27 results about "Stretchable electronics" patented technology

This invention discloses a stretchable electronic device, including a first reflective panel. The first reflective panel includes a first substrate, a second substrate, a first liquid crystal layer, a first sealant, and a first material layer. The first substrate has at least one first opening. The second substrate is positioned opposite the first substrate. The first liquid crystal layer is disposed between the first substrate and the second substrate. The first sealant is disposed between the first substrate and the second substrate and adjacent to the first liquid crystal layer. The first material layer is disposed in at least one first opening, wherein the material of the first material layer is different from the material of the first substrate.

The present invention relates to an ink composition, a kit comprising components of the ink composition, a method of manufacturing a deformable conductor utilizing the ink composition, a deformable conductor obtainable by the method, an electronic device, in particular a wearable and / or stretchable electronic device, comprising the deformable conductor, a method of manufactuing a conductor, a conductor obtainable by the method and an electronic device comprising the conductor. The ink composition comprises a source of transition metal ions, a reducing agent and a polymer and / or a polymer precursor, the polymer precursor comprising a polymerizable terminal multiple bond. The method of manufacturing a deformable conductor comprises the steps of applying the ink composition on at least a part of a surface of a deformable substrate and thermally treating and / or irradiating the ink composition.

According to an aspect, a stretchable device includes: a resin base member; and a strain gauge, a signal line, and an output line stacked on the resin base member. The resin base member includes: a plurality of bodies disposed separately from each other; and a plurality of hinges that couple the bodies adjacently disposed while meandering in an intersecting direction intersecting an imaginary line that couples the bodies adjacently disposed. The hinges include a first hinge and a second hinge that couple the bodies adjacently disposed. A meander length of the second hinge in the intersecting direction is longer than a meander length of the first hinge in the intersecting direction. The strain gauge is provided to the first hinge. The signal line and the output line are provided to the second hinge.

The invention discloses a flexible array type stretchable electronic skin and a preparation method thereof, is used for collecting surface electromyogram signals of a human body, and relates to the technical field of flexible electronics and bioelectricity detection. The stretchable electronic skin comprises a supporting layer, a substrate layer, an electromyographic signal transmission layer and a hydrogel interface layer, the supporting layer is made of a single-sided viscous material with certain physical rigidity and provides necessary structural rigidity; the substrate layer and the supporting layer are bonded and fixed; the electromyographic signal transmission layer is adhered to the surface of the substrate layer, and the electromyographic signal transmission layer is made of a flexible PCB (Printed Circuit Board) material; the hydrogel interface layer is arranged on the surface of an electrode contact of the electromyographic signal transmission layer and serves as a conducting medium between the electronic skin and the human epidermis. The electronic skin provided by the invention has good myographic signal to noise ratio, reusability, fitting performance and tensile property.

The present application relates to a stretchable electronic device and a manufacturing method thereof. The stretchable electronic device can overcome a trade-off between a light-emitting area and a maximum tensile ratio of a two-dimensional stretchable display, and exhibit a high tensile ratio while having excellent initial-driving performance. In addition, the stretchable electronic device can be applied to various electronic elements by excluding high-temperature and wet processes of a conventional three-dimensional stretchable display technology. The stretchable electronic device according to one embodiment of the present invention comprises: an elastic substrate; an adhesive layer disposed on the elastic substrate; an anti-adhesive layer disposed on the adhesive layer so as not to cover the edge of the adhesive layer; a plurality of islands disposed on the adhesive layer and the anti-adhesive layer so as to be spaced apart from each other; and interconnectors for connecting the plurality of islands.

Disclosed are processes and materials for adhesive circuit patterning which strengthen and protect printed circuit traces and adhesive bonded joints of surface mounted devices in flexible or stretchable electronics in a single process. A method for adhesive circuit pattering include deposing a circuit pattern directly on a single thermal adhesive film, placing one or more surface mounted devices on a cured deposed circuit of the deposed circuit pattern, curing the one or more surface mounted devices and the cured deposed circuit together to form an assembled deposed circuit, placing the assembled deposed circuit on a stretchable substrate, and melting the single thermal adhesive film directly onto the assembled deposed circuit and the stretchable substrate to reinforce joint bonds of the assembled deposed circuit and to attach the assembled deposed circuit to the stretchable substrate.

The invention discloses an anisotropic conductive stretchable electronic solder and a preparation method and application thereof, the stretchable electronic solder comprises a polymer adhesive and a silver nanosheet, and the mass ratio of the polymer adhesive to the silver nanosheet is (5-20): 1; the high-molecular adhesive is obtained by heating bisphenol A diglycidyl ether, polyethylene glycol diglycidyl ether and furfuryl amine at 40-60 DEG C to react, and then heating with N, N '-(4, 4'-methylene diphenyl) bismaleimide at 60-80 DEG C to react. According to the anisotropic conductive stretchable electronic solder provided by the invention, by virtue of excellent flexibility and stretchability endowed by the dynamic chemical polymer adhesive, the problem of stress concentration caused by physicochemical property difference of a soft / hard base material can be effectively counteracted, stable connection of an electrical interface is always kept in a stretching deformation process, and the reliability of the electronic solder is improved. Universal welding of flexible, stretchable and rigid materials and devices is successfully achieved.

A method for fabricating a flexible or stretchable printed circuit includes providing a substrate including a polyethylene terephthalate (PET) support layer, a thermoplastic urethane (TPU) layer, and a hot melt adhesive (HMA) disposed between the PET and TPU layers, pre-shrunk processing the substrate, printing a resistive layer on the TPU layer of the substrate, printing an insulating layer on the resistive layer, removing the PET support layer, and transferring a portion of the substrate to the flexible or stretchable layer.

The application discloses a stretchable transparent electrode and a preparation method thereof. The stretchable transparent electrode comprises an elastic substrate and a multilayer layout flexible transparent conductive film; the multilayer layout flexible transparent conductive film is a double-layer conductive polymer film which is surface-modified, and a layer of conductive metal network is deposited on the surface-modified layer; the surface modification is to spin a layer of hydrophobic material on the surface of the double-layer conductive polymer film. The preparation method of the stretchable transparent electrode comprises the following steps: spin-coating a double-layer conductive polymer on a substrate; chemically modifying the double-layer conductive polymer; printing a conductive metal network on the double-layer conductive polymer; and transferring the double-layer conductive polymer / conductive metal network to the elastic substrate to obtain the stretchable transparent electrode. The stretchable transparent electrode prepared by the method has excellent photoelectric performance and excellent stretchability, and has a wide application prospect in the field of flexible stretchable electronic devices.

The invention relates to a flexible transparent electrode with an embedded periodic conductive structure and a preparation method of the flexible transparent electrode. The flexible transparent electrode comprises a flexible stretchable transparent elastomer substrate and a periodic patterned conductive micro-nano structure embedded into the elastomer substrate, the conductive micro-nano structure is an integrated structure which is formed by directly constructing conductive ink in a liquid elastomer substrate through a micro-nano printing technology and curing the conductive ink, the flexible transparent electrode has the characteristics of high conductivity, high light transmittance and high stretchability, the sheet resistance of the electrode can be less than 300 omega / sq, the light transmittance at the wavelength of 550 nm is more than 75%, the resistance change rate is less than 18% after circulation for 100 times under 50% tensile strain, and the flexible transparent electrode has the characteristics of high conductivity, high light transmittance and high stretchability. According to the preparation method, digital printing and liquid environment in-situ forming are combined, the conductive structure can be accurately regulated and controlled, the method is simple and suitable for large-area preparation so as to replace an indium tin oxide ITO transparent electrode, and a feasible path is provided for large-area and low-cost production of high-performance stretchable electronic devices.

The capillary transfer technology presented here represents a powerful approach to transfer soft films from surface of liquid onto a solid substrate in a fast and defect-free manner. The fundamental theoretical model and transfer criteria validated with comprehensive experiments and finite element analyses, for the first time provides a quantitative guide and optimization for the choice of material systems, operating conditions and environments for scalable on-demand transfers with high yield. The intrinsically moderate capillary transfer force and externally selectable transfer direction offer robust capabilities for achieving deterministic assembly and surface properties of structures with complex layouts and patterns for potentially broad applications in the fabrication of flexible / stretchable electronics, surface wetting structures and optical devices. Integration of this technology with other advanced manufacturing technologies associated with material self-assembly, growth and layout alignment represents promising future topics and would help create emerging new manufacturing technologies that leverage unique fluidity of liquid environments.

The application discloses a kind of high tensile high conductive hydrogel with layered structure and its preparation method and application.The method mixes PVA, PEDOT:PSS with EGaIn microparticles, and is prepared by the way of gravity settlement and electrostatic adsorption auxiliary settlement, and the hydrogel with layered structure is obtained.By controlling the proportion of PVA, PEDOT:PSS solution and EGaIn microparticles, the conductive hydrogel with layered structure prepared shows good conductive capacity and mechanical behavior, and can work normally under larger strain and stress conditions, and has wide application prospect in the field of flexible stretchable electronic devices.

The invention discloses an organic thin film transistor with a stretchable structure and a preparation method of the organic thin film transistor, and a semiconductor channel layer of the organic thin film transistor is of a monolithic integrated structure and is patterned into a preset two-dimensional microstructure through micro-nano processing. Through the structural design, when the device bears macroscopic stretching, strain is mainly dissipated through geometric deformation modes such as rigid body displacement, rotation or out-of-plane buckling of a solid area of the semiconductor, so that the maximum stretching strain of the material is far lower than the elastic limit of the material. According to the scheme, the electrical property of the material and the mechanical property of the device are successfully decoupled, and the device with excellent stretchability (gt; 100%) and high cycle stability is allowed to be constructed by adopting a high-performance but rigid semiconductor material. The process is simple, and an effective way is provided for low-cost manufacturing of high-performance stretchable electronic devices.

The application discloses a battery encapsulated by liquid metal and a preparation method. The battery comprises an encapsulation shell and an energy storage inner core wrapped in the encapsulation shell. Both the encapsulation shell and the energy storage inner core are flexible and stretchable. Liquid metal is filled into a gap between the encapsulation shell and the energy storage inner core to seal the energy storage inner core. An inner surface of the encapsulation shell is provided with a support array structure facing the energy storage inner core, and / or an outer surface of the energy storage inner core is provided with a support array structure facing the encapsulation shell. The energy storage device encapsulated by the liquid metal has good stability in a stretching process, and has great development potential as a power component of a stretchable electronic device.

The application discloses anisotropic conductive stretchable electronic solder as well as a preparation method and application thereof, the stretchable electronic solder comprises a polymer binder and silver nanosheets, and the mass ratio of the polymer binder to the silver nanosheets is (5-20):1; the polymer binder is obtained by heating reaction of bisphenol A diglycidyl ether, polyethylene glycol diglycidyl ether and furfurylamine at 40-60 DEG C, and then heating reaction of N,N'-(4,4'-methylene diphenyl) bismaleimide at 60-80 DEG C. The anisotropic conductive stretchable electronic solder provided by the application can effectively offset the stress concentration problem caused by the difference in physical and chemical properties of soft / hard substrates, and ensure that the electrical interface always maintains stable connection in the stretching deformation process, and successfully realizes the universal welding of flexible, stretchable and rigid materials and devices.

Devices and methods relating to stretchable electronics. A stretchable electronic film includes an insulating polymer and less than 1 wt % of a semiconducting polymer. Manufacturing a multi-layered, stretchable electronic device characterized by a single peel-off step for integrating the components of the device rather than a multi-peel synthesis of the device.

A stretchable electronic device includes a first reflective panel. The first reflective panel includes a first substrate having at least one first opening, a second substrate opposite to the first substrate, a first liquid crystal layer disposed between the first substrate and the second substrate, a first frame glue disposed between the first substrate and the second substrate and adjacent to the first liquid crystal layer, and a first material layer disposed in the at least one first opening. A material of the first material layer is different from a material of the first substrate.

An electronic device (10, 10A, 10B, 10C, 10D, 10E, 10F, 10G, 10H) comprises a stretchable electronic component layer (110), a decorative component layer (120), a transparent hardboard layer (160, 160B, 160D), and an upper hardboard layer (170, 170B, 170D, 170E). The stretchable electronic component layer (110) has a stretchable zone (110a), a first non-stretchable zone (110n-1), and a second non-stretchable zone (110n-2). The stretchable zone (110a) is located between the first non-stretchable zone (110n-1) and the second non-stretchable zone (110n-2). The decorative component layer (120) is arranged on the stretchable electronic component layer (110). The transparent hardboard layer (160, 160B, 160D) is embedded or buried in the decorative component layer (120) and overlaps with the first non-stretchable zone (110n-1) of the stretchable electronic component layer (110).The upper hardboard layer (170, 170B, 170D, 170E) is embedded in or buried within the decorative component layer (120) and overlaps with the second non-stretchable zone (110n-2) of the stretchable electronic component layer (110).

The invention belongs to the field of preparation of stretchable conductor materials, and provides a stretchable conductor material for 3D printing of vertical interconnection wires in multilayer stretchable electronics and a preparation method thereof.The preparation method comprises the steps that an elastomer matrix, an inhibitor, a coupling agent and a rheology modifier are mixed to be uniform, then a flow promoter is added, the mixture is mixed to be uniform and subjected to synchronous vacuum defoaming, and the stretchable conductor material is obtained; an organic carrier is obtained; adding the flocculent silver particles into a dispersing agent, and performing ultrasonic dispersion to obtain flocculent silver particle dispersion liquid; uniformly mixing the organic carrier and the flocculent silver particle dispersion liquid, and performing two-stage stirring and synchronous vacuum defoaming to obtain a stretchable conductor material; wherein the boiling point range of the dispersing agent is 60-100 DEG C, and the dispersing agent and the organic carrier are mutually soluble; and the flocculent silver particles account for 50-80% of the mass fraction of the stretchable conductor material. The prepared silver-based stretchable conductor material has high conductivity, high stretchability, low electrical hysteresis and low-temperature curing performance, stretchable VIA direct forming can be achieved through a direct-writing 3D printing process, and the silver-based stretchable conductor material is particularly suitable for electrical interconnection between different functional layers in a multi-layer stretchable electronic device. The stretchable conductor material is mainly composed of an elastomer matrix, a conductive filler, a rheology modifier, a silane coupling agent, a flow promoter, an inhibitor and the like.

This invention discloses a mechanically interlocked polymer-reinforced and toughened titanium carbide thin film material, its preparation method, and its applications, relating to the fields of synthetic chemistry and nanocomposite material preparation. By reacting mechanically interlocked molecules with a copolymer and further bridging them onto the surface of a titanium carbide thin film, the titanium carbide thin film is reinforced and toughened by utilizing the controllable intramolecular motion mechanism of the mechanically interlocked molecules, such as sliding, rotation, and translation. In particular, the prepared titanium carbide thin film exhibits excellent stretchability, especially maintaining stable conductivity even during repeated stretching, making it suitable for applications in stretchable electronics, such as flexible electronic products, wearable smart devices, and wearable rehabilitation devices.

The application provides a preparation method of a stretchable polymer nanowire transistor and photoelectric application thereof, and belongs to the field of stretchable electronic devices. The transistor adopts a bottom gate top contact or bottom gate bottom contact structure, is composed of a stretchable substrate, a gate, an insulating layer, a semiconductor layer and source-drain electrodes, and the semiconductor layer is a polymer nanowire prepared by coaxial fluid jet printing of a conjugated polymer and elastomer polymer blended solution. The method realizes preparation of nanowires with high stretchability and high orientation, so that the semiconductor layer has excellent stretchability and electrical properties. Through horizontal and vertical integration, a stretchable complementary inverter and a visual self-adaptive device are constructed, and the advantages of multifunctional integration are exhibited. The application has wide application prospects in the development of miniaturized, highly integrated wearable electronic devices and multifunctional neural interfaces.

A stretchable electronic device includes an array including at least two islands spaced apart from each other to dispose a device, and an interconnector to perform a stretchable action between the islands, and an external connection to apply an electrical signal to the array.

The embodiment of the invention provides soft and hard dual-packaging electronic equipment, and the equipment comprises a soft housing which is elastic and is internally provided with a cavity; the electronic mechanism is arranged in the cavity, the electronic mechanism comprises a hard mounting plate, an electronic element and an elastic substrate, the rigidity of the hard mounting plate is greater than that of the soft mounting shell, the elastic substrate has elasticity, an elastic circuit is arranged on the elastic substrate, the elastic substrate comprises a first surface and a second surface which are arranged back to back, and the first surface and the second surface are opposite to each other. The plurality of electronic components are arranged on the first surface, the electronic components are electrically connected with the circuit, the plurality of hard mounting plates are fixedly arranged on the second surface, the hard mounting plates and the electronic components are in one-to-one correspondence, the plurality of hard mounting plates on the same elastic substrate are arranged at intervals, the projections of the electronic components along the first direction are on the hard mounting plates, and the first direction is the orientation direction of the second surface. Through the structural design, faults of electronic components in the soft shell can be effectively avoided, the mechanical integrity of the stretchable electronic equipment is improved, and the service life of the stretchable electronic equipment is prolonged.

An electronic device includes a stretchable electronic component layer and a decorative component layer. The decorative component layer includes a first sub-layer and a second sub-layer. The first sub-layer is disposed on the stretchable electronic component layer. The second sub-layer is disposed on the first sub-layer. The first sub-layer is located between the second sub-layer and the stretchable electronic component layer. The second sub-layer has a decorative texture. A transmittance of the first sub-layer is less than a transmittance of the second sub-layer.

Disclosed are processes and materials for adhesive circuit patterning which strengthen and protect printed circuit traces and adhesive bonded joints of surface mounted devices in flexible or stretchable electronics in a single process. A method for adhesive circuit pattering include deposing a circuit pattern on a thermal adhesive film. One or more surface mounted device(s) are attached to a cured printed circuit to form an assembled printed circuit. The assembled printed circuit may be placed on a stretchable substrate. The thermal adhesive film is melted on the assembled printed circuit and the stretchable substrate to protect and reinforce joint bonds and the circuit pattern of the assembled circuit pattern and attach the assembled printed circuit to the stretchable fabric in one melting or curing step.

The invention provides an optical genetic stimulation probe which comprises a mu LED and a lead. The lead comprises two metal wires which are respectively connected with the positive electrode and the negative electrode of the mu LED, and the surfaces of the metal wires are covered with insulating coatings; the two metal wires are wrapped in the flexible insulating layer and are of a three-dimensional spiral structure in the same direction in the flexible insulating layer. According to the invention, a three-dimensional (3D) spiral stretchable electronic interconnection structure is innovatively adopted, the device is endowed with excellent flexibility and tensile property, the device can still maintain stable and reliable working performance even though the device experiences 60% of repeated tensile deformation, and the tensile limit of a traditional two-dimensional structure is effectively broken through.

Disclosed are processes and materials for adhesive circuit patterning which strengthen and protect printed circuit traces and adhesive bonded joints of surface mounted devices in flexible or stretchable electronics in a single process. A method for adhesive circuit pattering include deposing a circuit pattern directly on a single thermal adhesive film, placing one or more surface mounted devices on a cured deposed circuit of the deposed circuit pattern, curing the one or more surface mounted devices and the cured deposed circuit together to form an assembled deposed circuit, placing the assembled deposed circuit on a stretchable substrate, and melting the single thermal adhesive film directly onto the assembled deposed circuit and the stretchable substrate to reinforce joint bonds of the assembled deposed circuit and to attach the assembled deposed circuit to the stretchable substrate.