4127results about How to "Simple technology" patented technology

A secure credit card having daily changing security number is disclosed. The upper half portion of the secure credit card has a magnet strip and its thickness is same as a normal credit card, so it can be read by a credit-card reader. The bottom half portion of the secure credit card contains a processor, key or keypad, battery, display window and a program download port. The processor is loaded with a predetermined program so that the processor can generate date and a daily renewed security number that can be shown on the display window. The security number is the function of the date and their relationship is defined by the predetermined program. Giving a date, a corresponding security number can be generated by this predetermined program. The computer of the credit card company keeps this predetermined program and can compute the security number of the date by this predetermined program. The security number of the date computed by the credit card company is identical to the security number of the date shown on the display window of the secure credit card. So that the valid of the credit card and its transaction can be verified by the credit card company based on the cardholder's name, card number and the security number of the date. With this secure credit card, the credit card payment becomes very secure even through internet.

Contact structures exhibiting resilience or compliance for a variety of electronic components are formed by bonding a free end of a wire to a substrate, configuring the wire into a wire stem having a springable shape, severing the wire stem, and overcoating the wire stem with at least one layer of a material chosen primarily for its structural (resiliency, compliance) characteristics. A variety of techniques for configuring, severing, and overcoating the wire stem are disclosed. In an exemplary embodiment, a free end of a wire stem is bonded to a contact area on a substrate, the wire stem is configured to have a springable shape, the wire stem is severed to be free-standing by an electrical discharge, and the free-standing wire stem is overcoated by plating. A variety of materials for the wire stem (which serves as a falsework) and for the overcoat (which serves as a superstructure over the falsework) are disclosed. Various techniques are described for mounting the contact structures to a variety of electronic components (e.g., semiconductor wafers and dies, semiconductor packages, interposers, interconnect substrates, etc.), and various process sequences are described. The resilient contact structures described herein are ideal for making a "temporary" (probe) connections to an electronic component such as a semiconductor die, for burn-in and functional testing. The self-same resilient contact structures can be used for subsequent permanent mounting of the electronic component, such as by soldering to a printed circuit board (PCB). An irregular topography can be created on or imparted to the tip of the contact structure to enhance its ability to interconnect resiliently with another electronic component. Among the numerous advantages of the present invention is the great facility with which the tips of a plurality of contact structures can be made to be coplanar with one another. Other techniques and embodiments, such as wherein the falsework wirestem protrudes beyond an end of the superstructure, or is melted down, and wherein multiple free-standing resilient contact structures can be fabricated from loops, are described.

Improved techniques for performing accelerated video presentation on a media device are disclosed. The improved techniques enable smooth, uniform accelerated video presentation by displaying key frames from a video file in a periodic fashion. The rate and direction of accelerated video presentation can be controlled. The improved techniques are well suited for use with portable media devices.