22results about "Circuit optical details" patented technology

The present invention provides a wiring board, module, and image display device that suppress the generation of moiré patterns and flicker caused by reflected light. [Solution] The wiring board comprises a substrate and a mesh wiring layer 20, and has an electromagnetic wave transmission and reception function. The substrate is transparent. The mesh wiring layer is configured as an antenna and has wiring 21, 22. Two or more openings 23 are formed by being surrounded by the wiring, and the planar shape of the openings is a polygon with opposing sides parallel, and when the distance between sides extending in the first direction (Y direction) in each opening is d, and the average value of the distance between sides extending in the first direction in 100 consecutively adjacent openings or all openings is D, then 95% or more of the 100 openings or all openings are 0.70D ≤ d ≤ 0.98D Does it satisfy the following relationship? 1.02D ≤ d ≤ 1.30D This relationship is satisfied.

The present invention provides a light-transmitting conductive film suitable for reducing resistance and suppressing yellowing, a transparent conductive film equipped with the light-transmitting conductive film, and an article with the transparent conductive film. [Solution] The light-transmitting conductive film 20 contains an indium-containing conductive oxide and includes a first region 21 in at least a portion of its thickness that contains krypton in a content ratio of less than 0.1 atomic percent. The light-transmitting conductive film 20 also contains an indium-containing conductive oxide and includes a second region 22 in at least a portion of its thickness that does not contain krypton.

A transparent article has a transparent laminating film; and an electrically-conductive, metal-containing pattern disposed over a surface of the transparent laminating film (or transparent polymeric film). The electrically-conductive, metal-containing pattern has a metallic pattern comprising a first surface facing the transparent laminating film and an opposing second surface. Such articles can be prepared using steps A) and B'), in order: A) providing a metallic pattern on a surface of a first substrate; and B') transferring the metallic pattern to a surface of a second substrate (transparent laminating film), thereby providing an electrically-conductive metal-containing pattern on the surface of the second substrate, wherein the second substrate is a transparent laminating film. Catalytic inks can also be used to prepare the electrically-conductive, metal-containing pattern. Such articles can also be incorporated between two panes of rigid materials such as glass to form a composite article such as a windshield with an invisible antenna.

An eye-tracking system may include an optical assembly with integrated micro light emitting diodes. The optical assembly may include a substrate and a flexible printed circuit board assembly bonded to the substrate. Micro light emitting diodes may also be bonded to the substrate. A plurality of conductors may be laminated in the substrate. The conductors may electrically connect the micro light emitting diodes to the printed circuit board assembly. An optically clear adhesive layer may be adhered to the substrate. The optically clear adhesive layer may include an anti-reflective layer and an optical adhesive layer arranged in a stacked configuration.

Proposed is an epoxy flux film that is to be positioned between a semiconductor substrate and a device and is heated and pressed without addition of an additional flux. Thus, device-substrate soldering and sealing are simultaneously performed, and interference of light reflected from the solder can be reduced.

A method for manufacturing a semiconductor-based light detection and ranging (LIDAR) system for a vehicle, includes: coupling a first optical component with solder disposed on a first portion of the first optical component to a second optical component in a first alignment operation, where the solder disposed on the first portion of the first optical component is not in contact with the second optical component and coupling the first optical component to a third optical component with solder disposed on a first portion of the third optical component in a second alignment operation, where the solder disposed on the first portion of the third optical component is not in contact with a second portion of the first optical component. Heat is then applied to the solder disposed on the first portion of the first optical component and the solder disposed on the first portion of the third optical component.

Embodiments of this disclosure relate to polymer lenses for mechanical retention in photonic devices. A photonic device includes a PCB having an integrated circuit mounted thereon, the PCB having a cap mounted to the PCB and carrying a lens located on the integrated circuit. The cap is formed of: an outer wall mounted to the PCB, extending upward from the PCB and surrounding a portion of the integrated circuit; a first retaining structure extending inwardly from the outer wall and across the integrated circuit, the first retaining structure having an aperture defined therein; and a second retaining structure having an aperture defined therein, the second retaining structure being secured within the first retaining structure such that the aperture in the second retaining structure is axially aligned with the aperture in the first retaining structure. The lens is mechanically constrained within the cap between the first and second retaining structures.

An optical network interface card, adapted for use with at least an optical cable unit, includes a load board, a network chip disposed on the load board, at least an optical adapter installed on the load board for connection with the optical cable unit, a photonic integrated circuit disposed on the load board and electrically connected to the network chip, and an optical coupling assembly installed on the load board and connected between the optical adapter and the photonic integrated circuit.

A head-mounted device may be provided with displays. The displays and lenses through which images on the displays are viewed may be mounted in optical modules. Lens positioners may be used to move the optical modules toward and away from eye boxes to adjust eye relief distance. Control circuitry may gather sensor data such as motion sensor data from a motion sensor indicating whether the head-mounted device is in free fall and / or image sensor data from a front-facing camera indicating whether the head-mounted device is headed toward a collision with an external surface. The control circuitry may use the lens positioners to automatically increase the eye relief distance in response to sensor data if a collision is predicted. The lens positioners may include solenoids or other actuators. The positions of the lenses may be adjusted without necessarily adjusting a distance between the lens and the display.

A method for manufacturing a semiconductor-based light detection and ranging (LIDAR) system for a vehicle, includes: coupling a first optical component with solder disposed on a first portion of the first optical component to a second optical component in a first alignment operation, where the solder disposed on the first portion of the first optical component is not in contact with the second optical component and coupling the first optical component to a third optical component with solder disposed on a first portion of the third optical component in a second alignment operation, where the solder disposed on the first portion of the third optical component is not in contact with a second portion of the first optical component. Heat is then applied to the solder disposed on the first portion of the first optical component and the solder disposed on the first portion of the third optical component.

An omnidirectional light emitting device is provided. An example device includes a flexible substrate (102) having a substrate length, a first substrate surface (1022), and a second substrate surface (1024). The flexible substrate is configured to be flexibly wrenched about a longitudinal axis that is parallel to the substrate length. The example device further includes a plurality of LED packages (104) disposed on the first substrate surface (1022). Each LED package of the plurality of LED packages (104) is configured to emit light outward from the flexible substrate (102).

An article is provided to have a transparent substrate; and an electrically-conductive, metal-containing pattern disposed on a surface the transparent substrate. The electrically-conductive, metal-containing pattern has, in order outwardly from a surface of the transparent substrate: a first darkening agent; a metallic pattern; and a second darkening agent. The first darkening agent substantially conforms to a first surface of the metallic pattern, forming a first darkened surface on the metallic pattern. In addition, the second darkening agent is disposed over at least a portion of a second surface of the metallic pattern, forming a second darkened surface on the metallic pattern.

To provide a wiring board and a method for manufacturing the wiring board that suppresses the difficulty of current flow in a mesh wiring layer.SOLUTION: A wiring board (10) has a substrate (11) and a mesh wiring layer (20) that is disposed on the substrate (11) and includes a plurality of wires (21, 22). The substrate (11) has a transmittance of 85% or more for light rays of wavelengths from 400 nm to 700 nm. The wiring (21, 22) includes a surface roughness Ra, and the surface roughness Ra is equal to or less than 100 nm.SELECTED DRAWING: Figure 2

A transparent circuit board includes a conductive wiring, a transparent insulating layer, and a cover film stacked on the transparent insulating layer. The conductive wiring penetrates the transparent insulating layer along the stacking direction, and is at least partially embedded in the conductive wiring. A blackened layer is formed on a surface of the conductive wiring combined with the cover film, a carbon black layer is formed on a surface of the conductive wiring without the blackened layer, thereby improving a light transmittance of the transparent circuit board.

A potential-separating optical signal transmission device comprisesa printed circuit board-based transmitter device with a signal input, a transmission signal conditioning circuit and an optical signal transmitter,a printed circuit board-based receiver device with an optical signal receiver, a received signal processing circuit and a signal output,an optical transmission path between the signal transmitter and the signal receiver,a shield assembly for each transmitter and receiver device,an implementation of the shield assemblies by means of metallic layers in and / or on at least one printed circuit board, anda substantially rigid, transparent transfer rod as an optical transmission path,the ends of said transfer rod being arranged within the respective shield assembly of the transmitter and receiver device in front of the signal transmitter and signal receiver, respectively, andbeing mechanically held by the at least one printed circuit board.

A display device includes a display panel that includes a display area that displays an image, a non-display area disposed at an edge of the display area, and an antenna area that protrudes in a first direction from a part of the non-display area, and an antenna driving substrate electrically connected to an antenna array through an antenna pad disposed adjacent to an end of the antenna area. The antenna array is disposed at a boundary between the antenna area and a portion of the non-display area adjacent to the antenna area. The antenna array includes a plurality of antennas that generate polarized waves in a second direction perpendicular to the first direction and that are disposed at intervals along the second direction, and a shielding member disposed between adjacent antennas and connected to a ground line.

An optical package includes: a Printed Circuit Board (PCB) including a plurality of cut-out sections; a lens, including a first plurality of protrusions corresponding respectively to the plurality of cut-out sections, wherein the first plurality of protrusions includes three protrusions being guide posts, a first protrusion of the first plurality of protrusions is formed on a first side of the lens, and a second protrusion of the first plurality of protrusions is formed on a second side of the lens opposite to the first side, and when the lens is placed under the PCB, the first plurality of protrusions will pass through the cut-out sections; and a sensor for attaching on to the lens and the PCB.

A thermal solution using a heat exchanger mounted inside an outdoor telecom unit. More specifically, a hardened optical platform includes a base chassis and a lid configured to seal an interior of the base chassis, wherein each of the base chassis and the lid include a plurality of fins. The hardened optical platform also including a vapor chamber in the interior including a heat exchanger. The heat exchanger including a second plurality of fins that are intertwined with a third plurality of fins on the base chassis in the interior.

The invention relates to an electro-optical structure comprising at least one optical component (54, 56) and a plurality of electrical components (44, 46, 48, 50) which are arranged on a common printed circuit board (10, 26, 50). The printed circuit board comprises a plate-shaped base body (12, 28) consisting of molybdenum or an Invar material.

The electrical element-mounting substrate includes a first substrate including a ceramic as a first base member, and a second substrate including an organic resin as a second base member. The first substrate has a first surface and a second surface opposite to the first surface. The first surface includes a first mounting region where an electrical element is mounted and an installation portion where a lens holder or a window material is installed. The installation portion is located around the first mounting region in a plan view. The second substrate is located on the second surface of the first substrate.