3101 results about "Copper foil" patented technology

The invention provides a circuit board electrical performance test and diagnosis method, which comprises the following steps of: constructing a structured process-electrical data set by collecting process parameters such as etching time, pressing temperature, drilling precision, copper foil thickness and the like and electrical test indexes such as impedance deviation, leakage current, signal attenuation and the like; screening key process variables by adopting mutual information analysis and a maximum correlation-minimum redundancy criterion; through modeling of a three-layer causal diagram and a structural equation, quantitative influence evaluation of process parameters on electrical performance and fault types is realized; when a fault is detected, the system can automatically perform reverse reasoning, identify a main manufacturing deviation item and generate attribution diagnosis and process optimization suggestions, so that the accuracy of fault diagnosis and the pertinence of process adjustment are improved, and the fault occurrence rate is reduced and the product quality is improved.

The invention relates to a cooling structure for an ultraprecise linear motor and belongs to the technical field of linear motors. The cooling structure solves the problem of proneness to heat exchange with environment caused by high side temperature of two-side surface-mounted cooling structures of existing linear motors. The cooling structure comprises a winding supporting portion, a winding and a heat conductive portion, wherein the winding is fixed on the surface of the winding supporting portion, the heat conductive portion is arranged on the surface on the outer side and fixedly connected with the winding supporting portion, the heat conductive portion is a copper foil ring which fits the outer profile of the winding and is sleeved and fixed on the surface on the outer side of the winding, or the heat conductive portion is a copper foil heat conductive ring formed by arraying multiple copper foil sections in a dispersed manner, the copper coil heat conductive ring fits the outer profile of the winding, and each copper coil section is fixed on the surface on the outer side of the winding. The cooling structure for the ultraprecise linear motor is suitable for cooling of linear motors.

The embodiment of the invention relates to the technical field of electrolytic copper foil testing, and particularly discloses a continuous testing method and system for warping of an electrolytic copper foil. The method comprises the following steps: periodically cutting an electrolytic copper foil sample; adjusting a test environment, and carrying out leveling positioning and reference calibration on the electrolytic copper foil sample; performing three-dimensional panoramic scanning and multi-point scanning supplement on the electrolytic copper foil sample; reconstructing a three-dimensional surface model, carrying out reference comparison, and calculating a plurality of warping key indexes; and performing qualification judgment and trend analysis on the plurality of warping key indexes, generating a warping test report, and performing feedback control of a continuous test. According to the method, the defect evolution rule is visually presented by automatically generating the three-dimensional surface diagram and the distribution curve visual report; the electroplating parameters are dynamically adjusted by triggering the process feedback control module, a test-analysis-regulation closed loop is formed, the warping degradation trend is inhibited from the source, and the product yield and the production continuity are improved.

The invention discloses a negative electrode interface modification material, a negative electrode plate, a positive electrode interface functional layer, a positive electrode plate, a solid-state battery and a power utilization device, and relates to the technical field of batteries, the negative electrode interface modification material comprises a first polymer matrix, a reinforcing filler, a conductive agent and a lithium salt, the modulus of the reinforcing filler is greater than 50 GPa. The tensile strength of the negative electrode interface modification material can be improved through the first polymer matrix, breakage of a negative electrode interface modification layer is reduced, interface impedance is reduced, meanwhile, the first polymer matrix can be matched with the expansion coefficient of a silicon-based material, and bulging of a negative electrode plate is reduced. The modulus of the reinforcing filler is greater than 50GPa, so that the modulus of the negative electrode interface modification layer can be improved, the expansion of the silicon-based active material is further inhibited, the conductive agent can relieve the problem that the flexible substrate interface of the copper foil and the negative electrode interface modification layer possibly causes unsmooth electron transmission, and the lithium salt can improve the ion conduction capability and reduce the interface impedance.

The invention discloses a reinforced composite PCB and a preparation method thereof, and belongs to the technical field of PCB preparation. The preparation method of the reinforced composite PCB comprises the following steps: step 1, processing an inner-layer core board to obtain a preprocessed inner-layer core board; 2, cutting, drilling and activating the modified composite film to obtain a treated modified composite film; and 3, sequentially carrying out stacking, hot pressing treatment, pressure relief, cooling, drilling, hole metallization treatment, outer layer pattern transfer, pattern electroplating, outer layer etching, resistance welding, surface treatment, molding and testing on a copper foil, a prepreg, the pretreated inner layer core plate, the prepreg, the treated modified composite film, the prepreg, the pretreated inner layer core plate, the prepreg and the copper foil. And the composite PCB is obtained. The circuit board prepared by the method has excellent thermal stability and mechanical properties.

The invention relates to the technical field of new material detection, in particular to a copper foil coating content detection method. The method comprises the following steps: preparing a plurality of mixed standard solutions; the mixed standard solution comprises copper ions and at least one to-be-detected element ion; in the plurality of mixed standard solutions, the copper ion concentrations are the same and are first preset concentration values; measuring a plurality of mixed standard solutions, and establishing a standard curve between a theoretical value and a measured value of the ion concentration of each to-be-measured element; dissolving a plating layer on the surface of the to-be-detected copper foil by using nitric acid, and filtering to obtain a to-be-detected sample solution; adding copper salt into the to-be-detected sample solution to obtain a to-be-detected analysis solution; measuring the to-be-measured analysis solution to obtain the measurement concentration of each to-be-measured element ion; according to the measured concentration of each to-be-measured element ion and the corresponding standard curve, the corrected content of each to-be-measured element ion is obtained. The problem that an existing copper foil coating content detection method is low in detection accuracy is solved.

The invention discloses a copper foil production system and method.The copper foil production system comprises an electrolytic bath and a cathode roller arranged in the electrolytic bath and further comprises a partition anode module, a partition cooling module, a detection module and a control system; the partitioned anode module comprises a plurality of anode assemblies which are arranged along the axial direction of the cathode roller, and an electric control module which is respectively connected with each anode assembly; the subarea cooling module comprises a plurality of cooling structures which are arranged in the cathode roller and are in one-to-one correspondence with the anode subareas, and a cooling control module which is respectively connected with each cooling structure; the control system is electrically connected with the electric control module, the cooling control module and the detection module. According to the method, differentiated cooperative control of partition current and cooling can be intelligently executed according to the source and size of supersaturation degree deviation, so that rapid directional compensation is performed at any axial position, and the defects of response lag and extensive regulation and control in a traditional mode are effectively overcome.

The invention relates to a high-precision ultra-long size copper foil die cutting assembly and a production process thereof, the copper foil assembly sequentially comprises a surface insulation film layer, a copper foil layer and a bottom insulation film layer from top to bottom, and the copper foil layer in the copper foil assembly is integrally formed through three times of die cutting of three continuous die cutting roller sets and waste discharging; and a reinforcing insulating film is attached to the outer surface area of the bottom insulating film layer corresponding to the outer end part of the thin and long copper foil strip. The rotary die-cutting machine is adopted for production, the ultra-long copper foil die-cutting assembly (FDC) is segmented according to a specific rule, then a small-size die and a matched splicing type production process are developed and designed, the machining period and machining difficulty of the die can be effectively reduced, the die development and manufacturing cost is reduced, and the production efficiency is improved. Meanwhile, the die damage risk is reduced, and machine adjusting difficulty is lowered; the copper foil material used as the conduction layer in the assembly is expensive and needs precise die cutting, and the staggered layout mode is adopted, so that the waste material area is reduced, and the material utilization rate is improved.

The invention provides a preparation method of a porous copper foil with a regular polygonal hole array, which comprises the following steps of: grinding and polishing a titanium plate until the titanium plate is matte, punching holes with the regular polygonal hole array in the titanium plate by laser, finely trimming vertex angles of the regular polygonal holes by laser, and polishing and grinding the titanium plate to obtain the porous copper foil with the regular polygonal hole array. The method comprises the following steps: preparing a titanium plate, cleaning with pure water and alcohol to obtain a clean titanium plate, preparing a copper sulfate electrolyte, adding a proper amount of a brightener, a wetting agent and a high resistance agent into the electrolyte, mixing, pouring the mixed solution into an electrolytic bath, putting the clean titanium plate and a carbon plate into the electrolytic bath, and carrying out electrolytic foil generation by taking the titanium plate as a cathode and the carbon plate as an anode; and after foil generation is finished, the copper foil is stripped from the surface of the titanium plate, and the porous copper foil with the regular polygon holes is obtained. According to the method, the holes of the titanium plate are the regular polygon holes, and the vertex angles of the regular polygon holes are finely trimmed, so that the copper foil of the electrolytic raw foil is not easy to adhere to the titanium plate during stripping, and the production yield of the copper foil is further improved.

The invention discloses a preparation method of a 3-micron ultrathin lithium battery copper foil. The preparation method comprises the following steps: preparing a copper sulfate electrolyte; a wetting agent, a brightening agent and a high resistance agent are added into the copper sulfate electrolyte, the high resistance agent is at least one of thiazolidinethione, polyethyleneimine, 2-mercaptobenzimidazole and ethylene thiourea, and a mixed additive is formed; polishing and grinding a cathode roller by adopting a flying wing wheel, and carrying out electrolytic treatment on the mixed additive through the polished and ground cathode roller to obtain a first-stage copper foil; and the first-stage copper foil is placed in a nitrogen furnace to be subjected to annealing treatment, and the 3-micron ultrathin lithium battery copper foil is obtained. The invention aims to solve the technical problems that in the prior art, edge tearing, foil breaking, warping, dark appearance oxidation and the like are prone to occurring in the production process of the ultrathin copper foil, the tensile strength and the ductility are difficult to consider at the same time, and stable mass production of the 3-micron copper foil is still difficult.

The invention relates to the technical field of industrial data processing, and discloses a copper foil production monitoring method and system based on data storage optimization, and the method comprises the following steps: carrying out the periodic aggregation of high-frequency data when a production process is in a steady state, and carrying out the calculation of a newly recognized production process event when the production process is monitored to deviate from the steady state. Whether causal association exists or not is judged by calculating the correlation between the new event and the current activity event in time and physical dimensions, and if the association exists, a chained event ID inheriting a precursor event identifier is generated for the new event; if the event is an independent event, a brand-new root event ID is generated, context data before the event occurs is extracted in a backtracking mode, and the generated event ID is marked on a data set in a unified mode in combination with real-time data during the event occurrence period for permanent storage. According to the method, the storage configuration is obviously optimized, and the efficiency of fault causal chain tracing is improved through the structured chain ID.

The invention relates to the technical field of special cables, in particular to an anti-electromagnetic interference double-shielding signal cable for precise instruments, which comprises conductor units, insulating layers, wire pair shielding layers, a filling buffer layer, a self-adaptive conductive layer, an inner main shielding layer, a bonding layer, an outer main shielding layer and a sheath layer, through combination of the graphene composite conductor and the low-dielectric insulating layer, 10GHz signal attenuation is smaller than or equal to 0.5 dB / m, signal transmission errors are greatly reduced, through cooperation of the 3D braided shielding layer and the filling buffer structure, the bending fatigue life of the signal cable is larger than or equal to 200,000 times, through self-repairing design of the liquid metal microcapsules, the shielding effectiveness of a damaged part is recovered, and the service life of the signal cable is prolonged. Protrusions are arranged on the inner layer, form mechanical occlusion with a microscopic rough surface of a copper foil composite layer on the inner main shielding layer, and are matched with a plurality of pits in the surface of the outer layer to form point-surface composite contact with a 3D woven silver-plated copper wire layer of the outer main shielding layer, so that the peel strength of the inner main shielding layer and the outer main shielding layer is greatly improved.

The invention relates to the technical field of electrolytic copper foil processing, and particularly provides a method for reducing the rough surface roughness of an HVLP copper foil by using a composite additive, which comprises the following steps: step (1): enabling the composite additive to flow into a high-level tank through an additive flow pump, uniformly mixing the composite additive with a copper sulfate electrolyte, and enabling the mixture to flow into a crude foil machine; step (2), then adjusting process parameters of a crude foil machine, including current and line speed of a cathode roller; (3) foil generation and foil drawing are carried out; the composite additive comprises one or two of gelatin and collagen. One or more composite additives composed of gelatin, collagen, sodium dithiodipropane sulfonate, N, N-dimethyl-dithioformamide sodium propanesulfonate, 3-sulfydryl-1-sodium propane sulfonate, hydroxyethyl cellulose and polyethylene glycol are added into the raw foil electrolyte, so that the copper electrodeposition reaction potential can be effectively changed; and uniform and compact copper crystallization peaks are obtained, the rough surface roughness of the raw foil is reduced, and the uniformity of a plating layer is improved.

The invention discloses a copper foil cutting and punching cooperative control method and equipment. The equipment comprises a continuous discharging device, a copper foil punching device, a cutting and pulling device and a cooperative control system. The continuous discharging device feeds materials at a constant speed, and a material storage assembly is arranged between discharging and punching to form a buffering section. The copper foil punching device is used for carrying out intermittent punching on the copper foil; the cutting and pulling device comprises a feeding assembly, a cutting assembly, a pneumatic pressing assembly and a pulling assembly and is used for conveying, clamping and cutting the copper foil, the pneumatic pressing assembly can push the remaining copper foil to a clamping position after cutting, and the copper foil is prevented from falling off; the cooperative control system is combined with a sensor detection signal to dynamically adjust the action rhythm of discharging, punching and cutting, and coordination and synchronization of multiple procedures are achieved.

The invention provides a preparation method of a copper-clad substrate and the copper-clad substrate. The preparation method comprises the following steps: providing a copper-clad substrate for forming an inner-layer core plate; the copper-clad substrate comprises a copper-clad plate base material and a copper foil arranged on the surface of the copper-clad plate base material; executing an interface modification process on the surface of the copper foil; forming a dry film photoetching film on the surface of the copper foil after interface modification; performing exposure and development processing on the dry film photoetching film to form a dry film photoetching film with a circuit pattern; and the dry film photoetching film is used as a mask to execute an etching process so as to form a circuit pattern on the copper-clad substrate, so that the technical effect of improving the wiring precision is realized.

The invention belongs to the technical field of sodium ion battery negative electrode material preparation, and particularly relates to an asphalt-based hard carbon material and a preparation method and application thereof, a negative electrode material and a preparation method thereof, and a sodium ion battery. In order to realize controllable preparation of high-value conversion, highly disordered and low-cost hard carbon of coal pitch, asphalt is used as a precursor material, modified asphalt is synthesized under the action of a solvent, a cross-linking agent and a catalyst, the hard carbon material is prepared through carbonization, and the hard carbon material is large in interlayer spacing and high in disordered degree and is accompanied with defects and closed pores, so that the high-value conversion, highly disordered and low-cost hard carbon is prepared. The preparation method is beneficial to reversible storage of sodium ions and improvement of the electrochemical performance of the sodium-ion battery, so that the sodium-ion battery is fully mixed with a conductive agent, an adhesive and deionized water to prepare slurry, the slurry is uniformly coated on a copper foil in a blade coating manner and is subjected to vacuum drying to prepare a negative electrode material, and the negative electrode material is matched with a corresponding counter electrode, electrolyte and a diaphragm to assemble the battery. The battery is low in cost, high in safety performance, relatively long in cycle life, high in rate capability and good in environmental sustainability.

The invention belongs to the technical field of lithium ion battery preparation, and discloses a negative pole piece containing a porous copper foil, a preparation method and a method for preparing a lithium ion battery by using the negative pole piece. The porous copper foil is prepared by adopting a composite etching-electrochemical deposition method, then the porous copper foil is subjected to surface modification, the surface and pores of the porous copper foil are uniformly coated with the electrode slurry, the prepared negative electrode containing the porous copper foil is applied to the lithium ion battery, the injection process of the electrolyte is optimized, and a gradient pressure regulation mode is adopted, so that the lithium ion battery is prepared. The electrolyte can rapidly and fully infiltrate the porous copper foil and the electrode material, and the ion conduction rate of the battery is improved, so that the rate capability and the cycle life of the battery are improved. The initial capacity of the obtained battery is higher than 170mAh / g, the cycle life can reach more than 1000 times, the capacity retention ratio is more than 80%, and the capacity retention ratio of rate capability (under 5C charge and discharge conditions) is more than 70%.

The invention provides a copper foil thickness analysis method and device. The copper foil thickness analysis method comprises the steps that tension values of all layer number positions and thickness measurement results of the corresponding layer number positions in the copper foil winding process are obtained; analyzing a deformation mechanism by combining the obtained interlayer relative displacement and torsion angle according to the compression deformation analysis result to obtain stress distribution mode data; compensating thickness measurement data based on the stress distribution mode data to obtain compensated thickness measurement data; setting a normal thickness range and an anomaly judgment threshold based on the compensated thickness measurement data, and determining a sensitivity identification threshold parameter of thickness anomaly detection; judging a thickness anomaly state according to the sensitivity identification threshold parameter of the thickness anomaly detection to obtain a thickness anomaly detection result; and in combination with the thickness anomaly detection result and historical winding process thickness measurement data, thickness anomaly detection combination parameters are determined.

The invention provides an electrochemical etching preparation method of a perforated battery copper foil, which comprises the following steps: firstly, pretreating the copper foil, then performing asymmetric bidirectional pulse etching in a specific electrolyte system by taking the copper foil as an anode and a platinum sheet as a cathode, and gradually decreasing the pulse interval time in a gradient manner in the etching process; and after etching is completed, immediately transferring into an ammonia water solution containing a sulfonated modified calixarene supramolecular corrosion inhibitor to stop the reaction, and drying and annealing to obtain the sulfonated modified calixarene supramolecular corrosion inhibitor. By dynamically regulating and controlling the pulse interval time and cooperating with the electrolyte with specific components and the efficient supramolecular corrosion inhibitor, the uniformity and controllability of the etching process are remarkably improved, and the problems that in the prior art, hole distribution is not uniform, excessive etching is likely to happen, the hole shape is irregular, and efficiency is low are solved; the prepared copper foil has the characteristics of uniform and consistent pore structure, smooth pore wall and excellent mechanical property and conductivity, and the application performance and reliability of the copper foil in a high-end lithium ion battery current collector are greatly improved.

The invention relates to the technical field of FPC (Flexible Printed Circuit) laminated structure optimization, in particular to a module FPC laminated structure optimization system based on signal integrity, which comprises a laminated parameter sensitivity extraction module used for defining the thickness of a dielectric layer, the thickness of a copper foil and a dielectric constant as closed interval values with upper and lower boundaries according to FPC design specifications. According to the method, the accumulated deviation area and the normalized confidence score are obtained in combination with integral operation, conversion from a frequency domain to a time domain and from qualitative analysis to quantitative evaluation is achieved, tiny flaws of impedance continuity are captured, inferior paths are screened based on the confidence score, and a physical junction area is positioned. The geometric gravity center of the deviation area is calculated to be matched with the slope and the length of the gradient line, a smoothly-transited geometric figure is constructed, structural compensation can be achieved in areas where impedance is prone to sudden change such as a reinforcing plate junction and covering film pressing, and signal reflection caused by physical sudden change of a stacked structure is eliminated.

The application relates to the field of wire sleeving machines, in particular to a wire sleeving machine adopting a new copper foil wrapping mechanism, which can realize the original basic functions and is provided with two structures of a film pasting mechanism and a tape pasting mechanism, for example, a tape guiding assembly is arranged in a posture of sending out the tape to the glue wrapping guiding assembly, a copper foil guiding assembly is arranged in a posture of sending out the copper foil to the surface of the tape, and a film wrapping guiding assembly is arranged in a posture of sending out the film to the bottom surface of the tape, so that the finished copper foil is manufactured.

The anti-static ton barrel comprises a barrel body of a multi-layer structure, the multi-layer structure sequentially comprises an inner layer, a functional layer and an outer layer from inside to outside, and the thickness of the inner layer is 1-2 mm; the functional layer is a composite conductive layer taking polyethylene as a matrix, and double conductive networks are integrated in the functional layer; the dual-conductive network comprises a conductive network and conductive master batches, and the dual-conductive network can always maintain operation of at least one conductive mechanism; the outer layer comprises a layer structure, the tail end of the contact penetrates through the outer layer to be connected with the functional layer, the contact is electrically connected with a collector ring through a flexible copper foil or a braided wire, and the collector ring is connected with a grounding port outside the barrel body through a shielding wire; and it is ensured that the ton barrel can adapt to various working conditions when transporting high-purity electronic chemicals or pharmaceuticals, rapid static dissipation is continuously provided, and therefore the operation safety and efficiency are improved.

The utility model belongs to the technical field of electroacoustic conversion, and relates to a sounding monomer and an electronic device, the sounding monomer comprises a housing, and a vibration system and a magnetic circuit system which are fixedly connected to the housing; the magnetic circuit system comprises a magnetic conductive yoke, a common magnetic part, a central magnetic part and four side magnetic parts, and the four side magnetic parts are arranged on the periphery of the common magnetic part and the central magnetic part; the vibration system comprises a vibrating diaphragm assembly, a serial connection part, two voice coils and four centering disks, the vibrating diaphragm assembly is connected to the shell, the two voice coils are arranged side by side, the first end of each voice coil is connected to the vibrating diaphragm assembly, and the second end of each voice coil is inserted into the two magnetic gaps; the serial connection part is arranged on the vibrating diaphragm assembly, and the two voice coils are electrically connected with the serial connection part so as to be arranged in series. Through the above structure, the ineffective copper foil DC resistance can be reduced, the impedance of the sounding monomer can be reduced, the tone quality effect of the sounding monomer can be improved, the driving force factor BL of the sounding monomer can be improved, and the loudness of the sounding monomer can be improved.

The invention relates to the technical field of high-speed cable shielding materials, and discloses a manufacturing method of rolled copper foil for high-speed cable shielding. The method comprises the following steps: preparing a copper plate; performing multi-pass cold rolling on the copper plate to form an elongated grain structure oriented along the rolling direction; performing controlled annealing on the cold-rolled copper foil to recover plasticity and inhibit complete recrystallization; the target thickness is obtained through finish rolling; carrying out finishing rolling on at least one surface of the copper foil by adopting a mirror surface working roller so as to reduce the surface roughness; and performing surface smoothing or passivating treatment to inhibit oxidation and performance degradation. Therefore, the obtained rolled copper foil has good ductility, structural stability and high-frequency performance.

The invention provides a preparation method of a graphene-copper composite material and the graphene-copper composite material, and the preparation method comprises the following steps: controlling a copper foil to only grow graphene on part of the surface so as to obtain a graphene-copper sheet material; the at least two graphene copper sheets are stacked in sequence; in every two adjacent graphene copper sheets, part of the copper foil of one graphene copper sheet is in contact with part of the copper foil of the other graphene copper sheet; and the graphene copper sheets are subjected to hot pressing, so that every two adjacent graphene copper sheets are metallurgically bonded.

This invention relates to a method for surface roughening of high-end copper foil for electronic circuits, comprising the following steps: sequentially performing acid washing, roughening, blackening, ashing, passivation, and coupling agent coating on raw copper foil, with water washing steps interspersed between these steps, and finally drying and winding. The method is characterized in that the roughening step uses an alkaline plating solution containing copper pyrophosphate. This invention provides an alkaline plating solution for alkaline roughening of raw copper foil, generating grains with lower roughness on the already extremely thin surface of high-end copper foil. The grain size is between 0.02 and 0.1 micrometers. After deposition on the raw foil, the surface roughness of the finished foil increases by approximately 0.2 to 0.3 micrometers, ensuring that the surface roughness of the final product meets the requirements of high-end copper foil while maintaining peel strength.

The invention discloses a preparation method of a porous copper foil based on a hydrogel template and the porous copper fores.The method comprises the steps that firstly, a hydrogel solution is applied to the surface of a cathode roller in a spraying mode, and a hydrogel shielding point array is formed by means of the self-polymerization characteristic of the hydrogel solution; secondly, performing electrolysis operation by taking a cathode roller area outside the shielding point as a deposition site to prepare a composite copper foil mingled with the hydrogel shielding point; and then, stripping the composite copper foil from the cathode roller, placing the composite copper foil in an alkaline solution for ultrasonic treatment for 0.5-5 minutes, so that the hydrogel shielding point is swelled and then falls off through ultrasonic oscillation, and a pure porous copper foil is obtained. And finally, performing surface treatment on the porous copper foil by adopting a passivation solution to improve the stability of the porous copper foil. According to the method, accurate regulation and control of the porous structure are achieved through the hydrogel template, the preparation process is green and efficient, and the obtained porous copper foil is uniform in pore distribution, large in specific surface area and good in mechanical property.

The invention provides a high-frequency multilayer circuit board processing method and a high-frequency multilayer circuit board. The high-frequency multilayer circuit board processing method comprises the following steps: obtaining an inner-layer core board, a prepreg and a copper foil, and carrying out lamination treatment on the inner-layer core board, the prepreg and the copper foil to obtain a laminated board body; wherein the number of the inner-layer core plates is multiple; carrying out drilling treatment on the laminated plate body; carrying out riveting treatment on the laminated plate body after drilling; fusing the riveted laminated board body to obtain a semi-finished product of the high-frequency multilayer circuit board; performing film coating treatment on the semi-finished product of the high-frequency multilayer circuit board; laminating the semi-finished product of the high-frequency multi-layer circuit board coated with the film; and carrying out post-processing treatment on the laminated semi-finished product of the high-frequency multilayer circuit board. According to the processing method of the high-frequency multilayer circuit board, the high-frequency multilayer circuit board is relatively high in use reliability.

The invention relates to the technical field of composite armored cables, and discloses an intelligent sensing type photoelectric composite armored cable for deep-sea mining equipment, which comprises a cable core formed by twisting a plurality of power cable core conductors, an optical fiber communication unit, a medium conveying pipeline and an intelligent sensing unit, and an outer coating layer, tin-plated annealed copper wires and high-strength copper foil wires are arranged in a conductor of the power cable core, an insulation shielding layer is wrapped outside the conductor, the intelligent sensing unit integrates a plurality of optical fibers and optical fiber grating sensors, a loose structure is arranged outside the intelligent sensing unit, one intelligent sensing unit is used for monitoring strain distribution, the other intelligent sensing unit is used for monitoring temperature distribution, and other redundant optical fibers are used as redundant backups. A certain length of grid region interval is preset, distributed measurement along the length of the cable is realized, a sensing optical fiber in the intelligent sensing unit is connected to an optical fiber demodulator of a deck control room, a software system displays strain, temperature, vibration and form data of each point of the cable in real time, an alarm threshold value is set, and the structure is highly integrated and can adapt to a deepwater environment.

The invention relates to the technical field of manufacturing of electronic components, and discloses an LCM (liquid crystal module) backlight FPC (flexible printed circuit) micro-deformation prevention method, which comprises the following specific steps: S1, implementing large-area copper laying design on an element surface of a flexible printed circuit board, and covering a main area of the element surface with uniformly distributed copper foils to form a continuous conductive layer with consistent thickness, while the conductive layer bears electrical connection of the LED light source, the surface reflection characteristic of the conductive layer is optimized, and the phenomenon of uneven light reflection caused by surface fluctuation is reduced. Through the large-area copper laying design of the element surface and the S-shaped isolation interval layout, thermal stress is effectively guided to be symmetrically distributed in multiple directions and offset each other, plane micro-deformation of the FPC under thermal circulation is remarkably restrained, the deformation quantity is controlled within 50 micrometers, the problems of stress concentration and deformation amplification caused by linear intervals in the prior art are solved, and the reliability of the FPC is improved. And long-term stability and optical performance of the backlight module are ensured.