423results about "Circuit optical details" patented technology

Integrated circuit packages having electrical and optical connectivity and methods of making the same are disclosed herein. According to one embodiment, an integrated circuit package includes a glass substrate, an optical channel, and redistribution layers. The integrated circuit package further includes an integrated circuit chip positioned on the glass substrate and in optical communication with the optical channel and in electrical continuity with the redistribution layers.

An apparatus includes: at least one of a circuit board or a substrate; and a first structure attached to the at least one of a circuit board or a substrate. The first structure is configured to enable an optical module with connector to be removably coupled to the first structure, and the optical module with connector is configured to enable an optical fiber connector to be removably coupled to the optical module with connector. For example, the circuit board or the substrate includes first electrical contacts, the first structure includes walls that define a first opening, the walls also define one or more retaining mechanisms such that when the optical module with connector is inserted into the first opening, the one or more retaining mechanisms on the walls of the first structure engage one or more latch mechanisms on the optical module with connector to secure the optical module with connector to the first structure, and second electrical contacts on the optical module with connector are electrically coupled to the first electrical contacts on the circuit board or the substrate.

A driving mechanism is provided, including a fixed part, a movable part for holding an optical element, a driving assembly, a circuit board, and conductive element. The driving assembly is used for driving the movable part to move relative to the fixed part. The circuit board is disposed on the fixed part, having a conductive portion exposed to an outer surface of the circuit board. The conductive element forms a longitudinal end portion not parallel to the outer surface of the circuit board, wherein the conductive element is electrically connected to the driving assembly and the conductive portion of the circuit board.

A photosensitive assembly includes a circuit board and a photosensitive chip, as well as a molded base. The molded base is integrally formed on the circuit board and the photosensitive chip, and forms a light window for providing a light path for the photosensitive chip. For a portion of the molded base corresponding to a first end side of the molded base adjacent to a flexible region, a distance between outer and inner edges thereof is a; for a portion of the molded base corresponding to an opposite second end side of the molded base away from the flexible region, a distance between outer and inner edges thereof is c, wherein 0.2 mm≤a≤1 mm, and 0.2 mm≤c≤1.5a. The dimensions a and c enable a corresponding forming groove in a molding process to be filled with molding material.

The present invention discloses an optical joystick apparatus including a housing and a joystick. A PCB board is provided in the housing. A light-emitting element and a photosensitive element are provided on the PCB board. The joystick is rotatably connected to the housing. A lower part of the joystick extends into the housing and is provided with a light-shielding portion. The light-emitting element and the photosensitive element are arranged on two sides of the light-shielding portion, respectively.

A wiring board (10) includes a substrate (11) and a mesh wiring layer (20) disposed on the substrate (11) and including a plurality of wiring lines (21, 22). The substrate (11) has a transmittance of 85% or more for light with a wavelength of 380 nm or more and 750 nm or less. Each of the wiring lines (21, 22) includes a metal layer (27) and a blackened layer (28) disposed on the metal layer (27). The blackened layer (28) has a thickness (T2) of 5 nm or more and 100 nm or less.

The invention relates to a method (100) for optically contacting a printed circuit board (200), comprising: providing (110) a printed circuit board (200) with at least one first optically conductive printed circuit board layer (210; 210') for conducting optical signals and at least one first opening, wherein the first opening extends through the printed circuit board (200) to at least the first printed circuit board layer (210; 210'); providing (120) a connecting piece (300) for conducting the optical signals with a first section and a second section, wherein the first section is configured for optically contacting the first printed circuit board layer (210; 210') and the second section is configured for optically contacting a unit (200') for communicating the optical signals; inserting (130) the first section into the first opening such that the first section is connected to the first printed circuit board layer (210;210') is optically contacted and the second section extends away from the circuit board (200).

A printed circuit board (PCB) assembly may include a PCB comprising a base layer, an electrical layout layer, and a dielectric located between the base layer and the electrical layout layer. The electrical layout layer may include a plurality of electrical pads and a plurality of electrical traces. The PCB assembly may include an emitter assembly comprising a plurality of emitters configured to emit light. The plurality of emitters may be mounted to the PCB and electrically connected to the electrical pads via respective wind bonds. The PCB assembly may include drive circuitry configured to control power delivered to the plurality of emitters. The drive circuitry may be mounted to the PCB and electrically connected to the electrical pads via respective solder connections. The PCB assembly may include communication circuitry configured to cause the drive circuitry to control the emitters in response to messages received via wireless signals.

The embodiment of the invention provides a display module, a preparation method of the display module and a display device, and relates to the technical field of display. The display module comprises a display substrate and a back film, the display substrate comprises a display area, a bending area and a binding area, the bending area and the binding area are located on one side of the display area, the bending area is located between the display area and the binding area, the bending area is bent to enable the binding area to be located on the backlight side of the display substrate, and the binding area comprises a first binding pin and a second binding pin; the first binding pin is located on the backlight side of the display substrate; the back film is arranged on the backlight side of the display substrate; the surface of the side, away from the display substrate, of the back film comprises a fingerprint module area and a fingerprint module binding area, and the fingerprint module binding area is arranged on the side, close to the binding area, of the fingerprint module area. The fingerprint module area is provided with a fingerprint identification module; the fingerprint module binding area is provided with a fingerprint pin, the fingerprint pin is electrically connected with the fingerprint identification module, and the fingerprint pin is in binding connection with the first binding pin. According to the embodiment of the invention, the integration of the display substrate and the fingerprint identification module is realized, the preparation process of the display module can be simplified, the production cost is reduced, and the preparation efficiency and yield of the display module are improved.

An optoelectronic device comprises a printed circuit board having at least a first printed circuit board section, a separate second printed circuit board section, and a flexible connecting section, wherein at least the first printed circuit board section is rigid. The second printed circuit board section is mechanically connected to the first printed circuit board section via the flexible connecting section, wherein respective contact elements of the first printed circuit board section and the second printed circuit board section are electrically connected via conductor tracks of the flexible connecting section. An optical component is arranged on the second printed circuit board section. For adjusting the position of the optical component, the optoelectronic device has a drive for the controlled movement of the second printed circuit board section relative to the first printed circuit board section, deforming the flexible connecting section.

An optical module includes a substrate, an optical element, and an optical coupling module. The substrate includes a glass cloth constituted of glass threads serving as weft and warp. An outer edge of the substrate has a rectangular shape defined by a pair of first side surfaces in a predetermined direction and a pair of second side surfaces in a direction orthogonal to the predetermined direction. The weft is inclined with respect to the first side surfaces and the second side surfaces. The warp is inclined with respect to the first side surfaces and the second side surfaces. A cavity is formed in the substrate. At least a part of the optical coupling module is accommodated in the cavity. A side surface of the cavity includes an inclined region inclined with respect to an extension direction of the weft and an extension direction of the warp.

Lighting module disclosed in an embodiment of the invention, a substrate; a plurality of light emitting devices disposed on the substrate; a first reflective layer disposed on the substrate; a resin layer disposed on the first reflective layer and the light emitting device; and a second reflective layer disposed on the resin layer, wherein the resin layer is a front side surface on which light generated from the plurality of light emitting devices is emitted, a rear side surface facing the front side surface, and first and second side surfaces connecting the front side surface and the rear side surface with each other. A distance between the first reflective layer and the second reflective layer is smaller than a distance between the front side surface and the rear side surface of the resin layer, and the front side surface of the resin layer has a plurality of convex portions convex toward the front side surface from the light emitting device and a plurality of concave portions recessed in a direction of the rear side surface.

An omnidirectional light emitting device is provided. An example device includes a flexible substrate having a substrate length, a first substrate surface, and a second substrate surface. The flexible substrate is configured to be flexibly wrenched about a longitudinal axis that is parallel to the substrate length. The example device further includes a plurality of LED packages disposed on the first substrate surface. Each LED package of the plurality of LED packages is configured to emit light outward from the flexible substrate.

Lighting module disclosed in an embodiment of the invention, a substrate; a plurality of light emitting devices disposed on the substrate; a first reflective layer disposed on the substrate; a resin layer disposed on the first reflective layer and the light emitting device; and a second reflective layer disposed on the resin layer, wherein the resin layer is a front side surface on which light generated from the plurality of light emitting devices is emitted, a rear side surface facing the front side surface, and first and second side surfaces connecting the front side surface and the rear side surface with each other. A distance between the first reflective layer and the second reflective layer is smaller than a distance between the front side surface and the rear side surface of the resin layer, and the front side surface of the resin layer has a plurality of convex portions convex toward the front side surface from the light emitting device and a plurality of concave portions recessed in a direction of the rear side surface.

A coated article includes: a substrate; a first dielectric layer over at least a portion of the substrate; a first metallic layer over at least a portion of the first dielectric layer; a first primer layer over at least a portion of the first metallic layer; and a second dielectric layer over at least a portion of the first primer layer; where the first primer layer is selected from the group consisting of zinc, aluminum-doped silver, aluminum zinc, vanadium zinc, tungsten tantalum, titanium niobium, zirconium niobium, tungsten niobium, aluminum niobium, aluminum titanium, tungsten titanium, tantalum titanium, zinc titanium, zinc tin, indium zinc, silver zinc, gallium zinc, indium tin, mixtures thereof, combinations thereof, and alloys thereof.

A method for producing a substrate for a plurality of electronic semiconductor chips is provided, comprising the following steps: - Providing a flexible carrier (1) onto which a polymer layer (3) is applied, - introducing cavities (4) into the polymer layer (3) so that a structured main surface (5) of the polymer layer (3) is created, - applying a seed layer (6) to the structured main surface (5) of the polymer layer (3), - depositing a metal layer (7) on the seed layer (6), - depositing a solder layer (9) on or over the metal layer (7), - partially removing the solder layer (9) and the metal layer (7) so that a flat surface (11) is formed on which areas (12) with the solder (13) of the solder layer (7) and / or with an intermetallic phase (14) of the solder (13) of the solder layer (9) are exposed. A further method for producing a substrate for a plurality of electronic semiconductor chips and substrates for a plurality of electronic semiconductor chips are provided.

An optoelectronic component (100) is specified, which comprises: - a covering material (30) which covers at least one component area (101) to be protected, - an optoelectronic structure (10) which is provided for emitting and / or receiving electromagnetic radiation and is at least partially covered or uncovered by the encapsulation material (30), and - a stop device (20) which limits the wrapping material (30) to the at least one component area (101) to be protected, wherein the stop device (20) is interrupted in some areas.

A blank package for mimicking an electronic component package comprises a body and a plurality of conductive pads. The body is formed from generally transparent electrically insulating material and has a top surface, a bottom surface, and a plurality of side surfaces. The bottom surface has a shape and dimensions that are similar to a bottom surface of the electronic component package. The conductive pads are formed from electrically conductive material and attached to the body, with each conductive pad corresponding to a successive one of the conductive pads of the electronic component package. Each conductive pad has features that are similar to features of the corresponding conductive pad of the electronic component package.

The present invention provides a wiring board, module, and image display device that suppress the generation of moiré patterns and flicker caused by reflected light. [Solution] The wiring board comprises a substrate and a mesh wiring layer 20, and has an electromagnetic wave transmission and reception function. The substrate is transparent. The mesh wiring layer is configured as an antenna and has wiring 21, 22. Two or more openings 23 are formed by being surrounded by the wiring, and the planar shape of the openings is a polygon with opposing sides parallel, and when the distance between sides extending in the first direction (Y direction) in each opening is d, and the average value of the distance between sides extending in the first direction in 100 consecutively adjacent openings or all openings is D, then 95% or more of the 100 openings or all openings are 0.70D ≤ d ≤ 0.98D Does it satisfy the following relationship? 1.02D ≤ d ≤ 1.30D This relationship is satisfied.

A device is provided that includes a printed circuit board and an integrated circuit that is installed on the printed circuit board. A plurality of optical transceiver modules are positioned on the printed circuit board around three or more sides of the integrated circuit. The plurality of optical transceiver modules are to be in operable communication with the integrated circuit. A faceplate is installed that has multiple face portions that expose receptacles for the plurality of optical transceiver modules around the integrated circuit.

Aspects of this disclosure configure a processor for detecting defects in the solder mask of a printed circuit board (PCB) using an optical waveguide. The processor directs an optical beam toward the input of one or more optical waveguides embedded in a protective coating layer of a PCB, the protective coating layer being adjacent to one or more conductive traces of the PCB. The processor measures a beam property of the optical beam emitted by the one or more optical waveguides. The processor detects a break in the optical beam emitted by the one or more optical waveguides based on this beam property.The processor detects a fault in the protective coating layer of the PCB based on detecting the interruption of the optical beam emitted by the one or more optical waveguides.

A molded electronic device (1) comprising: - a printed film (10), the printed film (10) comprising a film (12) and at least one printed layer (14, 16), the film (12) having an outer face (12a) and an inner face (12b), - an electronic element (2) electrically connected to the electrically conductive layer (16), - a support layer (32, 42) extending over the inner face (12b) and stiffening the printed film (10), and - an outer protective layer (22), the outer protective layer (22) is transparent, made of crosslinked polyurethane and has an appearance face (22a) and a contact face (22b), the appearance face (22) has a glossy appearance and the outer face (12b) of the film (12) has an arithmetic roughness greater than 200 nm. Figure for abstract: Figure 4

This wiring substrate comprises a substrate and a mesh wiring layer. The wiring substrate has an electromagnetic wave transmission / reception function. The substrate has transparency. The mesh wiring layer is configured as an antenna, and has wires. Two or more openings are formed by being surrounded by the wires. The planar shape of each of the openings is a polygon in which opposing sides are paralleled to each other. The distances between the sides extending in a first direction in the respective openings are each denoted as d. The average value of the distances between the sides extending in the first direction in 100 sequentially adjacent openings or all of the openings is denoted as D. In this case, at least 95% of openings, of the 100 openings or all of the openings, satisfy the relationship of 0.70D≤d≤0.98D or the relationship of 1.02D≤d≤1.30D.

A wiring board includes a layered structure and a waveguide. The layered structure include multiple insulating layers that are laminated. The waveguide is formed inside the layered structure. The waveguide includes a pair of conductive layers, and multiple conductive pillars. The pair of the conductive layers face each other in a lamination direction of the insulating layers. The multiple conductive pillars are arranged in two rows along a propagation direction of electromagnetic waves between the pair of the conductive layers, and connects the pair of the conductive layers. The respective conductive pillars include multiple connection pads and a via. The connection pads are laminated between the pair of the conductive layers. The via connects the connection pads of adjacent layers, and has a cross-section perpendicular to the lamination direction in a rectangular shape.

Damage to a joint part of a terminal of an electronic component mounted on a substrate is detected. The substrate includes a base material unit, a land, and a light detection unit. The land included in the substrate is arranged with a stress light emitting body configured to emit light in accordance with stress, includes a transparent member, and is joined with a terminal of an element arranged in the base material unit included in the substrate. The light detection unit included in the substrate is arranged between the base material unit and the land included in the substrate, and detects light from the stress light emitting body.

To provide a manufacturing method of a wiring board capable of forming a wiring to which a metal particle is sintered at a low temperature, and provide a manufacturing method of a light-emitting device.SOLUTION: A manufacturing method of a wiring board contains steps of: preparing a base material 10 in which a hole part where one part of a first surface 10A and a second surface 10B of the base material 10 is exposed is formed in a resist part 30; filling a paste member 40 containing a metal particle into the hole part of the resist part 30; and sintering the past member 40 at a temperature of 150°C or more and lower than a melting point of the metal particle. In the step of preparing the base material 10, the hole part is formed so that a width LM2 of an inner bottom surface of the hole part becomes larger than a width LM1 of an opening, and the metal particle is a copper particle with a predetermined particle diameter. The paste member 40 is heated to a predetermined temperature in a vacuum or a nitrogen atmosphere under a predetermined pressure in the sintering of the paste member 40. By sintering the metal particles, a wiring is formed to as to be a shape along the inner bottom surface and an inner side surface of the hole part, and the wiring is electrically connected.SELECTED DRAWING: Figure 2C

The present invention provides a light-transmitting conductive film suitable for reducing resistance and suppressing yellowing, a transparent conductive film equipped with the light-transmitting conductive film, and an article with the transparent conductive film. [Solution] The light-transmitting conductive film 20 contains an indium-containing conductive oxide and includes a first region 21 in at least a portion of its thickness that contains krypton in a content ratio of less than 0.1 atomic percent. The light-transmitting conductive film 20 also contains an indium-containing conductive oxide and includes a second region 22 in at least a portion of its thickness that does not contain krypton.

Lighting system with an optic (8) comprising at least one light guide (22) for at least one light source (6), comprising a mounting frame (10) for the optic (8) by means of which the optic (8) is attached to a circuit board (4) comprising the at least one light source (6), and comprising a spacer (15) for positioning the optic (8) which is arranged between the mounting frame (10) and the circuit board (4), wherein the spacer (15) for receiving the at least one light guide (22) has at least one continuous bearing opening (58), wherein at least one guide recess (94; 106) is provided at the edge of the at least one bearing opening (58) and at least one support surface (96) is provided at the edge on which the light guide (22) inserted into the bearing opening (58) can be supported, characterized in that on which at least one light guide (22) has a surface (80) pointing towards the spacer (15) on which the light guide (22) can be supported on the spacer (15), which at least one guide notch (94; 106) or at least part of the guide notches (94; 106) are triangular in shape, and which at least one guide recess (94; 106) or the respective guide recess (94; 106) points with its corner area away from the respective bearing opening (58) and opens / open into the respective bearing opening (58) on one side.

An integrated optically functional multilayer structure (100, 200, 300, 400, 500, 600, 700, 800, 900, 1100, 1300, 1400, 1500) suitable for large area dynamic illumination, comprising a flexible, optionally 3D-formable and thermoplastic, substrate film (102, 102a) arranged with a circuit design (106) comprising at least a number of electrical conductors preferably additively printed on the substrate film; and a plurality of top-emitting (104a), bottom- installed light sources (104) provided upon a first side of the substrate film to internally illuminate (104a) at least portion of the structure for external perception via associated outcoupling areas (112, 112a, 112b, 112c), wherein for each light source of the plurality of light sources there is, optionally at least partially shared, optically transmissive plastic layer (108), optionally of thermoplastic material, provided upon the first side of the substrate film, said plastic layer at least laterally surrounding or neighboring, optionally also at least partially covering, the light source, the substrate film optionally comprising material or material layer same as that of the plastic layer or at least having a similar or lower refractive index therewith; and reflector design comprising at least one material layer (110), provided at least upon (110b; 110c) the light source and configured to reflect, optionally dominantly specularly, the light emitted by the light source and incident upon the reflective layer towards the plastic layer. Related method of manufacture is presented.