10 results about "Ic testing" patented technology

The application discloses a wrong-leader-preventing distribution device and relates to the technical field of IC testing. The bundling table of the wrong-leader-preventing distribution device is provided with a bundling groove matched with the bundling magic tape profile, a plurality of first storage cavities are formed by being separated from a first storage cavity, each first opening corresponds to a first door plate, and the first door plate selectively closes the corresponding first opening. The bundling table with the bundling groove is additionally arranged on the workbench to avoid the risks of tray explosion, IC loss and IC crushing caused by bundling the tray loaded with IC products. In addition, the first door plate selectively closes the corresponding first opening, and the selective closing of the different first storage cavities avoids the risk of IC mixing caused by the human wrong taking of the corresponding bundling magic tape. Moreover, the opening control signal of the first door plate is suitable for being associated with the control of a handler tray signal, company ERP customer test information and the like, thereby facilitating the linkage with the above-mentioned external equipment, effectively improving the adaptability and production efficiency.

This invention relates to an automated integrated circuit (IC) system and apparatus for testing the entire IC. The automated IC system includes an acquisition unit for acquiring IC test data, and further includes: a central controller that communicates with the acquisition unit and receives IC test data sent by the acquisition unit through a receiving module therein; and a transmission module that communicates with the receiving module to transmit the IC test data to a comparison module and to a database for storage. Simultaneously, the comparison module retrieves pre-stored data from a memory and compares the IC test data with the pre-stored data. The comparison result is analyzed and judged by an analysis and judgment module. This testing system has high completeness, greatly improving the rigor of IC testing, effectively avoiding errors in the testing process, and ensuring testing effectiveness.

The utility model provides a test socket used for IC test. The test socket for IC testing includes: a housing; the device comprises a shell and two movable openings, the two movable openings are formed in the two sides of the shell, a butt joint base is installed at the bottom of the inner wall of the shell, a connector is installed on the back face of the butt joint base, sliding rods are fixedly connected to the positions, close to the four corners, of the bottom of the inner wall of the shell through supporting discs, and auxiliary springs are fixedly connected to the outer surfaces of the supporting discs. And movable rings are slidably connected to the outer surfaces of the sliding rods correspondingly, sliding blocks are installed at the tops of the four movable rings correspondingly, a movable plate is fixedly connected between the four sliding blocks, and supporting plates are fixedly connected to the two sides of the movable plate correspondingly. According to the test socket for the IC test provided by the utility model, the IC integrated circuit is clamped into the test socket through the design, so that the test socket is powered off, and the condition that the IC integrated circuit is damaged due to improper operation when the IC integrated circuit is clamped into the test socket in an electrified manner is avoided.

The application belongs to the technical field of chip testing, and discloses an IC adjacent pin short circuit and gold finger contact detection system and method. The IC testing system is used for generating control instructions and measurement instructions, and the control instructions and the measurement instructions are respectively sent to a control module and a measurement module. The control module is used for receiving the control instructions generated by the IC testing system, and sending the control instructions to a to-be-tested IC chip through a control interface of a DUT board, so that the to-be-tested IC chip works according to the control instructions. The measurement module is used for receiving the measurement instructions generated by the IC testing system, and measuring the to-be-tested IC chip through a measurement interface of the DUT board to obtain measurement data, and feeding back the measurement data to the IC testing system to generate a test result. According to the control module and the measurement module, the test parameters can be accurately controlled, the measurement data of the chip can be accurately measured, and a more accurate test result can be obtained.

The utility model belongs to the technical field of IC carrying, and particularly discloses an IC carrying shuttle device. The IC carrier comprises the shell, the carrying assembly is arranged in the shell, the carrying assembly comprises the first IC carrier plate and the second IC carrier plate, the two motors are arranged on one side of the shell, the first IC carrier plate and the second IC carrier plate can be carried at the same time through the carrying assembly, the effect of carrying the double-layer IC carrier plates is achieved, it means that the number of ICs capable of being carried at the same time is doubled, and the carrying efficiency is improved. The carrying efficiency is greatly improved, the overall production cycle is effectively shortened, the high-efficiency requirement of large-scale integrated circuit production is met, the first IC carrier plate and the second IC carrier plate can accurately carry ICs to designated positions through stable movement and track limitation, the accuracy of subsequent IC testing, processing and other links is improved, and the production efficiency is improved. The defective rate caused by carrying errors is reduced, and the product quality and the production reliability are improved.

The invention discloses a suction nozzle cleaning mechanism and IC test equipment. The suction nozzle cleaning mechanism is arranged in the moving range of the suction nozzle mechanism of the equipment and can clean an adsorption opening of the suction nozzle mechanism in time on the basis that the equipment performance and the carrying and adsorption performance of the suction nozzle mechanism are not affected, dust accumulation at the adsorption opening of the suction nozzle mechanism can be avoided, the carrying performance of the suction nozzle mechanism can be effectively guaranteed, and the service life of the suction nozzle mechanism is prolonged. The suction nozzle mechanism ensures that the IC to-be-carried part does not fall off in the carrying process, so that the IC to-be-carried part is prevented from being damaged due to falling off, the working efficiency can be ensured, equipment where the suction nozzle mechanism is located basically has zero interruption and zero abnormity during operation, and the productivity is improved. The suction nozzle cleaning mechanism is easy and convenient to install and flexible to use, and can be applied to various tool equipment with suction nozzle mechanisms, such as IC testing equipment. The suction nozzle cleaning mechanism is additionally arranged to clean an adsorption opening of the suction nozzle mechanism, and the service life of the suction nozzle mechanism is prolonged. The IC test equipment comprises the suction nozzle cleaning mechanism.

The invention discloses an IC test sorting machine which comprises a rack, a feeding and discharging arm, a transfer device, a plurality of IC test devices and a plurality of stock bin devices. The rack is provided with a feeding area, a first sorting area and a second sorting area, and the feeding area and the first sorting area are each provided with the stock bin device. The stock bin device is used for receiving and storing the trays and outputting the trays; the charging tray is used for storing ICs; the transfer device and the IC testing device are respectively arranged on the rack, and the transfer device is respectively adjacent to the feeding area and the IC testing device; the feeding and discharging arm is arranged above the rack and can transfer empty trays among the feeding area, the first sorting area and the second sorting area or transfer ICs among the trays, the transfer device and the IC testing device. According to the IC testing and sorting machine, full-automatic testing and sorting can be achieved, the labor intensity of workers is reduced, and the production efficiency is improved.

The application discloses a kind of based on crosstalk simulation analog IC synchronous test optimization method and system.The method first obtains the position layout data in analog IC synchronous test process and the test signal data of each analog IC, determines electromagnetic crosstalk information in combination with test signal, and accordingly constructs crosstalk schematic diagram with position layout data;Spectral clustering algorithm is used to cluster the schematic diagram, and the crosstalk path in synchronous test is identified;Based on the schematic diagram and the crosstalk path, an electromagnetic crosstalk signal isolation barrier is designed and deployed in the test environment, the analog IC is simulated and evaluated by constructing and injecting crosstalk simulation signals for independent testing, and the isolation effect is judged;According to the evaluation result, the isolation barrier is optimized to obtain an optimization scheme.The method can effectively identify and isolate the electromagnetic crosstalk path in the synchronous test process, and improve the accuracy and reliability of analog IC testing.

A method for monitoring parameters of IC testing equipment includes the following steps: S100: configuring key parameters to be monitored in the IC testing equipment as a shareable data file; S200: reading and parsing the key parameters in the data file in real time using monitoring software; S300: comparing the parsed key parameters with preset work standard parameters; S400: triggering an anomaly determination when a deviation is detected between the key parameters and the work standard parameters; S500: sending an anomaly alarm message to a designated terminal via a message push system based on the anomaly determination result, and controlling the IC testing equipment to perform a shutdown operation or enter a pending state. This method uses automated monitoring software to set different judgment conditions according to different parameters, and uses the system push function to promptly detect problems and perform processing and optimization.