11861 results about "Copper foil" patented technology

Stationary and on-board battery chargers, methods of charging batteries, electric-vehicle chargers, and vehicles with chargers, including electric vehicles and hybrid electric vehicles. Chargers may automatically charge at the correct battery voltage for various types of batteries. Chargers have variable AC power supplies controlled by digital controllers, isolation transformers, and rectifiers. Transformers may be foil-type, and may have copper foil. Power supplies may be variable-frequency generators and the controllers may control the frequency. Electric vehicle chargers may have card readers, and vehicles may have batteries and a charger. Methods of charging include identifying the battery type and gradually increasing the charging at different rates of increase while monitoring charging voltage, charging current, or both, until a current lid is reached. Charging may occur at constant current and then at constant voltage.

Stationary and on-board battery chargers, methods of charging batteries, electric-vehicle chargers, and vehicles with chargers, including electric vehicles and hybrid electric vehicles. Chargers may automatically charge at the correct battery voltage for various types of batteries. Chargers have variable AC power supplies controlled by digital controllers, isolation transformers, and rectifiers. Transformers may be foil-type, and may have copper foil. Power supplies may be variable-frequency generators and the controllers may control the frequency. Use of the variable frequency generator supply facilitates reduced component size and weight and better battery charging performance. Electric vehicle chargers may have card readers, and vehicles may have batteries and a charger. Methods of charging include identifying the battery type and gradually increasing the charging at different rates of increase while monitoring charging voltage, charging current, or both, until a current lid is reached. Charging may occur at constant current and then at constant voltage.

Disclosed are a printed wiring board having micro-via holes highly reliable for conduction and a method of making the micro-via hole by providing a coating or sheet of an organic substance containing 3 to 97% by volume of at least one selected from a metal compound powder, a carbon powder or a metal powder having a melting point of at least 900° C. and a bond energy of at least 300 kJ/mol on a copper foil as an outermost layer of a copper-clad laminate having at least two copper layers, or providing a coating or sheet of the same after oxidizing a copper foil as an outermost layer, irradiating the coating or sheet with a carbon dioxide gas laser at an output of 20 to 60 mJ/pulse, thereby removing a micro-via-hole-forming portion of at least the copper foil as the outermost layer, then irradiating micro-via-hole-forming portions of the remaining layers with a carbon dioxide gas laser at an output of 5 to 35 mJ/pulse to make a micro-via hole which does not penetrate through the copper foil in a bottom of the micro-via hole, and electrically connecting the copper foil as the outermost layer and the copper foil in the bottom of the micro-via hole with a metal plating or an electrically conductive coating composition.

A circuit with embedding components (13) is produced by placing the components (13) on a substrate (14) and applying sheets (15) of prepreg. The prepreg sheets (15) have apertures to accommodate the -components, the number of sheets and arrangement of apertures being chosen to accommodate a variety of component X, Y and Z dimensions. A top layer with Cu foil (16(b)) is applied. The assembly is pressed in an operation analogous to conventional multilayer board lamination pressing. This causes all of the prepreg resin to flow to completely embed the components without raids or damage. Electrical connections are made by drilling and plating vias.

An electronic control device having a high heat dissipating ability includes a printed board secured to an enclosure and interposed between a case and a cover with screws passing through the printed board. Thermally conductive thin film layers made of copper foil are formed in parallel on a mount face and an opposite mount face of the printed board and inside the printed board so as to be thermally separated from each other. A protrusion is provided on the cover and protrudes beyond a bottom part of the cover toward the position where an electronic component is mounted. A flexible, semi-solid thermally conductive material is placed between an end face of the protrusion and the opposite mount face of the printed board corresponding to the position where the electronic component is mounted to be in contact with the end face and the opposite mount face.

The display filter is constituted by laminating a transparent adhesive layer (C) 31 containing dye, a polymer film (B) 20, a transparent electrically conductive layer (D) 10, a transparent adhesive layer (E) 40, and a functional transparent layer (A) 60 having an anti-reflection property, a hard coat property, a gas barrier property, an antistatic property and an anti-fouling property sequentially in this order, adhered on a display area 00; on this occasion, the transparent electrically conductive layer (D) 10 is grounded to a ground terminal of the display via an electrode 50 and an electrically conductive copper foil adhesive tape 80.

The invention relates to a composite material, a high-frequency circuit substrate therefrom and a manufacture method thereof. The composite material comprises thermoset mixture, glass fiber cloth, power filler, a fire retardant and a curing initiator, wherein the thermoset mixture comprises more than one kind of vinyl liquid resin and polyphenyl ether resin; the molecular weight of the vinyl liquid resin is below 10000, and the vinyl liquid resin is provided with a polar functional group; the molecular weight of the polyphenyl ether resin is less than 5000, and the molecular tail end of the polyphenyl ether resin is provided with unsaturated double bonds. The high-frequency circuit substrate manufactured with the composite material comprises multiple layers of semi-solidified sheets and copper foils, wherein the semi-solidified sheets are mutually overlaid, and the copper foils are respectively pressed on two sides. The composite material disclosed by the invention causes the semi-solidified sheets to be easily manufactured and have high adhesive bonding force with the copper foils. The high-frequency circuit substrate manufactured by the material has the advantages of low dielectric constant, low dielectric loss angle tangent, good heat resistance and simple technical operation. Thus, the composite material disclosed by the invention is suitable for manufacturing the circuit substrate of the high-frequency electronic equipment.

A light-emitting device having the quality of an image high in homogeneity is provided. A printed wiring board (second substrate) (107) is provided facing a substrate (first substrate) (101) that has a luminous element (102) formed thereon. A PWB side wiring (second group of wirings) (110) on the printed wiring board (107) is electrically connected to element side wirings (first group of wirings) (103, 104) by anisotropic conductive films (105a, 105b). At this point, because a low resistant copper foil is used to form the PWB side wiring (110), a voltage drop of the element side wirings (103, 104) and a delay of a signal can be reduced. Accordingly, the homogeneity of the quality of an image is improved, and the operating speed of a driver circuit portion is enhanced.

Dielectrics are formed having high dielectric constants, low loss tangents, and other desirable electrical and physical properties. The dielectrics are annealed at temperatures allowing the use of copper foil substrates, and at low oxygen partial pressures.

The invention relates to a high-quality transfer method of graphene prepared by a chemical vapor deposition method. The method comprises the following steps: a, spinning a polymethylmethacrylate (PMMA) thin layer having even thickness on the surface of graphene prepared on a copper foil substrate with the chemical vapor deposition method; b, dissolving the copper foil; c, laminating; and d, and removing PMMA. By using the method provided by the invention, graphene can be stably, reliably and high-quality transferred, and the impurities in graphene are less, thereby ensuring the completeness and good property of prepared graphene not to be damaged and meeting the requirement of researching and applying graphene. After the method provided by the invention is adopted, complete and less-impurity-containing graphene can be stably, reliably and high-quality transferred, and thus a reliable guarantee for representation, research and application of graphene is provided.

The invention discloses a method for preparing single-layer or multi-layer graphene through chemical vapor deposition, and relates to a method for preparing a graphene material. The method comprises the following steps of: placing a metal substrate in a vacuum tubular furnace or a vacuum atmosphere furnace; injecting hydrogen into a vacuum cavity under the situation of removing the oxygen in the vacuum cavity; heating to 800-1,100 DEG C; and injecting a carbon source gas into the vacuum cavity to obtain the metal substrate for depositing graphene. According to the method disclosed by the invention, a graphene film is deposited by cracking methane or other carbon source gases on the metal substrate (such as a copper foil or a nickel foil and the like) at a high temperature by using the chemical vapor deposition method; and therefore, the invention provides a method for preparing the single-layer or multi-layer graphene with an ultra-large area.

The present invention provides a substrate for flexible wiring comprises a liquid crystalline polyester layer and a copper foil with a thickness of 5 μm or less. The substrate has a large adhesion between the resin layer and the copper foil, and is sufficient in water absorbing property and electrical properties.

The invention relates to a high-performance lithium ion battery. According to the battery, an electrode material is subjected to a nano-composite treatment of grapheme and polyaniline; an anode current collector comprises aluminium foil; a cathode current collector comprises copper foil; a conductive agent comprises superconducting carbon black, conductive graphite or acetylene black; a binding agent comprises styrene butadiene rubber, carboxymethylcellulose sodium, polytetrafluoroethylene, polyvinylidene difluoride or hydroxy propyl methylcellulose; a electrolyte comprises liquid electrolyte or a polymer electrolyte containing a conductive polymer, a nano-material, or a mixture comprising the conductive polymer and the nano-material; a membrane is subjected to a high temperature resistant insulation coating treatment, or directly adopts a high temperature resistant insulating porous polymer matrix. A preparation process for the high-performance lithium ion battery comprises: material preparing, coating, drying, rolling, slicing, coil winding or sheet stacking, assembling, liquid injecting, formation and capacity distributing. The lithium ion battery provided by the present invention has characteristics of excellent charge and discharge performance at the large rate, small capacity fading, good heat stability, good safety performance and long electrode cycle life, and can be widely applicable for the fields of electric bicycles, electric motorcycles, electric cars and the like.

The present invention relates to a wiring member including: a copper foil layer having a smooth surface with a surface roughness Rz of 2 μm or less; a noise suppressing layer containing a metallic material or a conductive ceramic and having a thickness of 5 to 200 nm; and an insulating resin layer provided between the smooth surface of the copper foil layer and the noise suppressing layer, and also relates to a printed wiring board equipped with the wiring member. Moreover, the present invention relates to a noise suppressing structure including: a first conductive layer; a second conductive layer; a noise suppressing layer provided between the first conductive layer and the second conductive layer, the noise suppressing layer being to be electromagnetically-coupled with the first conductive layer, the noise suppressing layer comprising a metallic material or a conductive ceramic, and the noise suppressing layer having a thickness of 5 to 300 nm; a first insulating layer provided between the first conductive layer and the noise suppressing layer; and a second insulating layer provided between the second conductive layer and the noise suppressing layer; wherein the noise suppressing structure has: a region (I) in which the noise suppressing layer and the first conductive layer face each other; and a region (II) in which the noise suppressing layer and the first conductive layer do not face each other but the noise suppressing layer and the second conductive layer face each other, the regions (I) and (II) neighboring each other.

The invention discloses a three-dimensional porous current collector which is used as a negative current collector of a metal secondary battery. At least one surface of the three-dimensional porous current collector is provided with a porous structure, sufficient in pore volume and moderate in thickness. Compared with a flat current collector, a metal negative electrode loaded on the three-dimensional porous current collector can be used for effectively restraining the formation of dendritic crystals, so that the safety of the metal negative electrode is improved, the cycle life of the metal negative electrode is long, and the voltage polarization of the metal negative electrode is small. The three-dimensional porous current collector can be prepared from a flat copper foil, and can be prepared through simple steps. The method for preparing the three-dimensional porous current collector is simple, suitable for large-scale production and very high in practicability, and the raw materials are easily available.

The invention provides halogen-free resin composition, and a copper clad laminate and a printed circuit board applying the halogen-free resin composition. The halogen-free resin composition comprises, by weight, (A) 100 parts of epoxy resin, (B) 1 part -100 parts of benzoxazine resin, (C) 1part -100 parts of styrene maleic anhydride, (D) 0.5 part -30 parts of amine curing agents, and (E) 5-150 parts of halogen-free flame retardants. By means of the specified constituents and ration, the halogen-free resin composition achieves the purposes of low dielectric constant, low dielectric loss, high heat resistance, and high flame resistance, can be manufactured into semi-solidified rubber pieces or resin films, and then achieves the purposes of being applied to the copper clad laminate and the printed circuit board.

The invention relates to a black surface treatment process of an electrolytic copper foil, belonging to the technical field of production processes of high and precision electrolytic copper foils. The black surface treatment process of an electrolytic copper foil is characterized in that a VLP (Very Low Profile) electrolytic copper foil of 8-12 mu m is used as an electrode, and then copper or copper alloy is roughened, solidified, weakly roughened and electrically deposited at a running speed of 25.0+/-0.1m/min; a layer of nano-scale nickel or cobalt alloy and a layer of nano-scale zinc alloy are sequentially and electrically deposited; and then alkaline chromate passivation is carried out and a layer of coupling agent is coated. In the invention, the black copper foil for an FPC (Flexible Printing Circuit) is obtained by carrying out a series of special surface treatments on the ultrathin and VLP electrolytic copper foil of 8-12 mu m, wherein the surface roughness Ra of the obtained copper foil is smaller than or equal to 0.30 mu m, Rz is smaller than or equal to 2.5 mu m; the thickness of the copper foil subjected to the surface treatments is increased by 1.40-1.80 mu m; the copper foil does not contain elements having serious damages to the human body, such as lead, mercury, cadmium, stibium, and the like and has excellent oxidation resistance as well as corrosion and etching resistance; the peel strength of the copper foil on a PI (Polyimide) film reaches higher than 1.0N/mm, and the folding strength on the PI film reach more than 100 thousand numbers of times; the copper foil has good appearance characteristics after the copper foil is microetched, and after the copper foil is made into an FCCL (Flexible Copper Clad Laminate), the copper foil has similar appearance characteristics to a rolled copper foil; and the properties of the copper foil product are equivalent to that of an electrolytic copper foil with the same specification for the FCCL.

Semiconductor device 3 comprises semiconductor chip 11, Au ball bumps 21 formed on pad electrodes 12 with a stud bump method, and thermoplastic adhesive layer 22 provided on the surface of semiconductor chip 11 on which pad electrodes 12 are formed, in which the tops of Au ball bumps 21 project from the surface of adhesive layer 22. Reliable bonding can be realized by forming the bumps for electrical connection and the adhesive resin having an adhesion function on the semiconductor chip. In addition, the present invention provides a method of bonding a copper foil to a semiconductor wafer to form a wiring pattern, a multi chip module in which electrical connection is established by bumps bonded to each other through an adhesive layer, and the like.

A process for producing an electrodeposited copper foil with its surface prepared, comprising the steps of: subjecting an electrodeposited copper foil having a shiny side and a matte side whose average surface roughness (Rz) is in the range of 2.5 to 10 mum to at least one mechanical polishing so that the average surface roughness (Rz) of the matte side becomes in the range of 1.5 to 3.0 mum; and subjecting the matte side having undergone the mechanical polishing to a selective chemical polishing so that the average surface roughness (Rz) of the matte side becomes in the range of 0.8 to 2.5 mum. The invention further provides an electrodeposited copper foil with its surface prepared, produced by the above process, and still further provides PWBs and a multilayer laminate of PWBs, produced with the use of the above electrodeposited copper foil with its surface prepared. The mechanical polishing followed by chemical polishing of the matte side enables obtaining an electrodeposited copper foil with its surface prepared, the matte side of which exhibits excellent properties, and hence enables obtaining PWBs and a multilayer PWBs which have excellent properties.

The present invention provides an article comprising: a substrate having a surface and comprising electrodeposited copper foil or copper alloy foil; an adherent layer serving to promote adhesion, comprising at least one organophosphonate or salt thereof covalently bound to the surface; and a functional layer, comprising at least one polymer bound to the adherent layer. The present invention further provides devices comprising a heat source or electronic component and the article described above, wherein the heat source is in thermal contact with the substrate and the electronic component is in electrical contact with the substrate.

Also provided is a method of producing the above-described article.