335 results about "Microsystem" patented technology

The invention discloses an inertial microsystem thermal coupling analysis method based on a physical information neural network, and the method comprises the steps: S1, setting material parameters and boundary conditions of an inertial microsystem, and building a thermal coupling analysis model; s2, performing electrothermal coupling analysis to obtain temperature distribution of the inertial microsystem; s3, thermal stress distribution of the microsystem is obtained through thermal-mechanical coupling simulation analysis; s4, predicting a temperature field of the microsystem through the physical information neural network; s5, taking the temperature field as a boundary condition of mechanical simulation of the microsystem to obtain mechanical properties such as stress and strain of the microsystem; and S6, performing mechanical-electric coupling simulation analysis, and analyzing the influence of structural deformation on each parameter in electrical performance. According to the method, the neural network solving precision is improved through the improved adaptive weight strategy, the complete polynomial basis function is combined with the neural network, the state dimension is reduced by introducing the expansion basis function, the calculation cost and time are reduced, accurate prediction of the micro-system multi-moment temperature field is achieved, and the micro-system performance under electric heating power multi-physics field coupling is calculated.

Disclosed in the present invention is a physics-informed neural network-based thermo-mechanical coupling analysis method for an inertial microsystem, the method comprising: S1, configuring material parameters and boundary conditions of an inertial microsystem, and establishing a thermo-mechanical coupling analysis model; S2, performing electro-thermal coupling analysis to obtain a temperature distribution of the inertial microsystem; S3, performing thermo-mechanical coupling simulation analysis to obtain a thermal stress distribution of the microsystem; S4, predicting temperature fields of the microsystem by means of a physics-informed neural network; S5, using the temperature fields as boundary conditions for mechanical simulation of the microsystem, obtaining mechanical properties such as stress and strain of the microsystem; and S6, performing electromechanical coupling simulation analysis to analyze the impact of structural deformation on various parameters of electrical performance. The present invention improves the solution accuracy of the neural network by means of an improved adaptive weighting strategy, combines a complete polynomial basis function with the neural network, and introduces an expanded basis function to reduce the state dimensionality, thus reducing computational costs and time, achieving accurate prediction of temperature fields of microsystems at multiple moments, and allowing for computation of the performance of microsystems under electro-thermal-mechanical multi-physics coupling.

The invention relates to the technical field of chemical engineering and machine learning, and provides a Fischer-Tropsch reactor strengthening method based on microsystem catalyst screening and kinetic research. The method comprises four main steps of catalyst screening, kinetic model establishment, reactor size optimization and performance verification. The method comprises the following steps: firstly, screening Fe9Cr3 as an optimal bimetallic catalyst through molecular dynamics simulation; then, establishing a kinetic model by utilizing an Arrhenius equation, and calculating a reaction rate constant and activation energy; secondly, optimizing the length-diameter ratio L / D of the reactor through macroscopic simulation and computational fluid dynamics (CFD) simulation; finally, the performance of the optimized reactor is verified through experiments, it is ensured that the activity and the synthesis rate of the catalyst reach expected targets, and CO2 emission reduction is achieved. According to the method, microscopic simulation and macroscopic simulation are combined, so that the overall efficiency and performance of F-T synthesis are improved, and meanwhile, the research and development cost is reduced, and the research and development time is shortened.

The invention belongs to the technical field of radio frequency microsystem integration, and particularly relates to a heat dissipation structure based on a three-dimensional heterogeneous integrated radio frequency microsystem, the heat dissipation structure comprises a packaging box and a heat dissipation assembly installed on the side wall of the packaging box, the heat dissipation assembly comprises a U-shaped air pipe and a fan, a plurality of packaging modules are installed in the packaging box, and the U-shaped air pipe is connected with the fan. Each packaging module is installed between two ports of the U-shaped air pipe, the multiple packaging modules are connected through the BGA solder balls, the fans are installed in the two ports of the U-shaped air pipe, and the sealing cover is packaged on the top of the packaging box. Each packaging module is installed between the two ports of the U-shaped air pipe, when each module in the packaging box works, the fan in the U-shaped air pipe drives gas at the top of the packaging module to circulate towards the bottom of the packaging module, then gas flowing among the packaging modules is accelerated, and the packaging efficiency is improved under the condition that it is guaranteed that the packaging box is sealed. And the effect of uniform heat dissipation of each packaging module is realized.

The invention discloses a TSV-based multi-layer microsystem interconnection module total dose effect simulation modeling method, and relates to the technical field of three-dimensional integrated microsystems, and the method comprises the steps: obtaining geometric parameters and material parameters of a multi-layer three-dimensional microsystem interconnection module, building a finite element model of a microsystem module based on the geometric parameters and the material parameters, and carrying out the simulation modeling of the TSV-based multi-layer microsystem interconnection module total dose effect. Setting boundary conditions and port excitation; scattering parameters under different material conditions in the finite element model are extracted, frequency points are fixed, and a relational expression of the scattering parameters and material parameters is established; an RLC equivalent circuit model is constructed, and an equivalent circuit extraction method is obtained; according to an equivalent circuit extraction method, in combination with a relational expression of scattering parameters and material parameters, establishing a relationship between return loss parameters and equivalent circuit parameters; and establishing a relation model between the radiation dose and the resistance, inductance and capacitance in the equivalent circuit according to the relation between the return loss parameter and the equivalent circuit parameter. According to the invention, a scientific basis is provided for the reliability design of the three-dimensional microsystem in the radiation environment.

The invention relates to the technical field of artificial intelligence, in particular to a breathing sleep state intelligent monitoring wireless integrated microsystem which comprises a breathing sleep state intelligent monitoring module, a central processing unit module and a monitoring terminal which are connected in sequence. Four physiological signals including chest and abdomen movement signals, blood oxygen data, mouth and nose airflow information and snore characteristics are collected through the intelligent breathing and sleep state monitoring module to replace traditional detection of more than 10 physiological signals, so that diagnosis of the sleep apnea-hypopnea syndrome is lighter; on the premise that PSG monitoring accuracy is guaranteed, lead setting is reduced, and portability is improved; the system is designed for adapting to non-professional personnel, and the operation process is simplified.

The invention discloses a three-dimensional microsystem temperature calculation method considering thermal capacity change of a transient thermal analysis model. The method comprises the following steps: extracting anisotropic equivalent thermal conductivity of a substrate of a TCV array embedded in a three-dimensional microsystem; wherein a plurality of chips are arranged on the substrate; obtaining a first anisotropic transient thermal analysis model corresponding to a single chip in the three-dimensional microsystem according to the anisotropic equivalent thermal conductivity; superposing the first anisotropic transient thermal analysis models of the plurality of chips to obtain a second anisotropic transient thermal analysis model; and gradually updating the heat capacity value of the second anisotropic transient thermal analysis model in a plurality of continuous time periods to obtain a final anisotropic transient thermal analysis model corresponding to the last time period, and obtaining the final transient temperature of the three-dimensional microsystem according to the final anisotropic transient thermal analysis model. According to the method, the temperature of the three-dimensional microsystem is calculated, the relation between the heat capacity value of the chip and the temperature is considered, and the method has high precision and short calculation time.

The invention discloses a self-closed-loop microsystem air cooling heat dissipation structure based on a micropump. The self-closed-loop microsystem air cooling heat dissipation structure comprises a microchannel radiator, the micropump, a fan combination, a temperature measurement optical fiber, a control module, cooling liquid and the like. According to the invention, a heat dissipation mode of combining liquid cooling internal circulation with air cooling external circulation is adopted, the air cooling heat dissipation problem of the high-heat-flux power chip is converted into a conventional air cooling heat dissipation problem, and the air cooling heat dissipation problem of the high-heat-flux power chip in the current engineering is solved; liquid cooling internal circulation is physically isolated from the external environment, so that the risk that impurities block a flow channel in secondary heat exchange equipment is avoided, and the reliability of the equipment is improved; the micro-channel radiator adopts a three-dimensional flow channel, the size is greatly reduced, and the tree-shaped distribution network and the micro-channel heat sink are combined, so that the heat exchange capacity is improved; and a self-adaptive temperature control measure based on temperature feedback is adopted, so that the power chip works in a proper temperature range, the performance and reliability of equipment are improved, and the service life of the equipment is prolonged.

The application discloses a high-reliability high-power three-dimensional heterogeneous integrated radio frequency antenna integrated microsystem, comprising a DPC substrate, a copper-based three-dimensional structure, a two-stage SiC adapter plate, a bare chip, a radio frequency circuit, a passive device and an antenna interface; wherein the DPC substrate is used for realizing integrated three-dimensional heterogeneous integration of the microsystem; the copper-based three-dimensional structure comprises a three-dimensional coaxial transmission structure and a three-dimensional packaging frame structure, and is used for realizing vertical transmission of high-power radio frequency signals and air-tight packaging of the microsystem; the two-stage SiC adapter plate is used for realizing a 2.5D*2 five-layer ultra-high-density mixed three-dimensional stacking architecture; the bare chip comprises a silicon-based Fan-out multifunctional bare chip, a power management bare chip, a power amplifier bare chip and a receiving bare chip; the radio frequency circuit comprises a radio frequency transmitting circuit and a radio frequency receiving circuit. The application forms a complete integrated air-tight packaging microsystem, and simultaneously realizes high reliability, high-density integration and high-power heat dissipation.

The invention provides a rapid optimization method suitable for a radio frequency heterogeneous integrated microsystem interconnection structure, and the method comprises the steps: constructing an equivalent circuit model of a complex interconnection structure required by a system based on an equivalent circuit model of a basic interconnection structure unit or an equivalent circuit model library of the basic interconnection structure unit; parameter information such as the physical size of the interconnection structure is obtained by rapidly optimizing the constructed equivalent circuit model, then corresponding physical size parameters serve as initial values of the electromagnetic simulation model of the interconnection structure, and the electromagnetic simulation model of the interconnection structure is obtained by combining the trend and rule of the constructed equivalent circuit model changing along with the physical size of the interconnection structure. The optimization and design process of three-dimensional electromagnetic simulation of the interconnection structure is guided and accelerated; the design method effectively solves the problems that the efficiency is low and the resource overhead is high when a traditional three-dimensional electromagnetic simulation optimization design is adopted for the interconnection structure of the integrated microsystem, and rapid deployment of the radio frequency integrated microsystem is achieved.

The invention discloses a photoelectric liquid interconnection structure of a system-on-chip, an assembly method of the photoelectric liquid interconnection structure and the system-on-chip. The photoelectric liquid interconnection structure comprises a heat dissipation microsystem, a wafer-level substrate and a power supply microsystem interconnection structural member which are stacked in a layered manner, the power supply microsystem comprises a power supply board II for preliminarily distributing an external power supply, and a power supply board I for inputting and controlling signals and secondarily distributing current preliminarily distributed by the power supply board II; the interconnection structural member comprises an elastic needle connector used for current transmission and signal transmission between the first power supply board and the second power supply board, and a fuzz button connector used for signal transmission and current transmission between the first power supply board and the wafer-level substrate and having a double-sided elastic contact function. Assembling is carried out by adopting a layered stacking connection mode and a step-by-step assembling method, high-density integration and high-precision interconnection of modules / components are achieved, and the technical problem that an existing on-chip system cannot achieve high-density and high-precision signal transmission, system power supply and heat dissipation in a limited space is solved.

The invention provides a scalable model modeling method for an advanced packaging process passive component, which comprises the following steps of: on the basis of a mathematical expression and an equivalent circuit model for representing a passive component mechanism, combining process information and design requirements, taking a physical size parameter of a model as an independent variable, taking a model component value as a dependent variable, and establishing a scalable model; a Scalable equation form for multivariable parameter fitting is given by adopting a Taylor expansion polynomial, and a radio frequency integrated microsystem scalable model which is high in precision, wide in parameter coverage range and high in expansibility is established; the problems that equivalent circuit models of passive components are incomplete and scalable models are missing in an advanced integrated packaging process for realizing the radio frequency integrated microsystem at present are effectively solved; according to the method, the modeling time of the radio frequency integrated microsystem model is greatly shortened, and the iteration speed of the radio frequency integrated microsystem design is improved.

The invention discloses a miniaturized intelligent integrated radio frequency microsystem, which comprises a main control board and a signal processing board, the main control board integrates a power conversion unit, a clock unit and an interface unit, so that processing clocks in the system are homologous, system interfaces are expanded, and the universality of the system is further expanded; the signal processing board comprises a radio frequency processing unit and a fast hopping frequency source, the radio frequency processing unit is integrated with a second comprehensive processing chip, a zero intermediate frequency chip and a frequency source chip, digital radio frequency integrated design is adopted, the functions of amplification, filtering, frequency conversion, sampling, signal processing and frequency conversion are integrated, discrete devices and split design circuits in the prior art are replaced, and compared with traditional design, the signal processing board has the advantages that the cost is low, and the cost is low. The volume is reduced by about 30%, and the power consumption is reduced by more than 40%.

The present invention discloses a method for simulating and analyzing PI and SI signals of DDR3 in a microsystem module, which realizes simulation analysis of power integrity and signal integrity of the microsystem module, provides simulation judgment criteria, and improves simulation accuracy. The method includes the steps of merging a silicon substrate and a tube shell and then performing a DC voltage drop simulation. The steps are as follows: importing the layout of the tube shell and the silicon substrate into simulation software and setting simulation parameters; adding a voltage source and a current source between the power pin and the ground pin of the chip, starting the simulation software to perform a DC voltage drop simulation and performing calculations to obtain a simulation result; judging whether the simulation result meets the requirements according to the simulation criteria, and if so, completing the simulation; if not, locating the items in the layout that do not meet the simulation criteria, and modifying the layout of the items that do not meet the simulation criteria until the requirements are met and the simulation is completed.

The invention discloses a microscopic imaging device and a super-resolution microscopic imaging method, and the device comprises a sample stage which is used for containing a sample; the laser is used for emitting laser; the first digital micromirror is used for receiving the laser and generating diffracted light; the light condensing unit is used for condensing the plurality of diffracted light to form structured light so as to excite fluorescence carrying sample information; the second digital micromirror is used for receiving the fluorescence and converting the fluorescence into a random binary coding image; the image acquisition unit is used for receiving images and transmitting the images to the processing unit; the processing unit is used for reconstructing a microscopic super-resolution image based on the plurality of random binary coding images; the first digital micromirror, the second digital micromirror and the image acquisition unit are in communication connection, and the second digital micromirror controls the grating pattern conversion frequency of the first digital micromirror and controls the image acquisition frequency of the image acquisition unit. The biological cell sample can be protected from being damaged by phototoxicity and photobleaching performance, and super-resolution imaging in the structured illumination obvious microsystem is achieved.

The invention relates to the technical field of microsystem module air tightness detection, in particular to a microsystem module online air tightness leak detection device and method based on a humidity sensor, and the device comprises a microsystem module, the humidity sensor embedded and integrated in the package of the microsystem module, and a detection unit connected with the humidity sensor. The detection unit is connected with the humidity sensor and used for acquiring a humidity signal, monitored by the humidity sensor, inside the microsystem module package, and the controller is connected with the detection unit and used for judging the air tightness state of the microsystem module based on the humidity signal and the quantitative relation between the preset humidity change and the leakage rate; and the output unit is connected with the controller and is used for outputting the air tightness state. According to the invention, in-situ, online and long-term nondestructive monitoring of the airtightness of the microsystem module is realized, and the integrated requirements of different types of microsystem modules can be met.

The invention discloses a W-band two-dimensional DBF microsystem based on an AiP technology, and belongs to the technical field of packaging antennas, the W-band two-dimensional DBF microsystem comprises an active array antenna module for realizing transceiving and frequency conversion of W-band signals, the active array antenna module is provided with a plurality of antenna units, and each antenna unit corresponds to a signal processing channel; the radio frequency direct acquisition transceiver module is used for multi-channel parallel sampling and transmitting and completing conversion between an analog radio frequency signal and a digital baseband signal; the digital beam former module is used for carrying out weighting, phase correction and delay control on each channel signal output by the radio frequency direct acquisition transceiver module so as to realize two-dimensional digital beam forming; and the active array antenna module, the radio frequency direct acquisition transceiver module and the digital beam former module are independently integrated on the integrated module to realize integral packaging. According to the invention, deep fusion of the AiP module and the DBF module is realized under the W-band condition.

The invention discloses a micro-flow sensing chip based on thermal feedback and digital power distribution and a control method, the chip comprises a microstrip line assembly and an interface circuit which are arranged on a substrate, and the interface circuit comprises an amplifier, a comparator, a controller and a phase inverter; a connection point between the first fixed-value resistor and the fourth thermistor and a connection point between the second fixed-value resistor and the first thermistor are respectively connected with two input ends of an amplifier; the connecting end of the first fixed-value resistor and the second fixed-value resistor is connected with a voltage-stabilized power supply; the output end of the amplifier is connected with the positive input end of the comparator; the output end of the comparator is connected with one connecting end of the controller; the other connecting end of the controller is connected with the input end of the phase inverter and one end of the second thermistor; the output end of the phase inverter is connected with one end of the third thermistor. According to the flow sensing microsystem, the flow sensing chip is connected with the exclusive interface circuit in the thermal feedback mode, the signal stability of the integrated sensing microsystem is enhanced, and the inherent temperature drift problem is solved.

The invention discloses a broadband double-layer interconnection structure based on a silicon adapter plate technology, and belongs to the technical field of radio frequency microsystems. According to the method, a three-dimensional compensation structure is formed by adding square conductive metal and TSVs into lower-layer metal at one end, close to a transition structure, of an original coplanar waveguide transmission line, and a resonance point with return loss of-51dB is introduced at 17.59 GHz, so that the broadband interconnection effect that the return loss of 0-33GHz is smaller than or equal to-20dB is achieved, and the in-band insertion loss fluctuation value is reduced by 11.6% compared with that of the original structure. Compared with a traditional interconnection structure broadband design, the method has the advantages that on the premise that the plane area is not increased, the broadband interconnection design difficulty is greatly reduced through the three-dimensional structure design.

The invention discloses a signal integrity simulation analysis method for a digital radio frequency hybrid microsystem, and belongs to the field of advanced packaging of integrated circuits. According to the method, a complete analysis process accompanied with product research and development is established, systematic work of qualitative simulation evaluation, rule design and quantitative analysis verification is sequentially carried out in various stages of project approval demonstration, scheme design, design verification and the like of product design, and process conditions, material characteristics and rationality and feasibility of system layout are rapidly evaluated; qualitative support is provided for agile design of the scheme; designing rules and optimization ranges of structures such as a radio frequency link, a digital link and a coupling shield are formulated according to process and material rules, and accurate initial input is provided for comprehensive design of a product; according to the layout wiring form, digital, radio frequency and coupling areas are formed through division, time domain analysis, frequency domain analysis and near field analysis are carried out in a targeted mode, quantitative reference is provided for judging design reasonability, and an effective basis is provided for optimizing design content.

The invention particularly relates to a reconnaissance load for a light and small unmanned aerial vehicle. The reconnaissance load comprises a broadband receiving antenna, a receiving front end and a signal processing rear end which are connected in sequence, the broadband receiving antenna is used for receiving a space electromagnetic signal; the receiving front end is used for performing front-end processing on the space electromagnetic signal to obtain a corresponding digital signal; the signal processing rear end is used for carrying out signal sorting processing on the digital signals and sending sorted feature data to the signal processing background; the receiving front end is provided with a radio frequency analog digital hybrid integrated microsystem, and a signal amplification module, a secondary frequency conversion module, an intermediate frequency amplification filtering module, a sampling module, a frequency synthesis module and a reference clock are packaged in the receiving front end; the signal amplification module, the secondary frequency conversion module, the intermediate frequency amplification filtering module and the sampling module are connected in sequence; the frequency synthesis module is connected with the reference clock, the sampling module and the secondary frequency conversion module. According to the scheme, the investigation load is light in weight, low in cost, low in power consumption and high in applicability.

The invention discloses a digital system power distribution network impedance optimization method and system, and the method comprises the following steps: S1, obtaining the frequency-varying parasitic parameters Jg (f), Jr (f) and Jz (f) of a digital system power supply through a vector network analyzer, and enabling f to be a frequency variable; s2, calculating a dynamic matching coefficient DsC based on the frequency-varying parasitic parameter, and calling a PDN decoupling scheme set from a decoupling scheme database according to a DsC matching interval; s3, inputting the PDN decoupling scheme set into ADS software for segmented variable step size impedance simulation, wherein the step size of the frequency band from 1 MHz to 100 MHz is 0.5 MHz, and the step size of the frequency band from 100 MHz to 3 GHz is 5 MHz; and generating a surface-mounted PCB decoupling index DI containing a resonance penalty term and a micro-system substrate decoupling index WI. According to the method, the high-frequency resonance suppression capability is improved, frequency change parasitic parameter extraction is combined with resonance point penalty term design, impedance peak fluctuation is compressed to be within + / -8% of a target value in a 1-3GHz frequency band, and actually measured power supply noise of a 10Gbps SerDes interface is reduced by 62%.

The invention discloses a multichannel comprehensive radio frequency microsystem supporting fast frequency hopping, a multichannel receiving module, a transmitting module, a fast frequency hopping source, a processor SOC and an external interface IO are integrated in the multichannel comprehensive radio frequency microsystem, and the multichannel receiving module comprises an amplitude limiter, a power divider, a first balun 1, a second balun 2, a third balun 3, a fourth balun 4, a first transceiver chip 1 and a second transceiver chip 2. The transmitting module comprises a third transceiver chip 3, a fifth balun 5, a low noise amplifier and a first filter 1. The invention has the advantages of miniaturization, generalization, reconfiguration and the like, and can be widely applied to the field of wireless communication.

The invention discloses a high-reliability three-dimensional integrated direct sampling software radio architecture radio frequency microsystem, which is based on a direct sampling software radio system architecture and a multi-layer glass-based TGV adapter plate wafer-level bonded POP three-dimensional stacked packaging architecture. A high-performance glass antenna, silicon-based single core particle Fan-in and Fan-out packaging, mixed multi-core particle integration of an embedded glass-based TGV adapter plate, mixed bonding integration of a silicon-based digital TSV adapter plate and the glass-based TGV adapter plate are combined, and a glass antenna, a direct sampling core particle, a silicon-based computing power circuit, a silicon-based storage circuit and a silicon-based interface circuit are integrated. And the three-dimensional heterogeneous integration of the microsystem is realized. According to the micro-system, a glass substrate is used as a main body packaging material, a radio frequency circuit and a digital-analog hybrid circuit are fused, three-dimensional heterogeneous integration from a glass antenna to a baseband storage and calculation integrated processing circuit is realized, and a complete integrated airtight packaging micro-system is formed and can cover a DC-20GHz frequency band.

The present invention discloses a thermomechanical coupling analysis method for an inertial microsystem based on a physical information neural network, comprising: S1, setting the material parameters and boundary conditions of the inertial microsystem and establishing a thermomechanical coupling analysis model; S2, obtaining the temperature distribution of the inertial microsystem through electrothermal coupling analysis; S3, obtaining the thermal stress distribution of the microsystem through thermomechanical coupling simulation analysis; S4, predicting the temperature field of the microsystem through a physical information neural network; S5, using the temperature field as the boundary condition for the mechanical simulation of the microsystem to obtain the mechanical properties such as stress and strain of the microsystem; S6, performing electromechanical coupling simulation analysis to analyze the influence of structural deformation on various parameters in the electrical properties. The present invention improves the solving accuracy of the neural network through an improved adaptive weight strategy, combines the complete polynomial basis function with the neural network, introduces the expanded basis function to reduce the state dimension, reduces the computational cost and time, realizes the accurate prediction of the temperature field of the microsystem at multiple moments, and calculates the performance of the microsystem under the coupling of electrothermal and mechanical multi-physical fields.

The invention belongs to the technical field of avionics, and particularly relates to an airborne platform-oriented hierarchical distributed sensor system architecture and a use method thereof, and the system comprises a distributed skin microsystem, a distributed signal processing unit, a task processing unit, a primary network and a secondary network. The distributed skin microsystem comprises N skin sensing elements, and N is not less than 2; the N skin sensing elements are respectively connected to the primary network; the primary network is connected with M distributed signal processing units, and M is not less than 2; the M distributed signal processing units are connected with the secondary network, the secondary network is further connected with the task processing unit, and the task processing unit is connected with the cabin display control system.

The invention provides a heterogeneous multi-core sealing microsystem for satellite-borne on-orbit intelligent calculation and a fusion method, belongs to the field of electrical data processing, and aims at data processing, intelligent reasoning and decision control requirements in a satellite-borne intelligent application scene, a multi-core / single-core scalar, vector and tensor intelligent calculation unit is integrated on a single chip, and the multi-core scalar, vector and tensor intelligent calculation unit is integrated on the single chip. Meanwhile, a real-time efficient calculation scheduling unit is arranged, parallel heterogeneous calculation can be carried out on the premise of a high energy efficiency ratio, and hot backup and protection reinforcement treatment are set at the same time according to the requirements of radiation prevention, cosmic ray prevention and high-energy particle prevention of a satellite-borne scene. The scheme of high performance, small size and small mass is adopted, and the antenna is suitable for satellite-borne application scenes.

The invention discloses a multi-channel three-dimensional heterogeneous and heterogeneous integrated microsystem with high reliability. Comprising a top-layer silicon-based adapter plate upper solder ball, a top-layer silicon-based adapter plate, a top-layer silicon-based adapter plate inner silicon through hole, a top-layer silicon-based adapter plate lower surface frequency selection structure, a middle-layer silicon-based adapter plate, a middle-layer silicon-based adapter plate silicon through hole, a low-power-consumption chip device, a bottom-layer silicon-based adapter plate upper surface rewiring and a bottom-layer silicon-based adapter plate inner silicon through hole. The high-power chip device comprises a bottom-layer silicon-based adapter plate, a bottom-layer silicon-based adapter plate lower surface solder ball, a high-temperature co-fired ceramic substrate, a high-temperature co-fired ceramic substrate lower surface frequency selection structure, a direct copper-plated ceramic substrate box dam, a high-power chip device, a direct copper-plated ceramic substrate and a high-thermal-conductivity material. And the frequency selection structures are respectively arranged right above the low-power-consumption chip device and the high-power chip device, are metal structures and are used for absorbing electromagnetic waves under a specific frequency. The electromagnetic stability of the system can be improved, the thermal conductivity of the system is improved, and the reliability of the system is integrally improved.

A method (600) is presented. The method (600) comprising obtaining (610) an engineering plan and a chiplet arrangement hardware model. The method (600) further comprises estimating (630) a microsystem hardware model based on the hardware requirements and a hardware data set describing hardware resources of the chiplet arrangement and simulating (640) the estimated microsystem hardware model by electrical simulations to provide one or more hardware capabilities. The method (600) further comprises obtaining (650) a chiplet arrangement environment model and estimating (660) a microsystem software model using the hardware capabilities and the software requirements. The method (600) further comprises simulating (670) the estimated microsystem software model on the chiplet arrangement environment model to provide one or more software capabilities and compiling (680) the estimated microsystem hardware model, the estimated microsystem software model, the one or more hardware capabilities, the one or more software capabilities to a microsystem model comprising one or more microsystem capabilities.

The invention provides a test fixture for a photoelectric microsystem. The test fixture comprises a test seat and a test plate, the test seat comprises a cooling device, an adapter plate, a needle frame and a heat sink; the cooling device is fixed to the heat sink and used for cooling the heat sink. The heat sink provides downward pressing force, so that the elastic contact of the photoelectric microsystem is connected to the adapter plate, and meanwhile, the adapter plate is pressed on the pin frame; the needle frame is made of metal and is used as a ground network; the signal pins are fixed on the pin frame through the dielectric ring to form signal point locations; the power needles are fixed on the needle frame through the medium rings to form power source point positions; the power needle is directly fixed on the needle frame to form a site; the signal pin and the power pin are connected with the test board; by adjusting the installed signal pin and the power pin, the photoelectric micro-system test with different pin definitions can be adapted.