film to obtain a treated modified composite film; and 3, sequentially carrying out stacking, hot pressing treatment, pressure relief, cooling, drilling, hole metallization treatment, outer layer pattern transfer, pattern electroplating, outer layer etching, resistance welding, surface treatment, molding and testing on a copper foil, a prepreg, the pretreated inner layer core plate, the prepreg, the treated modified composite film, the prepreg, the pretreated inner layer core plate, the prepreg and the copper foil. And the composite PCB is obtained. The circuit board prepared by the method has excellent thermal stability and mechanical properties.

The invention discloses a method for preparing antioxidant MXene through electrochemical stripping, and belongs to the technical field of two-dimensional nano materials. Comprising the following steps: (1) centrifuging a Ti < 3 > C < 2 > T < x > MXene dispersion liquid to obtain a MXene wet solid, and coating the MXene wet solid on two sides of a copper foil; (2) the copper foil coated with the MXene wet solid serves as a cathode, and the cathode and the anode are placed in an electrolytic tank together; and (3) applying a constant voltage for electrolysis, collecting sediments in an electrolytic tank, centrifuging, washing, carrying out suction filtration, and drying to obtain the e-MXene film. The e-MXene prepared by the invention has excellent oxidation resistance and adjustable infrared emissivity, and can adapt to infrared camouflage application under damp and hot conditions.

The invention discloses a composite multifunctional lithium metal negative electrode and a preparation method and application thereof, and relates to the technical field of lithium ion batteries. The invention relates to a preparation method of a composite multifunctional lithium metal negative electrode, which comprises the following steps: adding lithium-loving nanoparticles into an N-methyl pyrrolidone solution, fully dispersing, coating on a copper foil, and drying to obtain a lithium-loving nanoparticle layer; cleaning and preheating the surface of the lithium negative electrode; transferring the lithium-loving nanoparticle layer to the lithium foil; evaporating the lithium foil, and depositing on the surface of the lithium foil substrate to form a thin film; and cooling and curing the evaporated lithium foil to obtain the composite multifunctional lithium metal negative electrode. According to the invention, the problems of dendritic crystal growth caused by uneven lithium deposition, irreversible loss caused by interface side reaction, insufficient structural performance of the existing SEI layer and weak material interface bonding force are solved.

The invention provides an electrolytic copper foil which is at least provided with a low-roughness surface, copper nodules on the low-roughness surface are rod-shaped protrusions and / or granular protrusions, the distance between every two adjacent protrusions ranges from 10 nm to 650 nm, the height of the copper nodules of the rod-shaped protrusions ranges from 300 nm to 800 nm, and the height of the copper nodules of the granular protrusions ranges from 80 nm to 250 nm. And the number of the rod-shaped bulge copper nodules and / or the granular bulges is 50-150 in every 25 mu m < 2 > of the area of the low-roughness surface. The invention further provides a preparation method and application of the electrolytic copper foil. The electrolytic copper foil provided by the invention has a low-roughness surface, so that the signal integrity of the copper foil substrate is improved, the problem of large signal transmission loss in the prior art is solved, the peeling strength between the copper foil and the substrate is improved, and the defect of insufficient peeling strength in the prior art is overcome.