6583results about "Circuit susbtrate materials" patented technology

Disclosed herein are bonded structures and methods of forming the bonded structures. In some embodiments, the bonded structures include a first element having an inorganic dielectric surface, a second element having an organic dielectric surface, an interface layer between the first and second elements and bonded to the inorganic and organic dielectric surfaces. The method of forming the bonded structure includes providing the first and second elements, exposing the inorganic dielectric surface to a silane coupling agent to form the interface layer, contacting the organic dielectric surface to the interface layer, and heating the first element, second element, and interface layer to bond the first element to the second element.

The invention belongs to the technical field of flexible circuits, and discloses an integrally formed multilayer flexible fabric circuit which comprises a main circuit I, a branch circuit I, a main circuit II and a branch circuit II according to functional layout classification, the main circuit I is connected with the branch circuit I, the main circuit II is connected with the branch circuit II, the main circuit I is not connected with the main circuit II, and the branch circuit II is connected with the branch circuit II. The branch circuit I is not connected with the branch circuit II; the main circuit I and the main circuit II define a [-shaped area, and the branch circuit I and the branch circuit II are both located in the area. According to composition and structure classification, the warp knitting fabric comprises an insulating warp knitting fabric, and a single conductive yarn a, a single conductive yarn b and a plurality of conductive yarns X which are simultaneously positioned inside the insulating warp knitting fabric; the conductive yarn a and the conductive yarn b are respectively weft yarns which are lined into the insulated warp knitting fabric from the left side and the right side. The fabric has the advantages of light weight, softness and breathability, is good in ductility, is integrally formed during weaving, and keeps the structural integrity and the yarn continuity.

The invention relates to the technical field of ceramic substrates, and provides a low-dielectric-loss multilayer ceramic substrate and a preparation method thereof. The low-dielectric-loss multilayer ceramic substrate is prepared from, by weight, 90-100 parts of aluminum oxide, 1-3 parts of plasticizer, 3-5 parts of sintering aid, 6-10 parts of binder, 1-3 parts of dispersing agent and 50-60 parts of water, the aluminum oxide is composed of first aluminum oxide and second aluminum oxide, and the first aluminum oxide and the second aluminum oxide are different in form. According to the technical scheme, the problem of high dielectric loss of the multilayer ceramic substrate in the prior art is solved.

The invention provides a method and system for preparing a high-temperature anti-aging test board for chip testing, and relates to the technical field of data energy storage and resource scheduling, and the method comprises the steps: designing a schematic circuit diagram and a PCB wiring scheme; a test plate is made of a high-temperature resistant material; bare board verification, electrical performance verification, program setting verification, high temperature verification and junction temperature measurement verification are carried out; using data is recorded, ultrasonic cleaning and drying are carried out, and a performance evaluation model is established through a hardware management system to judge whether maintenance or replacement is needed. According to the invention, the accuracy of chip testing in a high-temperature environment is improved, and the service life of the test board is prolonged.

The invention provides a low-dielectric glass fiber composition, a low-dielectric glass fiber and a preparation method thereof, and the low-dielectric glass fiber composition comprises the following components in molar percentage: 54 to 60 percent of SiO2, 21 to 32 percent of B2O3, 1.0 to 9.5 percent of Al2O3, 3 to 16 percent of alkaline earth metal oxide, 0.01 to 4.0 percent of ZrO2, 0.1 to 4.0 percent of TiO2, 0.01 to 2.0 percent of LiO2 and 0.5 to 5.0 percent of F2. Wherein the alkaline earth metal oxide comprises CaO and MgO, and according to the molar percentage, the CaO accounts for 0.01%-4.0%, and the MgO accounts for 0.5%-8.0%. According to the glass fiber, SiO2 and B2O3 are taken as main components of the glass, SiO2 can be taken as a network former of a glass structure, on one hand, part of B2O3 can form a [BO4] tetrahedral structure to enter a glass silica network structure so as to play a role in reinforcing a net, and on the other hand, B2O3 can effectively inhibit ion polarization so as to reduce the dielectric constant and dielectric loss of the glass fiber; according to the present invention, the specific type of the alkaline earth metal oxide is added, and the certain content of the Al2O3, the ZrO2, the TiO2, the LiO2 and the F2 is supplemented so as to further reduce the dielectric constant and the dielectric loss of the glass fiber, and the cooperative control of the components is beneficial to the improvement of the glass processing property and the guarantee of the glass fiber drawing stability.

The invention discloses a copper-clad plate for a printed circuit board and a preparation method of the copper-clad plate, and relates to the technical field of printed circuit board materials. The invention discloses a preparation method of a copper-clad plate for a printed circuit board, which comprises the following steps of: soaking a reinforcing material in a glue solution, and drying to obtain a prepreg; carrying out hot-pressing treatment on the prepreg and copper foil to obtain a copper-clad plate; the glue solution comprises the following raw materials in parts by weight: 15-20 parts of vinyl-terminated polyphenyl ether, 20-25 parts of epoxy resin, 20-25 parts of difunctional silicon dioxide, 15-25 parts of an organic solvent, 0.3-0.6 part of a curing agent and 0.05-0.1 part of a curing accelerator; the difunctional silicon dioxide cross-linked polyphenyl ether and epoxy resin prepared by the preparation method disclosed by the invention are used as a resin material of a glue solution, and have the characteristics of good heat resistance and excellent mechanical properties.

The invention discloses a low-loss resin composition, which is prepared from the following main components in parts by weight: 10 to 90 parts of acenaphthylene-p-vinylbiphenyl copolymer, 10 to 70 parts of cross-linking agent, 20 to 60 parts of elastomer, 0.1 to 3 parts of initiator and 10 to 90 parts of filler. The acenaphthylene-p-vinylbiphenyl copolymer is obtained by pre-polymerizing acenaphthylene and divinylbiphenyl, the acenaphthylene monomer residue is less, the acenaphthylene monomer is difficult to volatilize in a resin system, implosion caused by too fast curing reaction of the resin system is prevented while good reaction activity is maintained, and a subsequent curing product is high in crosslinking density and good in heat resistance; a machining window is wide, and subsequent production and machining are facilitated; and an acenaphthylene structure has high symmetry and rigidity and does not contain elements such as oxygen, sulfur and nitrogen, so that the resin composition has excellent dielectric properties and thermal properties and a low thermal expansion coefficient, and an elastomer as a cross-linking curing matrix material can provide the characteristics of low dielectric constant, low dielectric loss, low water absorption and the like.

The invention discloses a flexible circuit board made of weldable low-temperature silver paste and a preparation process of the flexible circuit board, and relates to the technical field of flexible electronic device manufacturing, and the flexible circuit board comprises a base material layer, a low-temperature weldable silver paste conductive layer and a protective layer. According to the invention, the collaborative design of the weldable low-temperature silver paste and the self-repairing protection layer is integrated, the efficient preparation of the flexible circuit board is realized through the printing technology, the weldable low-temperature silver paste breaks through the traditional high-temperature limitation, supports a wide range of substrates and can be directly welded without surface treatment, and in addition, the polyurethane protection layer containing the dynamic disulfide bond has a self-repairing function. Compared with a traditional FPC, only two core processes of printing and baking are needed, the process is greatly simplified, the equipment investment is reduced, and double reduction of the manufacturing cost and the material cost is achieved.

The invention relates to the technical field of electronic information materials, in particular to a metal foil with a carrier, a metal-clad laminated board and a circuit board. The invention discloses a metal foil with a carrier, a metal-clad laminated board and a circuit board, the metal foil with the carrier is characterized in that the metal foil with the carrier comprises a carrier layer and a functional layer, the functional layer is arranged on one side face of the carrier layer, and the functional layer is arranged on the other side face of the carrier layer. And the ratio of the thermal expansion coefficient a of the functional layer to the thermal expansion coefficient b of the carrier layer satisfies 40% < = a / b < = 120%. The thermal expansion coefficient ratio of the carrier layer to the functional layer of the metal foil with the carrier is in a proper range, so that the stripping stability of the metal foil with the carrier during use can be improved, and the processing efficiency is improved.

The invention belongs to the technical field of dielectric materials, and particularly relates to a dielectric material based on polybenzocyclobutene as well as a preparation method and application of the dielectric material. According to the multi-benzocyclobutene-based dielectric material provided by the invention, different halogenated hydrocarbon, olefin and other raw materials are used, and on the basis of containing more than two benzocyclobutene groups, a specific group can be introduced into a connecting group so as to improve the dielectric property and thermal stability of the material; meanwhile, specific groups can be introduced into R2 and R3 through secondary Heck reaction to further improve the dielectric property and thermal stability of the material, so that the dielectric material with excellent comprehensive properties such as dielectric property and thermal stability is provided, and the technical problem of lack of dielectric materials for high-frequency and high-speed printed circuit boards (PCBs) in the prior art can be solved.

An electronic device is provided. The electronic device includes a hinge structure, a first housing structure, a second housing structure that is foldable with the first housing structure, a foldable housing, a flexible display, a first mid-plate disposed on one side of the first housing structure, a second mid-plate disposed on one side of the second housing structure, a flexible printed circuit board (FPCB) extending between the first mid-plate and the second mid-plate, a first sealing member that seals a first opening formed in the first mid-plate, and a second sealing member that seals a second opening formed in the second mid-plate.

The invention discloses a manufacturing process of a circuit board structure of aviation equipment, which comprises the following steps of: providing a carbon fiber reinforced ceramic substrate, after desizing process treatment, coating high-temperature ceramic slurry on the carbon fiber reinforced ceramic substrate, forming a high-temperature-resistant base material layer through vacuum drying, coating an electromagnetic shielding material on the surface of the base material layer, and forming the circuit board structure of the aviation equipment. Designing a circuit pattern, and transferring the circuit pattern to the electromagnetic shielding layer through a laser cutting or etching process to form a circuit layout; wiring the copper alloy film according to the circuit pattern, and combining the copper alloy film with the polymer composite material middle layer through a lamination process to form an electrical connection layer; coating the surface of the circuit board with a resin material, performing curing treatment, mounting a metal connecting piece in the edge area of the circuit board, performing connection in a crimping manner, then performing a 3D printing process, and printing connecting points on the surface of the circuit board; the circuit board provided by the invention has the advantages of high temperature resistance, electromagnetic interference resistance, support and excellent protection performance.

A bonded body according to an embodiment includes a ceramic substrate, a copper plate, and a bonding layer bonding the ceramic substrate and the copper plate. The bonding layer includes Ag, Cu, an active metal, and a first element. The first element is one or two selected from Sn and In. A detection amount (mass %) of the first element divided by a detection amount (mass %) of Ag at a first measurement point is within a range of not less than 0 and not more than 0.4 when any cross section is analyzed by SEM-EDX, and when a location at which a detection amount of Cu is not less than 80 mass % and at which a change of a slope in a graph of the detection amount of Cu is largest is taken as the first measurement point.

The invention relates to the technical field of ceramic substrates, and provides a low-dielectric-constant multilayer ceramic substrate and a preparation method thereof. The low-dielectric-constant multilayer ceramic substrate comprises the following components in parts by weight: 100 parts of aluminum oxide, 4-8 parts of a sintering aid, 8-16 parts of silicate, 3-6 parts of copper oxide, 3-5 parts of a dispersing agent, 6-12 parts of a binder and 70 parts of a solvent, the silicate comprises magnesium aluminum silicate and zirconium silicate in a weight ratio of (1.5-9): 1. According to the technical scheme, the problem that the bending strength of the multi-layer ceramic substrate is poor in the prior art is solved.

An earphone device includes a housing subassembly, an inner casing subassembly, an audio processor, and a force sensor patch. The inner casing subassembly is disposed in the housing subassembly and integrated with a printed circuit board having specific electrode(s). The audio processor is disposed on the printed circuit board. The force sensor patch is pasted onto specific electrode(s) of the printed circuit board to be coupled to the audio processor through specific electrode(s). The force sensor patch is disposed between a part of the housing subassembly and a part of the inner casing subassembly and arranged to detect a user's pressure applied onto the part of the housing subassembly.

Provided is an arylalkyl-modified indene composition comprising a plurality of compounds, each of the compounds having one or more arylalkyl groups on an indene ring and differing from the others in the number of arylalkyl groups in one molecule. The content of the compound or compounds having a single arylalkyl group in one molecule is 1% or less in the composition at the percentage calculated on the basis of the area ratio in a GPC chart. At least one of the arylalkyl groups present in the composition is an arylalkyl group having a polymerizable unsaturated bond-containing group, while at least one of the arylalkyl groups present in the composition is an arylalkyl group having no polymerizable unsaturated bond-containing group.

Provided is an arylalkyl-modified indene composition that contains a plurality of types of compounds having an arylalkyl group on an indene ring, the compounds having different numbers of arylalkyl groups in one molecule, wherein: the content of a compound in which the number of arylalkyl groups in one molecule is 1 is 1% or less as calculated from the area ratio of the GPC chart; at least one of the arylalkyl groups present in the composition has a polymerizable unsaturated bond-containing group; and at least one of the arylalkyl groups present in the composition does not have a polymerizable unsaturated bond-containing group.

A printed circuit board (PCB) has a dielectric substrate of fiber-reinforced polymer with opposite sides. Each side has channels formed by molding or machining the dielectric substrate. Conductive wires are inserted into the channels to define conductive traces.

The present invention addresses the problem of providing a thermosetting resin composition that contains a low-viscosity modified resin and that can realize a low thermal expansion and low elastic modulus. The present invention provides a thermosetting resin composition that contains a thermosetting resin (A), a curing agent (B), a modified resin (C), and at least one filler (D) selected from the group consisting of inorganic fine particles and fibers, the thermosetting resin composition being characterized by containing a modified resin (C) in which the ether concentration is 11.5 to 23 mol / kg. The present invention also provides a cured product from the thermosetting resin composition, as well as a semiconductor sealing agent, a semiconductor device, an insulating material for printed wiring boards, and a printed wiring board, in each instance containing the thermosetting resin composition.

The invention discloses a copper-clad plate as well as a middle layer and a preparation method and application thereof, and belongs to the technical field of copper-clad plates. The preparation method of the intermediate layer for the copper-clad plate comprises the following steps: orthogonally weaving PBO fibers and glass fibers to obtain blend fibers; the mass ratio of the PBO fibers to the glass fibers is (10: 90)-(60: 40); carrying out modification treatment on the blend fibers to obtain modified blend fibers; dipping the modified blend fiber in a resin-containing dipping solution; and drying the impregnated modified blend fiber. The preparation method is simple and easy to operate, the PBO fibers and the glass fibers are orthogonally woven according to a specific ratio, so that on one hand, the blend fibers have the advantages of the PBO fibers and the glass fibers, on the other hand, the anisotropy of the blend fibers is effectively optimized, and the obtained copper-clad plate has relatively low dielectric loss and expansion coefficient; the peeling strength, the heat resistance and the flexibility are better.

The present invention relates to the technical field of flexible electronics, and relates to a breathable and stretchable circuit capable of being activated by imprinting, and a preparation method therefor and a use thereof. The preparation method for the breathable and stretchable circuit capable of being activated by imprinting in the present invention comprises the following steps: dissolving a thermoplastic polymer in a solvent, adding liquid metal particles, and mixing and dispersing to obtain a mixed solution; carrying out electrospinning on the obtained mixed solution to prepare a nanofiber membrane; and using a stamping model having a circuit pattern to stamp the obtained nanofiber membrane so as to obtain the breathable and stretchable circuit capable of being activated by imprinting. The present invention ensures the breathability and the stretchability by using the nanofiber membrane. The liquid metal particles match fibers in diameter, and therefore, liquid metal in nanofibers can be overflowed by means of imprinting to form a conductive path, achieving high-precision preparation of circuits.

This method for producing an aryl-alkylated indene composition involves: adding an arylalkyl group having a polymerizable unsaturated bond-containing group to an indene compound; and adding an arylalkyl group having no polymerizable unsaturated bond-containing group to the indene compound to which the arylalkyl group having a polymerizable unsaturated bond-containing group is added.

The invention relates to the field of copper-clad plates, and discloses a low-dielectric-constant high-performance copper-clad plate and a preparation method thereof.The preparation method comprises the specific steps that epoxy resin, phenolic resin, polyphenyl ether modified resin, modified nano silicon dioxide and the like are taken and mixed to obtain a resin glue solution; impregnating glass fabric in the resin glue solution to obtain a prepreg; laminating prepregs, and covering copper foil for hot pressing; the polyphenyl ether modified resin comprises epoxy resin, diallyl cyanate and fluorine-containing polyphenyl ether resin prepared by reaction of polyphenyl ether, bisphenol AF and benzoyl peroxide; the modified nano silicon dioxide is prepared by reacting allyl glycidyl ether, vinyltriethoxysilane and phenyltris (dimethylsiloxane) silane, then grafting with a phosphorus-containing intermediate to prepare a modified additive, and grafting with nano silicon dioxide, and the phosphorus-containing intermediate is prepared by reacting phenylphosphoryl dichloride and eugenol. The copper-clad plate with high flame retardance, high peel strength, heat resistance and low dielectric constant is prepared.

The invention relates to the technical field of printed circuit boards, and discloses a circuit board structure and a preparation method thereof, and the circuit board structure comprises a copper seat, the top of which is provided with a first groove; a chip, wherein the chip is arranged in the first groove; the ceramic substrate layer is arranged at the bottom of the copper seat, and the shape of the cross section of the ceramic substrate layer is the same as that of the bottom surface of the copper seat; the copper plate layer is arranged at the bottom of the ceramic substrate layer, and the shape of the cross section of the copper plate layer is the same as that of the cross section of the ceramic substrate layer. The ceramic substrate layer and the copper plate layer are sequentially arranged at the bottom of the copper base, the thermal resistance of the chip during working can be remarkably reduced, the overall heat dissipation performance can be improved, the cross sections of the ceramic substrate layer and the copper plate layer are consistent with the bottom surfaces of the copper base and the copper plate layer in shape, and the layers are high in structural fitting degree, uniform in stress distribution and good in plate thickness consistency after lamination; and the warping problem of the copper seat caused by thermal expansion is effectively reduced.

The invention discloses a reinforced composite PCB and a preparation method thereof, and belongs to the technical field of PCB preparation. The preparation method of the reinforced composite PCB comprises the following steps: step 1, processing an inner-layer core board to obtain a preprocessed inner-layer core board; 2, cutting, drilling and activating the modified composite film to obtain a treated modified composite film; and 3, sequentially carrying out stacking, hot pressing treatment, pressure relief, cooling, drilling, hole metallization treatment, outer layer pattern transfer, pattern electroplating, outer layer etching, resistance welding, surface treatment, molding and testing on a copper foil, a prepreg, the pretreated inner layer core plate, the prepreg, the treated modified composite film, the prepreg, the pretreated inner layer core plate, the prepreg and the copper foil. And the composite PCB is obtained. The circuit board prepared by the method has excellent thermal stability and mechanical properties.

A method for producing a core substrate for wiring boards, which includes hot pressing an intermediate base material including a fiber base material and a thermosetting resin composition impregnated into the fiber base material, thereby forming a core substrate having a core portion having a first main surface and a second main surface on the rear side of the first main surface, the core portion including the fiber base material and an insulating resin layer that is the cured or semi-cured thermosetting resin composition; and planarizing at least one surface of the first main surface or the second main surface, thereby forming a flat surface.

The invention provides an embedded substrate and a manufacturing method thereof. The manufacturing method specifically comprises the following steps: forming a conduction copper column and a shielding copper column on a first circuit layer of the substrate; pressing a second dielectric layer on the first circuit layer, the conduction copper column and the shielding copper column; mounting a component on the second dielectric layer; pressing the component into the second dielectric layer to enable the shielding copper column and the first circuit layer to surround the component; pressing a fourth dielectric layer on the second dielectric layer and the component, and curing the second dielectric layer and the fourth dielectric layer; forming an outer circuit layer on the fourth dielectric layer; and the outer circuit layer is in conducting connection with the conducting copper column, the shielding copper column and the terminal of the component. The shielding copper columns can reduce the deviation of the component in the extrusion process of the component and improve the yield, five surfaces of the embedded component are all provided with metal copper, and a good electromagnetic shielding effect can be achieved. Moreover, the second dielectric layer and the fourth dielectric layer are made of high-thermal-conductivity materials, so that heat can be quickly guided into the shielding copper columns, and the heat dissipation effect is obviously improved.

To provide a resin composition enabling formation of an insulating layer having reduced dielectric tangent and suppressed warpage.SOLUTION: A resin composition comprising (A) an epoxy resin, (B) a curing agent, (C) a low-elasticity polymer, and (D) an inorganic filler, wherein the curing agent (B) includes an active ester resin containing at least one skeleton selected from the group consisting of an aliphatic hydrocarbon skeleton having 4 or more carbon atoms, a polyalkyleneoxy skeleton, a polysiloxane skeleton, and a polycarbonate skeleton.SELECTED DRAWING: None

The invention provides a titanium anode, a titanium anode preparation method, an electrolytic copper foil and application. The titanium anode comprises a titanium substrate and a composite layer on the surface of the titanium substrate. The composite layer comprises a first active layer and a second active layer which are sequentially arranged on the titanium substrate, and the first active layer is arranged on the surface of the titanium substrate; wherein the first active layer includes an oxide of titanium and an oxide of tantalum, and the second active layer includes an oxide of tantalum, an oxide of iridium, and an oxide of cerium. The titanium anode provided by the invention has the characteristics of strong binding force, few cracks, high electrocatalytic activity, good uniformity, good erosion resistance and the like, and is beneficial to prolonging the service life.

The invention relates to the technical field of circuit boards, in particular to a production method of a circuit board, which comprises the following steps of: sequentially arranging an improved layer and a copper foil layer on the surface of a copper substrate, and then carrying out hot pressing treatment on the substrate coated with the improved layer and the copper foil layer at the hot pressing temperature of 180 DEG C for 2 hours. In the production of the circuit board, the surface of the copper substrate is matched with the improved layer and the copper foil layer, and the improved layer is formed by coating an improved material obtained by blending epoxy resin, a modified filler, a nano titanium dioxide regulator and a curing agent on the surface of the copper substrate, so that the thermal conductivity, dielectric loss and wear resistance of a product are enhanced; the performance of the product is improved in a balanced and coordinated manner, and the performance stability effect of the product is remarkable under high-heat and high-humidity conditions.