12results about How to "Shorten the conduction path" patented technology

The invention belongs to the technical field of lithium ion batteries, and particularly relates to a preparation method and application of a carbon-containing lithium iron phosphate positive electrode material. The preparation method of the carbon-containing lithium iron phosphate positive electrode material provided by the invention comprises the following steps: (1) mixing a lithium source, an iron source, a phosphorus source and a carbon source, and sintering in an inert atmosphere to obtain precursor powder; (2) mixing the precursor powder, a conductive agent and a dispersing agent, and filtering to obtain a mixed material; and (3) drying the mixed material, grinding and sieving to obtain the carbon-containing lithium iron phosphate positive electrode material. According to the method, the carbon-containing lithium iron phosphate precursor and the conductive agent are mixed to prepare the positive electrode material, so that the use amount of the conductive agent is reduced, the processing performance of slurry is improved, the distribution uniformity of the conductive agent is improved, the conductivity among particles is enhanced, the sheet resistance of a positive plate is reduced, the conduction path of Li < + > is shortened, and the electrochemical performance of the positive electrode material is improved.

The invention relates to the technical field of cable materials, and particularly discloses a heat-conducting insulated cable material and a preparation method thereof. The preparation method of the heat-conducting insulated cable material comprises the following steps: dispersing hexagonal boron nitride in water, adding a sulfuric acid solution and a hydrogen peroxide solution, stirring in a constant-temperature water bath, cooling, centrifuging, drying, adding tetraisopropyl titanate, ethylene glycol, an antioxidant and terephthalic acid, stirring in a constant-temperature oil bath, reducing the system pressure and stirring, cooling in a vacuum environment, and obtaining the heat-conducting insulated cable material. The activated polyethylene glycol terephthalate is obtained; the preparation method comprises the following steps: adding spherical boron nitride and dopamine hydrochloride into a Tris-HCl buffer solution for ultrasonic treatment, adding amino-terminated polyamidoamine for ultrasonic treatment, centrifuging, washing and drying to obtain activated boron nitride; mixing the activated polyethylene glycol terephthalate and the activated boron nitride, stirring, extruding and cooling to obtain the heat-conducting insulated cable material. The cable material is good in thermal conductivity and insulativity, and the preparation method is simple.

A stacked electronic module and a manufacturing method thereof are disclosed. The stacked electronic module includes a magnetic device including a magnetic body, a plurality of electrodes of the magnetic device disposed on upper and lower surfaces of the magnetic body, a package encapsulating the magnetic body, and a plurality of conductive layers disposed on the package and electrically connected to the plurality of electrodes.

The present invention provides a fan-out packaging structure and a packaging method, wherein the fan-out packaging structure comprises a first rewiring layer, a second rewiring layer, a metal connecting column, a semiconductor chip, a packaging layer, a stacked chip package, a passive component, a filling layer and a metal bump. The present invention can integrate a plurality of chips with different functions into one packaging structure, thereby improving the integration of the fan-out packaging structure; through the first rewiring layer, the second rewiring layer and the metal connecting column, a three-dimensional vertical stacking packaging is realized, which can effectively improve the integration of the packaging structure, and can effectively shorten the conduction path, so as to reduce power consumption, increase transmission speed and increase data processing capacity.

The invention relates to the technical field of storage and transportation devices. The invention particularly relates to a cold storage plate and a refrigerator car. According to the technical scheme, the cold storage plate is provided, due to the high heat conduction performance of the heat conduction piece, the cold energy is transmitted to the phase change cold storage agent in the heat conduction space, and the volume of the formed heat conduction space is smaller than that of the whole containing cavity; and the cold energy is conducted from the surface of the heat conduction piece to the center of the formed heat conduction space, and the conduction path is smaller than the conduction path without the heat conduction piece. Due to the fact that the smaller the conduction path is, the smaller the heat transfer resistance is, the solidification speed of the phase change cold storage agent in the heat conduction space is higher, and the cold charging speed of the cold storage plate is increased. And the multiple heat conduction spaces can communicate with one another, so that the cold storage plate containing cavity can be filled with the phase change cold storage agent as much as possible. Furthermore, the heat conduction piece is arranged in the containing cavity, so that the overall strength and hardness of the cold storage plate are improved.

The present invention provides an antenna packaging structure and packaging method with an air chamber, the structure comprising: a rewiring layer, the rewiring layer comprising a first surface and a second surface opposite to each other; a chamber side wall formed on the second surface of the rewiring layer; a substrate comprising a first surface and a second surface opposite to each other, an antenna metal layer formed on the first surface of the substrate, the substrate bonded to the chamber side wall, the substrate, the chamber side wall and the rewiring layer forming an air chamber; an antenna circuit chip, the antenna circuit chip is electrically bonded to the second surface of the rewiring layer and is located in the air chamber; a metal bump is formed on the first surface of the rewiring layer to realize electrical extraction of the rewiring layer. The present invention sets the air chamber below the antenna metal layer, which can greatly reduce the loss of antenna signals compared to other packaging materials, thereby effectively enhancing the antenna's transceiver efficiency.

The invention relates to the technical field of concrete, and particularly discloses low-density thermal insulation foam concrete and a preparation method thereof. The preparation method of the low-density thermal-insulation foam concrete comprises the following steps: dispersing waste feather fibers in a bio-based polyurethane solution, stirring, standing, carrying out ultrasonic treatment, adding cement, fly ash, a foaming agent, water and Tween-80, stirring, and standing to obtain a pretreated concrete blank; the preparation method comprises the following steps: dispersing mesoporous silica powder and lauryl sodium sulfate in water, stirring, performing ultrasonic treatment, adding shrimp shell chitin fibers, stirring, filtering, collecting solids, and drying to obtain a modified shrimp shell chitin fiber compound; mixing the pretreated concrete blank and the modified shrimp shell chitin fiber compound, stirring, performing ultrasonic treatment, pouring into a mold, and curing to obtain the low-density thermal insulation foam concrete. The low-density foam concrete disclosed by the invention is good in thermal insulation performance, high in strength, simple in preparation method and suitable for large-scale popularization and production.

The utility model discloses a notebook computer heat dissipation module and a notebook computer, and relates to the technical field of electronic products, and the notebook computer heat dissipation module comprises a fan shell, heat dissipation fins and a heat dissipation plate; the fan shell comprises a first shell body and a second shell body, and a containing cavity is defined by the first shell body and the second shell body. The heat dissipation fins are arranged on one side of the fan shell, and part of the heat dissipation fins are arranged in the containing cavity and connected with the first shell; partial structure of the heat dissipation pipe is arranged in the containing cavity and is attached to the heat dissipation fins and the second shell; according to the technical scheme provided by the utility model, the occupied space of the heat dissipation module of the notebook computer can be reduced.

The utility model discloses an intelligent watch and PCB mainboard thereof. The PCB mainboard comprises: a mainboard main body; a plurality of functional circuit areas arranged on the mainboard main body, electronic components and / or metal wiring being arranged in the functional circuit areas; a plurality of signal isolation areas arranged on the mainboard main body, a plurality of first through holes penetrating through the mainboard main body being arranged in the signal isolation areas; and the plurality of first through holes are arranged in sequence at the edges of the signal isolation areas, so as to reduce signal interference and loss between different functional circuit areas.

The utility model relates to the technical field of ice making device especially, and is a kind of ice making device and the equipment with it, including ice making mould, the ice making mould includes outer mould shell, at least one ice making cavity is equipped in the outer mould shell, the electric heating element is equipped on the outside of ice making cavity, the ice making cavity is heated by the electric heating element, makes ice block and the cavity wall separation of ice making cavity;By setting the electric heating element on the outside of ice making cavity, electric heating element is powered on and can generate heat, to directly heat the ice making cavity, shorten the heat conduction path in ice making mould, increase the heating area of ice making cavity, make ice block heat evenly, promote ice block to be able to and ice making cavity cavity wall fast separation, improve ice-off efficiency.

The present invention relates to a high-speed coaxial radio frequency connector with a grounding function, which is formed by an insulating plastic body and a metal conductive seat being buckled together. The metal conductive seat includes a metal conductive shell, an insulating column, a wiring terminal and a conductive support seat. Along the direction from left to right, the metal conductive shell is formed by an insertion part, a plastic limiting part and a conductive shell body being connected in sequence. The insertion part is composed of a plurality of insertion columns in a rectangular array, which are directly extended to the left by the left side wall of the plastic limiting part. The wiring terminal is passed through and fixed in the insulating column, and is integrally placed in the insertion column. When the metal conductive seat is buckled relative to the insulating plastic body, the axial displacement movement of the insulating plastic body is limited by the plastic limiting part. The conductive support seat is built in and fixed in the cavity of the conductive shell body. The conductive support seat is always kept in a grounded state and is electrically conductive with the metal conductive shell at the same time.

This invention provides a high-efficiency heat dissipation power packaging structure with a pressure-resistant insulating film, belonging to the field of semiconductor technology. The high-efficiency heat dissipation power packaging structure with a pressure-resistant insulating film includes a thermally conductive carrier plate and a molding compound, with a chip disposed on the thermally conductive carrier plate. An insulating film formed by sputtering is disposed on the side of the thermally conductive carrier plate opposite to the chip, and the molding compound covers the periphery of the thermally conductive carrier plate. This structure can reduce the manufacturing difficulty of power components and improve the heat dissipation efficiency of power components by utilizing the sputtered insulating film; furthermore, the insulating film allows for a smaller and thinner overall packaging structure.