2061results about "Circuit susbtrate materials" patented technology

The invention relates to the technical field of printed circuit boards, and discloses a circuit board structure and a preparation method thereof, and the circuit board structure comprises a copper seat, the top of which is provided with a first groove; a chip, wherein the chip is arranged in the first groove; the ceramic substrate layer is arranged at the bottom of the copper seat, and the shape of the cross section of the ceramic substrate layer is the same as that of the bottom surface of the copper seat; the copper plate layer is arranged at the bottom of the ceramic substrate layer, and the shape of the cross section of the copper plate layer is the same as that of the cross section of the ceramic substrate layer. The ceramic substrate layer and the copper plate layer are sequentially arranged at the bottom of the copper base, the thermal resistance of the chip during working can be remarkably reduced, the overall heat dissipation performance can be improved, the cross sections of the ceramic substrate layer and the copper plate layer are consistent with the bottom surfaces of the copper base and the copper plate layer in shape, and the layers are high in structural fitting degree, uniform in stress distribution and good in plate thickness consistency after lamination; and the warping problem of the copper seat caused by thermal expansion is effectively reduced.

A printed wiring board includes a first conductor layer, a resin insulating layer formed on the first conductor layer, a second conductor layer formed on the resin insulating layer and including a seed layer and a metal layer on the seed layer, a via conductor formed in the resin insulating layer such that the via conductor is connecting the first conductor layer and the second conductor layer, and a base layer formed on the resin insulating layer and including resin and one of iron and chromium in a range of 0.2 at % to 5.0 at % with respect to the resin such that the base layer includes part formed between the resin insulating layer and the seed layer.

A method of the subject technology includes forming a first circuit component at a first portion of a deformable substrate and forming a second circuit component at a second portion of the deformable substrate. The method further includes electronically coupling the first circuit component and the second circuit component using traces comprising a formulation including a liquid Ga-based alloy and a metal filler.

The invention provides a low-dielectric high-toughness alkali-free spherical glass powder modified copper-clad plate. The low-dielectric high-toughness alkali-free spherical glass powder modified copper-clad plate consists of a composite resin matrix, modified alkali-free spherical glass powder, a synergistic functional filler, an auxiliary agent, a reinforced base material and a conductive layer, the modified alkali-free spherical glass powder is subjected to gradient treatment of plasma activation, silane grafting and organic silicon coating, the particle size of the modified alkali-free spherical glass powder is 0.5-2 microns, the modified alkali-free spherical glass powder accounts for 10-20 parts by weight in the raw materials, and the content of organic functional groups on the surface of the modified alkali-free spherical glass powder is larger than or equal to 1.6 mmol / g.The invention further provides a preparation method of the low-dielectric high-toughness alkali-free spherical glass powder modified copper-clad plate. Compared with the prior art, the preparation method has the following beneficial effects that a double-resin blending and elastomer toughening system is constructed through a modification process of filler activation, silane grafting and organic silicon coating, and the technical bottleneck is solved in combination with an interface compatibility technology.

To provide a fixing structure of an insulating sheet in which the number of components and the number of assembling steps are small and fixing force is hardly reduced by heat, vibration, or the like, and to provide an insulating sheet capable of easily achieving the fixing structure of the insulating sheet, and a manufacturing method capable of easily manufacturing the fixing structure of the insulating sheet.SOLUTION: An insulating sheet according to the present invention is an insulating sheet that is fixed to an object to be protected and insulates and protects the object to be protected, the insulating sheet including a flat plate portion that is made of a resin material and extends in a flat plate shape, and a protruding molded portion that is molded so as to protrude in a protruding shape from the flat plate portion, in which an outer surface of the protruding molded portion includes an enlarged diameter portion that is enlarged in diameter from a base end portion toward a tip end portion of the protruding molded portion.SELECTED DRAWING: Figure 1

The invention relates to an AMB ceramic substrate capable of improving reliability and a process method thereof. The AMB ceramic substrate comprises a first copper layer, a first solder layer, a ceramic layer, a second solder layer and a second copper layer which are sequentially stacked, the AMB ceramic substrate is of an axisymmetric structure in the width direction. The width of the first solder layer is larger than that of the first copper layer, and the wider structure in the first solder layer is marked as a first step structure on one side of a symmetry axis in the width direction of the AMB ceramic substrate; the width of the second solder layer is larger than that of the second copper layer, and the wider structure in the second solder layer is marked as a second step structure on one side of the symmetry axis in the width direction of the AMB ceramic substrate. According to the AMB ceramic substrate and the manufacturing method thereof, the step structures in the first solder layer and the second solder layer can achieve gradient dispersion of stress and effectively relieve residual stress, so that the stress distribution condition is remarkably improved, and the reliability of the AMB ceramic substrate is improved.

The invention provides a double-sided conduction AMB ceramic substrate and a manufacturing method thereof, and belongs to the technical field of ceramic substrates for power modules. The manufacturing method comprises the following steps: punching holes in a ceramic substrate; filling conductive metal slurry into the holes by using a screen printing machine and sintering at high temperature; brazing materials are printed on the two faces of the ceramic; the copper layer and the ceramic layer are laminated and then subjected to vacuum brazing; manufacturing a circuit; etching the solder layer of the AMB line groove to expose the ceramic; performing surface treatment; laser cutting; and conducting test and inspection. Two-sided conduction is realized through metal slurry hole filling and a high-temperature sintering process, the problem that conduction of an upper copper layer and a lower copper layer of a traditional AMB ceramic substrate cannot be realized is solved, the assembling size of a power module is reduced, the three-dimensional integration requirement of a high-end module is met, meanwhile, the technological process is reasonable, and the production cost is reduced.

According to the special-shaped FPC and the manufacturing method thereof, the pre-formed special-shaped flexible base material layer is arranged, the shape of the pre-formed special-shaped flexible base material layer is directly matched with the special-shaped surface of a target installation space, and a circuit layer, an insulation covering layer and a special-shaped supporting layer are all attached to the special-shaped surface of the special-shaped flexible base material layer, so that the FPC does not need to be forcibly bent, twisted or stretched subsequently, and the production efficiency is improved. The problems of circuit breakage and delamination caused by stress concentration are fundamentally avoided, the structural stability of the FPC is improved, and the service life of the FPC is prolonged. The flexible circuit board is used for solving the technical problem that in order to achieve special-shaped layout, the plane of an existing flexible circuit board generally needs to be forcibly bent, twisted or stretched.

The invention discloses a diamine monomer based on lignin chemical modification, a polyimide material and a preparation method and application thereof. The invention provides a diamine monomer based on lignin chemical modification and a preparation method thereof. The diamine is used for synthesizing polyimide. And copolymerizing the diamine monomer with an aromatic diamine monomer and a dianhydride monomer to prepare the polyimide material. Due to the addition of diamine, the free volume between polyimide molecular chains can be increased, so that the obtained polyimide material shows considerable dielectric properties in high frequency under the condition that the polyimide material does not contain fluorine, and the polyimide material has good insulating properties, which provides possibility for application to the field of microelectronics.

This disclosure provides a circuit board and an electronic device. In addition to a PCB, the circuit board may further include an FPC assembled on the PCB. In addition, a line between different components assembled on the PCB includes a line in the PCB, and further includes a line in the FPC. Because a quantity of core boards in the FPC is generally far less than a quantity of core boards in the PCB, selecting a core board with a dielectric loss less than that of the core board in the PCB for the FPC helps reduce a transmission loss of a high-speed signal in the circuit board, and helps reduce costs of the circuit board. This disclosure further provides an electronic device. Selecting, for the electronic device, the circuit board provided in this disclosure helps improve cost competitiveness of the electronic device in a high-speed high-density scenario.

Provided is a method for producing a wiring circuit board that includes the steps of forming a first metal layer on a metal supporting substrate; forming an insulating layer on the first metal layer; removing a portion of the first metal layer, the portion being exposed at the opening portion of the insulating layer, to expose the metal supporting substrate at the opening portion; forming a second metal layer on a portion of the metal supporting substrate exposed at the opening portion and on the insulating layer; and forming a conductive layer on the second metal layer. A wiring circuit board includes the metal supporting substrate, the first metal layer having a first opening portion, the insulating layer having a second opening portion having an opening along the first opening portion, the second metal layer connected to the metal supporting substrate, and the conductive layer on the second metal layer.

The purpose of the present invention is to provide a resin film that is capable of adequately maintaining bonding strength to other materials even in a high temperature environment. The resin film contains at least a fluorine resin. The water contact angle of the surface of the resin film is 55°-105°. When the resin film is subjected to heat treatment at 180°C for 10 minutes, the surface of the resin film before the heat treatment and the surface of the resin film after the heat treatment have therebetween, in the CIE1976 (L*,a*,b*) color space as measured in accordance with JIS Z 8781-4:2013, a chromaticity difference ∆b* of 0.5 or less and a color difference ∆E* of 0.8 or less.

Disclosed are a thin, stretchable and flexible printed circuit and a manufacturing method therefor. The manufacturing method comprise: attaching an adhesion-reducing carrier film to a first side of a flexible circuit board provided with a circuit layer and two protective films, wherein the adhesion-reducing carrier film has a large first preset adhesive force; and attaching a first elastomer composite film, and then performing an adhesion-reducing operation on the adhesion-reducing carrier film to allow the adhesion-reducing carrier film to have a small second preset adhesive force. The elastomer composite film is formed by two polymer films with different melting points. The invention can increase the product yield in mass production based on the adhesion-reducing carrier film and can wrap a serpentine circuit by means of the elasticity of a composite structure of the polymer films to realize thin and light design and miniaturization.

A flexible printed circuit board according to an embodiment includes: a substrate; and a circuit pattern disposed on the substrate, wherein the circuit pattern includes a plurality of first circuit patterns, a plurality of second circuit patterns, and a plurality of third circuit patterns, wherein the third circuit pattern includes a third-first pad portion, a third-second pad portion, and a third wiring portion connecting the third-first pad portion and the third-second pad portion, a plurality of fourth wiring portions are disposed between a plurality of third wiring portions, a line width of the third wiring portion is greater than a line width of the fourth wiring portion, and a distance between the third wiring portion and the fourth wiring portion adjacent to the third wiring portion is greater than a distance between the fourth wiring portions.

A photosensitive resin film containing (A) a photopolymerizable compound having an ethylenically unsaturated group and an acidic substituent and (B) an inorganic filler, in which the amount of the inorganic filler (B) contained is 25% by volume or more, and in which the cured product of the photosensitive resin film has a refractive index of 1.550 or more, and a printed wiring board and a semiconductor package each using the photosensitive resin film.

The present application relates to the field of copper-clad plate, and particularly relates to a halogen-free high-CTI polymer material for copper-clad plate, which is used to solve the problem of low CTI value of the existing halogen-free material, and the low CTI value means that the material is more susceptible to arc discharge and moisture, thereby accelerating the performance decline; the polymer material can significantly improve the flame retardance and electrical performance of the base material by taking epoxy resin as the base material and adding multiple DOPO-based compounds and modified graphene oxide to the base material, can effectively improve the thermal stability and tracking resistance of the copper-clad plate material, not only meets the demand of long-time stable operation of electronic devices, but also improves the safety performance of the product, and effectively reduces the failure or fire risk caused by the electric leakage.

The invention provides a resin composition, and a prepreg and a metal foil-clad laminated board containing the same. The resin composition comprises the following components: a maleimide compound (A) containing an indane structure in a molecule and thermosetting resin (B), the maleimide compound (A) having an indane structure in the molecule has an acid value of 5.0 mgKOH / g or less. According to the present invention, the Df change is small after the cured product of the resin composition is subjected to the extreme environment thermal oxidation treatment, such that the prepared prepreg and the prepared metal foil-coated laminated board have characteristics of excellent dielectric property and extreme environment resistance, and are especially suitable for high-speed packaging.

The present application relates to the technical field of copper clad laminates, and discloses a copper clad laminate, a resin composition for the copper clad laminate, and spherical silicon and a preparation method therefor. The spherical silicon of the present application is composed of spherical silicon dioxide and zinc molybdate particles dispersedly grown on the surface of the spherical silicon dioxide in situ and has a diameter of less than 10 microns and a D50 of 0.6-6 microns. The content of zinc molybdate per unit area on the surface of the spherical silicon dioxide is 0.03-1 g / m2, and the size of the zinc molybdate particles is less than or equal to 400 nm. The preparation method comprises: enabling spherical silicon dioxide to come into contact with / be mixed with a soluble molybdate and a zinc salt in an aqueous reaction system; and reacting the soluble molybdate with the zinc salt in situ on the surface of the spherical silicon dioxide, so as to form spherical silicon chemically coated with zinc molybdate particles. In the present application, by directly synthesizing the zinc molybdate in situ on the surface of the spherical silicon dioxide by means of a hydrothermal method, the structural morphology of the obtained spherical silicon and the size of the zinc molybdate particles can be effectively controlled, thereby ensuring that the wear of a drill bit during the drilling of the copper clad laminate is effectively mitigated.

To provide a bond ply capable of combining low dielectric tangent and dimensional stability.SOLUTION: A bond ply comprises a first adhesive layer, a polyimide layer and a second adhesive layer, in which a) a thickness of an entire bond ply is in the range of 50 μm or more and 300 μm or less, and a ratio of the thickness of the polyimide layer to the thickness of the entire bond ply is 0.2 or more and 0.9 or less, b) after drying at 80°C for 1 hour, the moisture absorption measured after conditioning for 24 hours under constant temperature and humidity at 23°C and 50% RH is 0.4 wt.% or less, and c) the storage elastic moduli at 50°C of the first adhesive layer and the second adhesive layer are each independently 1800 MPa or lower, and the maximum value of the storage elastic moduli at 180 to 260°C are each independently 800 MPa or less.SELECTED DRAWING: None

The application provides a composite PCB, a preparation method and application thereof, and the method comprises the following steps: cutting ceramic raw materials into ceramic blanks, arranging a copper plating layer on the surface of the ceramic blank to obtain a ceramic substrate; obtaining a resin core plate, opening an embedding groove penetrating through the resin core plate in the length direction on the top surface of the resin core plate, embedding the ceramic substrate into the embedding groove, and making the opposite two end surfaces of the ceramic substrate flush with the opposite two side surfaces of the resin core plate to form an initial PCB; arranging an interconnection structure on the side surface of the initial PCB to form a composite PCB. The heat generated by the LED chip is conducted to the ceramic substrate, and the heat is quickly conducted to the whole plate body through the interconnection structure, so that high-efficiency heat dissipation is realized; the thermal expansion coefficients of the ceramic and the metal are matched, the thermal stress is greatly reduced, and the influence of the excessively high thermal stress on product quality can be reduced; the resin core plate serves as a carrier of the driving circuit integration function, the cost is significantly reduced compared with the full ceramic plate, and the balance between performance and cost is realized.

The present invention provides a curable composition with excellent thermal expansion resistance when used in prepreg applications, as well as prepregs, resin films, metal-clad laminates, printed circuit boards, semiconductor packages, and a method for adjusting melt viscosity. [Solution] The resin contains at least two compounds that have different structures from the compounds represented by general formula (1), and R is present in the resin. 1 , R 2 and R 3 At least one of them is a vinylbenzyl group, and R present in the resin 1 , R 2 and R 3 A curable composition comprising a resin (A) in which at least one of the members is an arylalkyl group other than a vinylbenzyl group, an azo radical polymerization initiator (B), and an imidazole compound (C).

To provide a ceramic copper circuit board using a Ag-free brazing filler metal layer, wherein the brazing filler metal layer of the ceramic copper circuit board includes a protruding part, and a semiconductor device using the same.SOLUTION: A ceramic copper circuit board according to the embodiment includes a ceramic substrate, and a plurality of copper circuit parts bonded respectively via brazing filler metal layers on at least one surface of the ceramic substrate. The brazing filler metal layer does not contain Ag and contains Cu, Ti, and one or two kinds selected from Sn and In. The brazing filler metal layer includes a junction provided between the ceramic substrate and the copper circuit part, and a first protruding part provided around the junction and having a titanium content in the range of 70 mass% or more and 100 mass% or less. When the thickness of the copper circuit part is D and the shortest distance between adjacent copper circuit parts is P, the thickness D of the copper circuit part is 0.1 mm or more, and a region satisfying 1≤P / D≤3 is included.SELECTED DRAWING: Figure 1

To provide a resin composition with excellent varnish stability. [Solution] A resin composition comprising (A) epoxy resin, (B) maleimide resin, a specific range of amounts of (C) inorganic filler, and a specific (D) cyclic phosphazene compound.

[Problem] To provide a curable resin composition from which a cured product having excellent insulation reliability can be formed and which has a suppressed amount of emission of halogen-containing substances during combustion. [Solution] This curable resin composition comprises an epoxy resin, an epoxy resin curing agent, and a filler, wherein a filler containing at least one selected from the group consisting of magnesium carbonate, magnesium oxide, hydrotalcite, and aluminum hydroxide is used as the filler.

The objective is to provide a treated copper foil that can adhere firmly to a substrate at a smooth interface with minimal irregularities, and a method for manufacturing the same. Furthermore, the objective is to provide a laminate in which the treated copper foil and the substrate are firmly adhered at a smooth interface with minimal irregularities, and a method for manufacturing the same. [Solution] By using a treated copper foil in which a conductive layer (B) containing silver (b1) is laminated onto a copper foil (A) with a smooth surface, it is possible to firmly adhere the copper foil (A) and the substrate (D) at a smooth interface with minimal irregularities, thus completing the present invention.

A method of manufacturing a packaging substrate according to the present disclosure includes a preparing step of preparing a panel-level packaging substrate comprising a core substrate, a first redistribution layer disposed on the core substrate, and a second redistribution layer disposed under the core substrate, and an electroless surface treatment step of forming terminals by simultaneously performing electroless surface treatment on an upper surface and a lower surface of the panel-level packaging substrate. The packaging substrate comprises a core layer, the first redistribution layer disposed on the core layer, the second redistribution layer disposed under the core layer, and the terminals disposed on an upper surface of the first redistribution layer and a lower surface of the second redistribution layer. A difference between a maximum thickness value and a minimum thickness value of the terminals formed on the packaging substrate is 5 µm or less. In such a case, terminals having improved thickness uniformity may be formed, and process efficiency during terminal formation may be promoted.

A circuit board structure and a manufacturing method thereof are provided. The circuit board structure includes a base layer, a first circuit layer, a support material layer, a build-up material layer, and a second circuit layer. The first circuit layer is disposed on the base layer. The support material layer is disposed on the base layer and on one side of the first circuit layer. The build-up material layer is disposed on the first circuit layer and the support material layer. The second circuit layer is disposed on the build-up material layer.

The present invention provides a thermosetting adhesive sheet, the cured product of which has excellent adhesiveness, and also has excellent dielectric properties and heat resistance. The thermosetting adhesive sheet has an adhesive layer containing an adhesive composition containing component A and component B, and the cured product of the thermosetting adhesive sheet has a relative dielectric constant of 1.0-3.0 and a dielectric loss tangent of 0.0001-0.01 at 23 DEG C, 50% RH, and 28 GHz. Component A is a resin composition containing more than 35% by mass of a styrene elastomer (a1) in which the content of structural units derived from an aromatic vinyl compound is less than 30% by mass, and a resin (a2) having a plurality of reactive functional groups in the structure, and component B is an inorganic filler.

The invention relates to the field of ceramic packaging materials, in particular to a packaging material for a high-voltage-resistant ceramic side wall and a preparation method of the packaging material. The packaging material is prepared from an epoxy-silica hybrid prepolymer, an aluminum oxide and silicon dioxide core-shell composite filler, methylhexahydrophthalic anhydride and 2-ethyl-4-methylimidazole, wherein the hybrid prepolymer is prepared by carrying out hydrolytic condensation on bisphenol A diglycidyl ether, hydroxyl-terminated PDMS (Polydimethylsiloxane) and 3-glycidoxypropyltrimethoxysilane; low viscosity and low volatile matter are realized; the core-shell filler takes aluminum oxide as a core and silicon dioxide as a shell, and a shell layer is grafted with epoxy silane so as to be chemically bonded with resin. And after curing, the power frequency short-time electrical strength of the packaging layer is greater than or equal to 20 kV / mm, the partial discharge initial voltage is greater than or equal to 3 kV, the volatile matter is less than or equal to 1.0 wt%, and the water content is less than or equal to 0.2 wt%.

Provided: A curable resin laminate with low dielectric properties, capable of easily fabricating an insulating layer with excellent adhesion (peel strength) to the conductor layer. A curable resin laminate comprising: a first resin layer formed of a first curable composition; and a second resin layer laminated on the first resin layer and formed of a second curable composition, the second resin layer having a thickness of 5-35% relative to the total thickness of the first and second resin layers, the first curable composition comprising (A1) polyphenylene ether and filler, wherein the filler content (M) as a total solid component is... B1 The content of the second curable composition is 30% or more by mass, and the content of the filler as a solid component is (M). B2 () is less than 40% by mass, which is M B1 >M B2 The slopes of (A1) and (A2) calculated from the conformation diagrams are less than 0.6.