2240 results about "Test board" patented technology

The invention provides a method and system for preparing a high-temperature anti-aging test board for chip testing, and relates to the technical field of data energy storage and resource scheduling, and the method comprises the steps: designing a schematic circuit diagram and a PCB wiring scheme; a test plate is made of a high-temperature resistant material; bare board verification, electrical performance verification, program setting verification, high temperature verification and junction temperature measurement verification are carried out; using data is recorded, ultrasonic cleaning and drying are carried out, and a performance evaluation model is established through a hardware management system to judge whether maintenance or replacement is needed. According to the invention, the accuracy of chip testing in a high-temperature environment is improved, and the service life of the test board is prolonged.

An open and short circuit testing device and method. The device comprises a base (1), a support frame (2), a test board (5) and a placement frame (4). The test board (5) is slidably connected to the side opposite to the support frame (2), and the test board (5) moves downwards to drive a gear (14) to rotate; a limiting plate (17) is used for limiting reverse rotation of the gear (14); and a probe (26) is used for connecting to a circuit board to achieve testing. Under normal conditions, the friction force when the probe (26) is inserted into a wiring terminal (29) is less than the minimum elastic force of a second spring (25), when the probe (26) fails to be normally connected to the wiring terminal (29), the probe (26) is pressed downwards when a movable plate (23) moves downwards, the probe (26) is adjusted by means of the second spring (25) at the top of the probe (26), so that the probe (26) returns to normal, the pressure sensor (31) detects whether there is an abnormality, and when the second spring (25) at the top of the probe (26) is compressed, the pressure sensor (31) at the top of the second spring (25) measures an excessively large pressure value, i.e., indicating that a device abnormality occurs during the testing process rather than representing that there is necessarily a problem with the circuit board to be tested itself, thereby improving the accuracy of the testing result.

The invention discloses a mechanical property testing method for an inflatable wing, and belongs to the technical field of aerospace testing. The method comprises the following steps: S1, wing installation: clamping an inflatable wing on a test board, and enabling a chord plane of the inflatable wing to be perpendicular to a loading direction; s2, applying a load: driving a loading mechanism to apply a vertical load to the inflatable wing through an external universal tester; s3, data acquisition: synchronously acquiring a deflection curve and stress distribution data by using a displacement measurement unit and a strain detection unit; and S4, failure judgment: when monitoring that the shape of the deflection curve suddenly changes or the strain data exceeds a threshold value, judging that the inflatable wing is subjected to buckling failure, stopping loading and recording the maximum load. The test bench serves as an expansion platform of a universal tester, can be adapted to a large-size inflatable wing, does not need special equipment, reduces the cost, realizes cooperative monitoring of displacement and strain data, realizes closed-loop control of inflation air pressure-deformation-load, and remarkably improves the test precision and the data reliability.

The embodiment of the invention provides a hot plug test board, a hot plug test system, a hot plug test method, hot plug test equipment and a medium, and relates to the field of internet big data. The hot plug test board comprises a logic module, a signal switch switching unit and a power supply detection unit, the logic module is connected with the signal switch switching unit and used for transmitting an NVME signal and controlling gating and cutting off of the signal switch switching unit so as to achieve hot removal or hot addition of the NVME hard disk, and the signal switch switching unit responds to control of the logic module and controls the power supply detection unit to detect the power supply of the NVME hard disk. And the NVME signal transmission to the NVME hard disk is gated or cut off, and the power supply detection unit is connected with the NVME hard disk and is used for detecting whether the NVME hard disk is normally powered off or powered on after hot plugging. Through the mode, the NVME hard disk hot plug test can be efficiently and conveniently carried out on the premise of not influencing the overall structure and the hardware and software logic of the original server.

The invention relates to the technical field of ICT testing, in particular to an efficient online ICT intelligent testing device which comprises a machine table, a tester is fixedly mounted at the top of the machine table, an air cylinder is fixedly mounted at the top of the tester, a mounting seat is fixedly mounted at the output end of the air cylinder, and limiting rods which are symmetrically arranged in pairs are mounted in the tester. A limiting rod is arranged at the top end of the mounting seat, a test board slides on the outer wall of the limiting rod, an air pump is fixedly mounted at the bottom end of the test board, a clamping mechanism for fixing a circuit board is arranged at the top end of the test board, and a pressure detection mechanism for detecting the circuit board is arranged at the bottom end of the mounting seat. The air inlet speed is automatically adjusted through the thickness of the circuit board, the circuit board is protected, pseudo soldering spots are accurately positioned through the air cylinder, the probe and the displacement sensor, the air cylinder is used for driving components to move, the welding spots with cracks are detected through vibration, and the detection efficiency and reliability are improved.

The invention relates to a large current tester for charging pile chip detection, which comprises a base and a cover body, and is characterized in that the top of the base is provided with a positioning mechanism for positioning a chip; a testing mechanism for detecting a chip is mounted at the bottom of the base, the testing mechanism comprises a testing plate and a plurality of probe modules electrically connected with the testing plate, each probe module comprises a heat conduction block, a connecting piece and probe elastic pieces distributed in an array, the connecting piece is sequentially connected with the heat conduction block and the probe elastic pieces in series, and the probe elastic pieces are electrically connected with the testing plate. The probe elastic sheet is arranged on the inner side of the heat conduction block to form a probe module; a pressing assembly for fixing the chip is arranged on the inner side of the cover body, and a control assembly for driving the pressing assembly to be close to the base is arranged at the top of the cover body. During testing, the probe elastic sheets are elastically deformed, stable contact between each probe elastic sheet and the corresponding pin can be guaranteed, the probe elastic sheets are distributed independently, it is guaranteed that the probe elastic sheets have high conduction efficiency in the detection process, and the stability and precision of large-current testing are guaranteed.

The invention specifically discloses a method for evaluating the health state of a cigarette comprehensive test board, and the method comprises the steps: obtaining the fault type of the cigarette comprehensive test board, and carrying out the analysis of the fault type, so as to obtain the self degradation of equipment and the influence factors of the fault; carrying out fault influence factor analysis on influence factors of equipment degradation and faults, and carrying out numeralization on the influence factors; carrying out fault data acquisition and processing on the cigarette comprehensive test bench, structuring data of equipment faults, and further carrying out fault data expansion through a generative model GAN network; and a DNN deep neural network is constructed, training is performed by using the expanded fault data, and then fault probability evaluation is performed on the cigarette comprehensive test bench through the DNN deep neural network. According to the invention, the convenience and accuracy of health assessment of the cigarette comprehensive test board can be improved.

The utility model relates to an omni-directional impact performance test device for a backrest and a headrest of an automobile seat, which belongs to the technical field of automobile seat test devices and comprises a test board, an impact head, a height adjusting mechanism and an angle adjusting mechanism. The impact head exerts impact force on a backrest and a headrest of an automobile seat, the height adjusting mechanism drives the impact head to move up and down in a vertical plane so as to adjust the installation height of the impact head, the angle adjusting mechanism drives the impact head to rotate in the horizontal plane and the vertical plane, and all-directional impact resistance testing is conducted on the backrest and the headrest of the automobile seat. According to the utility model, the technical problems in the prior art that the application range of seat backrests at different inclination angles is limited, the test positions of the seat backrests and headrests are not comprehensive, and rapid and continuous tests cannot be carried out can be solved.

The invention discloses a test board and a test system, the test board comprises multiple types of board card interfaces, a test module, a switching module and a test controller, each board card interface comprises a clock pin, a data pin and a management pin, and a target board card to be tested is connected with at least one board card interface; the test module is connected with data pins of the board card interfaces; the switching module is connected with the test module and the clock pin of each board card interface; the test controller is connected with management pins of the board card interfaces, and the test controller is used for determining target board card interfaces connected with target board cards based on the management pins and controlling the switching module, so that a clock pin of one target board card interface is communicated with the test module, and a clock pin of the other target board card interface is communicated with the test module; and the test module is used for testing the interface function of the target board card based on the connected clock pin and the data pin of the target board card interface. And multiple types of board card interfaces are arranged, so that multiple types of to-be-tested target board cards can be compatible, and the test universality is improved.

The invention provides a chip power consumption measurement system and method.The chip power consumption measurement system comprises a test board, a power consumption collection module and a control module, the control module sends task instructions to a chip to be tested, and the task instructions comprise any one or more of a voltage instruction, a frequency instruction and an operation core instruction; when the chip to be tested executes a task instruction, the power consumption acquisition module acquires voltage information of each test resistor and transmits the voltage information to the control module; the control module determines the test power consumption of the to-be-tested chip according to the voltage information. According to the technical scheme, the task instruction can be sent to the to-be-tested chip, any one or more of the working frequency, the working voltage and the number of the running cores of the to-be-tested chip can be changed, different use scenes can be simulated, power consumption measurement of the to-be-tested chip can be completed in different scenes, and the test power consumption of the to-be-tested chip can be accurately and rapidly obtained.

The invention provides a chip aging test system and method based on a field programmable gate array, and the system is characterized in that a drive control panel comprises a processor module, a communication interface module, and an external connector module; the external connector module comprises a first connector and a second connector; the processor module is used for receiving a test instruction sent by the upper computer through the communication interface module, generating a test signal and a control signal, and receiving a test result acquisition instruction sent by the upper computer after the communication interface module sends response information to the upper computer; the first end of the processor module is also used for sending the interrupt information to an upper computer through the communication interface module and displaying the interrupt information; and the third end of the processor module is connected with the second connector and is used for outputting the control signal to the test board. Test signals are output to multiple groups of tested chips of the test board in parallel through the first connector, the second connector controls the test sequence of the to-be-tested chips on the test board, and hundreds of chips are driven by a single drive board and used for aging test.

The invention relates to an SOC chip performance test device, method and equipment and a readable storage medium. In the device, an upper computer is used for sending an excitation instruction to a voltage simulator and sending a test instruction to a signal generator according to a test requirement; the voltage simulator is used for inputting a voltage excitation signal to the test board according to the excitation instruction; the signal generator is used for inputting a test signal to the test board according to the test instruction; the test board is used for conditioning the voltage excitation signal and the test signal and sending a first conditioning signal to the SOC chip to be tested so as to indicate the SOC chip to be tested to respond to the first conditioning signal; the test board is also used for acquiring a response signal returned by the SOC chip to be tested, conditioning the response signal, and returning a second conditioning signal to the upper computer; and the upper computer is also used for analyzing the second conditioning signal to obtain a performance test result. The SOC chip performance test efficiency can be improved.

The invention discloses an automobile shock absorber and a buffer test device thereof, and relates to the technical field of automobile shock absorbers, the automobile shock absorber comprises a shock absorber main body, one end of the shock absorber main body is provided with a mounting hole, and a position, close to the mounting hole, of the shock absorber main body is provided with a test positioning member; and the other end of the shock absorber main body is provided with a detachable detection top piece. The buffer test device of the automobile shock absorber comprises a test board, a sensing detection mechanism, a telescopic installation clamping piece and a simulation turntable mechanism. The simulation turntable mechanism drives the reciprocating screw rod to synchronously rotate in the rotating process, the reciprocating screw rod enables the matched screw rod sleeve to reciprocate, and the screw rod sleeve drives the linkage ring to transversely reciprocate, so that the linkage ring drives the distributed sliding bumps to slide relative to the simulation turntable mechanism through the first linkage rod to adjust the projection height; therefore, different-degree bumpy road surfaces can be automatically adjusted and simulated.

The invention relates to the field of instrument testing, and discloses pulse controller testing equipment, which comprises a signal simulation unit, a parameter acquisition unit, a gas circuit control unit, a main control unit and a test board, the signal simulation unit generates simulated dust concentration and pressure difference signals; the parameter acquisition unit is used for acquiring blowing interval time, duration time and output voltage signals in real time; the air path control unit provides compressed air with adjustable pressure through an air storage tank, a pressure regulating valve and a pulse valve driving module, and a pressure sensor and a flow sensor feed back signals in real time so as to adjust air path parameters. The main control unit controls the test process and judges whether the pulse controller is abnormal based on the collected data; the test bench realizes equipment fixation and connection through a clamp and an electrical / pneumatic port. The device calculates a comprehensive abnormal index through standardized parameters, supports multi-stage early warning and fault determination, and is suitable for automatic testing of the pulse controller.

A lower plunger of a pogo pin according to the present disclosure includes a metal pin and an electro-conductive rubber, and the electro-conductive rubber having a configuration in which a plurality of electro-conductive particles are contained in an elastic insulating material is attached to a lower end of the metal pin to increase a contact area between the lower plunger and a pad of a test board through a surface contact, thereby preventing the occurrence of inductive spikes and thus improving signal quality in a high-speed signal transmission environment.

A chip testing device and a method of operating thereof is provided herein. According to at least one embodiment, the chip testing device comprises: a test board having at least one mounting surface; at least one chip socket located on one of the at least one mounting surface, wherein each of the at least one chip socket comprises: a positioning fixture mounted to the at least one mounting surface, the positioning fixture defining a mounting area for mounting a chip; a sliding cover that is slidably moveable between an open position and a closed position, wherein, in the open position, the mounting area is at least partially exposed to allow for mounting of the chip, and in the closed position, the cover overlays at least a portion of the chip and the positioning fixture.

The utility model discloses a temperature control water nozzle service life testing machine, and relates to the technical field of temperature control water nozzle service life detection. The temperature control water nozzle service life testing machine comprises a testing stand and a constant temperature water nozzle body, a fixing frame is fixed to the rear side of the top of the testing stand, a water supply pipe is embedded in the fixing frame, a water outlet pipe is arranged on the front side of the water supply pipe, a threaded sleeve is rotationally connected to the front end of the water outlet pipe and is in threaded fit with the constant temperature water nozzle body, and a hose is connected between the water supply pipe and the water outlet pipe. A screw rod is obliquely arranged on the inner side of the fixing frame, a movable block is arranged on the screw rod in a threaded mode, an elastic assembly is connected to the bottom of the movable block, a U-shaped frame is connected to the lower end of the elastic assembly, a pressing wheel is rotationally installed on the inner side of the U-shaped frame through a rotating shaft, and the pressing wheel is matched with a hose. By combining the elastic effect of the elastic assembly, the pressing wheel extrudes the hose, the size of the drift diameter of the hose is changed, the purpose of adjusting the water flow speed is achieved, the structure is simple, and use is convenient.

The utility model relates to the technical field of automatic assembling, and particularly discloses a test board assembling device which comprises a rack, an assembling mechanism, a storage mechanism and a mechanical arm, the assembling mechanism is provided with an assembling table, a ballast assembly and an assembling assembly, the assembling table can contain a main board and a test board, the ballast assembly is arranged on the assembling table, the storage mechanism is arranged on the assembling table, and the mechanical arm is arranged on the assembling table. The ballast end of the assembly component can ballast the mainboard, and the output end of the assembly component can push the test board to be installed in the mainboard so as to form a finished product; the storage mechanism is arranged on the rack, and the storage mechanism is used for supplying a carrier carrying a main board and storing a carrier carrying a finished product; the mechanical arm is arranged on the rack and used for moving the main board to the assembling table from the storage mechanism and moving the finished product to the storage mechanism from the assembling table. Through the arrangement, the labor intensity of workers is reduced; the damage probability of the test board and the mainboard is reduced; and waste caused by mistaken scrapping can be reduced.

The invention provides a semiconductor chip on-line test device, and particularly relates to the technical field of chip performance test.The semiconductor chip on-line test device comprises a test box, a main controller is installed at the top of one side of the test box, and a vertical heat insulation plate is fixedly arranged in the middle of an inner cavity of the test box; a test space is divided into a low-temperature test area and a high-temperature test area which are independent through a vertical heat insulation plate and a horizontal heat insulation plate, an annular groove is formed in the position, corresponding to the permanent magnet ring, of the top face of the horizontal heat insulation plate, two symmetrically-arranged permanent magnet blocks are arranged in the annular groove in a sliding mode, and the positions of the two permanent magnet blocks correspond to the position of the permanent magnet ring in an up-and-down mode. The test board can enter different temperature zones at the same time for synchronous test under the driving of the circular ring plate, the problem of temperature fluctuation caused by environment exposure during environment switching in the prior art is avoided, the temperature of the temperature zones does not need to be frequently adjusted, the stability of the test environment is ensured, and the test efficiency of the semiconductor chip is improved.

Disclosed is a test board which includes a substrate that includes a device under test (DUT) placement area where a first DUT and a second DUT are disposed, a first load switch connected in series with the first DUT and configured to be set to a switch on state or a switch off state based on a first enable signal, a second load switch connected in series with the second DUT and configured to be set to the switch on state or the switch off state depending on a second enable signal, and a test controller. The test controller may be configured to perform a test operation in a (1-1)-th mode by activating the first enable signal and deactivating the second enable signal and then perform the test operation in a (1-2)-th mode by deactivating the first enable signal and activating the second enable signal.

The invention discloses a switching power supply performance test device, which comprises a test board, an inner cavity is arranged in the test board, a driving device is fixedly arranged in the inner cavity, the upper end of the driving device penetrates through the inner cavity and extends to the upper end of the test board, and the driving device is located at the upper end of the test board and is connected with an adjustable test mechanism. An electric telescopic rod is fixedly installed at the upper end of the test table, the output end of the electric telescopic rod is close to the test mechanism, the output end of the electric telescopic rod is fixedly connected with a placement table, and the placement table is connected with an adjustable clamping mechanism. The invention solves the problems that the combination of the switching power supply and a connecting probe needs to be manually pushed to test each switching power supply, the connection probe is fixed and is difficult to adjust in height, and a base plate needs to be arranged below different switching power supplies to meet the combination of the probe and a switching power supply port; the input voltage, the output voltage and the current of the tested product cannot be visually displayed, and the test efficiency is low.

The invention belongs to the technical field of PCB (printed circuit board) detection equipment, and particularly relates to a dynamic adjustment system and method for uniform distribution of test points of a flying probe machine, and the system comprises a flying probe test machine, a camera alignment system, a data processing unit and a movement mechanism. The flying probe testing machine is provided with at least two guide rails, and flying probes are arranged on the guide rails and used for testing test points on the PCB. And the camera alignment system carries out at least two times of alignment with the PCB, and outputs alignment information. And the data processing unit receives the alignment information, loads PCB data, and determines the offset of the PCB according to the distribution of the test points and the alignment information. And the movement mechanism is connected with the PCB and responds to the offset to control the PCB to translate, so that the test points are uniformly distributed on the flying probe test machine. According to the invention, by dynamically adjusting the position of the PCB, the test efficiency of the flying probe tester is improved, the distribution uniformity of test points is ensured, and the test flow of the PCB is optimized.

The invention provides a mold inner hole detection device and a detection method. The mold detection device comprises a test board, a mounting disc, a laser test mechanism, an adjustable mechanism and a laser contour detection mechanism, a lower die is erected above the test bench, a die core is installed in the lower die, an upper die plate is slidably connected above the lower die, a to-be-tested hole is formed in the middle of the upper die plate, upper die holes are formed in the upper die plate and located around the to-be-tested hole, and the upper die holes are communicated with the to-be-tested hole. According to the scheme, the difference value of the inner diameters of the topmost position and the bottommost position of the to-be-detected hole can be accurately detected in an omnibearing mode, then when the laser testing mechanism moves to the bottommost end, the angle of the polarizer can be changed, the angle of laser rays is made to move downwards, the perpendicularity of the axis can be detected, through type detection can be achieved, and the detection accuracy is improved. And secondly, the hollow pipe and the to-be-detected hole do not need to be concentrically calibrated in the calibration process, and only the hollow pipe needs to enter the to-be-detected hole.

The invention provides an electromagnetic compatibility test system for an integrated circuit, a part or a whole vehicle. The system comprises an interference signal injection or receiving device, a test board, an oscilloscope, an upper computer, a power supply and an isolation communication device, the interference signal injection or receiving device is used for sending a quantitative interference signal to the test board or receiving and measuring the size of the interference signal of the test board; the test board is used for bearing a tested integrated circuit and carrying out an electromagnetic compatibility test according to a working state specified by the upper computer; the isolation communication device is used for performing photoelectric conversion on a control signal and a monitoring signal corresponding to the electromagnetic compatibility test to form photoelectric isolation; the oscilloscope is used for measuring the waveform of the monitoring signal; and the upper computer is used for controlling the test process and analyzing the monitoring signal to judge the test result. The isolation communication device is used for cutting off electrical connection between the test board and the upper computer and the oscilloscope, it is ensured that the test board is not affected by the outside in the electromagnetic compatibility test process, and the accuracy of the electromagnetic compatibility test is improved.

A heating element test board and a heating element test system are applied to the technical field of heating element test, and the heating element test board comprises a processor, a communication unit and a heating element test unit. The heating body test unit is used for being connected with a to-be-tested heating body and realizing a preset test function on the to-be-tested heating body; the communication unit is provided with a communication access end and a communication cascade end, and the communication access end is connected with the communication cascade end; the communication access end is used for being connected with a communication end of an upper computer or being connected with a communication end of a heating element test board of a previous cascade, and the communication cascade end is used for being connected with a communication end of a heating element test board of a next cascade; and the processor is respectively connected with the heating body testing unit and the communication unit. The plurality of heating element test boards can be cascaded based on the communication unit, and the plurality of cascaded heating element test boards can be connected and communicated with the upper computer, so that the test efficiency is improved.

The invention relates to the technical field of hardware testing, and discloses a test board card, a test system and a test method for a hard disk backplane, and a server-side first transceiving interface in the test board card is used for receiving a control command sent by a server; the test instruction simulation module is used for generating a first test instruction according to the control command; the server side second transceiving interface is used for receiving a second test instruction sent by the server; and the controller is used for sending the first test instruction or the second test instruction to the hard disk backboard side transceiving interface, receiving first feedback information or second feedback information of the hard disk backboard, and feeding back the first feedback information or the second feedback information to the server. Therefore, under the two conditions that the VPP and the I2C of the server can not directly communicate with the hard disk backboard, the hard disk backboard can be tested, the test board card can be suitable for various types of servers, and the server can be reused when the test board card is used for testing the hard disk backboard.

A method for normalizing the solder interconnects (e.g., normalizing the height of the solder ball interconnects) in a circuit package module (e.g., dual-sided mold grid array package module) after removal from a test board includes receiving in a fixture the circuit package module upside down and removably coupling a stencil to the fixture and over the circuit package module. The stencil has a pattern of apertures that coincides with the pattern of solder interconnects of the circuit package module. The method also includes applying solder paste over the stencil to pass through the apertures to add solder paste to the solder interconnects. The method also includes removing the stencil from over the fixture, and removing the circuit package module from the fixture. The circuit package module can be heated to reflow the solder interconnects with the added solder paste.

The invention relates to the technical field of cable detection devices, and discloses a novel optical fiber communication cable production detection device, which comprises a bottom plate, the top of the bottom plate is fixedly connected with a supporting rod, the circumferential surface of the supporting rod is sleeved with a spring, and the circumferential surface of the supporting rod is slidably connected with a test board. The inner wall of the test bench is rotatably connected with a bidirectional threaded rod, the circumferential surface of the bidirectional threaded rod is in threaded connection with a sliding plate, the top of the sliding plate is fixedly connected with a lower clamping plate, the inner wall of the lower clamping plate is slidably connected with a limiting rod, and the top of the limiting rod is fixedly connected with an upper clamping plate. The two-way threaded rod drives the upper clamping plate to be matched with the lower clamping plate to clamp the cable, the stability and consistency of the cable in the detection process can be ensured through automatic clamping, cable position deviation caused by improper manual operation is avoided, and therefore the accuracy of the detection result is improved.

The invention provides textile yarn tensile property detection equipment and a detection method, and relates to the technical field of material strength tests.The detection equipment comprises a testboard, a clamping and stretching mechanism, a top layer pushing assembly and a bottom layer pushing assembly, a winding and unwinding shaft is welded to one end of the surface of the testboard, and to-be-detected textile yarn is wound on the surface of the winding and unwinding shaft; the other end of the surface of the test board is welded with an end plate, one side of the top of the end plate is in threaded connection with a clamping and stretching mechanism, and the front end and the rear end of the surface of the test board are respectively welded with a front end supporting plate and a rear end supporting plate. Clamping and stretching treatment can be automatically completed in the measuring process, the measuring efficiency is greatly improved, and multiple times of measurement can be rapidly completed. The problem that two clamping point positions and the stretching direction are not aligned during clamping is also avoided, and the accuracy and the reliability of a final detection result are improved.

The utility model discloses a testing device for a damp-heat test of a plastic package device, which comprises a test board system and a high-acceleration test system, and the test board system is connected with the high-acceleration test system. The test board system comprises a PCB, a golden finger, a power supply jumper wire, a device welding area, a protective tube welding area and a support, the golden finger is connected with the PCB, and the golden finger, the power supply jumper wire, the protective tube welding area and the device welding area are electrically connected in sequence. According to the utility model, the test board is provided with the power supply jumper wire and the protective tube welding area, so that the electrical connection abnormity of a plug-in jumper wire structure and a plug-in protective tube caused by the oxidation of a connector lug in a humid and hot environment is avoided; the device welding area and the corresponding welding station are arranged, a to-be-tested device product is placed at the position of the welding pad during welding, welding is conducted through reflow soldering, and the situation that electric connection is abnormal due to the fact that a probe head is oxidized in a hot and humid environment in a testing seat connection mode is avoided.