2972results about How to "Improve thermal performance" patented technology

Embodiments of the invention are directed to semiconductor die packages. One embodiment of the invention is directed to a semiconductor die package including, (a) a semiconductor die including a first surface and a second surface, (b) a source lead structure including protruding region having a major surface, the source lead structure being coupled to the first surface, (c) a gate lead structure being coupled to the first surface, and (d) a molding material around the source lead structure and the semiconductor die, where the molding material exposes the second surface of the semiconductor die and the major surface of the source lead structure.

Structural cement panel for resisting transverse and shear loads equal to transverse and shear loads provided by plywood and oriented strain board, when fastened to framing for use in shear walls, flooring and roofing systems. The panels provide reduced thermal transmission compared to other structural cement panels. The panels employ one or more layers of a continuous phase resulting from curing an aqueous mixture of calcium sulfate alpha hemihydrate, hydraulic cement, coated expanded perlite particles filler, optional additional fillers, active pozzolan and lime. The coated perlite has a particle size of 1-500 microns, a median diameter of 20-150 microns, and an effective particle density (specific gravity) of less than 0.50 g/cc. The panels are reinforced with fibers, for example alkali-resistant glass fibers. The preferred panel contains no intentionally added entrained air. A method of improving fire resistance in a building is also disclosed.

Composites comprising organic aerogel matrix and inorganic aerogel fillers are described. The methods of manufacturing such composite aerogels are also described. Inorganic aerogels fillers are demonstrated to improve the thermal performance of organic aerogels. Composite aerogels with various organic aerogels and inorganic aerogel fillers are described.

Methods, apparatuses, and systems are disclosed for flexible thermal ground planes. A flexible thermal ground plane may include a support member. The flexible thermal ground plane may include an evaporator region or multiple evaporator regions configured to couple with the support member. The flexible thermal ground plane may include a condenser region or multiple condenser regions configured to couple with the support member. The evaporator and condenser region may include a microwicking structure. The evaporator and condenser region may include a nanowicking structure coupled with the micro-wicking structure, where the nanowicking structure includes nanorods. The evaporator and condenser region may include a nanomesh coupled with the nanorods and/or the microwicking structure. Some embodiments may include a micromesh coupled with the nanorods and/or the microwicking structure.

A structure and method of manufacture for an improved multi-chip semiconductor package that reduces package resistance to a negligible level, and offers superior thermal performance. Housing of multiple dies is facilitated by providing electrically isolated lead frames that are separated from a common base carrier by a non-conductive layer of laminating material. A silicon die is attached inside a cavity formed in each lead frame. Direct connection of the active surface of the silicon die to the printed circuit board is then made by an array of solder bumps that is distributed across the surface of each die as well as the edges of the lead frame adjacent to each die.

An apparatus having a three-dimensional integrated circuit structure is described herein. The apparatus include an interposer for carrying a plurality of high and low-power chips. The high-power chips are attached and connected to one side of the interposer, while the low-power chips are attached and connected to the other side of the interposer. In generally, the high-power chips produce more heat than does the low-power chip during their operations. The interposer further include through silicon vias and redistribution layers for connecting the chips on both surfaces. In addition, the interposer assembly is attached and connected to a substrate layer, which is in turn attached and connected to a printed circuit board. In order to provide improve thermal management, the interposer surface carrying the high-power chips are oriented away from the circuit board. A heat spreader is attached to the back sides of the high-power chips for dissipating the heat.

A drinking cup has sandwiched between an inner paper liner and an outer paper shell a ridge structure which has its ridges running peripherally, i.e. perpendicular to the axis, e.g. in the form of corrugations, a mesh or a cell network and can be partially filled with a phase-transition material to maintain a maximum temperature at the exterior of the shell for a given hot temperature of the liquid within the cup.

A compact mid-IR laser device utilizes an external cavity to tune the laser. The external cavity may employ a Littrow or Littman cavity arrangement. In the Littrow cavity arrangement, a filter, such as a grating, is rotated to provide wavelength gain medium selectivity. In the Littman cavity arrangement, a reflector is rotated to provide tuning. A quantum cascade laser gain medium provides mid-IR frequencies suitable for use in molecular detection by signature absorption spectra. The compact nature of the device is obtained owing to an efficient heat transfer structure, the use of a small diameter aspheric lens for both the output lens and the external cavity lens and a monolithic assembly structure to hold the optical elements in a fixed position relative to one another. The compact housing size may be approximately 20 cm×20 cm×20 cm or less. Efficient heat transfer is achieved using a thermoelectric cooler TEC combined with a high thermal conductivity heat spreader onto which the quantum cascade laser gain medium is thermally coupled. The heat spreader not only serves to dissipate heat and conduct same to the TEC, but also serves as an optical platform to secure the optical elements within the housing in a fixed relationship relative on one another. The small diameter aspheric output and external cavity lens each may have a diameter of 10 mm or less and each lens is positioned to provided a collimated beam output from the quantum cascade laser gain medium. The housing is hermetically sealed to provide a rugged, light weight portable MIR laser source.

A thermal dissipator disposable in a heat transfer relationship with a heat-generating source, such as an electronic component, which is mounted on a substrate, such as a printed circuit board. The dissipator includes a thermal dissipation member having a top and bottom surface, and a pressure sensitive adhesive layer disposed on the thermal dissipation member to cover at-least a portion of the bottom surface thereof. The dissipation member is formed of a thermally-conductive, electrically-nonconductive ceramic material. The pressure sensitive adhesive layer has an inner surface adhered to the bottom surface of the thermal dissipation member, and an outer surface bondable to a heat transfer surface of the source for attaching the dissipator to the source in a heat transfer relationship therewith.

The design of a compact, high-efficiency, high-flux capable compact-accelerator fusion neutron generator (FNG) is discussed. FNG's can be used in a variety of industrial analysis applications to replace the use of radioisotopes which pose higher risks to both the end user and national security. High efficiency, long lifetime, and high power-handling capability are achieved though innovative target materials and ion source technology. The device can be scaled up for neutron radiography applications, or down for borehole analysis or other compact applications. Advanced technologies such as custom neutron output energy spectrum, pulsing, and associated particle imaging can be incorporated.

The invention relates to a preparation method of a graphene oxide/waterborne polyurethane nanometer composite material. Especially, the preparation method comprises the following steps of: utilizing gamma-aminopropyl triethoxysilane (KH550) to carry out surface modification (functionalization of graphene oxide) onto graphene oxide; lowering hydrophily of a graphene oxide sheet layer; improving dispersion of the graphene oxide sheet layer in an organic solvent and compatibility of the graphene oxide and the polymer; and utilizing an in-situ polymerization method to prepare the graphene oxide/waterborne polyurethane nanometer composite material. The preparation method of the graphene oxide/waterborne polyurethane nanometer composite material belongs to the preparation field of composite materials.

A compact mid-IR laser device utilizes a quantum cascade laser to provide mid-IR frequencies suitable for use in molecular detection by signature absorption spectra. The compact nature of the device is obtained owing to an efficient heat transfer structure, the use of a small diameter aspheric lens and a monolithic assembly structure to hold the optical elements in a fixed position relative to one another. The compact housing size may be approximately 20 cm×20 cm×20 cm or less. Efficient heat transfer is achieved using a thermoelectric cooler TEC combined with a high thermal conductivity heat spreader onto which the quantum cascade laser is thermally coupled.

An x-ray source comprises a structured anode that has a thin top layer made of the desired target material and a thick bottom layer made of low atomic number and low density materials with good thermal properties. In one example, the anode comprises a layer of copper with an optimal thickness deposited on a layer of beryllium or diamond substrate. This structured target design allows for the use of efficient high energy electrons for generation of characteristic x-rays per unit energy deposited in the top layer and the use of the bottom layer as a thermal sink. This anode design can be applied to substantially increase the brightness of stationary, rotating anode or other electron bombardment-based sources where brightness is defined as number of x-rays per unit area and unit solid angle emitted by a source and is a key figure of merit parameter for a source.

A cooking appliance includes a base upon which a pot is supported, with a stirrer configured as a lid, for closing an open top of the pot. A tool coupled to a motorized drive of the stirrer extends downwardly into the pot. A heating element is coupled to the base and resiliently biased outwardly from the base to engage the base of the pot. A latch mechanism is provided for releasably connecting the pot to the base. The motorized drive includes a planetary gear set mounted coaxially with a pot axis, and a tool coupling is connected to a planet gear of the planetary gear set to drive the stirring tool in an orbital motion.

A light emitting device is provided having high luminous output while maintaining high wall plug efficiency, wherein the high thermal and electrical conductivity paths of the device are separated during the semiconductor wafer and die level manufacturing step. The device includes an electrical conducting mirror layer, which reflects at least 60% of generated light incident on it, and an isolation layer having electrical insulating properties and thermal conducting properties. A first electrode, which is not in contact with the main semiconductor layers of the device, is located on the mirror layer. A light emitting module, system and projection system incorporating the light emitting device are also described, as is a method of manufacture of the device.

A coated article is provided so as to include a coating (e.g., low-E coating, or the like) having at least one layer of or including niobium chromium (NbCr). The NbCr layer may be nitrided. The NbCr inclusive layer (e.g., NbCrN_x) may be provided as any suitable layer of the multi-layer coating, but in certain example instances may be used as a contact layer adjacent to an infrared (IR) reflecting layer. Coated articles herein may be used in the context of insulating glass (IG) window units, laminated windows, architectural or residential monolithic window units, vehicle window units, and/or the like.

The invention discloses a method for preparing diphenol type phosphor-containing high flameproofing benzene-oxaxine resin, which uses monoamine, phosphor-containing diphenol formaldehyde as raw reaction materials. A benzene-oxaxine midbody is introduced with a compound containing phosphor to synthesize a phosphor-containing flameproofing benzene-oxaxine midbody which is solidified and crosslinked to obtain thermalsetting phosphor-containing high flameproofing benzene-oxaxine resin. Other fire retardants are not required to be added into the flameproofing materials which adopt the phosphor-containing flameproofing benzene-oxaxine resin of the invention as the basic flameproofing material; the flameproofing material using the resin has excellent flameproofing capacity, the flameproofing level can reach V-0, the thermal capacity is rather good and the vitrification transforming temperature can reach 225 DEG C. The phosphor-containing flameproofing benzene-oxaxine midbody which is prepared by the method of the invention can be individually used or used by being mixed with other type benzene-oxaxine midbody or phenolic resin or epoxy resin; an obtained solidified product has higher thermal resistance, and the phosphor-containing flameproofing benzene-oxaxine midbody is applicable to the production of structural material, flameproofing material, electric insulation material, electronic encapsulation material, ablation resistance material or braking material with high capacities which are used at the temperature higher than 180 DEG C.