169results about "Circuit optical details" patented technology

The present invention provides a wiring board, module, and image display device that suppress the generation of moiré patterns and flicker caused by reflected light. [Solution] The wiring board comprises a substrate and a mesh wiring layer 20, and has an electromagnetic wave transmission and reception function. The substrate is transparent. The mesh wiring layer is configured as an antenna and has wiring 21, 22. Two or more openings 23 are formed by being surrounded by the wiring, and the planar shape of the openings is a polygon with opposing sides parallel, and when the distance between sides extending in the first direction (Y direction) in each opening is d, and the average value of the distance between sides extending in the first direction in 100 consecutively adjacent openings or all openings is D, then 95% or more of the 100 openings or all openings are 0.70D ≤ d ≤ 0.98D Does it satisfy the following relationship? 1.02D ≤ d ≤ 1.30D This relationship is satisfied.

Aspects of this disclosure configure a processor for detecting defects in the solder mask of a printed circuit board (PCB) using an optical waveguide. The processor directs an optical beam toward the input of one or more optical waveguides embedded in a protective coating layer of a PCB, the protective coating layer being adjacent to one or more conductive traces of the PCB. The processor measures a beam property of the optical beam emitted by the one or more optical waveguides. The processor detects a break in the optical beam emitted by the one or more optical waveguides based on this beam property.The processor detects a fault in the protective coating layer of the PCB based on detecting the interruption of the optical beam emitted by the one or more optical waveguides.

This wiring substrate comprises a substrate and a mesh wiring layer. The wiring substrate has an electromagnetic wave transmission / reception function. The substrate has transparency. The mesh wiring layer is configured as an antenna, and has wires. Two or more openings are formed by being surrounded by the wires. The planar shape of each of the openings is a polygon in which opposing sides are paralleled to each other. The distances between the sides extending in a first direction in the respective openings are each denoted as d. The average value of the distances between the sides extending in the first direction in 100 sequentially adjacent openings or all of the openings is denoted as D. In this case, at least 95% of openings, of the 100 openings or all of the openings, satisfy the relationship of 0.70D≤d≤0.98D or the relationship of 1.02D≤d≤1.30D.

Damage to a joint part of a terminal of an electronic component mounted on a substrate is detected. The substrate includes a base material unit, a land, and a light detection unit. The land included in the substrate is arranged with a stress light emitting body configured to emit light in accordance with stress, includes a transparent member, and is joined with a terminal of an element arranged in the base material unit included in the substrate. The light detection unit included in the substrate is arranged between the base material unit and the land included in the substrate, and detects light from the stress light emitting body.

To provide a manufacturing method of a wiring board capable of forming a wiring to which a metal particle is sintered at a low temperature, and provide a manufacturing method of a light-emitting device.SOLUTION: A manufacturing method of a wiring board contains steps of: preparing a base material 10 in which a hole part where one part of a first surface 10A and a second surface 10B of the base material 10 is exposed is formed in a resist part 30; filling a paste member 40 containing a metal particle into the hole part of the resist part 30; and sintering the past member 40 at a temperature of 150°C or more and lower than a melting point of the metal particle. In the step of preparing the base material 10, the hole part is formed so that a width LM2 of an inner bottom surface of the hole part becomes larger than a width LM1 of an opening, and the metal particle is a copper particle with a predetermined particle diameter. The paste member 40 is heated to a predetermined temperature in a vacuum or a nitrogen atmosphere under a predetermined pressure in the sintering of the paste member 40. By sintering the metal particles, a wiring is formed to as to be a shape along the inner bottom surface and an inner side surface of the hole part, and the wiring is electrically connected.SELECTED DRAWING: Figure 2C

The present invention provides a light-transmitting conductive film suitable for reducing resistance and suppressing yellowing, a transparent conductive film equipped with the light-transmitting conductive film, and an article with the transparent conductive film. [Solution] The light-transmitting conductive film 20 contains an indium-containing conductive oxide and includes a first region 21 in at least a portion of its thickness that contains krypton in a content ratio of less than 0.1 atomic percent. The light-transmitting conductive film 20 also contains an indium-containing conductive oxide and includes a second region 22 in at least a portion of its thickness that does not contain krypton.

A wiring substrate includes an electrical wiring part including an insulating layer and a conductor layer and having an optical wiring region and a component region, and a support member formed on a surface of the electrical wiring part such that the support member is spanning across the optical wiring region and component region of the electrical wiring part. The component region of the electrical wiring part positions a component on the surface of the electrical wiring part, and the optical wiring region of the electrical wiring part positions an optical wiring part on the surface of the electrical wiring part.

An embodiment of the present disclosure relates to a thermoformed structural electronic module 1 with an integrated electronic device 10 and a method for making the same. The module can be made by a method including providing a thermoformed stack including a thermoplastic carrier substrate 3 and an electronic device 10 with wiring and a buffer layer therebetween, and thermoforming (103) the stack at a plasticizing condition of the carrier substrate 3 and the buffer layer 2, the thermomechanical buffer layer 2 comprising a thermoplastic composition having a storage modulus within the range of 0.005%-25%, preferably 0.01-10%, most preferably 0.02-2.5% of the storage modulus of the thermoplastic carrier substrate 3 during thermoforming.

The touch sensor module includes a touch sensor layer including a visual area, a bending area, and a pad area; a flexible circuit board electrically connected to the touch sensor layer on the pad area of the touch sensor layer; a support structure covering the touch sensor layer on the bending area; and an optical layer disposed on the visual area of the touch sensor layer. The optical layer partially covers the support structure on a portion of the bending area adjacent to the visual area.

A multi-layer assembly for an electronic device includes a substrate film configured to house an electronic device on at least a first side thereof, the film having a first side and a second side; an area light source on the first side of the substrate film and configured to emit light of a predetermined frequency or frequency band; a molded light guide layer disposed on the first side of the substrate film and at least partially embedding the light source, having an optically at least semi-transparent material configured to transmit light emitted by the embedded light source so that the transmitted light propagates within the light guide layer and is out-coupled therefrom via an outer surface thereof substantially opposite the embedded light source; and a mask layer disposed on the outer surface of the light guide layer, containing a substantially opaque material to block external viewing of at least some internal components of the multi-layer structure, wherein the mask layer defines a window for light emitted by the embedded light source and propagating within the plastic light guide layer to pass through the mask layer toward the environment. A method of manufacturing the multi-layer assembly is presented.

The lighting device disclosed in the embodiment includes a substrate, a light emitting device disposed on a lower surface of the substrate, a reflective layer disposed to face a light emitting surface of the light emitting device, a first resin layer disposed between the substrate and the reflective layer, and a light-transmission control layer disposed on an upper surface of the substrate, wherein the light-transmission control layer may include a liquid crystal layer including a cholesteric liquid crystal, and light emitted through the light emitting surface of the light emitting device may be reflected by the reflective layer and be provided to the light-transmission control layer through the substrate.

The present invention relates to a flexible LED strip (1) having: a flexible circuit board (2) extending longitudinally along a longitudinal extent (L), electrical conductor tracks (3) which are provided on the circuit board (2), components (4) at least having an LED chip (40), wherein the components (4) are fastened to the circuit board (2) and are each electrically connected to at least one of the conductor tracks (3), and terminal contact points (6) for the electrical connection of external terminal contacts (8) to the conductor tracks (3), wherein the terminal contact points (6) are each at least partially covered with solder (5) of a soldering paste that has been melted and hardened again, and electrically connected.

There is provided a head-mounted device (10), comprising: a head-mounted support structure (12); a lens support structure mounted in the head-mounted support structure; a lens (38) coupled to the lens support structure (30) and having an optical axis; a display (14) coupled to the lens support structure (30) and configured to provide an image viewable through the lens (38) from an eye box (36); and an actuator (28) configured to adjust an eye relief distance between the lens (38) and the eye box (36) based on sensor data.

A network switch includes a circuit board and a plurality of transmission ports. The circuit board is disposed in a chassis, and an opening of the chassis is corresponding to a first reference line. The plurality of transmission ports are disposed on an edge of the circuit board. The edge is corresponding to a second reference line, and the first reference line and the second reference line form an acute angle.

The present invention includes a method of making a RF impedance matching device in a photo definable glass ceramic substrate. A ground plane may be used to adjacent to or below the RF Transmission Line in order to prevent parasitic electronic signals, RF signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.

A wiring substrate includes an electrical wiring part including an insulating layer and a conductor layer and having an optical wiring region and a component region, an optical wiring is formed on a surface of the electrical wiring part such that optical wiring is positioned in the optical wiring region of the electrical wiring part, and a support substrate formed on the optical wiring such that the support substrate is positioned in the optical wiring region of the electrical wiring part on the opposite side with respect to the electrical wiring part. The component region of the electrical wiring part positions a component on the surface of the electrical wiring part.

A transparent article has a transparent laminating film; and an electrically-conductive, metal-containing pattern disposed over a surface of the transparent laminating film (or transparent polymeric film). The electrically-conductive, metal-containing pattern has a metallic pattern comprising a first surface facing the transparent laminating film and an opposing second surface. Such articles can be prepared using steps A) and B'), in order: A) providing a metallic pattern on a surface of a first substrate; and B') transferring the metallic pattern to a surface of a second substrate (transparent laminating film), thereby providing an electrically-conductive metal-containing pattern on the surface of the second substrate, wherein the second substrate is a transparent laminating film. Catalytic inks can also be used to prepare the electrically-conductive, metal-containing pattern. Such articles can also be incorporated between two panes of rigid materials such as glass to form a composite article such as a windshield with an invisible antenna.

A printed circuit board laminated device includes a circuit board unit, a bracket unit, a cover plate unit and a coupled unit. The circuit board unit includes a first control circuit and a second control circuit disposed on a circuit board body. The bracket unit includes a hollow bracket body disposed on the circuit board unit along a laminating direction. The cover plate unit is disposed on the bracket unit along the laminating direction and opposite to the circuit board unit to cooperatively define a compartment. The coupled unit includes first and second coupled elements which are securely connected with the circuit board body and in the compartment and which are respectively and electrically connected with the first and second control circuits. The second coupled element responds to the first coupled element to generate a sensing signal.

The present disclosure relates to a printed circuit board including: a substrate having a first through-portion; a metal pattern disposed on at least one surface of the substrate and extending onto a wall surface of the first through-portion; a first optical member disposed in the first through-portion; a dielectric layer disposed on the substrate, filling the first through-portion and covering each of the metal pattern and the first optical member, an optical waveguide pattern embedded in the dielectric layer and disposed on the substrate; and a mirror embedded in the dielectric layer and disposed on the first through-portion.

A transparent conductive film (TCF) and methods for creating the TCF. The TCF includes a substrate having a surface, a metal mesh layer over at least a portion of the surface of the substrate, and a conductive layer over the metal mesh layer. The conductive layer includes carbon nanotubes and a binder.

Various embodiments of the teachings herein include an electronic subassembly. An example includes: an electronic component; a board; wherein the component and the board extend horizontally relative to each other in various layers within the subassembly; contacting means of the electronic component extending vertically in the subassembly; a glass sheet incorporated into the subassembly in a horizontal installation position; a horizontal opening in the glass sheet through which is routed at least part of the contacting means; an optical waveguide structured in the glass sheet; and two optical connection points for the waveguide by which polarized laser light can be coupled into and out of the waveguide. The glass sheet is arranged between a mounting plate and the component.

An integrated functional multi-layer structure (100, 300, 500, 600, 700, 800, 900, 1000, 1100, 1300, 1400, 1500) comprising a flexible, preferably 3D formable, thermoplastic substrate film (102), and a lighting module (110, 400) disposed on the substrate film (102) and preferably electrically connected to a circuit design thereon, said lighting module (110, 400) comprising: a circuit board (112) for receiving electronics; and a circuit (114) disposed on the circuit board, the circuit (114) including at least one light source, and optionally including at least one LED. and a thermoplastic layer (108) comprising: a thermoplastic layer (108) at least laterally surrounding, and optionally also at least partially covering, a lighting module (110, 400), wherein a circuit (114) on a circuit board (112) of the lighting module (110, 400) including at least one light source is configured to be electrically and thermally connected by means of at least one connecting material (116A, 116B) disposed at some points to the remaining structure at the side or below the circuit board, between them, preferably disposed at least around the periphery of the circuit board (112). Related manufacturing methods are presented.

An optical module includes a substrate, an optical element, and an optical coupling module. The substrate includes a glass cloth constituted of glass threads serving as weft and warp. An outer edge of the substrate has a rectangular shape defined by a pair of first side surfaces in a predetermined direction and a pair of second side surfaces in a direction orthogonal to the predetermined direction. The weft is inclined with respect to the first side surfaces and the second side surfaces. The warp is inclined with respect to the first side surfaces and the second side surfaces. A cavity is formed in the substrate. At least a part of the optical coupling module is accommodated in the cavity. A side surface of the cavity includes an inclined region inclined with respect to an extension direction of the weft and an extension direction of the warp.

A multilayer structure (200, 300, 400, 500) for an electronic device, comprising a flexible substrate film (202, 02) for accommodating electronics, a number of electronic components (308, 508) provided on a first surface area (401A, 501A) of the film, said film also comprising second surface area adjacent (401B, 501B) to the first surface area, and a number of conductive traces (412, 512) printed on the substrate film for electrically connecting electronic components together, wherein said number of electronic components and the related first surface area of the substrate accommodating the components have been overmolded with first thermoplastic material (306, 506), the adjacent second surface area and at least part (509) of the first area being overmolded with second thermoplastic material (310, 510) so that at least part of the electronic components and said first thermoplastic material thereon are substantially embedded between the substrate film and second thermoplastic material. A corresponding method of manufacture is presented.

The smart conduit plug (80, 180, 300, 400) includes a plug body (100, 302) having an externally threaded region (101, 330) and a diameter and thread pitch for engaging the conduit port (28). At least one electrical component (108, 208, 228, 308, 328) is attached to the plug body (100, 302) and configured to electrically couple to the field device (14) and provide an indication to the field device (14).

To provide an array speaker for distributing music evenly throughout a room.SOLUTION: The array speaker radially distributes multiple audio driver assemblies 202 within an array speaker housing so as to evenly distribute the output of speaker drivers throughout the room. To improve the distribution of music throughout the room, the acoustic output of the audio driver assemblies is configured to propagate along a support surface 216 on which the array speaker is placed. The array speaker also includes fasteners for a subwoofer, the fasteners comprising a plurality of elastomer grommets distributed within the housing of the array speaker. The elastomer grommets reduce the magnitude of forces generated by the subwoofer.SELECTED DRAWING: Figure 2A