91 results about "Microsystem" patented technology

Disclosed in the present invention is a physics-informed neural network-based thermo-mechanical coupling analysis method for an inertial microsystem, the method comprising: S1, configuring material parameters and boundary conditions of an inertial microsystem, and establishing a thermo-mechanical coupling analysis model; S2, performing electro-thermal coupling analysis to obtain a temperature distribution of the inertial microsystem; S3, performing thermo-mechanical coupling simulation analysis to obtain a thermal stress distribution of the microsystem; S4, predicting temperature fields of the microsystem by means of a physics-informed neural network; S5, using the temperature fields as boundary conditions for mechanical simulation of the microsystem, obtaining mechanical properties such as stress and strain of the microsystem; and S6, performing electromechanical coupling simulation analysis to analyze the impact of structural deformation on various parameters of electrical performance. The present invention improves the solution accuracy of the neural network by means of an improved adaptive weighting strategy, combines a complete polynomial basis function with the neural network, and introduces an expanded basis function to reduce the state dimensionality, thus reducing computational costs and time, achieving accurate prediction of temperature fields of microsystems at multiple moments, and allowing for computation of the performance of microsystems under electro-thermal-mechanical multi-physics coupling.

The application discloses a high-reliability high-power three-dimensional heterogeneous integrated radio frequency antenna integrated microsystem, comprising a DPC substrate, a copper-based three-dimensional structure, a two-stage SiC adapter plate, a bare chip, a radio frequency circuit, a passive device and an antenna interface; wherein the DPC substrate is used for realizing integrated three-dimensional heterogeneous integration of the microsystem; the copper-based three-dimensional structure comprises a three-dimensional coaxial transmission structure and a three-dimensional packaging frame structure, and is used for realizing vertical transmission of high-power radio frequency signals and air-tight packaging of the microsystem; the two-stage SiC adapter plate is used for realizing a 2.5D*2 five-layer ultra-high-density mixed three-dimensional stacking architecture; the bare chip comprises a silicon-based Fan-out multifunctional bare chip, a power management bare chip, a power amplifier bare chip and a receiving bare chip; the radio frequency circuit comprises a radio frequency transmitting circuit and a radio frequency receiving circuit. The application forms a complete integrated air-tight packaging microsystem, and simultaneously realizes high reliability, high-density integration and high-power heat dissipation.

The invention discloses a signal integrity simulation analysis method for a digital radio frequency hybrid microsystem, and belongs to the field of advanced packaging of integrated circuits. According to the method, a complete analysis process accompanied with product research and development is established, systematic work of qualitative simulation evaluation, rule design and quantitative analysis verification is sequentially carried out in various stages of project approval demonstration, scheme design, design verification and the like of product design, and process conditions, material characteristics and rationality and feasibility of system layout are rapidly evaluated; qualitative support is provided for agile design of the scheme; designing rules and optimization ranges of structures such as a radio frequency link, a digital link and a coupling shield are formulated according to process and material rules, and accurate initial input is provided for comprehensive design of a product; according to the layout wiring form, digital, radio frequency and coupling areas are formed through division, time domain analysis, frequency domain analysis and near field analysis are carried out in a targeted mode, quantitative reference is provided for judging design reasonability, and an effective basis is provided for optimizing design content.

The invention provides a multi-physical coupling simulation method and device for a millimeter wave radar radio frequency integrated microsystem, and belongs to the technical field of simulation. The method provided by the invention comprises the following steps: constructing an initial physical model; performing electromagnetic simulation on the initial physical model to obtain electromagnetic performance and component power loss; performing thermal simulation on the initial physical model by taking the power loss of the component as a heat source to obtain the thermal performance of the initial physical model; constructing a multi-objective optimization problem based on the electromagnetic performance and the thermal performance, and obtaining a parameter group of the initial physical model; establishing a Pareto frontier solution set based on the plurality of parameter groups; and determining a target parameter group from the Pareto leading-edge solution set based on an engineering target, and taking the target parameter group as an operation parameter group of the initial physical model. The invention provides a multi-physical coupling simulation method and device for a millimeter wave radar radio frequency integrated microsystem. The method and device are used for improving the design efficiency and precision of the millimeter wave radar radio frequency integrated microsystem.

The application discloses a three-dimensional ferroelectric material based on two-dimensional ice stacking and preparation and application thereof, and belongs to the technical field of ferroelectric materials and multifunctional devices. The material is a three-dimensional periodic crystal structure of monoclinic P21 space group, water molecules in the material form a completely saturated network through hydrogen bonds, and there is no suspended hydrogen; interlayers are coupled through van der Waals force to form a multi-level cooperative ferroelectric sequence of "in-plane hydrogen bond ferroelectric + interlayer van der Waals ferroelectric". The material has the characteristics of a wide-bandgap semiconductor (band gap 5-6 eV), extreme anisotropic mechanical properties (Z-axis Young's modulus 48.6 GPa, Eyx=0.973), moderate bulk modulus (12.23 GPa), good acoustic performance (sound velocity 2638 m / s) and extremely high pressure stability (0-3000 GPa structure is complete, 1190 GPa metalization transition). The material can be widely applied in the fields of X-ray optical devices, ferroelectric memories, deep ultraviolet photoelectric detectors, extreme high-pressure sensors, directional stress sensors, mechanical logic devices, surface acoustic wave filters, multifunctional integrated microsystems and multi-parameter composite sensing networks, and opens up a new direction for pure water-based functional materials.

The invention discloses a high-power-density driving and energy control integrated electromechanical servo mechanism. Control drive components are integrated into an intelligent microsystem through the SIP stacking technology, high integration and miniaturization of a control driver are achieved, and the problems of heat dissipation and heat conduction are solved by attaching the metal adapter plate to the surface of the shell. The semi-solid lithium ion battery pack is used as an energy part, the appearance of the battery pack is designed according to shell structure matching, and the total envelope size is reduced. Meanwhile, the peak current output capability of the power supply is fused with a motor acceleration control method, and the regenerative electric energy absorption capability of the power supply is fused with a motor deceleration control method; a driver direct current bus input filter capacitor and a power supply output capacitor are fused, power supply output current and voltage detection and driver bus voltage monitoring are fused, and the optimal design of energy control driving comprehensive performance is achieved.

The present application relates to a kind of radio frequency microsystem based on wave-absorbing shielding structure, comprising: radiation source, it is configured to produce electromagnetic radiation;And wave-absorbing shielding structure, it is configured to absorb and shield electromagnetic radiation produced by the radiation source, wherein the wave-absorbing shielding structure includes: electromagnetic material layer, it is configured to absorb electromagnetic radiation;Resonant cavity, it is configured to absorb electromagnetic radiation;Conformal shielding layer, it is configured to shield electromagnetic radiation.

The invention provides a silicon adapter plate applied to a radio frequency microsystem and a preparation method thereof, and the method comprises the steps: sequentially forming a plurality of Damascus wiring layers and a plurality of organic medium wiring layers on a silicon substrate through employing a Damascus wiring technology and a PI wiring technology; therefore, the silicon adapter plate can realize high-density integration that the depth-to-width ratio of the TSV blind holes is not less than 10: 1 and the number of wiring layers is 8, the thermal stability and the high-frequency performance of a system are remarkably improved, and a better process platform support is provided for a radio frequency-digital integrated microsystem. Due to the superfine line width and line distance of the second interconnection structure in the Damascus wiring layer, the bottleneck of high-density signal interconnection can be effectively solved, and the transmission power consumption is greatly reduced; due to the existence of the organic medium wiring layer, the problem of large radio frequency loss of a single Damascus wiring layer can be solved, in addition, by adjusting the thickness of the organic medium wiring layer, regulation and control of warping of the adapter plate can be further achieved, and the preparation process is simple, easy to implement and low in manufacturing cost.

The invention relates to a three-dimensional stacked microsystem for communication, navigation and electromagnetic spectrum monitoring application. The three-dimensional stacked microsystem comprises a high-density interconnection substrate; the plurality of functional core particles comprise radio frequency direct sampling core particles and digital baseband processing core particles; the at least one radio frequency channel micro module is arranged on the first side of the high-density interconnection substrate; area array vertical electrical interconnection among the radio frequency channel micro module, the functional core particles and the high-density interconnection substrate and among the functional core particles is realized through micro salient points. The internal structure of the microsystem does not comprise a lead bonding structure. According to the invention, a lead bonding process can be abandoned, a full-flip and wafer-level stacking technology is adopted, and the limitation of volume, weight and signal bandwidth is further broken through through a more optimized radio frequency direct acquisition layout and a full-silicon-based cavity structure, so that the urgent demand of a lightweight unmanned platform on a conduction, guidance and supervision integrated load is met; the system has the characteristics of high performance, miniaturization and low power consumption.

The utility model provides a vacuum packaging device of an on-chip microsystem and a vacuum-packaged on-chip microsystem. The vacuum packaging device comprises an ultrafast laser generating device, an ultra-fast laser generating device, an ultra-fast laser processing device and a vacuum packaging device, wherein the ultrafast laser generating device is used for generating ultrafast laser for bonding; the closed chamber is used for accommodating a microsystem substrate and a cover plate substrate to be bonded; the first displacement table is used for supporting and moving the closed cavity; the second displacement table is used for moving the microsystem substrate and / or the cover plate substrate to be bonded, and is also used for aligning, fitting and fixing the bonding parts of the microsystem substrate and the cover plate substrate; the vacuum system is connected with the closed chamber and is used for pumping the vacuum degree of the closed chamber to preset air pressure after the microsystem substrate and the cover plate substrate are arranged in the closed chamber; and the driving system is used for providing voltage driving for the ultrafast laser generating device, the first displacement table, the second displacement table and the vacuum system. According to the utility model, the vacuum packaging of the on-chip microsystem under the condition of room temperature can be realized.

Disclosed is a microsystem for delivering a plurality of materials. The microsystem for delivering a plurality of materials can include a microstructure in which a microneedle is formed on one surface of a base film and the microstructure is made of a first material, and a material accommodation portion disposed in one region of the microstructure and having an accommodation space for accommodating a second material different from the first material.

The invention relates to a device for reducing interference of a GDS microscopic system on a focus tracking external light source. A connecting seat is fixed on one side of a mounting shell; the vertical surface of the sliding seat is slidably connected with the connecting seat, and the horizontal surface is located at one end of the mounting shell away from the camera; an objective lens is mounted on the horizontal plane of the sliding seat; the objective lens, the imaging barrel lens and the camera are located on the same axis, and the sliding direction of the sliding seat is parallel to the axis; the focusing sensor is connected to one side of the mounting shell, a short-pass dichroscope is fixed in the mounting shell, the short-pass dichroscope is used for reflecting laser emitted by the focusing sensor to the objective lens, and the laser is reflected by a shot object and then is reflected by the short-pass dichroscope to the focusing sensor. According to the invention, the interference condition of an external light source is effectively solved, the interference is effectively reduced by more than 80%, the overall detection virtual focus condition is reduced by more than 50%, the detection yield of equipment is improved, and the discharge of over-detection conditions caused by virtual focus is reduced.

The invention relates to a triboelectric-piezoelectric mixed liquid drop energy collection device based on a cantilever beam structure, and solves the technical problem of how to improve the energy conversion efficiency of a liquid drop friction type power generation energy collection device, the triboelectric-piezoelectric mixed liquid drop energy collection device comprises a fixed base, a cantilever beam and a friction power generation sheet, the cantilever beam is fixedly connected with the fixed base, and the cantilever beam is fixedly connected with the friction power generation sheet. The friction power generation piece is connected with the cantilever beam, the friction power generation piece is arranged in the vertical direction and is perpendicular to the cantilever beam, the cantilever beam comprises an upper electrode layer, a piezoelectric piece and a lower electrode layer, the piezoelectric piece is located between the upper electrode layer and the lower electrode layer, and the friction power generation piece comprises a left friction layer, a middle electrode layer, a right friction layer and a conducting strip. The conducting strip is connected with the right friction layer. The method is suitable for scenes of self-powered sensing systems, micro-system energy supply, embedded energy modules and the like.

The invention particularly relates to a millimeter wave eight-channel fully-polarized active phased array based on a TSV (Through Silicon Via) process. The millimeter wave eight-channel fully-polarized active phased array comprises a top antenna array, a silicon-based three-dimensional stacked eight-channel radio frequency microsystem, a bottom radio frequency control network and a power supply control layer, the silicon-based three-dimensional stacked eight-channel radio frequency microsystem comprises an upper radio frequency module, a lower radio frequency module, a top BGA solder ball, a middle BGA solder ball and a bottom BGA solder ball, the top-layer antenna array is located above the upper-layer radio frequency module, and the radio frequency control network is located below the lower-layer radio frequency module; and the bottom radio frequency control network sequentially passes through the bottom BGA solder balls, the lower radio frequency module, the middle BGA solder balls, the upper radio frequency module and the top BGA solder balls to the top antenna array. According to the millimeter wave eight-channel fully-polarized active phased-array antenna system, the micro-nano machining characteristic of the TSV technology is utilized, an eight-channel radio frequency microsystem is combined with an external dual-polarized array antenna, and the design of the millimeter wave eight-channel fully-polarized active phased-array antenna system is successfully achieved.

The invention discloses a floating type multi-parameter water quality monitoring microsystem and a preparation method thereof, and belongs to the technical field of water quality monitoring. The water quality monitoring microsystem sequentially comprises a functional floating carrier substrate, a flexible circuit module and an insulating packaging layer from bottom to top, the flexible circuit module comprises a flexible insulating dielectric layer, a planar spiral inductance coil is arranged on the upper surface of the flexible insulating dielectric layer, and a plurality of interdigital electrodes are arranged on the lower surface of the flexible insulating dielectric layer; each interdigital electrode is connected with the planar spiral inductance coil to form an LC resonant circuit of which the working frequencies are not overlapped; the surfaces of the interdigital electrodes are coated with ion sensitive membranes respectively; a through detection window is formed in the position, corresponding to the interdigital electrode, of the functionalized floating carrier substrate, so that the interdigital electrode can be directly contacted with a water body to be detected below through the detection window; and the insulating packaging layer completely covers the planar spiral inductance coil. The system can be used for monitoring water quality, and has the advantages of good real-time performance, high detection precision and the like.

A multi-parameter BP neural network temperature compensation method for an inertial microsystem comprises the steps of performing full-temperature-range precise calibration and establishing a data set, establishing a multi-physical-effect fused multi-parameter coupling error model, and establishing a BP neural network compensation model with temperature and error coefficients as input and compensation parameters as output. Dynamically adjusting a learning rate optimization convergence process by adopting a self-adaptive learning rate momentum method to obtain an optimal network weight and bias parameter, inputting the optimal network weight and bias parameter into the BP neural network compensation model, burning the updated BP neural network compensation model into the inertial microsystem, and finally obtaining the optimal network weight and bias parameter of the inertial microsystem. According to the method, multi-parameter coupling modeling and online compensation are combined, so that full-temperature-range, high-precision and autonomous temperature compensation of the inertial microsystem is realized, the performance stability and reliability of the inertial microsystem in a complex temperature environment are ensured, and the method is suitable for large-scale popularization and application. And the output precision and stability of the inertial microsystem in a complex temperature environment are obviously improved.

The invention relates to the field of microsystem manufacturing, and discloses a flexible tool clamp based on interchangeability, which comprises a base substrate and an upper pressing plate, and the upper pressing plate is detachably connected with the base substrate through an elastic buckle and a pin; a plugging head is arranged on the base substrate and is used for completely sealing the welding flux in the welding hole; the upper pressing plate is integrated with a vertical rail groove and a horizontal rail groove, the vertical rail groove is used for installing the horizontal rail groove, and the horizontal rail groove is used for arranging the sliding pressing head; the sliding pressing head is fixed in the horizontal rail groove through a bolt and used for fixing an assembly part in the to-be-welded assembly. According to the flexible tool clamp, stepless adjustment can be carried out according to the structural change of a radio frequency product, the assembly welding requirements of assemblies with different shapes and different channel numbers can be met through one set of flexible tool, resource waste caused by repeated development is avoided through the design, the research and development and trial production period can be greatly shortened, and the production efficiency is improved. Therefore, the manpower, material and financial costs are obviously reduced.

The invention relates to a simulation method for the influence of a radiation environment on the signal transmission characteristics of a microsystem device, and the method comprises the following steps: S1, constructing a three-dimensional model of the microsystem device, and splitting the three-dimensional model into independent grid files according to the types of materials; s2, setting a particle type, energy and an incident region in Geant4, simulating particle bombardment, and outputting single-particle energy deposition data, energy deposition distribution and linear energy transfer (LET) data; s3, establishing a material damage model in MATLAB, and calculating the post-radiation conductivity sigma (t) and relative dielectric constant epsilon r based on particle and substance action mechanism analysis; and S4, updating the material parameters calculated in the step S3 to a device model in the HFSS, simulating a signal transmission characteristic curve in a radiation environment, and analyzing an influence mechanism of radiation on signal transmission. The electrical performance of the micro-system device can be accurately evaluated in different radiation environments, a scientific basis is provided for design and optimization of the micro-system device in a high-radiation environment, and the anti-radiation capability and reliability of the device are effectively improved.

The invention provides a model-based MEMS-CMOS collaborative design method and device. The method comprises the following steps: constructing a parameterized collaborative model library; based on the collaborative model library, driving an MEMS simulator and a CMOS simulator to perform joint simulation through an automatic script engine, and automatically extracting system-level key performance indexes from a simulation result; taking the system-level key performance index as an optimization target, adopting a multi-target optimization algorithm to carry out collaborative optimization on design parameters in the MEMS parameterized multi-physical field model and the CMOS parameterized circuit macro model at the same time, and generating a Pareto optimal solution set; and performing Monte Carlo analysis on the design selected from the Pareto optimal solution set, and evaluating the yield of the design. According to the collaborative design method provided by the invention, a system-level optimal solution can be found, and the problem that the overall performance is reduced due to local optimum is avoided; the tape-out success rate is improved, and the design efficiency and the design precision of the whole microsystem are improved.

This invention proposes a battery internal multi-parameter monitoring microsystem module and packaging method based on system-level packaging, belonging to the field of microelectronic packaging and battery management technology. The module includes: a packaging substrate; a pressure sensing chip, a temperature sensing chip, a gas sensing chip, and a signal processing chip, respectively mounted on different positions on the same plane of the packaging substrate; the signal processing chip is electrically connected to the pressure sensing chip, the temperature sensing chip, and the gas sensing chip; an integrated molding compound encapsulates the packaging substrate, the pressure sensing chip, the temperature sensing chip, the gas sensing chip, and the signal processing chip; wherein, at least two open cavities are formed on the integrated molding compound, and the at least two open cavities expose the pressure-sensing diaphragm of the pressure sensing chip and the sensitive area of ​​the gas sensing chip, respectively.

The invention relates to the technical field of antennas, in particular to an AOB framework active phased-array antenna microsystem for low-altitude monitoring. The system comprises a multi-layer PCB support plate, and an array antenna, a TR assembly, a feed network, a wave control module, a heat dissipation structure and a power supply module are integrated on the multi-layer PCB support plate. The multi-layer PCB support plate is formed by mixing and pressing seven PCBs and six prepregs PP, and the array antenna, the TR assembly, the feed network, the wave control module, the heat dissipation structure and the power supply module are distributed in a pressed layered structure. The device has the characteristics of high integration, high density, low profile, light weight, low cost, simple structure, easiness in processing, convenience in automatic batch production and the like, and has good practical value and application prospect in the field of low-altitude economic safety perception.

The application provides a D-band one-dimensional DBF-AIP microsystem architecture, comprising a quartz substrate, an on-chip antenna arranged on the upper surface of the quartz substrate, an RFIC chip arranged on the lower surface of the quartz substrate, a microwave board arranged below the quartz substrate, and BGA solder balls for connecting the quartz substrate and the microwave board. The D-band one-dimensional DBF-AIP microsystem architecture provided by the application maximally shortens the signal transmission distance, reduces the parasitic parameters, and obtains better performance, and meanwhile, the D-band one-dimensional DBF-AIP microsystem architecture is small in size, light in weight, and suitable for large-scale integration.

The invention discloses a microsystem single event effect risk assessment method, which comprises the following steps: constructing a device-level model and a circuit-level model, and performing single event effect simulation on a device to obtain single event transient current curves under different linear energy transfer values LET; performing double-index model fitting to obtain an LET threshold value of each module; establishing a fault tree model based on the system architecture, and carrying out quantitative analysis to calculate the fault rate, the unavailability and the average fault interval time of each bottom event; and establishing a fault transmission model based on a Bayesian network, and identifying key risk nodes. According to the method, a circuit-level and system-level combined risk assessment model is innovatively constructed, and comprehensive and accurate assessment of the single event effect risk of the astronavigation microsystem is realized. Through methods such as fault tree modeling and Bayesian network modeling, transmission paths and influence factors of the faults can be deeply analyzed, key nodes of the system faults are identified, and a scientific basis is provided for design optimization and risk prevention and control of the microsystem.

The disclosure relates to a microelectromechanical system comprising a support and an actuator comprising a drive module comprising: a fixed drive portion, mounted fixedly on the support, and comprising a fixed comb with fingers, and a movable drive portion, mounted movably relative to the support, and comprising a movable comb with fingers, a latching mechanism movable between an initial unlatched configuration and a final latched configuration. The movable comb is arranged facing the fixed comb so that when the latching mechanism is in the initial unlatched configuration, the fingers of the movable comb are not engaged between the fingers of the fixed comb, and when the latching mechanism is in the final latched configuration, the fingers of the movable comb are engaged between the fingers of the fixed comb and the latching mechanism prevents disengagement of the fingers of the movable comb from between the fingers of the fixed comb.

This disclosure provides a thermal, mechanical, and fluid measurement system and testing method for microwave microsystems under complex service environments. The system includes: an environmental simulation subsystem, comprising an internal thermal excitation module and an external environmental simulation module. The internal thermal excitation module generates and outputs target thermal power to simulate the operating heat generation of a power-consuming chip in the microwave microsystem under test. The external environmental simulation module controls the external boundary conditions applied to the microwave microsystem under test, including at least two of thermal conduction boundary conditions, thermal convection boundary conditions, thermal radiation boundary conditions, and random vibrational dynamic loads. A comprehensive measurement subsystem is used to obtain temperature field information, stress-strain information, and liquid cooling fluid parameters of the microwave microsystem under test in the state of coordinated operation of the internal thermal excitation module and the external environmental simulation module. The environmental simulation subsystem and the comprehensive measurement subsystem are integrated in a test platform, and the microwave microsystem under test is placed in the test platform for testing.

The application discloses a method for calculating transient temperature of a three-dimensional microsystem under transient chip power, and belongs to the microelectronic technical field, comprising the following steps: determining anisotropic equivalent thermal conductivity of a substrate layer and a microsolder pad layer; taking a chip as a heat source, carrying out Fourier series expansion on heat flow density generated by each chip to obtain total heat flow density generated by the upper surface of each substrate layer; constructing a transient thermal analysis model under fixed chip power according to the total heat flow density; and updating chip power of each chip in the transient thermal analysis model in a plurality of continuous time periods to obtain a transient temperature field of the three-dimensional microsystem at all time nodes. Since the application considers the case that chip power in the three-dimensional microsystem changes with time when constructing the transient thermal analysis model under fixed chip power, the calculated temperature has higher precision, and the calculation efficiency is greatly improved.

The present application relates to the technical field of three-dimensional integrated circuit protection in aerospace radiation environment, and particularly relates to a method and system for simulating and modeling a microsystem interconnection module based on a through silicon via under proton irradiation. The method comprises: constructing a three-dimensional finite element model containing a through silicon via, a redistribution layer and a micro-bump, adjusting material parameters to extract scattering parameters, and establishing a correlation model between material characteristics and scattering parameters; constructing an equivalent RLC circuit in an ADS environment and establishing a corresponding relationship between the equivalent RLC circuit and the scattering parameters; combining a proton irradiation experiment to obtain scattering parameters under different radiation fluences, and further establishing a correlation model between the radiation fluence and the RLC circuit parameters. The present application combines simulation and experimental methods to achieve precise modeling between the radiation dose, the circuit parameters and the scattering characteristics, and provides support for the electrical performance prediction and protection design of three-dimensional microsystems in complex radiation environments.

The invention provides a floating type recycling-free marine multi-physical-quantity intelligent sensing microsystem which comprises a wide-area sensing unit and a comprehensive information management and control center. The wide-area sensing units are suitable for floating on the water surface and have a built-in ocean information sensing function, and autonomous networking communication among different wide-area sensing units and between the wide-area sensing units and nearby networking units is suitable for realizing networking detection and nearby service of ocean data information; and the information management and control center is arranged on a shipborne or shore-based platform and is used for performing task management and control and information processing on the wide-area sensing unit. According to the invention, miniaturization, low cost, maintenance-free and large-range application requirements of wide-area ocean monitoring are fully considered, all functional modules of the sensing unit are integrated, miniaturization and low cost of equipment are realized, the problem of wide-area ocean low-cost monitoring is solved, and the wide-area ocean low-cost monitoring is realized. And monitoring information and position information of each monitoring terminal are reported to an information management and control center through a Beidou short message function, so that wide-area ocean monitoring is realized.

This invention relates to the field of three-dimensional heterogeneous microsystem integration technology, and in particular to an IC-MEMS three-dimensional heterogeneous microsystem integration structure and its fabrication method. The proposed IC-MEMS three-dimensional heterogeneous microsystem integration structure vertically integrates a multi-chip integration layer, a wiring connection layer, and an IC-MEMS integration layer, realizing the combination, arrangement, integration, and connection of the three layers, effectively overcoming the problem of increased chip area caused by horizontal integration. This integration structure realizes the integration of peripheral circuits, multi-layer metal wiring, TSV adapter board, front-end IC, and movable MEMS structures, forming a complete and functionally rich three-dimensional heterogeneous IC-MEMS microsystem.

The invention relates to a quantum sensing microsystem and method. Comprising optical coupling between a light source and a grating coupler, integration of the grating coupler on a main optical waveguide, evanescent field coupling between the main optical waveguide and a diamond NV color center, near-field coupling between the main optical waveguide and an optical filter, and evanescent field coupling between the optical filter and a photodiode. The light source is used for emitting laser and enabling the laser to enter the grating coupler; the grating coupler is used for transmitting the laser to the diamond NV color center through the main optical waveguide, and the diamond NV color center emits fluorescent light according to laser excitation; the optical filter is used for filtering laser and coupling fluorescence to the photodiode through an evanescent field; the photodiode is used for generating a corresponding digital signal based on the fluorescence, and the digital signal is used for calculating a magnetic field measurement result of the to-be-measured magnetic field where the quantum sensing microsystem is located. According to the invention, the size of the quantum sensing system can be reduced.