3687results about "Circuit susbtrate materials" patented technology

The invention discloses a flexible circuit board made of weldable low-temperature silver paste and a preparation process of the flexible circuit board, and relates to the technical field of flexible electronic device manufacturing, and the flexible circuit board comprises a base material layer, a low-temperature weldable silver paste conductive layer and a protective layer. According to the invention, the collaborative design of the weldable low-temperature silver paste and the self-repairing protection layer is integrated, the efficient preparation of the flexible circuit board is realized through the printing technology, the weldable low-temperature silver paste breaks through the traditional high-temperature limitation, supports a wide range of substrates and can be directly welded without surface treatment, and in addition, the polyurethane protection layer containing the dynamic disulfide bond has a self-repairing function. Compared with a traditional FPC, only two core processes of printing and baking are needed, the process is greatly simplified, the equipment investment is reduced, and double reduction of the manufacturing cost and the material cost is achieved.

The invention belongs to the technical field of dielectric materials, and particularly relates to a dielectric material based on polybenzocyclobutene as well as a preparation method and application of the dielectric material. According to the multi-benzocyclobutene-based dielectric material provided by the invention, different halogenated hydrocarbon, olefin and other raw materials are used, and on the basis of containing more than two benzocyclobutene groups, a specific group can be introduced into a connecting group so as to improve the dielectric property and thermal stability of the material; meanwhile, specific groups can be introduced into R2 and R3 through secondary Heck reaction to further improve the dielectric property and thermal stability of the material, so that the dielectric material with excellent comprehensive properties such as dielectric property and thermal stability is provided, and the technical problem of lack of dielectric materials for high-frequency and high-speed printed circuit boards (PCBs) in the prior art can be solved.

Provided is an arylalkyl-modified indene composition comprising a plurality of compounds, each of the compounds having one or more arylalkyl groups on an indene ring and differing from the others in the number of arylalkyl groups in one molecule. The content of the compound or compounds having a single arylalkyl group in one molecule is 1% or less in the composition at the percentage calculated on the basis of the area ratio in a GPC chart. At least one of the arylalkyl groups present in the composition is an arylalkyl group having a polymerizable unsaturated bond-containing group, while at least one of the arylalkyl groups present in the composition is an arylalkyl group having no polymerizable unsaturated bond-containing group.

Provided is an arylalkyl-modified indene composition that contains a plurality of types of compounds having an arylalkyl group on an indene ring, the compounds having different numbers of arylalkyl groups in one molecule, wherein: the content of a compound in which the number of arylalkyl groups in one molecule is 1 is 1% or less as calculated from the area ratio of the GPC chart; at least one of the arylalkyl groups present in the composition has a polymerizable unsaturated bond-containing group; and at least one of the arylalkyl groups present in the composition does not have a polymerizable unsaturated bond-containing group.

This method for producing an aryl-alkylated indene composition involves: adding an arylalkyl group having a polymerizable unsaturated bond-containing group to an indene compound; and adding an arylalkyl group having no polymerizable unsaturated bond-containing group to the indene compound to which the arylalkyl group having a polymerizable unsaturated bond-containing group is added.

The invention relates to the technical field of printed circuit boards, and discloses a circuit board structure and a preparation method thereof, and the circuit board structure comprises a copper seat, the top of which is provided with a first groove; a chip, wherein the chip is arranged in the first groove; the ceramic substrate layer is arranged at the bottom of the copper seat, and the shape of the cross section of the ceramic substrate layer is the same as that of the bottom surface of the copper seat; the copper plate layer is arranged at the bottom of the ceramic substrate layer, and the shape of the cross section of the copper plate layer is the same as that of the cross section of the ceramic substrate layer. The ceramic substrate layer and the copper plate layer are sequentially arranged at the bottom of the copper base, the thermal resistance of the chip during working can be remarkably reduced, the overall heat dissipation performance can be improved, the cross sections of the ceramic substrate layer and the copper plate layer are consistent with the bottom surfaces of the copper base and the copper plate layer in shape, and the layers are high in structural fitting degree, uniform in stress distribution and good in plate thickness consistency after lamination; and the warping problem of the copper seat caused by thermal expansion is effectively reduced.

The invention discloses a reinforced composite PCB and a preparation method thereof, and belongs to the technical field of PCB preparation. The preparation method of the reinforced composite PCB comprises the following steps: step 1, processing an inner-layer core board to obtain a preprocessed inner-layer core board; 2, cutting, drilling and activating the modified composite film to obtain a treated modified composite film; and 3, sequentially carrying out stacking, hot pressing treatment, pressure relief, cooling, drilling, hole metallization treatment, outer layer pattern transfer, pattern electroplating, outer layer etching, resistance welding, surface treatment, molding and testing on a copper foil, a prepreg, the pretreated inner layer core plate, the prepreg, the treated modified composite film, the prepreg, the pretreated inner layer core plate, the prepreg and the copper foil. And the composite PCB is obtained. The circuit board prepared by the method has excellent thermal stability and mechanical properties.

The invention provides an embedded substrate and a manufacturing method thereof. The manufacturing method specifically comprises the following steps: forming a conduction copper column and a shielding copper column on a first circuit layer of the substrate; pressing a second dielectric layer on the first circuit layer, the conduction copper column and the shielding copper column; mounting a component on the second dielectric layer; pressing the component into the second dielectric layer to enable the shielding copper column and the first circuit layer to surround the component; pressing a fourth dielectric layer on the second dielectric layer and the component, and curing the second dielectric layer and the fourth dielectric layer; forming an outer circuit layer on the fourth dielectric layer; and the outer circuit layer is in conducting connection with the conducting copper column, the shielding copper column and the terminal of the component. The shielding copper columns can reduce the deviation of the component in the extrusion process of the component and improve the yield, five surfaces of the embedded component are all provided with metal copper, and a good electromagnetic shielding effect can be achieved. Moreover, the second dielectric layer and the fourth dielectric layer are made of high-thermal-conductivity materials, so that heat can be quickly guided into the shielding copper columns, and the heat dissipation effect is obviously improved.

A printed wiring board includes a first conductor layer, a resin insulating layer formed on the first conductor layer, a second conductor layer formed on the resin insulating layer and including a seed layer and a metal layer on the seed layer, a via conductor formed in the resin insulating layer such that the via conductor is connecting the first conductor layer and the second conductor layer, and a base layer formed on the resin insulating layer and including resin and one of iron and chromium in a range of 0.2 at % to 5.0 at % with respect to the resin such that the base layer includes part formed between the resin insulating layer and the seed layer.

The invention relates to the field of copper-clad plates, and discloses a high-performance flame-retardant low-dielectric-loss copper-clad plate and a preparation method thereof.The copper-clad plate comprises epoxy resin, benzoxazine resin, composite filler, carboxyl-terminated nitrile rubber, an active diluent, a curing agent and the like; the composite filler is prepared by compounding flame-retardant modifier grafted graphene oxide and epoxy silane modified silicon dioxide hollow spheres; according to the flame-retardant modifier, boric acid and pentaerythritol are used for preparing a double-terminal hydroxyl boron-containing intermediate, then dichlorodiphenyl silane and phenylphosphonic dichloride react with hydroxyl groups at the two ends of the intermediate to prepare a flame-retardant intermediate, and amino silane and vanillic aldehyde react with chlorine atoms at the two ends of the intermediate to prepare an aldehyde modified flame-retardant intermediate; the copper-clad plate prepared by the preparation method disclosed by the invention is low in dielectric constant and dielectric loss, high in heat conductivity coefficient and good in flexibility, and also has excellent heat resistance and flame retardance.

A printed circuit board according to an embodiment comprises: an insulating layer; a circuit pattern disposed on the upper surface of the insulating layer; a support layer which is disposed on the upper surface of the insulating layer to expose the upper surface of the circuit pattern and is in contact with the sides of the circuit pattern; and a protective layer disposed on the upper surfaces of the support layer and the circuit pattern, wherein the upper region of the insulating layer comprises a first region and a second region, and the protective layer comprises an open region exposing the upper surfaces of the support layer and the circuit pattern that are disposed in the first region, and the support layer comprises a first upper surface positioned at the highest level among the upper surfaces of the support layer and a second upper surface positioned at the lowest level among the upper surfaces of the support layer, the second upper surface being lower than the first upper surface, and the protective layer comprises a first portion which contacts the upper surface of the circuit pattern of the first region and a second portion which contacts the upper surface of the support layer of the first region, and the second portion of the protective layer contacts the second upper surface of the support layer and includes a first lower surface which is lower than the upper surface of the circuit pattern.

In order to solve the problems that an existing stretchable circuit board is large in impedance and short in service life, the stretchable circuit board comprises an elastic substrate and an elastic packaging layer, the elastic packaging layer covers the surface of one side of the elastic substrate, and the elastic packaging layer covers the surface of the other side of the elastic substrate. A fiber reinforcement area is formed on one side, facing the elastic packaging layer, of the elastic substrate, a glass fiber layer penetrating through the elastic substrate is arranged in the fiber reinforcement area, a line groove is formed in the fiber reinforcement area, the glass fiber layer partially penetrates through the line groove, the line groove is filled with a liquid metal coating, and the liquid metal coating is arranged on the elastic substrate. And a circuit pattern is formed by the liquid metal coating in the circuit groove.

Provided are a wiring substrate and a preparation method therefor, and a display apparatus. The wiring substrate comprises a base substrate, which comprises at least one bonding region and bending regions. The wiring substrate further comprises: a plurality of metal wiring layers, which are located above the base substrate; and a plurality of dielectric layers, wherein one dielectric layer is correspondingly arranged on the side of each of the plurality of metal wiring layers that is away from the base substrate, and each dielectric layer comprises an organic dielectric layer and an inorganic dielectric layer that are stacked, the orthographic projection of the organic dielectric layer on the base substrate not overlapping with the orthographic projection of the bonding region on the base substrate, and the orthographic projection of the inorganic dielectric layer on the base substrate at least partially overlapping with the orthographic projection of the bonding region on the base substrate.

A printed wiring board includes a first conductor layer, a resin insulating layer having an opening, a second conductor layer including a seed layer and an electrolytic plating layer formed on the seed layer, and a via conductor including the seed layer and the electrolytic plating layer and connecting the first conductor and second conductor layers. The seed layer has a first portion on the surface of the insulating layer, a second portion on an inner wall surface in the opening of the insulating layer, and a third portion on a portion of the first conductor layer exposed by the opening of the insulating layer such that the first portion is thicker than the second portion and the third portion, the second portion has a first film and a second film electrically connected to the first film, and a portion of the first film is formed on the second film.

The invention relates to the field of low dielectric materials, and particularly discloses a BCB-containing fluorene derivative as well as a preparation method and application thereof, and the derivative is specifically shown as follows: in substitution sites 1-10 of fluorene and / or fluorene derivative, substituent groups R1, R2, R3, R4, R5, R6, R7, R8, R9 and R10 are independently selected from at least one of hydrogen atoms, alkyl groups and aryl groups, and the substituent groups R9 and R10 comprise at least one BCB group. According to the present invention, the BCB group is introduced to the R9 and / or R10 substituent group of the fluorene and / or the fluorene derivative, such that the obtained BCB-containing fluorene derivative has characteristics of good thermal stability and low dielectric property. Meanwhile, the performance of the fluorene derivative containing BCB can be accurately optimized by flexibly regulating and controlling the types of substituent groups, the number of BCB groups on R9 and R10 substituent groups and the structure of the substituent group on the fluorenyl group, so that the problem of meeting low dielectric materials in the fields of high-performance PCBs, electronic packaging and the like in the prior art is solved.

The invention provides a preparation method of a copper-clad substrate and the copper-clad substrate. The preparation method comprises the following steps: providing a copper-clad substrate for forming an inner-layer core plate; the copper-clad substrate comprises a copper-clad plate base material and a copper foil arranged on the surface of the copper-clad plate base material; executing an interface modification process on the surface of the copper foil; forming a dry film photoetching film on the surface of the copper foil after interface modification; performing exposure and development processing on the dry film photoetching film to form a dry film photoetching film with a circuit pattern; and the dry film photoetching film is used as a mask to execute an etching process so as to form a circuit pattern on the copper-clad substrate, so that the technical effect of improving the wiring precision is realized.

The utility model provides a management function board applied to a mobile phone battery, which belongs to the technical field of mobile phone battery function boards and comprises a battery management module, a battery management module and a battery management module. An FPC flexible circuit layer and a PCB hard circuit layer; the through hole windows are formed in the upper end of the FPC flexible circuit layer, line conduction is achieved through alignment of the multiple layers of through hole windows, the overall mechanical stability of the provided mobile phone battery management function board is remarkably enhanced by adopting the integrated forming and pressing design of the FPC flexible circuit layer and the PCB rigid circuit layer, the FPC and the PCB are tightly combined through the pressing technology, and the reliability of the mobile phone battery management function board is improved. Compared with the prior art, the power management system has the advantages that the interlayer separation risk caused by long-term use or external impact is reduced, the durability and reliability of the whole power management system are improved, in addition, the high reliability of electrical connection is ensured through the accurate via hole windowing design and the SMT high-temperature processing technology, signal transmission is more stable, and power transmission is more efficient.

According to the printed circuit board and the preparation method thereof provided by the invention, the glass core plate is used for replacing a traditional resin material, and the characteristics of low thermal expansion coefficient, low humidity coefficient and low dielectric constant of the glass core plate are utilized, so that warping and signal interference caused by temperature change and environment humidity are effectively reduced, and the stability and reliability of the PCB are remarkably improved. Meanwhile, by repeatedly constructing a multilayer layer-adding structure, adopting an ABF layer at the position adjacent to the glass substrate and adopting dielectric layers with Dk < = 3.0 and Df < = 0.001 for the rest, signal attenuation and interference can be effectively reduced, signal integrity and transmission efficiency can be ensured, overall buckling deformation of the PCB structure can be reduced or even avoided, and the PCB structure is more stable in performance. The multi-layer adding meets the requirements of different application scenarios for the number of layers of the PCB, improves the flexibility and applicability of the PCB, and enables the PCB to be especially suitable for the application scenarios of high-frequency and high-speed signal transmission.

A method of the subject technology includes forming a first circuit component at a first portion of a deformable substrate and forming a second circuit component at a second portion of the deformable substrate. The method further includes electronically coupling the first circuit component and the second circuit component using traces comprising a formulation including a liquid Ga-based alloy and a metal filler.

A printed circuit board (PCB) includes a solder resist layer including at least one of an opening and a depression and a solder resist patch disposed in at least one of the opening and the depression to have an interface with the solder resist layer in at least one of the opening and the depression.

The invention discloses a copper-clad plate material containing elastomer resin and a preparation method of the copper-clad plate material, and belongs to the technical field of new materials. The method comprises the following steps: mixing a styrene-butadiene-styrene block copolymer with polybutadiene rubber, adding nano-montmorillonite, and carrying out intercalation modification through hexadecyl trimethyl ammonium bromide to prepare nano-modified elastomer resin; the preparation method comprises the following steps: mixing polybutylene terephthalate with nano silicon dioxide, and carrying out surface modification by gamma-aminopropyltriethoxysilane and hexamethyldisilazane to obtain a resin matrix; mixing the two phases, adding citric acid, and carrying out microwave heating and high-shear dispersion to obtain a discrete material; carrying out hot pressing on the dispersion, adding polyurethane and polylactic acid, uniformly mixing, adding polydimethylsiloxane and sodium dodecyl benzene sulfonate, and curing to obtain a cured product; and coating the surface of the cured product with a nano-copper layer. The material has the characteristics of high peel strength, low dielectric loss, low water absorption and low thermal expansion, and is suitable for the field of high-speed low-loss copper-clad plates.

To provide polyimide which is excellent in dimensional accuracy at high temperature while securing transparency, a method for producing a polyimide film, and a method for manufacturing a metal-clad laminate.SOLUTION: When a polyimide film is obtained by preparing a mixed solution containing a tetracarboxylic acid anhydride component, a diamine component, and an organic solvent, reacting the mixture and obtaining a solution of a polyamide acid, coating the solution onto a base material, drying the solution and obtaining a resin film, heat treating the resin film and imidizing the resin film, when the polyimide film is obtained by using a solvent containing a predetermined aprotic polar solvent and a predetermined amount of water as the organic solvent contained in the mixed solution, total light transmittance is 85% or more, polyimide having a thermal decomposition temperature (Td0.5) showing decrease in a weight of 0.5% of 460°C or higher is obtained.SELECTED DRAWING: None

A resin film (100) comprising a core layer (2) and adhesive resin layers (1) which are respectively provided to both sides of the core layer (2), wherein: the adhesive resin layers (1) each comprise an adhesive resin composition that contains an epoxy resin; the dielectric breakdown strength of a cured product of the adhesive resin composition is not less than 300 kV / mm; the core layer (2) comprises a polyimide film; and the dielectric breakdown strength of the polyimide film is not less than 300 kV / mm.

To provide a solid composition which achieves both a low dielectric constant and a low coefficient of linear expansion.SOLUTION: A solid composition contains a fluorine resin, and a fibrous anisotropic filler, where a reduction rate of a coefficient of linear expansion at 20°C to 200°C of the solid composition to a coefficient of linear expansion at 20°C to 200°C of the fluorine resin is 50% or more.SELECTED DRAWING: None

A strain gauge includes a flexible substrate, a resistor, and electrodes. Each electrode includes first patterns juxtaposed at predetermined intervals and electrically connected to each other. Second patterns of which longitudinal directions are toward a same direction as a longitudinal direction of each of the first patterns are disposed between opposing electrodes. The second patterns are electrically floating dummy patterns. The second patterns of which the longitudinal directions are toward a same direction as the longitudinal direction of each first pattern are disposed, the second patterns being interposed between first patterns opposite each other that are among given first patterns that constitute one of the electrodes and given first patterns that constitute another electrode. The plurality of second patterns are interposed between first patterns opposite each other that are among given first patterns that constitute one of the electrodes and given first patterns that constitute another electrode.

The present invention describes an electrical insulation material comprising syndiotactic polystyrene, beta-polypropylene particles, and / or beta-polypropylene fibers. Furthermore, an electronic component comprising at least one electrical insulation material according to the present invention and the use of the electrical insulation material are disclosed.

To provide a wiring circuit board capable of increasing rigidity of a wiring part in a thickness direction while allowing movement of the wiring part in a second direction.SOLUTION: The wired circuit substrate 1 includes a wired portion 3A and a supporting portion 3A supporting one end portion of the wired portion 2A. The interconnection part 3A includes a first insulating layer 12, an interconnection 133A, a metallic support layer 11, and a covering layer 15. The covering layer 15 has a first portion 151 covering the side S1 of the metallic support layer 11 and a second portion 152 covering the other side S2 of the metallic support layer 11 in the thickness direction. The thickness T12 of the second portion 152 is larger than the thickness T11 of the first portion 151.SELECTED DRAWING: Figure 2

The invention provides a low-dielectric high-toughness alkali-free spherical glass powder modified copper-clad plate. The low-dielectric high-toughness alkali-free spherical glass powder modified copper-clad plate consists of a composite resin matrix, modified alkali-free spherical glass powder, a synergistic functional filler, an auxiliary agent, a reinforced base material and a conductive layer, the modified alkali-free spherical glass powder is subjected to gradient treatment of plasma activation, silane grafting and organic silicon coating, the particle size of the modified alkali-free spherical glass powder is 0.5-2 microns, the modified alkali-free spherical glass powder accounts for 10-20 parts by weight in the raw materials, and the content of organic functional groups on the surface of the modified alkali-free spherical glass powder is larger than or equal to 1.6 mmol / g.The invention further provides a preparation method of the low-dielectric high-toughness alkali-free spherical glass powder modified copper-clad plate. Compared with the prior art, the preparation method has the following beneficial effects that a double-resin blending and elastomer toughening system is constructed through a modification process of filler activation, silane grafting and organic silicon coating, and the technical bottleneck is solved in combination with an interface compatibility technology.

To highly accurately calculate a lamination deviation amount between two layers of a laminated sheet body.SOLUTION: The sheet body 2 has a first sheet body 3 and a second sheet body 4 which are alternately laminated. The first sheet body includes a first mark 3334 and first through-holes 30c, 30d. The second sheet body includes a second mark 4344 and second through-holes 440c, 40d. The first marker is formed such that the first direction D1 can be specified. The second mark is formed so that the second direction D2 can be specified. When the first sheet element is accurately stacked on the second sheet element, the second mark is located at a predetermined second ideal position with respect to the first mark. When the second sheet element is accurately stacked on the first sheet element, the first mark is located at a predetermined first ideal position with respect to the second mark. In the upward view, the positional relationship between the position of the first marker and the second ideal position with respect to the first direction coincides with the positional relationship between the position of the second marker and the first ideal position with respect to the second direction.SELECTED DRAWING: Figure 6

To provide a fixing structure of an insulating sheet in which the number of components and the number of assembling steps are small and fixing force is hardly reduced by heat, vibration, or the like, and to provide an insulating sheet capable of easily achieving the fixing structure of the insulating sheet, and a manufacturing method capable of easily manufacturing the fixing structure of the insulating sheet.SOLUTION: An insulating sheet according to the present invention is an insulating sheet that is fixed to an object to be protected and insulates and protects the object to be protected, the insulating sheet including a flat plate portion that is made of a resin material and extends in a flat plate shape, and a protruding molded portion that is molded so as to protrude in a protruding shape from the flat plate portion, in which an outer surface of the protruding molded portion includes an enlarged diameter portion that is enlarged in diameter from a base end portion toward a tip end portion of the protruding molded portion.SELECTED DRAWING: Figure 1