The embodiment of the invention provides a three-dimensional sensor and a preparation method thereof, and relates to the technical field of
stretchable electronics. The three-dimensional sensor comprises a first layer structure, a
dielectric layer and a second layer structure which are stacked in sequence. In the first layer structure, the first flexible areas and the first rigid areas are alternately arranged in the first direction, the first strain sensing
layers are arranged on the sides, close to the second layer structure, of the first flexible areas, and the first
electrode layers are arranged on the sides, close to the second layer structure, of the first rigid areas. In the second-layer structure, the second flexible areas and the second rigid areas are alternately arranged in the second direction, the second strain sensing
layers are arranged on the sides, close to the first-layer structure, of the second flexible areas, and the second
electrode layers are arranged on the sides, close to the first-layer structure, of the second rigid areas. The first strain sensing layer is used for detecting stress in a first direction, the second strain sensing layer is used for detecting stress in a second direction, and the first
electrode layer and the second electrode layer are used for detecting
capacitance change so as to realize
pressure detection, so that three-dimensional detection is realized.