The invention relates to the technical field of
silicon carbide substrates, and discloses a
processing device for controlling the
surface type of a large-size
silicon carbide substrate, which comprises a base, the surface of the base is sleeved with a shell, the surface of the shell is fixedly connected with a
glass window, the upper surface of the shell is fixedly connected with a top plate, and the surface of the top plate is provided with a size adjusting device. The size adjusting device comprises a clamping ring rotationally connected with the top plate, a gear ring is fixedly connected to the end, close to the clamping ring, of the top plate, a clamping sleeve is fixedly connected to the surface of the clamping ring, and a first motor is fixedly connected to the surface of the clamping sleeve. According to the device, automatic
adaptation of
silicon carbide substrates with different diameters can be achieved, an air cylinder drives a
grinding roller to be rapidly attached to the edges of the substrates, a first motor is matched to drive a clamping ring and the
grinding roller to rotate around the substrates, it is ensured that the
grinding track is attached to corners of different sizes, diversified grinding can be completed without manual adjustment, and the universality and
machining efficiency of the device are improved; and consistency and precision of
polishing of corners of substrates with different diameters are ensured.