517results about "Circuit optical details" patented technology

An article is provided to have a transparent substrate; and an electrically-conductive, metal-containing pattern disposed on a surface the transparent substrate. The electrically-conductive, metal-containing pattern has, in order outwardly from a surface of the transparent substrate: a first darkening agent; a metallic pattern; and a second darkening agent. The first darkening agent substantially conforms to a first surface of the metallic pattern, forming a first darkened surface on the metallic pattern. In addition, the second darkening agent is disposed over at least a portion of a second surface of the metallic pattern, forming a second darkened surface on the metallic pattern.

An optical receiving module assembly is provided. The optical receiving module assembly includes an electric sub-assembly including a printed circuit board (PCB) including an opening portion and an electronic device mounted on the PCB and an optical receiving module including a first optical component mounted on the PCB and a second optical component mounted on the mount which includes a transparent material and is disposed in the opening portion, wherein the electronic device and the second optical component are electrically connected to each other by a mount electrode formed on a surface of the mount.

Integrated circuit packages having electrical and optical connectivity and methods of making the same are disclosed herein. According to one embodiment, an integrated circuit package includes a glass substrate, an optical channel, and redistribution layers. The integrated circuit package further includes an integrated circuit chip positioned on the glass substrate and in optical communication with the optical channel and in electrical continuity with the redistribution layers.

An apparatus includes: at least one of a circuit board or a substrate; and a first structure attached to the at least one of a circuit board or a substrate. The first structure is configured to enable an optical module with connector to be removably coupled to the first structure, and the optical module with connector is configured to enable an optical fiber connector to be removably coupled to the optical module with connector. For example, the circuit board or the substrate includes first electrical contacts, the first structure includes walls that define a first opening, the walls also define one or more retaining mechanisms such that when the optical module with connector is inserted into the first opening, the one or more retaining mechanisms on the walls of the first structure engage one or more latch mechanisms on the optical module with connector to secure the optical module with connector to the first structure, and second electrical contacts on the optical module with connector are electrically coupled to the first electrical contacts on the circuit board or the substrate.

A driving mechanism is provided, including a fixed part, a movable part for holding an optical element, a driving assembly, a circuit board, and conductive element. The driving assembly is used for driving the movable part to move relative to the fixed part. The circuit board is disposed on the fixed part, having a conductive portion exposed to an outer surface of the circuit board. The conductive element forms a longitudinal end portion not parallel to the outer surface of the circuit board, wherein the conductive element is electrically connected to the driving assembly and the conductive portion of the circuit board.

The present disclosure provides a wiring substrate and an electronic apparatus. The wiring substrate includes a substrate and a shielding signal line disposed on the substrate. The substrate includes a functional region; the functional region is provided with a plurality of pad groups; the plurality of pad groups are distributed in an array along a first direction and a second direction respectively, and the second direction intersects with the first direction. The shielding signal line includes a first portion surrounding all pad groups and second portions connected with the first portion, and the second portions are located between two adjacent pad groups along the second direction. The electronic apparatus includes the wiring substrate and an electronic element connected with the pad groups.

A photosensitive assembly includes a circuit board and a photosensitive chip, as well as a molded base. The molded base is integrally formed on the circuit board and the photosensitive chip, and forms a light window for providing a light path for the photosensitive chip. For a portion of the molded base corresponding to a first end side of the molded base adjacent to a flexible region, a distance between outer and inner edges thereof is a; for a portion of the molded base corresponding to an opposite second end side of the molded base away from the flexible region, a distance between outer and inner edges thereof is c, wherein 0.2 mm≤a≤1 mm, and 0.2 mm≤c≤1.5a. The dimensions a and c enable a corresponding forming groove in a molding process to be filled with molding material.

The present invention discloses an optical joystick apparatus including a housing and a joystick. A PCB board is provided in the housing. A light-emitting element and a photosensitive element are provided on the PCB board. The joystick is rotatably connected to the housing. A lower part of the joystick extends into the housing and is provided with a light-shielding portion. The light-emitting element and the photosensitive element are arranged on two sides of the light-shielding portion, respectively.

A wiring board (10) includes a substrate (11) and a mesh wiring layer (20) disposed on the substrate (11) and including a plurality of wiring lines (21, 22). The substrate (11) has a transmittance of 85% or more for light with a wavelength of 380 nm or more and 750 nm or less. Each of the wiring lines (21, 22) includes a metal layer (27) and a blackened layer (28) disposed on the metal layer (27). The blackened layer (28) has a thickness (T2) of 5 nm or more and 100 nm or less.

A lighting device has a light source assembly of semiconductor light sources arranged laterally next to one another and a reflector assembly of retroreflectors arranged laterally next to one another. The light source assembly and the reflector assembly form a common lighting region of the lighting device in which an emission of light by means of the light source assembly and a light reflection by means of the reflector assembly can be produced. The semiconductor light sources are not covered by the retroreflectors.

The invention relates to a method (100) for optically contacting a printed circuit board (200), comprising: providing (110) a printed circuit board (200) with at least one first optically conductive printed circuit board layer (210; 210') for conducting optical signals and at least one first opening, wherein the first opening extends through the printed circuit board (200) to at least the first printed circuit board layer (210; 210'); providing (120) a connecting piece (300) for conducting the optical signals with a first section and a second section, wherein the first section is configured for optically contacting the first printed circuit board layer (210; 210') and the second section is configured for optically contacting a unit (200') for communicating the optical signals; inserting (130) the first section into the first opening such that the first section is connected to the first printed circuit board layer (210;210') is optically contacted and the second section extends away from the circuit board (200).

A lighting device comprises a light source arrangement consisting of laterally adjacent semiconductor light sources and a reflector arrangement consisting of laterally adjacent retroreflectors. The light source arrangement and the reflector arrangement form a common illuminating area of ​​the lighting device, within which light emission can be generated by the light source arrangement and light reflection can be generated by the reflector arrangement. The semiconductor light sources are not covered by the retroreflectors.

A printed circuit board (PCB) assembly may include a PCB comprising a base layer, an electrical layout layer, and a dielectric located between the base layer and the electrical layout layer. The electrical layout layer may include a plurality of electrical pads and a plurality of electrical traces. The PCB assembly may include an emitter assembly comprising a plurality of emitters configured to emit light. The plurality of emitters may be mounted to the PCB and electrically connected to the electrical pads via respective wind bonds. The PCB assembly may include drive circuitry configured to control power delivered to the plurality of emitters. The drive circuitry may be mounted to the PCB and electrically connected to the electrical pads via respective solder connections. The PCB assembly may include communication circuitry configured to cause the drive circuitry to control the emitters in response to messages received via wireless signals.

The embodiment of the invention provides a display module, a preparation method of the display module and a display device, and relates to the technical field of display. The display module comprises a display substrate and a back film, the display substrate comprises a display area, a bending area and a binding area, the bending area and the binding area are located on one side of the display area, the bending area is located between the display area and the binding area, the bending area is bent to enable the binding area to be located on the backlight side of the display substrate, and the binding area comprises a first binding pin and a second binding pin; the first binding pin is located on the backlight side of the display substrate; the back film is arranged on the backlight side of the display substrate; the surface of the side, away from the display substrate, of the back film comprises a fingerprint module area and a fingerprint module binding area, and the fingerprint module binding area is arranged on the side, close to the binding area, of the fingerprint module area. The fingerprint module area is provided with a fingerprint identification module; the fingerprint module binding area is provided with a fingerprint pin, the fingerprint pin is electrically connected with the fingerprint identification module, and the fingerprint pin is in binding connection with the first binding pin. According to the embodiment of the invention, the integration of the display substrate and the fingerprint identification module is realized, the preparation process of the display module can be simplified, the production cost is reduced, and the preparation efficiency and yield of the display module are improved.

An optoelectronic device comprises a printed circuit board having at least a first printed circuit board section, a separate second printed circuit board section, and a flexible connecting section, wherein at least the first printed circuit board section is rigid. The second printed circuit board section is mechanically connected to the first printed circuit board section via the flexible connecting section, wherein respective contact elements of the first printed circuit board section and the second printed circuit board section are electrically connected via conductor tracks of the flexible connecting section. An optical component is arranged on the second printed circuit board section. For adjusting the position of the optical component, the optoelectronic device has a drive for the controlled movement of the second printed circuit board section relative to the first printed circuit board section, deforming the flexible connecting section.

An optical module includes a substrate, an optical element, and an optical coupling module. The substrate includes a glass cloth constituted of glass threads serving as weft and warp. An outer edge of the substrate has a rectangular shape defined by a pair of first side surfaces in a predetermined direction and a pair of second side surfaces in a direction orthogonal to the predetermined direction. The weft is inclined with respect to the first side surfaces and the second side surfaces. The warp is inclined with respect to the first side surfaces and the second side surfaces. A cavity is formed in the substrate. At least a part of the optical coupling module is accommodated in the cavity. A side surface of the cavity includes an inclined region inclined with respect to an extension direction of the weft and an extension direction of the warp.

Lighting module disclosed in an embodiment of the invention, a substrate; a plurality of light emitting devices disposed on the substrate; a first reflective layer disposed on the substrate; a resin layer disposed on the first reflective layer and the light emitting device; and a second reflective layer disposed on the resin layer, wherein the resin layer is a front side surface on which light generated from the plurality of light emitting devices is emitted, a rear side surface facing the front side surface, and first and second side surfaces connecting the front side surface and the rear side surface with each other. A distance between the first reflective layer and the second reflective layer is smaller than a distance between the front side surface and the rear side surface of the resin layer, and the front side surface of the resin layer has a plurality of convex portions convex toward the front side surface from the light emitting device and a plurality of concave portions recessed in a direction of the rear side surface.

An omnidirectional light emitting device is provided. An example device includes a flexible substrate having a substrate length, a first substrate surface, and a second substrate surface. The flexible substrate is configured to be flexibly wrenched about a longitudinal axis that is parallel to the substrate length. The example device further includes a plurality of LED packages disposed on the first substrate surface. Each LED package of the plurality of LED packages is configured to emit light outward from the flexible substrate.

Lighting module disclosed in an embodiment of the invention, a substrate; a plurality of light emitting devices disposed on the substrate; a first reflective layer disposed on the substrate; a resin layer disposed on the first reflective layer and the light emitting device; and a second reflective layer disposed on the resin layer, wherein the resin layer is a front side surface on which light generated from the plurality of light emitting devices is emitted, a rear side surface facing the front side surface, and first and second side surfaces connecting the front side surface and the rear side surface with each other. A distance between the first reflective layer and the second reflective layer is smaller than a distance between the front side surface and the rear side surface of the resin layer, and the front side surface of the resin layer has a plurality of convex portions convex toward the front side surface from the light emitting device and a plurality of concave portions recessed in a direction of the rear side surface.

A coated article includes: a substrate; a first dielectric layer over at least a portion of the substrate; a first metallic layer over at least a portion of the first dielectric layer; a first primer layer over at least a portion of the first metallic layer; and a second dielectric layer over at least a portion of the first primer layer; where the first primer layer is selected from the group consisting of zinc, aluminum-doped silver, aluminum zinc, vanadium zinc, tungsten tantalum, titanium niobium, zirconium niobium, tungsten niobium, aluminum niobium, aluminum titanium, tungsten titanium, tantalum titanium, zinc titanium, zinc tin, indium zinc, silver zinc, gallium zinc, indium tin, mixtures thereof, combinations thereof, and alloys thereof.

A method for producing a substrate for a plurality of electronic semiconductor chips is provided, comprising the following steps: - Providing a flexible carrier (1) onto which a polymer layer (3) is applied, - introducing cavities (4) into the polymer layer (3) so that a structured main surface (5) of the polymer layer (3) is created, - applying a seed layer (6) to the structured main surface (5) of the polymer layer (3), - depositing a metal layer (7) on the seed layer (6), - depositing a solder layer (9) on or over the metal layer (7), - partially removing the solder layer (9) and the metal layer (7) so that a flat surface (11) is formed on which areas (12) with the solder (13) of the solder layer (7) and / or with an intermetallic phase (14) of the solder (13) of the solder layer (9) are exposed. A further method for producing a substrate for a plurality of electronic semiconductor chips and substrates for a plurality of electronic semiconductor chips are provided.

Method and structure for shielding electromagnetic interference in photonic integrated circuits (PIC) disposed on electronic integrated circuits (EIC). The invention addresses the electromagnetic interference problem by employing vias through the PIC's bulk silicon substrate. The invention also uses a conductive layer covering the backside of the PIC bulk silicon substrate on which the metal heat spreader can be placed. Now, the vias can make electrical contact from the reference net formed for PIC's light transmission component on one or more metal layers of the PIC to the conductive layer on the backside of the PIC. Such an arrangement allows for robust electrical connection and allows the metal heat spreader to act as robust ground thus terminating the electromagnetic fields.

An optoelectronic component (100) is specified, which comprises: - a covering material (30) which covers at least one component area (101) to be protected, - an optoelectronic structure (10) which is provided for emitting and / or receiving electromagnetic radiation and is at least partially covered or uncovered by the encapsulation material (30), and - a stop device (20) which limits the wrapping material (30) to the at least one component area (101) to be protected, wherein the stop device (20) is interrupted in some areas.

A blank package for mimicking an electronic component package comprises a body and a plurality of conductive pads. The body is formed from generally transparent electrically insulating material and has a top surface, a bottom surface, and a plurality of side surfaces. The bottom surface has a shape and dimensions that are similar to a bottom surface of the electronic component package. The conductive pads are formed from electrically conductive material and attached to the body, with each conductive pad corresponding to a successive one of the conductive pads of the electronic component package. Each conductive pad has features that are similar to features of the corresponding conductive pad of the electronic component package.

The lighting device disclosed in the embodiment of the invention includes a substrate; a plurality of light emitting devices disposed on the substrate and emitting light in at least a first direction; a resin layer sealing the plurality of light emitting devices; and an optical member disposed on the resin layer, wherein the resin layer may include a first light blocking portion integrally formed with the resin layer and having a transmittance lower than that of the resin layer on an emission-side region of each of the plurality of light emitting devices.

The present invention provides a wiring board, module, and image display device that suppress the generation of moiré patterns and flicker caused by reflected light. [Solution] The wiring board comprises a substrate and a mesh wiring layer 20, and has an electromagnetic wave transmission and reception function. The substrate is transparent. The mesh wiring layer is configured as an antenna and has wiring 21, 22. Two or more openings 23 are formed by being surrounded by the wiring, and the planar shape of the openings is a polygon with opposing sides parallel, and when the distance between sides extending in the first direction (Y direction) in each opening is d, and the average value of the distance between sides extending in the first direction in 100 consecutively adjacent openings or all openings is D, then 95% or more of the 100 openings or all openings are 0.70D ≤ d ≤ 0.98D Does it satisfy the following relationship? 1.02D ≤ d ≤ 1.30D This relationship is satisfied.

A device is provided that includes a printed circuit board and an integrated circuit that is installed on the printed circuit board. A plurality of optical transceiver modules are positioned on the printed circuit board around three or more sides of the integrated circuit. The plurality of optical transceiver modules are to be in operable communication with the integrated circuit. A faceplate is installed that has multiple face portions that expose receptacles for the plurality of optical transceiver modules around the integrated circuit.

The present disclosure provides a wiring substrate, an array substrate and a light-emitting module, which belong to the field of display technology. The wiring substrate comprises a base substrate, a first metal wiring layer and an insulating material layer stacked in sequence, the first metal wiring layer is provided with a plurality of driving leads extending along a first direction, and the insulating material layer is provided with a plurality of vias exposing the driving leads. By adjusting the positions of the driving leads and the vias, the wiring substrate can be applied to different microchips, and can be used to prepare different array substrates.

Aspects of this disclosure configure a processor for detecting defects in the solder mask of a printed circuit board (PCB) using an optical waveguide. The processor directs an optical beam toward the input of one or more optical waveguides embedded in a protective coating layer of a PCB, the protective coating layer being adjacent to one or more conductive traces of the PCB. The processor measures a beam property of the optical beam emitted by the one or more optical waveguides. The processor detects a break in the optical beam emitted by the one or more optical waveguides based on this beam property.The processor detects a fault in the protective coating layer of the PCB based on detecting the interruption of the optical beam emitted by the one or more optical waveguides.