181 results about "Microsystem" patented technology

Disclosed in the present invention is a physics-informed neural network-based thermo-mechanical coupling analysis method for an inertial microsystem, the method comprising: S1, configuring material parameters and boundary conditions of an inertial microsystem, and establishing a thermo-mechanical coupling analysis model; S2, performing electro-thermal coupling analysis to obtain a temperature distribution of the inertial microsystem; S3, performing thermo-mechanical coupling simulation analysis to obtain a thermal stress distribution of the microsystem; S4, predicting temperature fields of the microsystem by means of a physics-informed neural network; S5, using the temperature fields as boundary conditions for mechanical simulation of the microsystem, obtaining mechanical properties such as stress and strain of the microsystem; and S6, performing electromechanical coupling simulation analysis to analyze the impact of structural deformation on various parameters of electrical performance. The present invention improves the solution accuracy of the neural network by means of an improved adaptive weighting strategy, combines a complete polynomial basis function with the neural network, and introduces an expanded basis function to reduce the state dimensionality, thus reducing computational costs and time, achieving accurate prediction of temperature fields of microsystems at multiple moments, and allowing for computation of the performance of microsystems under electro-thermal-mechanical multi-physics coupling.

The invention discloses a self-closed-loop microsystem air cooling heat dissipation structure based on a micropump. The self-closed-loop microsystem air cooling heat dissipation structure comprises a microchannel radiator, the micropump, a fan combination, a temperature measurement optical fiber, a control module, cooling liquid and the like. According to the invention, a heat dissipation mode of combining liquid cooling internal circulation with air cooling external circulation is adopted, the air cooling heat dissipation problem of the high-heat-flux power chip is converted into a conventional air cooling heat dissipation problem, and the air cooling heat dissipation problem of the high-heat-flux power chip in the current engineering is solved; liquid cooling internal circulation is physically isolated from the external environment, so that the risk that impurities block a flow channel in secondary heat exchange equipment is avoided, and the reliability of the equipment is improved; the micro-channel radiator adopts a three-dimensional flow channel, the size is greatly reduced, and the tree-shaped distribution network and the micro-channel heat sink are combined, so that the heat exchange capacity is improved; and a self-adaptive temperature control measure based on temperature feedback is adopted, so that the power chip works in a proper temperature range, the performance and reliability of equipment are improved, and the service life of the equipment is prolonged.

The application discloses a high-reliability high-power three-dimensional heterogeneous integrated radio frequency antenna integrated microsystem, comprising a DPC substrate, a copper-based three-dimensional structure, a two-stage SiC adapter plate, a bare chip, a radio frequency circuit, a passive device and an antenna interface; wherein the DPC substrate is used for realizing integrated three-dimensional heterogeneous integration of the microsystem; the copper-based three-dimensional structure comprises a three-dimensional coaxial transmission structure and a three-dimensional packaging frame structure, and is used for realizing vertical transmission of high-power radio frequency signals and air-tight packaging of the microsystem; the two-stage SiC adapter plate is used for realizing a 2.5D*2 five-layer ultra-high-density mixed three-dimensional stacking architecture; the bare chip comprises a silicon-based Fan-out multifunctional bare chip, a power management bare chip, a power amplifier bare chip and a receiving bare chip; the radio frequency circuit comprises a radio frequency transmitting circuit and a radio frequency receiving circuit. The application forms a complete integrated air-tight packaging microsystem, and simultaneously realizes high reliability, high-density integration and high-power heat dissipation.

The invention discloses a W-band two-dimensional DBF microsystem based on an AiP technology, and belongs to the technical field of packaging antennas, the W-band two-dimensional DBF microsystem comprises an active array antenna module for realizing transceiving and frequency conversion of W-band signals, the active array antenna module is provided with a plurality of antenna units, and each antenna unit corresponds to a signal processing channel; the radio frequency direct acquisition transceiver module is used for multi-channel parallel sampling and transmitting and completing conversion between an analog radio frequency signal and a digital baseband signal; the digital beam former module is used for carrying out weighting, phase correction and delay control on each channel signal output by the radio frequency direct acquisition transceiver module so as to realize two-dimensional digital beam forming; and the active array antenna module, the radio frequency direct acquisition transceiver module and the digital beam former module are independently integrated on the integrated module to realize integral packaging. According to the invention, deep fusion of the AiP module and the DBF module is realized under the W-band condition.

The invention discloses a signal integrity simulation analysis method for a digital radio frequency hybrid microsystem, and belongs to the field of advanced packaging of integrated circuits. According to the method, a complete analysis process accompanied with product research and development is established, systematic work of qualitative simulation evaluation, rule design and quantitative analysis verification is sequentially carried out in various stages of project approval demonstration, scheme design, design verification and the like of product design, and process conditions, material characteristics and rationality and feasibility of system layout are rapidly evaluated; qualitative support is provided for agile design of the scheme; designing rules and optimization ranges of structures such as a radio frequency link, a digital link and a coupling shield are formulated according to process and material rules, and accurate initial input is provided for comprehensive design of a product; according to the layout wiring form, digital, radio frequency and coupling areas are formed through division, time domain analysis, frequency domain analysis and near field analysis are carried out in a targeted mode, quantitative reference is provided for judging design reasonability, and an effective basis is provided for optimizing design content.

The invention discloses a digital system power distribution network impedance optimization method and system, and the method comprises the following steps: S1, obtaining the frequency-varying parasitic parameters Jg (f), Jr (f) and Jz (f) of a digital system power supply through a vector network analyzer, and enabling f to be a frequency variable; s2, calculating a dynamic matching coefficient DsC based on the frequency-varying parasitic parameter, and calling a PDN decoupling scheme set from a decoupling scheme database according to a DsC matching interval; s3, inputting the PDN decoupling scheme set into ADS software for segmented variable step size impedance simulation, wherein the step size of the frequency band from 1 MHz to 100 MHz is 0.5 MHz, and the step size of the frequency band from 100 MHz to 3 GHz is 5 MHz; and generating a surface-mounted PCB decoupling index DI containing a resonance penalty term and a micro-system substrate decoupling index WI. According to the method, the high-frequency resonance suppression capability is improved, frequency change parasitic parameter extraction is combined with resonance point penalty term design, impedance peak fluctuation is compressed to be within + / -8% of a target value in a 1-3GHz frequency band, and actually measured power supply noise of a 10Gbps SerDes interface is reduced by 62%.

The invention discloses a high-reliability three-dimensional integrated direct sampling software radio architecture radio frequency microsystem, which is based on a direct sampling software radio system architecture and a multi-layer glass-based TGV adapter plate wafer-level bonded POP three-dimensional stacked packaging architecture. A high-performance glass antenna, silicon-based single core particle Fan-in and Fan-out packaging, mixed multi-core particle integration of an embedded glass-based TGV adapter plate, mixed bonding integration of a silicon-based digital TSV adapter plate and the glass-based TGV adapter plate are combined, and a glass antenna, a direct sampling core particle, a silicon-based computing power circuit, a silicon-based storage circuit and a silicon-based interface circuit are integrated. And the three-dimensional heterogeneous integration of the microsystem is realized. According to the micro-system, a glass substrate is used as a main body packaging material, a radio frequency circuit and a digital-analog hybrid circuit are fused, three-dimensional heterogeneous integration from a glass antenna to a baseband storage and calculation integrated processing circuit is realized, and a complete integrated airtight packaging micro-system is formed and can cover a DC-20GHz frequency band.

The invention provides a test fixture for a photoelectric microsystem. The test fixture comprises a test seat and a test plate, the test seat comprises a cooling device, an adapter plate, a needle frame and a heat sink; the cooling device is fixed to the heat sink and used for cooling the heat sink. The heat sink provides downward pressing force, so that the elastic contact of the photoelectric microsystem is connected to the adapter plate, and meanwhile, the adapter plate is pressed on the pin frame; the needle frame is made of metal and is used as a ground network; the signal pins are fixed on the pin frame through the dielectric ring to form signal point locations; the power needles are fixed on the needle frame through the medium rings to form power source point positions; the power needle is directly fixed on the needle frame to form a site; the signal pin and the power pin are connected with the test board; by adjusting the installed signal pin and the power pin, the photoelectric micro-system test with different pin definitions can be adapted.

The application discloses a microsystem for an LCD light-curing 3D printing device and a micro-nano 3D printing method, wherein light rays converged by a converging lens group are micro-imaged on a printing forming area of the 3D printing device through a micro-lens group, micro-nano 3D printing is realized, the cost is effectively reduced, and the service life of the LCD screen is effectively prolonged because the LCD screen does not bear external force during general 3D printing.

A microsystem includes a substrate; a main part connected to the substrate via an anchor; a moving part configured to rotate about an axis of rotation O; a first beam connecting the moving part to the main part, the main direction of said first beam being along a first vector ej1 having as origin the junction of the moving part with the first beam and in the sense of the main part; a second beam connecting the moving part to the main part, the main direction of the second beam being along a second vector ej2 having as origin the junction of the moving part with the second beam and in the sense of the main part.

The invention provides a multi-physical coupling simulation method and device for a millimeter wave radar radio frequency integrated microsystem, and belongs to the technical field of simulation. The method provided by the invention comprises the following steps: constructing an initial physical model; performing electromagnetic simulation on the initial physical model to obtain electromagnetic performance and component power loss; performing thermal simulation on the initial physical model by taking the power loss of the component as a heat source to obtain the thermal performance of the initial physical model; constructing a multi-objective optimization problem based on the electromagnetic performance and the thermal performance, and obtaining a parameter group of the initial physical model; establishing a Pareto frontier solution set based on the plurality of parameter groups; and determining a target parameter group from the Pareto leading-edge solution set based on an engineering target, and taking the target parameter group as an operation parameter group of the initial physical model. The invention provides a multi-physical coupling simulation method and device for a millimeter wave radar radio frequency integrated microsystem. The method and device are used for improving the design efficiency and precision of the millimeter wave radar radio frequency integrated microsystem.

The application discloses a three-dimensional ferroelectric material based on two-dimensional ice stacking and preparation and application thereof, and belongs to the technical field of ferroelectric materials and multifunctional devices. The material is a three-dimensional periodic crystal structure of monoclinic P21 space group, water molecules in the material form a completely saturated network through hydrogen bonds, and there is no suspended hydrogen; interlayers are coupled through van der Waals force to form a multi-level cooperative ferroelectric sequence of "in-plane hydrogen bond ferroelectric + interlayer van der Waals ferroelectric". The material has the characteristics of a wide-bandgap semiconductor (band gap 5-6 eV), extreme anisotropic mechanical properties (Z-axis Young's modulus 48.6 GPa, Eyx=0.973), moderate bulk modulus (12.23 GPa), good acoustic performance (sound velocity 2638 m / s) and extremely high pressure stability (0-3000 GPa structure is complete, 1190 GPa metalization transition). The material can be widely applied in the fields of X-ray optical devices, ferroelectric memories, deep ultraviolet photoelectric detectors, extreme high-pressure sensors, directional stress sensors, mechanical logic devices, surface acoustic wave filters, multifunctional integrated microsystems and multi-parameter composite sensing networks, and opens up a new direction for pure water-based functional materials.

The invention discloses a high-power-density driving and energy control integrated electromechanical servo mechanism. Control drive components are integrated into an intelligent microsystem through the SIP stacking technology, high integration and miniaturization of a control driver are achieved, and the problems of heat dissipation and heat conduction are solved by attaching the metal adapter plate to the surface of the shell. The semi-solid lithium ion battery pack is used as an energy part, the appearance of the battery pack is designed according to shell structure matching, and the total envelope size is reduced. Meanwhile, the peak current output capability of the power supply is fused with a motor acceleration control method, and the regenerative electric energy absorption capability of the power supply is fused with a motor deceleration control method; a driver direct current bus input filter capacitor and a power supply output capacitor are fused, power supply output current and voltage detection and driver bus voltage monitoring are fused, and the optimal design of energy control driving comprehensive performance is achieved.

The application provides a normal-temperature dynamic burn-in device and method for a radio frequency digital mixed signal micro system, which comprises a burn-in control processor, a programmable clock generator electrically connected with the burn-in control processor, and a micro system burn-in test station; the radio frequency digital mixed signal micro system to be tested is connected on the micro system burn-in test station, the number of the micro system burn-in test stations is one or more than one, and each micro system burn-in test station can independently perform burn-in test and temperature control on one radio frequency digital mixed signal micro system to be tested. The application achieves the precise temperature control requirement of high consistency among the multiple chips in the micro system by reasonably designing the temperature control, state monitoring, chip temperature detection and control system and method of the micro system burn-in test station and the burn-in device, thereby realizing the micro system burn-in device without a temperature box; the burn-in method is easy to cascade and expand, and can be applied to the burn-in of micro systems in different batch scales, and is convenient for automatic monitoring and manual inspection.

The present application relates to a kind of radio frequency microsystem based on wave-absorbing shielding structure, comprising: radiation source, it is configured to produce electromagnetic radiation;And wave-absorbing shielding structure, it is configured to absorb and shield electromagnetic radiation produced by the radiation source, wherein the wave-absorbing shielding structure includes: electromagnetic material layer, it is configured to absorb electromagnetic radiation;Resonant cavity, it is configured to absorb electromagnetic radiation;Conformal shielding layer, it is configured to shield electromagnetic radiation.

The invention provides a silicon adapter plate applied to a radio frequency microsystem and a preparation method thereof, and the method comprises the steps: sequentially forming a plurality of Damascus wiring layers and a plurality of organic medium wiring layers on a silicon substrate through employing a Damascus wiring technology and a PI wiring technology; therefore, the silicon adapter plate can realize high-density integration that the depth-to-width ratio of the TSV blind holes is not less than 10: 1 and the number of wiring layers is 8, the thermal stability and the high-frequency performance of a system are remarkably improved, and a better process platform support is provided for a radio frequency-digital integrated microsystem. Due to the superfine line width and line distance of the second interconnection structure in the Damascus wiring layer, the bottleneck of high-density signal interconnection can be effectively solved, and the transmission power consumption is greatly reduced; due to the existence of the organic medium wiring layer, the problem of large radio frequency loss of a single Damascus wiring layer can be solved, in addition, by adjusting the thickness of the organic medium wiring layer, regulation and control of warping of the adapter plate can be further achieved, and the preparation process is simple, easy to implement and low in manufacturing cost.

The invention provides a radio frequency transmitting and receiving fusion circuit, a transmitting and receiving front-end chip and a radio frequency heterogeneous microsystem, and the radio frequency transmitting and receiving fusion circuit comprises a first bidirectional driving amplifier which is configured to be a radio frequency power amplifier and a low noise amplifier in a radio frequency transmitting process and a radio frequency receiving process; the phase shifter is connected with the first bidirectional driving amplifier and is configured to adjust the phase of a radio frequency signal; the radio frequency signal comprises a transmitting signal and a receiving signal; and the second bidirectional driving amplifier is connected with the phase shifter and is configured to carry out frequency mixing on the radio frequency signal. The invention provides a compact and efficient transmit-receive fusion design technology, and modules and devices with similar functions in the transmitting channel and the receiving channel are deeply fused and designed, so that the size of the transmit-receive channel is reduced, the chip simulation integration level is improved, and the performance of the transmit-receive channel is improved.

The invention relates to a three-dimensional stacked microsystem for communication, navigation and electromagnetic spectrum monitoring application. The three-dimensional stacked microsystem comprises a high-density interconnection substrate; the plurality of functional core particles comprise radio frequency direct sampling core particles and digital baseband processing core particles; the at least one radio frequency channel micro module is arranged on the first side of the high-density interconnection substrate; area array vertical electrical interconnection among the radio frequency channel micro module, the functional core particles and the high-density interconnection substrate and among the functional core particles is realized through micro salient points. The internal structure of the microsystem does not comprise a lead bonding structure. According to the invention, a lead bonding process can be abandoned, a full-flip and wafer-level stacking technology is adopted, and the limitation of volume, weight and signal bandwidth is further broken through through a more optimized radio frequency direct acquisition layout and a full-silicon-based cavity structure, so that the urgent demand of a lightweight unmanned platform on a conduction, guidance and supervision integrated load is met; the system has the characteristics of high performance, miniaturization and low power consumption.

The invention discloses a radio frequency adjustable medium cavity structure which comprises a cavity assembly and a metal band. The cavity assembly is formed by overlapping a plurality of metal layers and dielectric layers in a staggered manner, a first non-metal area is arranged in the metal layer at the topmost layer of the cavity assembly in a hollowed-out manner, the metal belt is arranged in the first non-metal area, and a preset angle is formed between the metal belt and the horizontal direction; according to the scheme, the staggered metalized through holes are formed in the periphery of the dielectric cavity, and the at least two working wavelength inclined-strip-shaped metal strips are arranged at the bottom and the top of the first dielectric layer of the dielectric cover plate, so that a negative feedback closed-loop system cannot be formed by radio frequency amplification due to the arrangement of the isolation frame, and radio frequency self-excitation can be inhibited; the top isolation frame is provided with the inclined strip metal belt which can cut off tube wall currents leaked in different directions, so that the electrical performance of the tube wall is changed, the purpose of eliminating radio frequency self-excitation after three-dimensional integration and microsystem integration packaging is achieved, the design flexibility and the product percent of pass are improved, and meanwhile the manpower and material resource cost is saved.

The application discloses a high-overload-resistant heterogeneous integration structure of an inertial microsystem component, which comprises a bottom buffer shell and a top rubber pad arranged in a metal shell of the inertial microsystem component, and an internal cavity formed by the bottom buffer shell and the top rubber pad is used for accommodating an electronic system of the inertial microsystem component; in the application, the bottom surface of the bottom buffer shell is composed of a foamed metal buffer structure and a rubber damping structure, and the foamed metal buffer structure and the rubber damping structure are heterogeneously integrated in a mode that the rubber damping structure surrounds the outer surface of the foamed metal buffer structure. The heterogeneous integration structure of the rubber and the foamed metal realizes the high-overload-resistance and damping characteristics of the inertial microsystem component, and the assembly stability and reliability of the internal electronic system.

An integrated hydrogen sensing microsystem, a manufacturing method, and a data processing method. Belonging to the technical field of integrated hydrogen sensing microsystems. The present invention solves the problem of accurate detection of a wide range that is difficult to solve with a single principle in current hydrogen detection. The alumina ceramic substrate of the present invention is covered with a first semiconductor principle electrode, a second semiconductor principle electrode, and a catalytic principle heating sensitive electrode. The first semiconductor principle electrode is connected to a first platinum pad, and the catalytic principle heating sensitive electrode is connected to a second platinum pad and a third platinum pad. A sensitive semiconductor blackbody silicon carbide anti-infrared radiation packaging layer is formed on the first semiconductor principle electrode and the second semiconductor principle electrode by a semiconductor principle sensitive material, and a sensitive catalytic body blackbody silicon carbide anti-infrared radiation packaging layer is formed on the catalytic principle heating sensitive electrode by a catalytic principle sensitive material. The integrated hydrogen sensing microsystem, the manufacturing method, and the data processing method of the present invention realize wide-range detection of hydrogen concentration.

The utility model provides a vacuum packaging device of an on-chip microsystem and a vacuum-packaged on-chip microsystem. The vacuum packaging device comprises an ultrafast laser generating device, an ultra-fast laser generating device, an ultra-fast laser processing device and a vacuum packaging device, wherein the ultrafast laser generating device is used for generating ultrafast laser for bonding; the closed chamber is used for accommodating a microsystem substrate and a cover plate substrate to be bonded; the first displacement table is used for supporting and moving the closed cavity; the second displacement table is used for moving the microsystem substrate and / or the cover plate substrate to be bonded, and is also used for aligning, fitting and fixing the bonding parts of the microsystem substrate and the cover plate substrate; the vacuum system is connected with the closed chamber and is used for pumping the vacuum degree of the closed chamber to preset air pressure after the microsystem substrate and the cover plate substrate are arranged in the closed chamber; and the driving system is used for providing voltage driving for the ultrafast laser generating device, the first displacement table, the second displacement table and the vacuum system. According to the utility model, the vacuum packaging of the on-chip microsystem under the condition of room temperature can be realized.

The invention discloses a programmable electrical interconnection neural information detection regulation and control microsystem and method, and belongs to the technical field of neuroscience and biomedical engineering. The system comprises a partitioned in-vitro neural chip, an electrical stimulation module, a multi-channel neural signal acquisition module, an electrical interconnection control module and an upper computer module. The partitioned in-vitro nerve chip is manufactured based on an MEMS (Micro Electro Mechanical System) process and supports partitioned culture of in-vitro nerve cells; the electrical stimulation module can generate multi-channel nanoampere-to-milliampere bidirectional constant-current pulses to realize accurate nerve regulation and control; the multi-channel neural signal acquisition module is provided with a low-noise amplifier array and is used for acquiring and converting multi-channel neural signals in real time; the electric interconnection control module realizes dynamic signal routing between partitions through the switch array; the upper computer module provides parameter configuration, signal processing and visual interaction functions. The system has the advantages of high integration level, high precision, programmability, real-time regulation and control and the like, and is suitable for in-vitro brain-computer interface and neural network function research.

Disclosed is a microsystem for delivering a plurality of materials. The microsystem for delivering a plurality of materials can include a microstructure in which a microneedle is formed on one surface of a base film and the microstructure is made of a first material, and a material accommodation portion disposed in one region of the microstructure and having an accommodation space for accommodating a second material different from the first material.

The invention relates to a device for reducing interference of a GDS microscopic system on a focus tracking external light source. A connecting seat is fixed on one side of a mounting shell; the vertical surface of the sliding seat is slidably connected with the connecting seat, and the horizontal surface is located at one end of the mounting shell away from the camera; an objective lens is mounted on the horizontal plane of the sliding seat; the objective lens, the imaging barrel lens and the camera are located on the same axis, and the sliding direction of the sliding seat is parallel to the axis; the focusing sensor is connected to one side of the mounting shell, a short-pass dichroscope is fixed in the mounting shell, the short-pass dichroscope is used for reflecting laser emitted by the focusing sensor to the objective lens, and the laser is reflected by a shot object and then is reflected by the short-pass dichroscope to the focusing sensor. According to the invention, the interference condition of an external light source is effectively solved, the interference is effectively reduced by more than 80%, the overall detection virtual focus condition is reduced by more than 50%, the detection yield of equipment is improved, and the discharge of over-detection conditions caused by virtual focus is reduced.

The invention discloses a high-reliability three-dimensional integrated system-on-chip software radio architecture radio frequency microsystem, belongs to the technical field of radio frequency microsystems, and relates to a composite heat sink structure based on a system-on-chip software radio system architecture, a ceramic substrate and a copper-based enclosure frame multilayer stacked packaging architecture and a SiC adapter plate. The three-dimensional heterogeneous integration of the microsystem is realized by the following steps of: carrying out single-core-particle Fan-out packaging of a compound-based core particle and a silicon-based core particle, carrying out CoWoS packaging of a radio frequency TSV adapter plate and a ceramic substrate, carrying out mixed multi-core-particle integration of an embedded digital TSV adapter plate, integrally integrating a ceramic antenna, a compound-based radio frequency front-end circuit, a silicon-on-chip system, a storage circuit and an interface circuit, and realizing three-dimensional heterogeneous integration of the microsystem. According to the microsystem, respective advantages of different materials are fully exerted, a radio frequency circuit and a digital circuit are fused, three-dimensional heterogeneous integration from the ceramic antenna to a baseband storage and calculation integrated processing circuit is realized, and an integrated airtight packaging microsystem is formed and can cover a DC-40GHz frequency band.

The invention relates to a triboelectric-piezoelectric mixed liquid drop energy collection device based on a cantilever beam structure, and solves the technical problem of how to improve the energy conversion efficiency of a liquid drop friction type power generation energy collection device, the triboelectric-piezoelectric mixed liquid drop energy collection device comprises a fixed base, a cantilever beam and a friction power generation sheet, the cantilever beam is fixedly connected with the fixed base, and the cantilever beam is fixedly connected with the friction power generation sheet. The friction power generation piece is connected with the cantilever beam, the friction power generation piece is arranged in the vertical direction and is perpendicular to the cantilever beam, the cantilever beam comprises an upper electrode layer, a piezoelectric piece and a lower electrode layer, the piezoelectric piece is located between the upper electrode layer and the lower electrode layer, and the friction power generation piece comprises a left friction layer, a middle electrode layer, a right friction layer and a conducting strip. The conducting strip is connected with the right friction layer. The method is suitable for scenes of self-powered sensing systems, micro-system energy supply, embedded energy modules and the like.

The invention particularly relates to a millimeter wave eight-channel fully-polarized active phased array based on a TSV (Through Silicon Via) process. The millimeter wave eight-channel fully-polarized active phased array comprises a top antenna array, a silicon-based three-dimensional stacked eight-channel radio frequency microsystem, a bottom radio frequency control network and a power supply control layer, the silicon-based three-dimensional stacked eight-channel radio frequency microsystem comprises an upper radio frequency module, a lower radio frequency module, a top BGA solder ball, a middle BGA solder ball and a bottom BGA solder ball, the top-layer antenna array is located above the upper-layer radio frequency module, and the radio frequency control network is located below the lower-layer radio frequency module; and the bottom radio frequency control network sequentially passes through the bottom BGA solder balls, the lower radio frequency module, the middle BGA solder balls, the upper radio frequency module and the top BGA solder balls to the top antenna array. According to the millimeter wave eight-channel fully-polarized active phased-array antenna system, the micro-nano machining characteristic of the TSV technology is utilized, an eight-channel radio frequency microsystem is combined with an external dual-polarized array antenna, and the design of the millimeter wave eight-channel fully-polarized active phased-array antenna system is successfully achieved.

The invention discloses a floating type multi-parameter water quality monitoring microsystem and a preparation method thereof, and belongs to the technical field of water quality monitoring. The water quality monitoring microsystem sequentially comprises a functional floating carrier substrate, a flexible circuit module and an insulating packaging layer from bottom to top, the flexible circuit module comprises a flexible insulating dielectric layer, a planar spiral inductance coil is arranged on the upper surface of the flexible insulating dielectric layer, and a plurality of interdigital electrodes are arranged on the lower surface of the flexible insulating dielectric layer; each interdigital electrode is connected with the planar spiral inductance coil to form an LC resonant circuit of which the working frequencies are not overlapped; the surfaces of the interdigital electrodes are coated with ion sensitive membranes respectively; a through detection window is formed in the position, corresponding to the interdigital electrode, of the functionalized floating carrier substrate, so that the interdigital electrode can be directly contacted with a water body to be detected below through the detection window; and the insulating packaging layer completely covers the planar spiral inductance coil. The system can be used for monitoring water quality, and has the advantages of good real-time performance, high detection precision and the like.

The invention discloses a radio frequency communication-oriented SDR embedded information processing microsystem and a packaging method thereof, which meet the application requirements of multi-system communication, adaptive protocol adaptation and universal network data encryption and decryption, and can be used for realizing data encryption and decryption by fusing a de-bonding multi-chip rewiring technology, a module-chip hybrid flip technology and a high-frequency high-speed chip isolation anti-interference technology. A radio frequency communication unit, a software programmable unit, an embedded encryption and decryption unit, a protocol subpackage unit and a multi-level mixed memory unit of various bonding technologies are integrated in a single packaging body, and the characteristics of small system size, high function density and simplified technology implementation are prominently reflected. Meanwhile, external interaction channels such as a high-reliability data transmission interface, a network communication interface, a wide-voltage high-performance interface and a compatible multi-protocol configurable high-speed interface are arranged, microsystem peripheral diversification is achieved, and the practicability, stability and reliability of the radio frequency comprehensive electronic system are improved.