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5079 results about "Copper foil" patented technology

Printed wiring board having highly reliably via hole and process for forming via hole

Disclosed are a printed wiring board having micro-via holes highly reliable for conduction and a method of making the micro-via hole by providing a coating or sheet of an organic substance containing 3 to 97% by volume of at least one selected from a metal compound powder, a carbon powder or a metal powder having a melting point of at least 900° C. and a bond energy of at least 300 kJ/mol on a copper foil as an outermost layer of a copper-clad laminate having at least two copper layers, or providing a coating or sheet of the same after oxidizing a copper foil as an outermost layer, irradiating the coating or sheet with a carbon dioxide gas laser at an output of 20 to 60 mJ/pulse, thereby removing a micro-via-hole-forming portion of at least the copper foil as the outermost layer, then irradiating micro-via-hole-forming portions of the remaining layers with a carbon dioxide gas laser at an output of 5 to 35 mJ/pulse to make a micro-via hole which does not penetrate through the copper foil in a bottom of the micro-via hole, and electrically connecting the copper foil as the outermost layer and the copper foil in the bottom of the micro-via hole with a metal plating or an electrically conductive coating composition.
Owner:MITSUBISHI GAS CHEM CO INC

Composite material, high-frequency circuit substrate therefrom and manufacture method thereof

The invention relates to a composite material, a high-frequency circuit substrate therefrom and a manufacture method thereof. The composite material comprises thermoset mixture, glass fiber cloth, power filler, a fire retardant and a curing initiator, wherein the thermoset mixture comprises more than one kind of vinyl liquid resin and polyphenyl ether resin; the molecular weight of the vinyl liquid resin is below 10000, and the vinyl liquid resin is provided with a polar functional group; the molecular weight of the polyphenyl ether resin is less than 5000, and the molecular tail end of the polyphenyl ether resin is provided with unsaturated double bonds. The high-frequency circuit substrate manufactured with the composite material comprises multiple layers of semi-solidified sheets and copper foils, wherein the semi-solidified sheets are mutually overlaid, and the copper foils are respectively pressed on two sides. The composite material disclosed by the invention causes the semi-solidified sheets to be easily manufactured and have high adhesive bonding force with the copper foils. The high-frequency circuit substrate manufactured by the material has the advantages of low dielectric constant, low dielectric loss angle tangent, good heat resistance and simple technical operation. Thus, the composite material disclosed by the invention is suitable for manufacturing the circuit substrate of the high-frequency electronic equipment.
Owner:GUANGDONG SHENGYI SCI TECH

High-performance lithium ion battery and preparation process thereof

The invention relates to a high-performance lithium ion battery. According to the battery, an electrode material is subjected to a nano-composite treatment of grapheme and polyaniline; an anode current collector comprises aluminium foil; a cathode current collector comprises copper foil; a conductive agent comprises superconducting carbon black, conductive graphite or acetylene black; a binding agent comprises styrene butadiene rubber, carboxymethylcellulose sodium, polytetrafluoroethylene, polyvinylidene difluoride or hydroxy propyl methylcellulose; a electrolyte comprises liquid electrolyte or a polymer electrolyte containing a conductive polymer, a nano-material, or a mixture comprising the conductive polymer and the nano-material; a membrane is subjected to a high temperature resistant insulation coating treatment, or directly adopts a high temperature resistant insulating porous polymer matrix. A preparation process for the high-performance lithium ion battery comprises: material preparing, coating, drying, rolling, slicing, coil winding or sheet stacking, assembling, liquid injecting, formation and capacity distributing. The lithium ion battery provided by the present invention has characteristics of excellent charge and discharge performance at the large rate, small capacity fading, good heat stability, good safety performance and long electrode cycle life, and can be widely applicable for the fields of electric bicycles, electric motorcycles, electric cars and the like.
Owner:LUNAN RES INST OF COAL CHEM

Noise-suppressing wiring-member and printed wiring board

The present invention relates to a wiring member including: a copper foil layer having a smooth surface with a surface roughness Rz of 2 μm or less; a noise suppressing layer containing a metallic material or a conductive ceramic and having a thickness of 5 to 200 nm; and an insulating resin layer provided between the smooth surface of the copper foil layer and the noise suppressing layer, and also relates to a printed wiring board equipped with the wiring member. Moreover, the present invention relates to a noise suppressing structure including: a first conductive layer; a second conductive layer; a noise suppressing layer provided between the first conductive layer and the second conductive layer, the noise suppressing layer being to be electromagnetically-coupled with the first conductive layer, the noise suppressing layer comprising a metallic material or a conductive ceramic, and the noise suppressing layer having a thickness of 5 to 300 nm; a first insulating layer provided between the first conductive layer and the noise suppressing layer; and a second insulating layer provided between the second conductive layer and the noise suppressing layer; wherein the noise suppressing structure has: a region (I) in which the noise suppressing layer and the first conductive layer face each other; and a region (II) in which the noise suppressing layer and the first conductive layer do not face each other but the noise suppressing layer and the second conductive layer face each other, the regions (I) and (II) neighboring each other.
Owner:SHIN-ETSU POLYMER CO LTD

Development method of flexible pressure-sensitive element based on carbon nano-tube filled high polymer composite material

The invention relates to a development method of a flexible pressure-sensitive element based on a carbon nano-tube filled high polymer composite material, which belongs to the technical field of sensors. The method comprises the following steps of: 1. pressure-sensitive material preparation: dispersing carbon nano-tubes into polydimethylsiloxane by utilizing ultrasonic vibration and mechanical stirring methods, and preparing a thin and flexible pressure-sensitive material by using tetraethoxysilane as a crosslinking agent and dibutyltin dilaurate as a catalyst with a spin coating method; 2. pressure-sensitive element packaging, wherein a two-stage sandwich structure is adopted, the first-stage sandwich structure comprises two layers of packaging films and the pressure-sensitive material positioned in the middle; and in the second-stage sandwich structure, each layer of packaging film comprises two layers of polyimide films as well as a copper foil electrode and a lead which are embedded in the two layers of polyimide films. The pressure-sensitive element developed by the invention has good flexibility, high precision, thin thickness, simple process and low cost and is applicable to the fields of pressure monitoring of structures between narrow curved surface layers in the fields of military industry and civil use and artificial electronic skin development and the like.
Owner:NORTHEASTERN UNIV

Halogen-free low dielectric resin composition and prepreg and copper clad laminate made of same

The invention relates to a halogen-free low dielectric resin composition and a prepreg and copper clad laminate made of the same. The halogen-free low dielectric resin composition comprises the following components in part by weight of organic solid content: 5 to 90 parts by weight of epoxidized polybutadiene resin, 10 to 90 parts by weight of benzoxazine resin, 10 to 90 parts by weight of epoxy resin, 1 to 50 parts by weight of curing agent, 10 to 50 parts by weight of organic flame retardant, 0.001 to 1 part by weight of curing accelerator, 0.1 to 10 parts by weight of initiator and 10 to 100 parts by weight of fillings. Due to the adoption of the epoxidized polybutadiene in the halogen-free low dielectric resin composition disclosed by the invention, not only are the defects of polybutadiene improved, but also the advantages on the aspects of dielectric and flexibility are well kept and the adhesion force between the halogen-free low dielectric resin composition and a copper foil is improved; and the prepreg and copper clad laminate for a printed circuit board, which is made of the resin composition, has excellent dielectric performance, good heat resistance and high glass transition temperature and the requirements on the high frequency of transmission of an electronic signal and high speed of information processing in the industry of the printed circuit copper clad laminate can be met.
Owner:GUANGDONG SHENGYI SCI TECH
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