259 results about "Microsystem" patented technology

Disclosed in the present invention is a physics-informed neural network-based thermo-mechanical coupling analysis method for an inertial microsystem, the method comprising: S1, configuring material parameters and boundary conditions of an inertial microsystem, and establishing a thermo-mechanical coupling analysis model; S2, performing electro-thermal coupling analysis to obtain a temperature distribution of the inertial microsystem; S3, performing thermo-mechanical coupling simulation analysis to obtain a thermal stress distribution of the microsystem; S4, predicting temperature fields of the microsystem by means of a physics-informed neural network; S5, using the temperature fields as boundary conditions for mechanical simulation of the microsystem, obtaining mechanical properties such as stress and strain of the microsystem; and S6, performing electromechanical coupling simulation analysis to analyze the impact of structural deformation on various parameters of electrical performance. The present invention improves the solution accuracy of the neural network by means of an improved adaptive weighting strategy, combines a complete polynomial basis function with the neural network, and introduces an expanded basis function to reduce the state dimensionality, thus reducing computational costs and time, achieving accurate prediction of temperature fields of microsystems at multiple moments, and allowing for computation of the performance of microsystems under electro-thermal-mechanical multi-physics coupling.

The invention discloses a self-closed-loop microsystem air cooling heat dissipation structure based on a micropump. The self-closed-loop microsystem air cooling heat dissipation structure comprises a microchannel radiator, the micropump, a fan combination, a temperature measurement optical fiber, a control module, cooling liquid and the like. According to the invention, a heat dissipation mode of combining liquid cooling internal circulation with air cooling external circulation is adopted, the air cooling heat dissipation problem of the high-heat-flux power chip is converted into a conventional air cooling heat dissipation problem, and the air cooling heat dissipation problem of the high-heat-flux power chip in the current engineering is solved; liquid cooling internal circulation is physically isolated from the external environment, so that the risk that impurities block a flow channel in secondary heat exchange equipment is avoided, and the reliability of the equipment is improved; the micro-channel radiator adopts a three-dimensional flow channel, the size is greatly reduced, and the tree-shaped distribution network and the micro-channel heat sink are combined, so that the heat exchange capacity is improved; and a self-adaptive temperature control measure based on temperature feedback is adopted, so that the power chip works in a proper temperature range, the performance and reliability of equipment are improved, and the service life of the equipment is prolonged.

The application discloses a high-reliability high-power three-dimensional heterogeneous integrated radio frequency antenna integrated microsystem, comprising a DPC substrate, a copper-based three-dimensional structure, a two-stage SiC adapter plate, a bare chip, a radio frequency circuit, a passive device and an antenna interface; wherein the DPC substrate is used for realizing integrated three-dimensional heterogeneous integration of the microsystem; the copper-based three-dimensional structure comprises a three-dimensional coaxial transmission structure and a three-dimensional packaging frame structure, and is used for realizing vertical transmission of high-power radio frequency signals and air-tight packaging of the microsystem; the two-stage SiC adapter plate is used for realizing a 2.5D*2 five-layer ultra-high-density mixed three-dimensional stacking architecture; the bare chip comprises a silicon-based Fan-out multifunctional bare chip, a power management bare chip, a power amplifier bare chip and a receiving bare chip; the radio frequency circuit comprises a radio frequency transmitting circuit and a radio frequency receiving circuit. The application forms a complete integrated air-tight packaging microsystem, and simultaneously realizes high reliability, high-density integration and high-power heat dissipation.

The invention discloses a photoelectric liquid interconnection structure of a system-on-chip, an assembly method of the photoelectric liquid interconnection structure and the system-on-chip. The photoelectric liquid interconnection structure comprises a heat dissipation microsystem, a wafer-level substrate and a power supply microsystem interconnection structural member which are stacked in a layered manner, the power supply microsystem comprises a power supply board II for preliminarily distributing an external power supply, and a power supply board I for inputting and controlling signals and secondarily distributing current preliminarily distributed by the power supply board II; the interconnection structural member comprises an elastic needle connector used for current transmission and signal transmission between the first power supply board and the second power supply board, and a fuzz button connector used for signal transmission and current transmission between the first power supply board and the wafer-level substrate and having a double-sided elastic contact function. Assembling is carried out by adopting a layered stacking connection mode and a step-by-step assembling method, high-density integration and high-precision interconnection of modules / components are achieved, and the technical problem that an existing on-chip system cannot achieve high-density and high-precision signal transmission, system power supply and heat dissipation in a limited space is solved.

The present invention discloses a method for simulating and analyzing PI and SI signals of DDR3 in a microsystem module, which realizes simulation analysis of power integrity and signal integrity of the microsystem module, provides simulation judgment criteria, and improves simulation accuracy. The method includes the steps of merging a silicon substrate and a tube shell and then performing a DC voltage drop simulation. The steps are as follows: importing the layout of the tube shell and the silicon substrate into simulation software and setting simulation parameters; adding a voltage source and a current source between the power pin and the ground pin of the chip, starting the simulation software to perform a DC voltage drop simulation and performing calculations to obtain a simulation result; judging whether the simulation result meets the requirements according to the simulation criteria, and if so, completing the simulation; if not, locating the items in the layout that do not meet the simulation criteria, and modifying the layout of the items that do not meet the simulation criteria until the requirements are met and the simulation is completed.

The invention discloses a microscopic imaging device and a super-resolution microscopic imaging method, and the device comprises a sample stage which is used for containing a sample; the laser is used for emitting laser; the first digital micromirror is used for receiving the laser and generating diffracted light; the light condensing unit is used for condensing the plurality of diffracted light to form structured light so as to excite fluorescence carrying sample information; the second digital micromirror is used for receiving the fluorescence and converting the fluorescence into a random binary coding image; the image acquisition unit is used for receiving images and transmitting the images to the processing unit; the processing unit is used for reconstructing a microscopic super-resolution image based on the plurality of random binary coding images; the first digital micromirror, the second digital micromirror and the image acquisition unit are in communication connection, and the second digital micromirror controls the grating pattern conversion frequency of the first digital micromirror and controls the image acquisition frequency of the image acquisition unit. The biological cell sample can be protected from being damaged by phototoxicity and photobleaching performance, and super-resolution imaging in the structured illumination obvious microsystem is achieved.

The invention relates to the technical field of microsystem module air tightness detection, in particular to a microsystem module online air tightness leak detection device and method based on a humidity sensor, and the device comprises a microsystem module, the humidity sensor embedded and integrated in the package of the microsystem module, and a detection unit connected with the humidity sensor. The detection unit is connected with the humidity sensor and used for acquiring a humidity signal, monitored by the humidity sensor, inside the microsystem module package, and the controller is connected with the detection unit and used for judging the air tightness state of the microsystem module based on the humidity signal and the quantitative relation between the preset humidity change and the leakage rate; and the output unit is connected with the controller and is used for outputting the air tightness state. According to the invention, in-situ, online and long-term nondestructive monitoring of the airtightness of the microsystem module is realized, and the integrated requirements of different types of microsystem modules can be met.

The invention discloses a W-band two-dimensional DBF microsystem based on an AiP technology, and belongs to the technical field of packaging antennas, the W-band two-dimensional DBF microsystem comprises an active array antenna module for realizing transceiving and frequency conversion of W-band signals, the active array antenna module is provided with a plurality of antenna units, and each antenna unit corresponds to a signal processing channel; the radio frequency direct acquisition transceiver module is used for multi-channel parallel sampling and transmitting and completing conversion between an analog radio frequency signal and a digital baseband signal; the digital beam former module is used for carrying out weighting, phase correction and delay control on each channel signal output by the radio frequency direct acquisition transceiver module so as to realize two-dimensional digital beam forming; and the active array antenna module, the radio frequency direct acquisition transceiver module and the digital beam former module are independently integrated on the integrated module to realize integral packaging. According to the invention, deep fusion of the AiP module and the DBF module is realized under the W-band condition.

The invention discloses a broadband double-layer interconnection structure based on a silicon adapter plate technology, and belongs to the technical field of radio frequency microsystems. According to the method, a three-dimensional compensation structure is formed by adding square conductive metal and TSVs into lower-layer metal at one end, close to a transition structure, of an original coplanar waveguide transmission line, and a resonance point with return loss of-51dB is introduced at 17.59 GHz, so that the broadband interconnection effect that the return loss of 0-33GHz is smaller than or equal to-20dB is achieved, and the in-band insertion loss fluctuation value is reduced by 11.6% compared with that of the original structure. Compared with a traditional interconnection structure broadband design, the method has the advantages that on the premise that the plane area is not increased, the broadband interconnection design difficulty is greatly reduced through the three-dimensional structure design.

The invention discloses a signal integrity simulation analysis method for a digital radio frequency hybrid microsystem, and belongs to the field of advanced packaging of integrated circuits. According to the method, a complete analysis process accompanied with product research and development is established, systematic work of qualitative simulation evaluation, rule design and quantitative analysis verification is sequentially carried out in various stages of project approval demonstration, scheme design, design verification and the like of product design, and process conditions, material characteristics and rationality and feasibility of system layout are rapidly evaluated; qualitative support is provided for agile design of the scheme; designing rules and optimization ranges of structures such as a radio frequency link, a digital link and a coupling shield are formulated according to process and material rules, and accurate initial input is provided for comprehensive design of a product; according to the layout wiring form, digital, radio frequency and coupling areas are formed through division, time domain analysis, frequency domain analysis and near field analysis are carried out in a targeted mode, quantitative reference is provided for judging design reasonability, and an effective basis is provided for optimizing design content.

The invention discloses a digital system power distribution network impedance optimization method and system, and the method comprises the following steps: S1, obtaining the frequency-varying parasitic parameters Jg (f), Jr (f) and Jz (f) of a digital system power supply through a vector network analyzer, and enabling f to be a frequency variable; s2, calculating a dynamic matching coefficient DsC based on the frequency-varying parasitic parameter, and calling a PDN decoupling scheme set from a decoupling scheme database according to a DsC matching interval; s3, inputting the PDN decoupling scheme set into ADS software for segmented variable step size impedance simulation, wherein the step size of the frequency band from 1 MHz to 100 MHz is 0.5 MHz, and the step size of the frequency band from 100 MHz to 3 GHz is 5 MHz; and generating a surface-mounted PCB decoupling index DI containing a resonance penalty term and a micro-system substrate decoupling index WI. According to the method, the high-frequency resonance suppression capability is improved, frequency change parasitic parameter extraction is combined with resonance point penalty term design, impedance peak fluctuation is compressed to be within + / -8% of a target value in a 1-3GHz frequency band, and actually measured power supply noise of a 10Gbps SerDes interface is reduced by 62%.

The invention discloses a high-reliability three-dimensional integrated direct sampling software radio architecture radio frequency microsystem, which is based on a direct sampling software radio system architecture and a multi-layer glass-based TGV adapter plate wafer-level bonded POP three-dimensional stacked packaging architecture. A high-performance glass antenna, silicon-based single core particle Fan-in and Fan-out packaging, mixed multi-core particle integration of an embedded glass-based TGV adapter plate, mixed bonding integration of a silicon-based digital TSV adapter plate and the glass-based TGV adapter plate are combined, and a glass antenna, a direct sampling core particle, a silicon-based computing power circuit, a silicon-based storage circuit and a silicon-based interface circuit are integrated. And the three-dimensional heterogeneous integration of the microsystem is realized. According to the micro-system, a glass substrate is used as a main body packaging material, a radio frequency circuit and a digital-analog hybrid circuit are fused, three-dimensional heterogeneous integration from a glass antenna to a baseband storage and calculation integrated processing circuit is realized, and a complete integrated airtight packaging micro-system is formed and can cover a DC-20GHz frequency band.

The present invention discloses a thermomechanical coupling analysis method for an inertial microsystem based on a physical information neural network, comprising: S1, setting the material parameters and boundary conditions of the inertial microsystem and establishing a thermomechanical coupling analysis model; S2, obtaining the temperature distribution of the inertial microsystem through electrothermal coupling analysis; S3, obtaining the thermal stress distribution of the microsystem through thermomechanical coupling simulation analysis; S4, predicting the temperature field of the microsystem through a physical information neural network; S5, using the temperature field as the boundary condition for the mechanical simulation of the microsystem to obtain the mechanical properties such as stress and strain of the microsystem; S6, performing electromechanical coupling simulation analysis to analyze the influence of structural deformation on various parameters in the electrical properties. The present invention improves the solving accuracy of the neural network through an improved adaptive weight strategy, combines the complete polynomial basis function with the neural network, introduces the expanded basis function to reduce the state dimension, reduces the computational cost and time, realizes the accurate prediction of the temperature field of the microsystem at multiple moments, and calculates the performance of the microsystem under the coupling of electrothermal and mechanical multi-physical fields.

The invention provides a heterogeneous multi-core sealing microsystem for satellite-borne on-orbit intelligent calculation and a fusion method, belongs to the field of electrical data processing, and aims at data processing, intelligent reasoning and decision control requirements in a satellite-borne intelligent application scene, a multi-core / single-core scalar, vector and tensor intelligent calculation unit is integrated on a single chip, and the multi-core scalar, vector and tensor intelligent calculation unit is integrated on the single chip. Meanwhile, a real-time efficient calculation scheduling unit is arranged, parallel heterogeneous calculation can be carried out on the premise of a high energy efficiency ratio, and hot backup and protection reinforcement treatment are set at the same time according to the requirements of radiation prevention, cosmic ray prevention and high-energy particle prevention of a satellite-borne scene. The scheme of high performance, small size and small mass is adopted, and the antenna is suitable for satellite-borne application scenes.

A method (600) is presented. The method (600) comprising obtaining (610) an engineering plan and a chiplet arrangement hardware model. The method (600) further comprises estimating (630) a microsystem hardware model based on the hardware requirements and a hardware data set describing hardware resources of the chiplet arrangement and simulating (640) the estimated microsystem hardware model by electrical simulations to provide one or more hardware capabilities. The method (600) further comprises obtaining (650) a chiplet arrangement environment model and estimating (660) a microsystem software model using the hardware capabilities and the software requirements. The method (600) further comprises simulating (670) the estimated microsystem software model on the chiplet arrangement environment model to provide one or more software capabilities and compiling (680) the estimated microsystem hardware model, the estimated microsystem software model, the one or more hardware capabilities, the one or more software capabilities to a microsystem model comprising one or more microsystem capabilities.

The invention provides a test fixture for a photoelectric microsystem. The test fixture comprises a test seat and a test plate, the test seat comprises a cooling device, an adapter plate, a needle frame and a heat sink; the cooling device is fixed to the heat sink and used for cooling the heat sink. The heat sink provides downward pressing force, so that the elastic contact of the photoelectric microsystem is connected to the adapter plate, and meanwhile, the adapter plate is pressed on the pin frame; the needle frame is made of metal and is used as a ground network; the signal pins are fixed on the pin frame through the dielectric ring to form signal point locations; the power needles are fixed on the needle frame through the medium rings to form power source point positions; the power needle is directly fixed on the needle frame to form a site; the signal pin and the power pin are connected with the test board; by adjusting the installed signal pin and the power pin, the photoelectric micro-system test with different pin definitions can be adapted.

The application discloses a microsystem for an LCD light-curing 3D printing device and a micro-nano 3D printing method, wherein light rays converged by a converging lens group are micro-imaged on a printing forming area of the 3D printing device through a micro-lens group, micro-nano 3D printing is realized, the cost is effectively reduced, and the service life of the LCD screen is effectively prolonged because the LCD screen does not bear external force during general 3D printing.

A microsystem includes a substrate; a main part connected to the substrate via an anchor; a moving part configured to rotate about an axis of rotation O; a first beam connecting the moving part to the main part, the main direction of said first beam being along a first vector ej1 having as origin the junction of the moving part with the first beam and in the sense of the main part; a second beam connecting the moving part to the main part, the main direction of the second beam being along a second vector ej2 having as origin the junction of the moving part with the second beam and in the sense of the main part.

Textile-integrated microsystem for transdermal drug delivery, characterized in that it has microstructured channels or micropores that enable non-invasive penetration of the upper skin layer.

The invention provides a multi-physical coupling simulation method and device for a millimeter wave radar radio frequency integrated microsystem, and belongs to the technical field of simulation. The method provided by the invention comprises the following steps: constructing an initial physical model; performing electromagnetic simulation on the initial physical model to obtain electromagnetic performance and component power loss; performing thermal simulation on the initial physical model by taking the power loss of the component as a heat source to obtain the thermal performance of the initial physical model; constructing a multi-objective optimization problem based on the electromagnetic performance and the thermal performance, and obtaining a parameter group of the initial physical model; establishing a Pareto frontier solution set based on the plurality of parameter groups; and determining a target parameter group from the Pareto leading-edge solution set based on an engineering target, and taking the target parameter group as an operation parameter group of the initial physical model. The invention provides a multi-physical coupling simulation method and device for a millimeter wave radar radio frequency integrated microsystem. The method and device are used for improving the design efficiency and precision of the millimeter wave radar radio frequency integrated microsystem.

The application discloses a three-dimensional ferroelectric material based on two-dimensional ice stacking and preparation and application thereof, and belongs to the technical field of ferroelectric materials and multifunctional devices. The material is a three-dimensional periodic crystal structure of monoclinic P21 space group, water molecules in the material form a completely saturated network through hydrogen bonds, and there is no suspended hydrogen; interlayers are coupled through van der Waals force to form a multi-level cooperative ferroelectric sequence of "in-plane hydrogen bond ferroelectric + interlayer van der Waals ferroelectric". The material has the characteristics of a wide-bandgap semiconductor (band gap 5-6 eV), extreme anisotropic mechanical properties (Z-axis Young's modulus 48.6 GPa, Eyx=0.973), moderate bulk modulus (12.23 GPa), good acoustic performance (sound velocity 2638 m / s) and extremely high pressure stability (0-3000 GPa structure is complete, 1190 GPa metalization transition). The material can be widely applied in the fields of X-ray optical devices, ferroelectric memories, deep ultraviolet photoelectric detectors, extreme high-pressure sensors, directional stress sensors, mechanical logic devices, surface acoustic wave filters, multifunctional integrated microsystems and multi-parameter composite sensing networks, and opens up a new direction for pure water-based functional materials.

The invention discloses a high-power-density driving and energy control integrated electromechanical servo mechanism. Control drive components are integrated into an intelligent microsystem through the SIP stacking technology, high integration and miniaturization of a control driver are achieved, and the problems of heat dissipation and heat conduction are solved by attaching the metal adapter plate to the surface of the shell. The semi-solid lithium ion battery pack is used as an energy part, the appearance of the battery pack is designed according to shell structure matching, and the total envelope size is reduced. Meanwhile, the peak current output capability of the power supply is fused with a motor acceleration control method, and the regenerative electric energy absorption capability of the power supply is fused with a motor deceleration control method; a driver direct current bus input filter capacitor and a power supply output capacitor are fused, power supply output current and voltage detection and driver bus voltage monitoring are fused, and the optimal design of energy control driving comprehensive performance is achieved.

The application provides a normal-temperature dynamic burn-in device and method for a radio frequency digital mixed signal micro system, which comprises a burn-in control processor, a programmable clock generator electrically connected with the burn-in control processor, and a micro system burn-in test station; the radio frequency digital mixed signal micro system to be tested is connected on the micro system burn-in test station, the number of the micro system burn-in test stations is one or more than one, and each micro system burn-in test station can independently perform burn-in test and temperature control on one radio frequency digital mixed signal micro system to be tested. The application achieves the precise temperature control requirement of high consistency among the multiple chips in the micro system by reasonably designing the temperature control, state monitoring, chip temperature detection and control system and method of the micro system burn-in test station and the burn-in device, thereby realizing the micro system burn-in device without a temperature box; the burn-in method is easy to cascade and expand, and can be applied to the burn-in of micro systems in different batch scales, and is convenient for automatic monitoring and manual inspection.

The present application relates to a kind of radio frequency microsystem based on wave-absorbing shielding structure, comprising: radiation source, it is configured to produce electromagnetic radiation;And wave-absorbing shielding structure, it is configured to absorb and shield electromagnetic radiation produced by the radiation source, wherein the wave-absorbing shielding structure includes: electromagnetic material layer, it is configured to absorb electromagnetic radiation;Resonant cavity, it is configured to absorb electromagnetic radiation;Conformal shielding layer, it is configured to shield electromagnetic radiation.

The invention provides a silicon adapter plate applied to a radio frequency microsystem and a preparation method thereof, and the method comprises the steps: sequentially forming a plurality of Damascus wiring layers and a plurality of organic medium wiring layers on a silicon substrate through employing a Damascus wiring technology and a PI wiring technology; therefore, the silicon adapter plate can realize high-density integration that the depth-to-width ratio of the TSV blind holes is not less than 10: 1 and the number of wiring layers is 8, the thermal stability and the high-frequency performance of a system are remarkably improved, and a better process platform support is provided for a radio frequency-digital integrated microsystem. Due to the superfine line width and line distance of the second interconnection structure in the Damascus wiring layer, the bottleneck of high-density signal interconnection can be effectively solved, and the transmission power consumption is greatly reduced; due to the existence of the organic medium wiring layer, the problem of large radio frequency loss of a single Damascus wiring layer can be solved, in addition, by adjusting the thickness of the organic medium wiring layer, regulation and control of warping of the adapter plate can be further achieved, and the preparation process is simple, easy to implement and low in manufacturing cost.

The invention provides a radio frequency transmitting and receiving fusion circuit, a transmitting and receiving front-end chip and a radio frequency heterogeneous microsystem, and the radio frequency transmitting and receiving fusion circuit comprises a first bidirectional driving amplifier which is configured to be a radio frequency power amplifier and a low noise amplifier in a radio frequency transmitting process and a radio frequency receiving process; the phase shifter is connected with the first bidirectional driving amplifier and is configured to adjust the phase of a radio frequency signal; the radio frequency signal comprises a transmitting signal and a receiving signal; and the second bidirectional driving amplifier is connected with the phase shifter and is configured to carry out frequency mixing on the radio frequency signal. The invention provides a compact and efficient transmit-receive fusion design technology, and modules and devices with similar functions in the transmitting channel and the receiving channel are deeply fused and designed, so that the size of the transmit-receive channel is reduced, the chip simulation integration level is improved, and the performance of the transmit-receive channel is improved.

The invention relates to a three-dimensional stacked microsystem for communication, navigation and electromagnetic spectrum monitoring application. The three-dimensional stacked microsystem comprises a high-density interconnection substrate; the plurality of functional core particles comprise radio frequency direct sampling core particles and digital baseband processing core particles; the at least one radio frequency channel micro module is arranged on the first side of the high-density interconnection substrate; area array vertical electrical interconnection among the radio frequency channel micro module, the functional core particles and the high-density interconnection substrate and among the functional core particles is realized through micro salient points. The internal structure of the microsystem does not comprise a lead bonding structure. According to the invention, a lead bonding process can be abandoned, a full-flip and wafer-level stacking technology is adopted, and the limitation of volume, weight and signal bandwidth is further broken through through a more optimized radio frequency direct acquisition layout and a full-silicon-based cavity structure, so that the urgent demand of a lightweight unmanned platform on a conduction, guidance and supervision integrated load is met; the system has the characteristics of high performance, miniaturization and low power consumption.

The invention discloses a radio frequency adjustable medium cavity structure which comprises a cavity assembly and a metal band. The cavity assembly is formed by overlapping a plurality of metal layers and dielectric layers in a staggered manner, a first non-metal area is arranged in the metal layer at the topmost layer of the cavity assembly in a hollowed-out manner, the metal belt is arranged in the first non-metal area, and a preset angle is formed between the metal belt and the horizontal direction; according to the scheme, the staggered metalized through holes are formed in the periphery of the dielectric cavity, and the at least two working wavelength inclined-strip-shaped metal strips are arranged at the bottom and the top of the first dielectric layer of the dielectric cover plate, so that a negative feedback closed-loop system cannot be formed by radio frequency amplification due to the arrangement of the isolation frame, and radio frequency self-excitation can be inhibited; the top isolation frame is provided with the inclined strip metal belt which can cut off tube wall currents leaked in different directions, so that the electrical performance of the tube wall is changed, the purpose of eliminating radio frequency self-excitation after three-dimensional integration and microsystem integration packaging is achieved, the design flexibility and the product percent of pass are improved, and meanwhile the manpower and material resource cost is saved.

The application discloses a high-overload-resistant heterogeneous integration structure of an inertial microsystem component, which comprises a bottom buffer shell and a top rubber pad arranged in a metal shell of the inertial microsystem component, and an internal cavity formed by the bottom buffer shell and the top rubber pad is used for accommodating an electronic system of the inertial microsystem component; in the application, the bottom surface of the bottom buffer shell is composed of a foamed metal buffer structure and a rubber damping structure, and the foamed metal buffer structure and the rubber damping structure are heterogeneously integrated in a mode that the rubber damping structure surrounds the outer surface of the foamed metal buffer structure. The heterogeneous integration structure of the rubber and the foamed metal realizes the high-overload-resistance and damping characteristics of the inertial microsystem component, and the assembly stability and reliability of the internal electronic system.

An integrated hydrogen sensing microsystem, a manufacturing method, and a data processing method. Belonging to the technical field of integrated hydrogen sensing microsystems. The present invention solves the problem of accurate detection of a wide range that is difficult to solve with a single principle in current hydrogen detection. The alumina ceramic substrate of the present invention is covered with a first semiconductor principle electrode, a second semiconductor principle electrode, and a catalytic principle heating sensitive electrode. The first semiconductor principle electrode is connected to a first platinum pad, and the catalytic principle heating sensitive electrode is connected to a second platinum pad and a third platinum pad. A sensitive semiconductor blackbody silicon carbide anti-infrared radiation packaging layer is formed on the first semiconductor principle electrode and the second semiconductor principle electrode by a semiconductor principle sensitive material, and a sensitive catalytic body blackbody silicon carbide anti-infrared radiation packaging layer is formed on the catalytic principle heating sensitive electrode by a catalytic principle sensitive material. The integrated hydrogen sensing microsystem, the manufacturing method, and the data processing method of the present invention realize wide-range detection of hydrogen concentration.