The utility model relates to the technical field of
adhesive tapes, in particular to a
wafer UV
adhesive tape. In order to solve the problems that cleaning of glue stains left on the surface of a
wafer is tedious, extra
working hours are consumed, impurities are easy to introduce, and negative effects are generated on the
electrical performance of a
chip, the following technical scheme is provided: the
chip comprises a base layer which is used as a core supporting layer; the buffer layer is tightly attached to one side of the base layer and used for buffering
mechanical vibration transmitted to the
adhesive tape in the
machining process; the heat
insulation layer is attached to the side, away from the base layer, of the buffer layer and used for preventing
machining heat from being conducted to the back face of the
wafer; the enhancement layer is arranged on one side, far away from the buffer layer, of the heat
insulation layer and is used for improving the
mechanical property of the adhesive tape and coping with stretching and bending stress under complex
processing working conditions; the adhesive layer is positioned on one side, far away from the heat
insulation layer, of the reinforcing layer. According to the utility model, the residual of the processed adhesive tape can be effectively prevented, the subsequent process is not interfered, and meanwhile, the good electrical property of the
chip is ensured.