468 results about "Integrated manufacturing" patented technology

In the manufacturing technology of an integrated MEMS in which a semiconductor integrated circuit (CMOS or the like) and a micro machine are monolithically integrated on a semiconductor substrate, a technology capable of manufacturing the integrated MEMS without using a special process different from the normal manufacturing technology of a semiconductor integrated circuit is provided. A MEMS structure is formed together with an integrated circuit by using the CMOS integrated circuit process. For example, when forming an acceleration sensor, a structure composed of a movable mass, an elastic beam and a fixed beam is formed by using the CMOS interconnect technology. Thereafter, an interlayer dielectric and the like are etched by using the CMOS process to form a cavity. Then, fine holes used in the etching are sealed with a dielectric.

Radio frequency identification (RFID) tags and processes for manufacturing the same. The RFID device generally includes (1) a metal antenna and/or inductor; (2) a dielectric layer thereon, to support and insulate integrated circuitry from the metal antenna and/or inductor; (3) a plurality of diodes and a plurality of transistors on the dielectric layer, the diodes having at least one layer in common with the transistors; and (4) a plurality of capacitors in electrical communication with the metal antenna and/or inductor and at least some of the diodes, the plurality of capacitors having at least one layer in common with the plurality of diodes and/or with contacts to the diodes and transistors. The method preferably integrates liquid silicon-containing ink deposition into a cost effective, integrated manufacturing process for the manufacture of RFID circuits. Furthermore, the present RFID tags generally provide higher performance (e.g., improved electrical characteristics) as compared to tags containing organic electronic devices.

The invention relates to a three-dimensional printing method and device for tissue/organ chip integrated manufacturing. The three-dimensional printing method comprises the following steps: (1), designing the three-dimensional structural drawing of a three-dimensional chip, and converting the three-dimensional structural drawing into a slice layer graphic file format; (2), starting a three-dimensional printing device, and absorbing printing ink into all spraying heads; leading in slice layer graphic files; (3),respectively printing a main body material printing ink, a sacrificial material printing ink and different cell printing ink into pre-designed positions of a bottom plate system through the three-dimensional printing device; (4), repeating the step (3) and accomplish printing of a three-dimensional chip structure layer by layer and in an accumulating manner until the printing to a slice layer graphic file is finished; (5), heating or refrigerating the three-dimensional chip integrally printed, so as to enable a channel sacrificial material to be changed into a sol state; (6), using a pipette to absorb the channel sacrificial material in the sol state, removing the channel sacrificial material, and forming an integrated three-dimensional chip structure; (7), carrying out crosslinking on the cell printing ink material not molten, and carrying out culture medium perfusion.

The invention discloses a broadband wave-absorbing material and a preparation method thereof. The broadband wave-absorbing material is composed of a low frequency wave-absorbing material bottom layer and a high frequency wave-absorbing material surface layer. The high frequency wave-absorbing material surface layer comprises a plurality of high frequency wave-absorbing layers with different concentrations. FeSi or FeSiAl particles are taken as the additive of the low frequency wave-absorbing material, and carbonyl iron particles are taken as the additive of the high frequency wave-absorbing material. A rolling method is adopted to prepare the low frequency wave-absorbing material bottom layer, and a three-dimensional moulding technology is adopted to prepare the high frequency wave-absorbing material surface layer. The multilayer lamination manufacturing method combines a multi-rolling technology and three-dimensional moulding together and has the advantages that the binding force between layers can be ensured, multiple repeated mould pressing is avoided, the thickness of each layer, the internal structure, and particle distribution can be adjusted so as to satisfy the predetermined electromagnetic property requirements; the broadband wave-absorbing performance of the wave-absorbing material and designable performance of a shielding material can be realized; the integrated manufacturing of space structure of the wave-absorbing material is achieved, and the preparation cost is low at the same time.

A consolidated plan splitting methodology sends distribution orders to a distribution execution system and planned production to a manufacturing execution system. Instructions from the planning system involving only movements of inventory within the distribution s system (e.g., warehouse to warehouse transfers) are passed directly to the distribution execution system. Instructions from the planning system involving movements of inventory where either the source or destination is in the manufacturing system causes a splitter located between the planning system and the distribution and manufacturing execution systems to carry out a decisional process wherein the movement of inventory is broken down into a selected number of distinct intermediate legs. Control of inventory balances is passed between the distribution and manufacturing execution systems as appropriate as the inventory moves from one execution system to another.

An integrated manufacturing and a maintenance system include a metrology device and a CAD system which has access to parametric data from the metrology device, said “as-built” data being used by the CAD system to morph a CAD model reflecting the “as-built” data, which can be used in manufacturing and aftermarket support.

The invention discloses a multi-material composite 3D printer and a working method and application of the multi-material composite 3D printer. The multi-material composite 3D printer comprises a base which is provided with a working table and a rack, the working table is provided with a printing bed for supporting a printed object, the rack is at least fixedly provided with a first spray head, a second spray head and a third spray head, and the first spray head, the second spray head and the third spray head are all located above the printed object; the first spray head is a multi-material active mixing spray head, the second spray head comprises a micro injector material barrel and an electric conduction spray nozzle arranged at the lower portion of the micro injector material barrel, and the third spray head at least comprises two fusion deposition spray heads, wherein one fusion deposition spray head is used for printing structural materials, and the other fusion deposition spray head is used for printing supporting materials; and electric conduction spray nozzles of the first spray head and the second spray head are both connected with the positive pole of a power source, and the printing bed is connected with the negative pole of the power source. Multi-material and multi-scale complex structure integrated manufacturing is achieved, the structural materials and functional materials are integrally printed, and the technical bottleneck for limiting integrated manufacturing of materials, structures and devices is broken through.

The invention relates to an integrated loudspeaker, a sound box manufactured by the same and a manufacturing method. The integrated loudspeaker comprises at least one horn system, at least one passive sound effect device and an integrated shell, wherein the integrated shell is provided with a vibration cavity, when the horn system receives an audio signal to produce vibration, air inside the vibration cavity is driven to vibrate, and the air inside the vibration cavity is further vibrated by the passive sound effect device, so that the horn system and the passive sound effect device vibrate together to produce a sound effect. The integrated loudspeaker is small in size, thin in thickness, simple in structure and capable of enhancing the bass. In order to guarantee the quality sound quality effect, an embedded and ejection integrated manufacturing technology is adopted, so that the sound quality effect can be maximally guaranteed, the working hours can be greatly reduced, and the production efficiency can be increased.

A single, flexible, robust and low rate capable manufacturing platform that may be associated with caseless munitions firing circuits, nano and microelectromechanical (“NEMS” and “MEMS”) devices, and/or fractal antennas is described. The platform may be designed for extensive research and development in printed electronics, 3D thermo-plastics and low melt metal casting, light machining, and other processing operations necessary for the integrated fabrication of various components, such as caseless munitions components. The platform may be used in a remote location.

The invention discloses an electromagnetic flexible composite fused deposition direct preparation forming method for a gradient part. The method comprises the following steps of 1, building a model, wherein functionally graded material CAD/CAM software is applied to build a geometric three-dimensional part model, and material gradient distribution and tissue gradient distribution are determined in the geometric three-dimensional model to form a space comprehensive model; 2, cutting the model into slices and generating numerical control codes, wherein layering and slicing processing is performed on the space comprehensive model formed in the step 1, and numerical control codes are generated; 3, obtaining a reverse solution for electromagnetic characteristics, wherein the reverse solution for externally-added magnetic pole distribution and exciting current characteristics is obtained; 4, performing fused deposition formation, wherein magnetic poles and/or electromagnetic coils are arranged, and fused deposition formation is performed layer by layer. According to the electromagnetic flexible composite fused deposition direct preparation forming method, the CAD/CAM software is adopted for determining the part organization and the material gradient distribution; with the combination of electricity-magnetism-heating power multi-physical field coupling control, integrated manufacturing of the gradient organization and gradient material part shape and microstructure is achieved.

The present invention discloses an integrated manufacturing apparatus for hydrogen-enriched water. The apparatus comprises a drinking cup, wherein a first water filling opening and a second water filling opening are formed at the upper end of the drinking cup, a first water reservoir which is communicated with the first water filling opening and a second second water reservoir which is communicated with the second water filling opening are arranged inside the drinking cup. The second reservoir is an "L"-shaped cavity consisting of a longitudinally extending cavity that extends downwardly from the second water filling opening and a transversely extending cavity that extends transversely from the lower portion of longitudinally extending cavity. The first water reservoir is located at the top of the transversely extending cavity, a cation-exchange membrane is arranged between the first water reservoir and the transversely extending cavity. A cathodic electrolysis plate and an anode electrolysis plate are separately arranged above and under the cation-exchange membrane, and the cathodic electrolysis plate and the anode electrolysis plate are separately located inside the first water reservoir and the transversely extending cavity. In the present invention, the drinking cup is integrally designed internally, so that secondary pollution which may be generated is avoided, the service life of the electrolytic plate is prolonged, and the phenomenon of dripping water is avoided.

The invention discloses a mini-type electromagnetism low frequency energy collector in the field of electronic component which comprises a libration pick up structure, a support structure and a micro-coil structure. The libration pick up structure comprises a metal plane spring and a permanent magnet. The metal plane spring comprises four square spirality elastic arms and a metal platform. The permanent magnet is arranged at the metal platform. The micro-coil comprises a micro-coil winding and an insulated underlay. The metal plane spring and the support structure are integrated as a whole. The libration pick up structure and the support structure are at the micro-coil. The libration pick up structure of the utility model has a natural frequency near to 100 HZ and is easy to satisfy the integrated requirements such as improvement of the low frequency energy collecting efficiency, low production cost and integrated production.

The invention discloses a high-performance micro electromagnetic vibration energy harvester easy for integrated manufacturing, which comprises a substrate, an insulating layer, a coil, electrodes, spring platforms, support seats and a permanent magnet. The harvester is characterized in that the coil is attached to a surface of the substrate, the head and the tail of the coil are respectively connected with two electrodes, the upper surface of the substrate is covered by the insulating layer, the coil is cladded inside the insulating layer, and the two electrodes are arranged on the insulatinglayer; and a plurality of support seats are attached to the upper surface of the insulating layer and are provided with the spring platforms, the spring platforms are arranged right above the coil, gaps exist between the spring platforms and the coil, and the spring platforms are fixedly connected with the permanent magnet. The invention realizes high integrated manufacturing of the harvester; atthe same time, the permanent magnet obtained by duplication via a micro die has higher thickness and magnetic property compared with a galvanized or sputtering permanent magnet material, thus vibrational energy can be more effectively converted into electrical energy.

A bistable electromagnetic microdriver is structurally characterized by that a pair of permanent-magnet bases are symmetrically arranged on a soft-magnetic liner on base, a soft-magnetic torsional beams is arranged via soft-magnetic transition layer on said two bases to form a bridge structure, and a pair of soft-magnetic cantilevers are horizontally and symmetrically extended from the middle part of torsional beam to make their ends above the planar windings containing iron core on said liner. An air gap is between the end of cantilever and planar winding.

The invention discloses a function gradient bionic structure titanium alloy artificial implant and a forming method thereof. Based on the special service performance demand of the human body skeletonand the enlightenment of the high performance of a honeycomb space porous structure in nature, by combining the excellent anti-bacterial performance of metal silver nanoparticles in the human body, and by means the advanced laser additive manufacturing technology, the low-modeling gradient bionic structure titanium alloy artificial implant with a high anti-bacterial performance function is precisely formed. According to the function gradient bionic structure titanium alloy artificial implant and the forming method thereof, the integrated manufacturing of the titanium alloy artificial implant with a bionic structure and the anti-bacterial function is achieved, the manufacturing efficiency is greatly improved, the production cost is effectively reduced, and good economic benefits are achieved; and on the other hand, the titanium alloy artificial implant manufactured through the method achieves the excellent mechanical performance and the anti-bacterial performance, the biocompatibility and the service performance of the implant are remarkably improved, and wide market prospects are achieved.

The invention discloses a 3D printing device for conformal antenna and circuit integrated manufacturing and a method thereof. The 3D printing device is characterized in that electric field driving jetting 3D printing, fusion deposition molding and five-axis linkage 3D printing are adopted for combination so as to achieve integrated manufacturing of a conformal antenna and a circuit; a base body structure of the antenna is manufactured by adopting an FDM technology, and the circuit of the conformal antenna is manufactured by adopting an electric field driving jetting 3D printing technology; self-supporting printing of various complex antenna base body structures is realized by utilizing a FDM nozzle and printing platform five-degree-of-freedom motion, and high-precision conformal printing of an antenna conductive pattern on a complex curved surface is realized on the basis of a five-axis linkage platform and an electric field driving jetting 3D printing nozzle; the FDM nozzle is used for supplying a printing consumable by adopting a wire feeding mechanism, and then the needed supply of the printing consumable is realized; and synchronous sintering and curing of the printed circuit are realized by adopting an in-situ laser sintering technology; and a CCD camera is adopted to assist in positioning, and the circuit printing process is monitored in real time. The device and the method have various advantages and wide industrial application prospects.

The invention provides a monolithically integrated manufacturing method and a chip for an integrated circuit and a capacitor type micro-silicon microphone. The method comprises the following steps: firstly, a substrate with a first area and a second area is provided; secondly, according to the standard semiconductor technique flow, the integrated circuit with a grid conductive layer is manufactured on the first area, the grid conductive layer and a medium insulating layer covered on the grid conductive layer extend to the second area; and thirdly, the medium insulating layer on the second area is removed, and a first membrane layer, a sacrificial layer and a second membrane layer are generated in sequence on the exposed grid conductive layer by the low temperature technique below 400 DEG C, and then the sacrificial layer with the eroded part forms the capacitor type micro-silicon microphone, the exposed grid conductive layer and the first membrane layer are taken as one electrode of the capacitor, and the second membrane layer is taken as the other electrode of the capacitor, thereby realizing the monolithic integration of the integrated circuit and the capacitor type micro-silicon microphone.

The invention provides an array substrate, a manufacturing method, and a display device. The array substrate comprises a monocrystalline silicon substrate, an array circuit layer, and an anode conducting layer. The monocrystalline silicon substrate is provided with a central display region, a first peripheral region, and a second peripheral region. The central display region comprises a plurality of pixel regions. The array circuit layer is formed on the monocrystalline silicon substrate, and comprises a plurality of transistors which are formed in the monocrystalline silicon substrate in an active region. The array circuit layer forms a scanning drive circuit in the first peripheral region, forms a data drive circuit in the second peripheral region, and forms a pixel circuit in each pixel region. The anode conducting layer is formed on an array circuit layer in each pixel region, and is used for outputting an organic light-emitting layer drive current in each pixel region and reflecting light from an organic light-emitting layer. According to the invention, the integrated manufacturing of the scanning drive circuit and the data drive circuit on the substrate is achieved, and the improvement of display performance is facilitated.

The invention relates to the field of marine engineering, and discloses an integrated manufacturing method for a shipboard segment in shipbuilding. At the stage of manufacturing the shipboard segment, longitudinal hatch coamings and shipboard standing poles are fixed on the shipboard segment by welding respectively. Particularly, before the erecting welding, the longitudinal hatch coamings are reserved with inverse deformation, and the inverse deformation value is 0 to 10mm deviation of the end parts of the longitudinal hatch coamings relative to the vertical wall plane of the inner shell. Therefore, in the method, the longitudinal hatch coamings and the shipboard standing poles are mounted at the stage of manufacturing the shipboard segment, and the method for controlling the mounting accuracy is also provided. Compared with the prior shipbuilding method, the method has the advantages of improving the segmentation integrity, saving the assembling and welding time of the longitudinal hatch coamings and the shipboard standing poles at the building berth (dock) stage and simultaneously saving polishing and painting time.

The invention discloses a capacitive temperature, humidity and air pressure sensor integrated manufacturing method based on SOI chip device layer silicon anodic bonding. According to the integrated manufacturing method, a step-by-step deep silicon etching technology, SOI chip device layer silicon and a glass anodic bonding technology are combined for use so that a thin film structure, a flat large capacitance structure with a tiny electrode gap and a sealed cavity structure needed by an integrated sensor can be manufactured at the same time. The capacitive temperature, humidity and air pressure sensor integrated manufacturing method is characterized in that plenary capacitance sensitive temperature, humidity and air pressure sensors are manufactured in an integrated mode, namely a low power consumption integrated multi-sensor structure is manufactured. The capacitive temperature, humidity and air pressure sensor integrated manufacturing method can be used for realizing on-chip integration of the temperature, humidity and air pressure sensors, therefore, the area of the sensor integrated structure is greatly reduced, the length of an interconnection line is reduced, and the system reliability is improved.