311results about "Circuit optical details" patented technology

A driving mechanism is provided, including a fixed part, a movable part for holding an optical element, a driving assembly, a circuit board, and conductive element. The driving assembly is used for driving the movable part to move relative to the fixed part. The circuit board is disposed on the fixed part, having a conductive portion exposed to an outer surface of the circuit board. The conductive element forms a longitudinal end portion not parallel to the outer surface of the circuit board, wherein the conductive element is electrically connected to the driving assembly and the conductive portion of the circuit board.

A photosensitive assembly includes a circuit board and a photosensitive chip, as well as a molded base. The molded base is integrally formed on the circuit board and the photosensitive chip, and forms a light window for providing a light path for the photosensitive chip. For a portion of the molded base corresponding to a first end side of the molded base adjacent to a flexible region, a distance between outer and inner edges thereof is a; for a portion of the molded base corresponding to an opposite second end side of the molded base away from the flexible region, a distance between outer and inner edges thereof is c, wherein 0.2 mm≤a≤1 mm, and 0.2 mm≤c≤1.5a. The dimensions a and c enable a corresponding forming groove in a molding process to be filled with molding material.

A wiring board (10) includes a substrate (11) and a mesh wiring layer (20) disposed on the substrate (11) and including a plurality of wiring lines (21, 22). The substrate (11) has a transmittance of 85% or more for light with a wavelength of 380 nm or more and 750 nm or less. Each of the wiring lines (21, 22) includes a metal layer (27) and a blackened layer (28) disposed on the metal layer (27). The blackened layer (28) has a thickness (T2) of 5 nm or more and 100 nm or less.

A printed circuit board (PCB) assembly may include a PCB comprising a base layer, an electrical layout layer, and a dielectric located between the base layer and the electrical layout layer. The electrical layout layer may include a plurality of electrical pads and a plurality of electrical traces. The PCB assembly may include an emitter assembly comprising a plurality of emitters configured to emit light. The plurality of emitters may be mounted to the PCB and electrically connected to the electrical pads via respective wind bonds. The PCB assembly may include drive circuitry configured to control power delivered to the plurality of emitters. The drive circuitry may be mounted to the PCB and electrically connected to the electrical pads via respective solder connections. The PCB assembly may include communication circuitry configured to cause the drive circuitry to control the emitters in response to messages received via wireless signals.

An optoelectronic device comprises a printed circuit board having at least a first printed circuit board section, a separate second printed circuit board section, and a flexible connecting section, wherein at least the first printed circuit board section is rigid. The second printed circuit board section is mechanically connected to the first printed circuit board section via the flexible connecting section, wherein respective contact elements of the first printed circuit board section and the second printed circuit board section are electrically connected via conductor tracks of the flexible connecting section. An optical component is arranged on the second printed circuit board section. For adjusting the position of the optical component, the optoelectronic device has a drive for the controlled movement of the second printed circuit board section relative to the first printed circuit board section, deforming the flexible connecting section.

Lighting module disclosed in an embodiment of the invention, a substrate; a plurality of light emitting devices disposed on the substrate; a first reflective layer disposed on the substrate; a resin layer disposed on the first reflective layer and the light emitting device; and a second reflective layer disposed on the resin layer, wherein the resin layer is a front side surface on which light generated from the plurality of light emitting devices is emitted, a rear side surface facing the front side surface, and first and second side surfaces connecting the front side surface and the rear side surface with each other. A distance between the first reflective layer and the second reflective layer is smaller than a distance between the front side surface and the rear side surface of the resin layer, and the front side surface of the resin layer has a plurality of convex portions convex toward the front side surface from the light emitting device and a plurality of concave portions recessed in a direction of the rear side surface.

A method for producing a substrate for a plurality of electronic semiconductor chips is provided, comprising the following steps: - Providing a flexible carrier (1) onto which a polymer layer (3) is applied, - introducing cavities (4) into the polymer layer (3) so that a structured main surface (5) of the polymer layer (3) is created, - applying a seed layer (6) to the structured main surface (5) of the polymer layer (3), - depositing a metal layer (7) on the seed layer (6), - depositing a solder layer (9) on or over the metal layer (7), - partially removing the solder layer (9) and the metal layer (7) so that a flat surface (11) is formed on which areas (12) with the solder (13) of the solder layer (7) and / or with an intermetallic phase (14) of the solder (13) of the solder layer (9) are exposed. A further method for producing a substrate for a plurality of electronic semiconductor chips and substrates for a plurality of electronic semiconductor chips are provided.

An optoelectronic component (100) is specified, which comprises: - a covering material (30) which covers at least one component area (101) to be protected, - an optoelectronic structure (10) which is provided for emitting and / or receiving electromagnetic radiation and is at least partially covered or uncovered by the encapsulation material (30), and - a stop device (20) which limits the wrapping material (30) to the at least one component area (101) to be protected, wherein the stop device (20) is interrupted in some areas.

The present invention provides a wiring board, module, and image display device that suppress the generation of moiré patterns and flicker caused by reflected light. [Solution] The wiring board comprises a substrate and a mesh wiring layer 20, and has an electromagnetic wave transmission and reception function. The substrate is transparent. The mesh wiring layer is configured as an antenna and has wiring 21, 22. Two or more openings 23 are formed by being surrounded by the wiring, and the planar shape of the openings is a polygon with opposing sides parallel, and when the distance between sides extending in the first direction (Y direction) in each opening is d, and the average value of the distance between sides extending in the first direction in 100 consecutively adjacent openings or all openings is D, then 95% or more of the 100 openings or all openings are 0.70D ≤ d ≤ 0.98D Does it satisfy the following relationship? 1.02D ≤ d ≤ 1.30D This relationship is satisfied.

Aspects of this disclosure configure a processor for detecting defects in the solder mask of a printed circuit board (PCB) using an optical waveguide. The processor directs an optical beam toward the input of one or more optical waveguides embedded in a protective coating layer of a PCB, the protective coating layer being adjacent to one or more conductive traces of the PCB. The processor measures a beam property of the optical beam emitted by the one or more optical waveguides. The processor detects a break in the optical beam emitted by the one or more optical waveguides based on this beam property.The processor detects a fault in the protective coating layer of the PCB based on detecting the interruption of the optical beam emitted by the one or more optical waveguides.

This wiring substrate comprises a substrate and a mesh wiring layer. The wiring substrate has an electromagnetic wave transmission / reception function. The substrate has transparency. The mesh wiring layer is configured as an antenna, and has wires. Two or more openings are formed by being surrounded by the wires. The planar shape of each of the openings is a polygon in which opposing sides are paralleled to each other. The distances between the sides extending in a first direction in the respective openings are each denoted as d. The average value of the distances between the sides extending in the first direction in 100 sequentially adjacent openings or all of the openings is denoted as D. In this case, at least 95% of openings, of the 100 openings or all of the openings, satisfy the relationship of 0.70D≤d≤0.98D or the relationship of 1.02D≤d≤1.30D.

Damage to a joint part of a terminal of an electronic component mounted on a substrate is detected. The substrate includes a base material unit, a land, and a light detection unit. The land included in the substrate is arranged with a stress light emitting body configured to emit light in accordance with stress, includes a transparent member, and is joined with a terminal of an element arranged in the base material unit included in the substrate. The light detection unit included in the substrate is arranged between the base material unit and the land included in the substrate, and detects light from the stress light emitting body.

To provide a manufacturing method of a wiring board capable of forming a wiring to which a metal particle is sintered at a low temperature, and provide a manufacturing method of a light-emitting device.SOLUTION: A manufacturing method of a wiring board contains steps of: preparing a base material 10 in which a hole part where one part of a first surface 10A and a second surface 10B of the base material 10 is exposed is formed in a resist part 30; filling a paste member 40 containing a metal particle into the hole part of the resist part 30; and sintering the past member 40 at a temperature of 150°C or more and lower than a melting point of the metal particle. In the step of preparing the base material 10, the hole part is formed so that a width LM2 of an inner bottom surface of the hole part becomes larger than a width LM1 of an opening, and the metal particle is a copper particle with a predetermined particle diameter. The paste member 40 is heated to a predetermined temperature in a vacuum or a nitrogen atmosphere under a predetermined pressure in the sintering of the paste member 40. By sintering the metal particles, a wiring is formed to as to be a shape along the inner bottom surface and an inner side surface of the hole part, and the wiring is electrically connected.SELECTED DRAWING: Figure 2C

The present invention provides a light-transmitting conductive film suitable for reducing resistance and suppressing yellowing, a transparent conductive film equipped with the light-transmitting conductive film, and an article with the transparent conductive film. [Solution] The light-transmitting conductive film 20 contains an indium-containing conductive oxide and includes a first region 21 in at least a portion of its thickness that contains krypton in a content ratio of less than 0.1 atomic percent. The light-transmitting conductive film 20 also contains an indium-containing conductive oxide and includes a second region 22 in at least a portion of its thickness that does not contain krypton.

A wiring substrate includes an electrical wiring part including an insulating layer and a conductor layer and having an optical wiring region and a component region, and a support member formed on a surface of the electrical wiring part such that the support member is spanning across the optical wiring region and component region of the electrical wiring part. The component region of the electrical wiring part positions a component on the surface of the electrical wiring part, and the optical wiring region of the electrical wiring part positions an optical wiring part on the surface of the electrical wiring part.

An embodiment of the present disclosure relates to a thermoformed structural electronic module 1 with an integrated electronic device 10 and a method for making the same. The module can be made by a method including providing a thermoformed stack including a thermoplastic carrier substrate 3 and an electronic device 10 with wiring and a buffer layer therebetween, and thermoforming (103) the stack at a plasticizing condition of the carrier substrate 3 and the buffer layer 2, the thermomechanical buffer layer 2 comprising a thermoplastic composition having a storage modulus within the range of 0.005%-25%, preferably 0.01-10%, most preferably 0.02-2.5% of the storage modulus of the thermoplastic carrier substrate 3 during thermoforming.

Connection arrangement (205) for an integrated circuit (215), the connection arrangement (205) comprising the following elements: - a plurality of columnar electrical connection elements (220, 225) extending parallel to one another from a surface of the integrated circuit (215); - wherein a first connecting element (220) is solid; - and a second connecting element (225) has an axial recess (235); - wherein the recess (235) is filled with an optically conductive medium (240) to allow transmission of a light signal on a radially inner portion; - wherein an optically and electrically conductive material for transmitting a light signal and an electrical signal is attached to one end of the second connecting element (225).

The touch sensor module includes a touch sensor layer including a visual area, a bending area, and a pad area; a flexible circuit board electrically connected to the touch sensor layer on the pad area of the touch sensor layer; a support structure covering the touch sensor layer on the bending area; and an optical layer disposed on the visual area of the touch sensor layer. The optical layer partially covers the support structure on a portion of the bending area adjacent to the visual area.

A multi-layer assembly for an electronic device includes a substrate film configured to house an electronic device on at least a first side thereof, the film having a first side and a second side; an area light source on the first side of the substrate film and configured to emit light of a predetermined frequency or frequency band; a molded light guide layer disposed on the first side of the substrate film and at least partially embedding the light source, having an optically at least semi-transparent material configured to transmit light emitted by the embedded light source so that the transmitted light propagates within the light guide layer and is out-coupled therefrom via an outer surface thereof substantially opposite the embedded light source; and a mask layer disposed on the outer surface of the light guide layer, containing a substantially opaque material to block external viewing of at least some internal components of the multi-layer structure, wherein the mask layer defines a window for light emitted by the embedded light source and propagating within the plastic light guide layer to pass through the mask layer toward the environment. A method of manufacturing the multi-layer assembly is presented.

The lighting device disclosed in the embodiment includes a substrate, a light emitting device disposed on a lower surface of the substrate, a reflective layer disposed to face a light emitting surface of the light emitting device, a first resin layer disposed between the substrate and the reflective layer, and a light-transmission control layer disposed on an upper surface of the substrate, wherein the light-transmission control layer may include a liquid crystal layer including a cholesteric liquid crystal, and light emitted through the light emitting surface of the light emitting device may be reflected by the reflective layer and be provided to the light-transmission control layer through the substrate.

The present invention relates to a flexible LED strip (1) having: a flexible circuit board (2) extending longitudinally along a longitudinal extent (L), electrical conductor tracks (3) which are provided on the circuit board (2), components (4) at least having an LED chip (40), wherein the components (4) are fastened to the circuit board (2) and are each electrically connected to at least one of the conductor tracks (3), and terminal contact points (6) for the electrical connection of external terminal contacts (8) to the conductor tracks (3), wherein the terminal contact points (6) are each at least partially covered with solder (5) of a soldering paste that has been melted and hardened again, and electrically connected.

An organic insulator is produced by cured resin product containing a cyclic olefin copolymer as a main component and has a cumulative luminescence amount measured by chemiluminescence measurement method of 4×105 cpm or less. The glass transition temperature of the cured product is from 134° C. to 140° C. The cumulative luminescence amount is from 8.2.8×105 cpm to 3.2×105 cpm. A wiring board includes an insulation layer and an electrical conductor layer disposed on a surface of the insulation layer, and the insulation layer is the organic insulator described above.

A printed circuit board (PCB) having a lateral extent and comprising a side landing pad for direct bonding of an optoelectronic chip, whereby the side landing pad comprises at least two landing areas being differently oriented with regard to the lateral, thus enabling a bonding of the chip in at least two different lateral orientations relative to the printed circuit board, whereby the electrical connection lengths of the landing areas are equal, and an optoelectronic module based on such a printed circuit board and an according time of flight camera.

A direct type backlight device includes a lower chassis, a reflective sheet disposed on a bottom portion of the lower chassis, and a plurality of light emitting diode (LED) bars disposed on an upper surface of the reflective sheet. Each of the plurality of LED bars includes a bar-shaped printed circuit board disposed on the upper surface of the reflective sheet, a plurality of LEDs disposed on an upper surface of the printed circuit board, and a reflective member provided on the upper surface of the printed circuit board. A reflectance of the reflective member is at least 90% of a reflectance of the reflective sheet.

There is provided a head-mounted device (10), comprising: a head-mounted support structure (12); a lens support structure mounted in the head-mounted support structure; a lens (38) coupled to the lens support structure (30) and having an optical axis; a display (14) coupled to the lens support structure (30) and configured to provide an image viewable through the lens (38) from an eye box (36); and an actuator (28) configured to adjust an eye relief distance between the lens (38) and the eye box (36) based on sensor data.

A network switch includes a circuit board and a plurality of transmission ports. The circuit board is disposed in a chassis, and an opening of the chassis is corresponding to a first reference line. The plurality of transmission ports are disposed on an edge of the circuit board. The edge is corresponding to a second reference line, and the first reference line and the second reference line form an acute angle.