376 results about "Probe card" patented technology

An object of the invention is to provide a probe card capable of properly performing a measurement. A probe card according to the invention includes: probes 100 shaped to allow vertical elastic deformation; a supporting substrate 200 with the probes provided on the lower surface thereof; a main substrate 300 positioned opposing the upper surface of the supporting substrate 200; an intermediate substrate 400 disposed between the supporting substrate 200 and main substrate 300; a supporting member 500 that is a column-shaped member with one end thereof attached to the center of the supporting substrate 200 and the other end thereof attached to the intermediate substrate 400 and holds the supporting substrate 200 so that the supporting substrate 200 is inclinable; and elastic members for holding the supporting substrate 200 so that the supporting substrate 200 is in a horizontal position relative to the main substrate 300, which are provided between the supporting substrate 200 and main substrate 300.

The invention discloses an impedance self-adaptive high-frequency probe, a probe card and a testing method, and belongs to the technical field of semiconductor high-frequency testing. When an existing high-frequency probe is used for a crimping test, a conductive probe body of the existing high-frequency probe generates mechanical deformation due to contact pressure, so that characteristic impedance is deviated, and uneven pressure in an array causes impedance dispersion. The problem is solved by coating the outer side of the conductive needle body with a composite material layer, the composite material layer is composed of an elastic insulating matrix and metal particles dispersed in the elastic insulating matrix, the metal particles have bimodal particle size distribution, and the total integral number is 30%-40%. When the probe is pressed, the composite material layer is subjected to reversible microscopic reconstruction, the effective dielectric constant of the composite material layer is increased along with the increase of the pressure, and the generated impedance change can counteract the impedance drop caused by the deformation of the conductive probe body, so that the self-adaptive stability of the characteristic impedance of the probe under the change of the pressure is realized. The impedance dispersion of the probe array can be remarkably reduced, the consistency and precision of high-frequency testing are improved, and the process compatibility is good.

The invention provides a full-automatic probe position inspection system for a probe card, and the system comprises a morphology collection module which is used for carrying out the three-dimensional morphology scanning of a probe group of the probe card, and obtaining the three-dimensional point cloud data of the probe group; the probe position analysis module is connected to the morphology acquisition module, comprises a machine learning model and is used for processing the three-dimensional point cloud data and generating probe position deviation data and probe health state scores; the compensation execution module is connected to the probe position analysis module and is used for scoring based on the probe position deviation data and the probe health state; calculating an optimal contact position, and driving the carrying platform to move to the position; and the verification module is used for verifying the accuracy of the needle position after the contact is executed at the optimal contact position. Passive detection, predictive maintenance and process closed-loop optimization are crossed, and the test yield, the equipment service life and the manufacturing process level are comprehensively improved through data driving.

To provide a ceramic having a high coefficient of thermal expansion and a low dielectric constant.SOLUTION: 50.0 to 90.0 mass% of 2MgO and SiO2, a total of 8.0 mass% or more of one of 7.0 to 14.0 mass% of ZrO2 and 10.0 to 50.0 mass% of Al2O3 or both of 14.0 mass% or less of ZrO2 and 50.0 mass% or less of Al2O3, and 3.0 to 15.0 mass% of one or more selected from Y2O3, CaO, CeO2, and HfO2, wherein a crystalline structure of the is a cubic structure. ZrO2.SELECTED DRAWING: None

The invention provides a wafer test probe pressure control method and system, electronic equipment and a storage medium. The method comprises the following steps: acquiring probe card information and to-be-tested product information configured for a current test task; based on the probe card information and the to-be-tested product information, extracting a corresponding multi-dimensional parameter set from a pre-established probe card comprehensive parameter database; inputting the multi-dimensional parameter set into a preset probe pressure optimization model, and calculating a probe pressure control interval suitable for the current test task; sending the probe pressure control interval to a production execution system in communication connection with the probe station; executing the current test task under the control of the production execution system, and collecting an actual probe pressure value applied by the probe station in real time through the production execution system; in response to the fact that the actual needle pressure value exceeds the needle pressure control interval, the production execution system is triggered to execute needle pressure abnormal control operation, and the problem that the needle mark is large due to the fact that non-optimal fixed needle pressure is used is solved.

The invention belongs to the technical field of semiconductor testing, and discloses a WAT test probe card life cycle management method and system. The method comprises the following steps: collecting full-life-cycle multi-source data of a probe card, performing unified management, and constructing a probe card digital twin data model; carrying out change point detection and segmentation on monitoring time sequence data, and constructing a stable fragment library; extracting a unified feature vector including electrical contact, test distribution, space structure and life load; calculating a needle card health index based on a machine learning regression model; predicting the remaining service life and the failure probability by using a proportional risk survival model; according to the health index, the remaining life and the failure probability, generating a maintenance decision suggestion and recommending execution time; the model is updated through maintenance result feedback, and closed-loop optimization is achieved. By means of the mode, accurate evaluation and predictive maintenance of the health state of the probe card are achieved.

A probe needle for testing a device under test (DUT) includes a needle core; a needle coat; and an isolation layer disposed between the needle coat and the needle core, wherein in an extending direction of the needle core, the isolation layer extends exceeding the needle coat and the needle core extends exceeding the isolation layer. A probe card structure including the probe needle having a needle core; a needle coat; and an isolation layer and a method of testing a device under test using the probe card structure are also provided.

Embodiments herein provide for probe cards and methods related thereto. A probe card comprises a probe and a substrate. The probe comprises a probe stand, a probe beam, and a probe tip. The probe tip and probe stand extend in a first direction, and the probe beam extends in a second direction different than the first direction. The substrate comprises a conductive feature disposed in a material layer. The probe stand of the probe is directly bonded to the conductive feature of the substrate via direct metal bonds.

A probe unit includes first and second probes of equal length. A probe body of at least one of the probes has a slot extending along a longitudinal direction thereof to define two slats. A total cross-sectional area of the slats of the first probe is greater than that of the second probe. Alternatively, the probe body of the second probe is solid, and the total cross-sectional area of the slats of the first probe is greater than the cross-sectional area of the solid probe body of the second probe. The slats are shaped in such a way that a contact force of the first probe is greater than that of the second probe, thereby meeting testing requirements of conductive contacts of different sizes on an electronic device under test, while reducing problems of different probe tip wear rates and excessive probe mark area ratio differences.

The invention discloses wafer dynamic parameter testing equipment which is provided with a testing device and a probe card for testing a wafer which is placed on a probe table and is internally provided with a to-be-tested device, and the probe card is provided with a plurality of probes connected with the to-be-tested device and a plurality of conductive contact pieces connected with the probes respectively. A connecting module of the testing device is provided with a plurality of connectors connected with conductive contact pieces, a high-voltage capacitor electrically connected with a high-voltage power supply in the testing device is connected with an inductive load module through a power switch, the inductive load module is connected with the connectors, and a control module is connected with a chip to be tested through the connectors. The control module realizes the dynamic parameter test of the device to be tested in the wafer by controlling the power switch to be turned on and turned off according to a certain time sequence, and the matching value of the probe card and the connector can reduce spurious oscillation signals so as to effectively improve the accuracy of the dynamic parameter test of the wafer. And therefore, the chip testing efficiency can be improved and the chip cost can be reduced.

The application provides a power module test method, system, device and medium. The method is applied to a chip test device, the chip test device includes a probe card, the probe card includes a plurality of phase sequence modules, and each phase sequence module is connected with a drive board. For the plurality of phase sequence modules, when it is detected that a target drive board is powered on, the target drive board reads test configuration information from the phase sequence module, the target drive board generates a first target phase sequence drive voltage based on initial phase sequence voltage information in the test configuration information, when a drive instruction is received, the target drive board generates a drive signal, and based on the drive signal, the first target phase sequence drive voltage is transmitted to the power module under test through the phase sequence module at a target pin to drive the power module under test. Therefore, no matter how the drive board is placed, the phase sequence drive voltage generated by the drive board can be accurately matched to the corresponding phase sequence of the device through the power module under test, manual operation errors are reduced, and test safety is ensured.

A bridge beam attached to a semiconductor device handling apparatus that handles a semiconductor device, includes a beam-shaped main body to which a probe card is attached. The probe card has a contact that is electrically connected to a terminal of the semiconductor device. The bridge beam includes a first actuator, attached to the beam-shaped main body, that moves an optical probe relative to the semiconductor device. The optical probe performs one or both of emitting an optical signal to the semiconductor device and receiving the optical signal from the semiconductor device.

This utility model discloses a liquid crystal panel moving testing fixture, belonging to the field of liquid crystal panel testing technology. The fixture includes a mounting platform, a guide rail fixed to the mounting platform, a probe holder slidably mounted on the guide rail, a removable elastic probe inserted into the probe holder, a clamping block that elastically presses a flexible circuit board against the rear end of the probe, and a mounting platform for supporting and fixing the liquid crystal panel. The front end of the probe is pressed against the detection point of the liquid crystal panel, and the other end of the flexible circuit board is connected to an external testing circuit via a piano cover, forming a quickly replaceable testing path. This utility model utilizes the cooperation between the elastic probe and the clamping block to achieve a highly reliable, low-contact-resistance electrical connection; the probe holder as a whole can move along the guide rail to adapt to different testing positions; the pluggable probe structure facilitates maintenance, significantly improving testing efficiency and reducing testing costs.

An example test system includes a probe card configured to contact a device under test (DUT); a module including a first optical connector configured to contact a second optical connector on the DUT, with the first optical connector being for a fiber optic cable; and a motion system configured to move into, and out of, contact with the module. When the motion system is in contact with the module, the motion system is configured to move the module relative to the DUT in order to align the first optical connector to the second optical connector.

A probe card includes a plurality of power lines that are electrically connected to the plurality of DUTs, a plurality of ground lines that are electrically connected to the plurality of DUTs and to each other, and a plurality of power compensation circuits that are electrically connected to respective ones of the plurality of power lines and respective ones of the plurality of ground lines, where the plurality of power compensation circuits are configured to generate and provide a plurality of compensated power supply voltages to the respective ones of the plurality of power lines, and where the plurality of compensated power supply voltages are configured to inhibit a variation of a ground voltage of the respective ones of the plurality of ground lines.

The utility model belongs to the technical field of temperature control mechanisms for probe cards, and discloses a temperature control mechanism for a high-temperature nitrogen blowing test probe card, which comprises a probe card mechanism, the surface of the probe card mechanism is communicated with a heating mechanism, the surface of the probe card mechanism is provided with a temperature control mechanism, and the temperature control mechanism comprises a hot air channel. The surface of the probe card mechanism is provided with a hot air channel, the hot air channel is communicated with the heating mechanism, the interior of the hot air channel is rotatably connected with a temperature control disc, the surface of the temperature control disc is provided with a movable rod, and the two ends of the movable rod penetrate through the temperature control disc and the probe card mechanism. The temperature control disc is arranged on the surface of the probe card mechanism, extends to the outside of the probe card mechanism and is rotatably connected to the inside of a *-shaped plate arranged on the surface of the probe card mechanism, and filtering discs are symmetrically arranged on the surface of the temperature control disc. The hot air can be controlled in the preheating process of the probe card, so that the preheating temperature of the probe card can be controlled.

The utility model discloses an insulation protection structure for a probe card. The insulation protection structure comprises a probe main body and a jack arranged in the probe main body. When the insulation protection structure for the probe card is used, the probe body is installed inside a socket, when an integrated circuit needs to be detected, the probe head is in contact with the integrated circuit, when the probe head is in contact with the integrated circuit, the contact tightness of the probe head and the integrated circuit can be enhanced due to the fact that the probe head is extruded by the spring, and meanwhile, the probe head is prevented from being damaged. In the moving process of the probe head, limiting clamping blocks on the left side and the right side of a first connecting plate can move in limiting clamping grooves in the inner wall of an insertion hole, so that the limiting effect on the probe head is achieved, and then whether an integrated circuit is qualified or not is judged by transmitting certain current and frequency; the contact tightness of the probe and the integrated circuit is enhanced, and the poor contact of the probe head and the integrated circuit is prevented from influencing the detection quality.

The invention provides a temperature control assembly for a probe card and the probe card, and relates to the field of wafer testing. The temperature control assembly for the probe card comprises a cover plate; the heating assembly is arranged on the side, away from the probe card, of the cover plate, and the heating assembly is electrically connected with the testing machine table; the heating buffer assembly is arranged on one side, close to the probe card, of the cover plate; the heat preservation assembly is arranged on the side, close to the probe card, of the cover plate, and the heat preservation assembly is an assembly with a closed pattern and is distributed on the outer side of the probe card; wherein the cover plate, the heat preservation assembly and the probe card form a heat receiving space, and the orthographic projection of the heating assembly on the cover plate is within the orthographic projection of the heating buffer assembly and the heat preservation assembly on the cover plate. According to the embodiment of the invention, the probe mark offset caused by temperature difference generated by heating of the probe card in the test process can be avoided, so that the test efficiency can be improved.

The utility model relates to the technical field of semiconductor test, disclose a quick replacement probe module for probe card, including circuit board and fixed ring, the outside of fixed ring is provided with connecting mechanism, the bottom fixed connection of circuit board has the inclined plate, the outer wall of circuit board is provided with the bolt mechanism, the top of fixed ring is provided with temperature sensing mechanism, the outside of fixed ring is provided with circuit mechanism, the connecting mechanism includes a plurality of T shaped blocks, the outer wall of a plurality of T shaped blocks all fixed connection in the outer wall of fixed ring, the outer wall of a plurality of T shaped blocks all is set up with the circular slot, the outer wall of fixed ring is set up with ring groove no.1. In the utility model, by pushing T shaped block into the installation mouth, complete positioning and preliminary connection, then rotate fixed ring, make T shaped block and the T shaped slot of inclined plate snap together complete connection, through -hole is inserted into the bolt, rotates the rotating ring and makes the clamping block snap together, make the connection more fastening, reduce the positioning error.

A protective cover for probe detection comprises a protective cover body, the bottom surface of the protective cover body is recessed inwards to form a groove, the periphery of the groove is provided with a plurality of positioning columns, the tops of the positioning columns are fixedly connected with the bottom of the protective cover body, a probe card is arranged below the protective cover body, the top of the probe card is provided with a protruding block, and the protruding block is fixedly connected with the bottom of the protective cover body. The cross section of the convex block is consistent with the cross section of the groove, the convex block is provided with a plurality of probe grooves, the probe grooves are provided with a plurality of holes, the periphery of the convex block is provided with a plurality of positioning holes, the positioning columns can be inserted into the positioning holes, the positioning columns are provided with fixing assemblies, the fixing assemblies comprise cavities and insertion blocks, and the insertion blocks are inserted into the cavities. Through the design of the inclined surface of the bottom surface of the insertion block and the spring, the fixing assembly can be adaptively fixed when the positioning column is inserted into the positioning hole, and the protection effect and the stability of the protection cover body are enhanced by rapidly connecting and fixing the protection cover body and the probe card.

This probe for a probe card has, on a reference surface perpendicular to a buckling direction a plurality of deformed regions which are arranged with spacings therebetween, the outer edge of which is circular, oval, or polygonal, and which has a recessed shape or a protruding shape, and a framework region, which is provided at the boundary of adjacent deformed regions. A plurality of the deformed regions are arranged with spacings therebetween in rows in a prescribed direction relative to the lengthwise direction of the probe, and a plurality of the rows are arranged with spacings therebetween in the lengthwise direction of the probe.

The invention discloses a probe card adhesive pressing jig. The probe card gluing and pressing jig comprises a base, a heightening piece and a pressing block. The heightening piece is assembled on the base and used for bearing the probe card. The pressing block is connected with the base or the heightening piece through locking assemblies distributed in the circumferential direction of the heightening piece at intervals, the pressing block and the top end of the heightening piece press the probe card, and the pressing block comprises a glue cleaning hole penetrating through the pressing block in the direction from the top end of the heightening piece to the base. The heightening piece is assembled on the base and can heighten the probe card, so that the probe card is higher than the base and has an operation space, residual glue on the outer side of the probe card can be conveniently observed and cleaned by a cleaning tool, the residual glue on the inner side of the probe card can be cleaned by the cleaning tool through the glue cleaning hole of the pressing block, and therefore, the probe card can be conveniently cleaned. According to the probe card adhesive pressing jig, the residual adhesive can be observed and cleaned conveniently.

The present invention comprises a wafer chuck (10) that fixes a semiconductor wafer (1) by vacuum suction and a probe card (20) that inspects the electrical characteristics of the semiconductor wafer (1). The probe card (20) has a pressure chamber (60) which has a pressure space (PS) and in which the pressure space (PS) is sealed by bringing a one end (61)-side into contact with a one surface (1a)-side of the semiconductor wafer (1). The pressure chamber (60) has a cylindrical surrounding wall (40) and a contact shield (50) which is provided on a one end (42)-side of the surrounding wall (40), and which is made of a softer material than is a surrounding wall (41) and also constitutes the one end (61)-side of the pressure chamber (60), to contact the one surface (1a)-side of the semiconductor wafer (1). The present invention is configured such that when the one end (61)-side contacts the one surface (1a)-side of the semiconductor wafer (1), some of a plurality of chip formation regions (Ra) on the one surface (1a)-side of the semiconductor wafer (1) are positioned inside the pressure space (PS) and the remaining chip formation regions (Ra) are positioned outside the pressure space (PS).

This disclosure relates to probe cards and methods for inspecting light-emitting diodes (LEDs) using the same. According to one aspect of this disclosure, the probe card includes: a probe substrate; a photodetector unit disposed on one surface of the probe substrate; and an electrode unit disposed on the photodetector unit and including a first sheath electrode and a second sheath electrode, the second sheath electrode including a through-hole overlapping the photodetector unit. Thus, the through-hole is formed in the second sheath electrode to allow light from the LED to be incident on the photodetector unit, and the electrode unit and the photodetector unit can simultaneously inspect the LED.

The invention relates to a layout structure of a fast recovery diode and a test method, the layout structure of the fast recovery diode comprises a wafer which comprises odd-numbered line areas and even-numbered line areas which are alternately distributed, each odd-numbered line area comprises a plurality of first areas which are sequentially arranged along the line direction, and each even-numbered line area comprises a plurality of second areas which are sequentially arranged along the line direction; each even-numbered line area comprises a plurality of second areas which are sequentially arranged in the line direction; the first recovery diode and the second recovery diode are located in the second area, the second recovery diode is located on one side of the first recovery diode in the row direction, the first recovery diode has a first current specification, and the second recovery diode has a second current specification; and a third recovery diode in the first region, the third recovery diode having a third current specification, the size of the third current specification being greater than the size of the first current specification and greater than the size of the second current specification. According to the layout structure, test programs can be reduced, the test times can be reduced, the probe card cost can be reduced, and the productivity can be improved.

The utility model discloses a probe station probe contact stability enhancing device, which comprises a probe clamping seat and a probe clamping assembly arranged at the end part of the probe clamping seat, the probe clamping assembly comprises a first clamping plate, a second clamping plate, a bottom plate, a transverse adjusting column and a contact strip, the first clamping plate and the second clamping plate are symmetrically distributed, the first clamping plate is fixed on the bottom plate, and the transverse adjusting column is fixed on the bottom plate. A sliding groove is formed in the bottom plate, a sliding block is installed at the right end of the second clamping plate and slidably arranged in the sliding groove, a probe penetrating groove is formed in the inner side of the first clamping plate, a threaded opening is formed in the upper left corner of the first clamping plate, the transverse adjusting column is inserted into the threaded opening in a threaded mode, an embedded opening is formed in the upper left corner of the second clamping plate, and the inner end of the transverse adjusting column is rotationally arranged in the embedded opening. The contact strip is embedded in the inner side of the second clamping plate and is symmetrically distributed with the probe through groove, and a floating adjusting mechanism is arranged at the joint of the probe clamping seat and the probe clamping assembly. According to the probe installation structure, the stability of the probe in the use process is improved, and the damage to the probe in the clamping process can be reduced.

The present application belongs to the technical field of probe card batch detection, and provides a chip batch detection method and system based on a probe card multiplexing strategy, comprising: obtaining the number of times of multiplexing of the probe card, analyzing the change of temperature drift of the probe card, constructing a temperature drift prediction model based on a deep learning model; based on the temperature drift prediction model, taking the current number of multiplexing and the current working temperature of the probe card as input, outputting the temperature drift prediction value of the current number of multiplexing, adopting a preset temperature drift compensation strategy to perform temperature drift compensation, and performing quantitative deviation analysis on the temperature drift compensation to determine whether the temperature drift compensation is out of limit; the present application realizes dynamic monitoring of the whole life cycle of the probe card, guides the staff to reasonably dispose, and avoids test failure and cost waste.

A probe card for probing a semiconductor substrate is disclosed. The probe card can include a probing element having a hybrid bonding surface that is configured to removably hybrid bond to a semiconductor element. The hybrid bonding surface of the probing element can include a nonconductive layer and contact pads at least partially embedded in the nonconductive layer. The contact pads of the probing element can be bonded to probe pads of the semiconductor element. Additionally, the nonconductive layer of the probing element can be bonded to a nonconductive layer of the semiconductor element. A conductive material can be deposited over the contact pads. The conductive material can comprise a lower melting point than the contact pads. The conductive material can comprise at least one of a low melting point metal and conductive polymer.

The invention discloses a wafer testing machine and a storage container for the wafer testing machine. The wafer testing machine comprises a chuck, a probe card, a storage container and a carrying device. And the probe card is arranged above the chuck relative to the chuck. The storage container comprises a plurality of drawers which are used for bearing test samples or auxiliary devices. And the carrying device is used for carrying the test sample or the auxiliary device among the chuck, the storage container and the wafer bearing box. According to the wafer testing machine, the overall testing time can be shortened.

To provide a technique capable of appropriately setting a recipe of substrate processing by automatically improving setup data.SOLUTION: The image processing system processes at least one of image information of the semiconductor device and image information of the probe card. The image processing system includes a calculation unit that calculates information related to a matching rate between a comparison image which is the acquired image information and a registered image held in advance, a comparison unit that compares the calculated information related to the matching rate with a threshold value held in advance, and a registration unit that adds the comparison image to the registered image to update the registered image to a new registered image in a case where the information related to the matching rate is less than the threshold value, and does not add the comparison image to the registered image in a case where the information related to the matching rate is equal to or greater than the threshold value.SELECTED DRAWING: Figure 6