3results about How to "Shorten the conduction path" patented technology

The utility model discloses a notebook computer heat dissipation module and a notebook computer, and relates to the technical field of electronic products, and the notebook computer heat dissipation module comprises a fan shell, heat dissipation fins and a heat dissipation plate; the fan shell comprises a first shell body and a second shell body, and a containing cavity is defined by the first shell body and the second shell body. The heat dissipation fins are arranged on one side of the fan shell, and part of the heat dissipation fins are arranged in the containing cavity and connected with the first shell; partial structure of the heat dissipation pipe is arranged in the containing cavity and is attached to the heat dissipation fins and the second shell; according to the technical scheme provided by the utility model, the occupied space of the heat dissipation module of the notebook computer can be reduced.

The utility model discloses an intelligent watch and PCB mainboard thereof. The PCB mainboard comprises: a mainboard main body; a plurality of functional circuit areas arranged on the mainboard main body, electronic components and / or metal wiring being arranged in the functional circuit areas; a plurality of signal isolation areas arranged on the mainboard main body, a plurality of first through holes penetrating through the mainboard main body being arranged in the signal isolation areas; and the plurality of first through holes are arranged in sequence at the edges of the signal isolation areas, so as to reduce signal interference and loss between different functional circuit areas.

This invention provides a high-efficiency heat dissipation power packaging structure with a pressure-resistant insulating film, belonging to the field of semiconductor technology. The high-efficiency heat dissipation power packaging structure with a pressure-resistant insulating film includes a thermally conductive carrier plate and a molding compound, with a chip disposed on the thermally conductive carrier plate. An insulating film formed by sputtering is disposed on the side of the thermally conductive carrier plate opposite to the chip, and the molding compound covers the periphery of the thermally conductive carrier plate. This structure can reduce the manufacturing difficulty of power components and improve the heat dissipation efficiency of power components by utilizing the sputtered insulating film; furthermore, the insulating film allows for a smaller and thinner overall packaging structure.