3367results about How to "Excellent dielectric properties" patented technology

Abstract of Disclosure Process for producing silicon oxide containing thin films on a growth substrate by the ALCVD method. In the process, a vaporisable silicon compound is bonded to the growth substrate, and the bonded silicon compound is converted to silicon dioxide. The invention comprises using a silicon compound which contains at least one organic ligand and the bonded silicon compound is converted to silicon dioxide by contacting it with a vaporised, reactive oxygen source, in particular with ozone. The present invention provides a controlled process for growing controlling thin films containing SiO2, with sufficiently short reaction times.

A thermosetting composition comprises a capped poly(arylene ether), an alkenyl aromatic monomer, and an alkoxylated acryloyl monomer. The composition provides good flow properties and fast curing rates. After curing, the composition exhibits good stiffness, toughness, and heat resistance.

A variety of techniques may be employed, separately or in combination, to improve the gap-filling performance of a dielectric material formed by chemical vapor deposition (CVD). In one approach, a first dielectric layer is deposited using sub-atmospheric chemical vapor deposition (SACVD), followed by a second dielectric layer deposited by high density plasma chemical vapor deposition (HDP-CVD) or plasma-enhanced chemical vapor deposition (PECVD). In another approach, a SACVD dielectric layer is deposited in the presence of reactive ionic species flowed from a remote plasma chamber into the processing chamber, which performs etching during the deposition process. In still another approach, high aspect trenches may be filled utilizing SACVD in combination with oxide layers deposited at high temperatures.

Process for producing silicon oxide containing thin films on a growth substrate by the ALCVD method. In the process, a vaporisable silicon compound is bonded to the growth substrate, and the bonded silicon compound is converted to silicon dioxide. The invention comprises using a silicon compound which contains at least one organic ligand and the bonded silicon compound is converted to silicon dioxide by contacting it with a vaporised, reactive oxygen source, in particular with ozone. The present invention provides a controlled process for growing controlling thin films containing SiO2, with sufficiently short reaction times.

To provide a grain oriented ceramic capable of exerting excellent piezoelectric properties, a production method thereof, and a piezoelectric material, a dielectric material, a thermoelectric conversion element and an ion conducting element each using the grain oriented ceramic, there is provided a grain oriented ceramic comprising, as the main phase, an isotropic perovskite-type compound which is represented by formula (1): {Lix(K1−yNay)1−x}(Nb1−z−wTazSbw)O3 in which x, y, z and w are in respective composition ranges of 0≦x≦0.2, 0≦y≦1, 0≦z≦0.4, 0≦w≦0.2 and x+z+w>0. The main phase comprises a polycrystalline body containing from 0.0001 to 0.15 mol of any one or more additional element selected from metal elements, semimetal elements, transition metal elements, noble metal elements and alkaline earth metal elements belonging to Groups 2 to 15 of the Periodic Table, per mol of the compound represented by formula (1). A specific crystal plane of each crystal grain constituting said polycrystalline body is oriented.

A method for enhancing the dielectric properties of an electrical cable segment having a central stranded conductor encased in a polymeric insulation jacket and an interstitial void volume in the region of the conductor, including filling the interstitial void volume with a dielectric property-enhancing fluid at a pressure below the elastic limit of the polymeric insulation jacket, and confining the fluid within the interstitial void volume at a residual pressure greater than about 50 psig, with the pressure being imposed along the entire length of the segment but below the elastic limit of the polymeric insulation jacket. Preferably, the residual pressure is sufficient to expand the interstitial void volume along the entire length of the cable segment by at least 5%.

In electronic devices, heat removal is an important consideration of any device designer. Thermally conductive, high-temperature polyimide composites are disclosed herein which are generally useful as a dielectric layer in an electronic device, or a precursor metal-laminate, where the dielectric is layered on one side (or on both sides) with a metal. The polyimide composites of the present invention contain dispersed therein thermally conductive filler particles at a weight percent between 40 and 85 % weight percent. These film composites have good dielectric strength, good thermal conductivity, and optionally good adhesivity.

The present invention discloses a thermosetting resin composition including: a bi-functional or multi-functional epoxy resin, a SMA uses as a curing agent, an allyl phenol such as diallyl bisphenol A used as a co-curing agent and a toughening agent a low-bromine or high-bromine BPA epoxy resin or tetrabromobispheno A (TBBPA or TBBA) uses as a flame retardant agent, and an appropriate solvent. After the resin composition of the invention is cured, the resin composition has lower dielectric property and better thermal reliability and tenacity. A copper clad laminate made of an enhanced material such as glass fiber has lower dielectric constant (Dk) and loss tangent (Df), high Tg, high thermal decomposition temperature (Td), better tenacity and PCB manufacturability, and thus very suitable to be used as a copper clad laminate and a prepreg for manufacturing PCBs or applied as a molding resin material for contraction, automobile and air navigation.

In accordance with the present invention, deposition of perovskite material, for example barium strontium titanite (BST) film, by a pulsed-dc physical vapor deposition process or by an RF sputtering process is presented. Such a deposition can provide a high deposition rate deposition of a layer of perovskite. Some embodiments of the deposition address the need for high rate deposition of perovskite films, which can be utilized as a dielectric layer in capacitors, other energy storing devices and micro-electronic applications. Embodiments of the process according to the present invention can eliminate the high temperature (>700° C.) anneal step that is conventionally needed to crystallize the BST layer.

The invention relates to an epoxy resin composition as well as a prepreg and a laminated board made of the same. The epoxy resin composition comprises the following components in parts by weight: 1-50 parts of modified polyphenylene oxide resin, 30-80 parts of epoxy resin, 20-60 parts of active ester curing agent, 0-50 parts of filler and 1-20 parts of assistant. The prepreg made of the epoxy resin composition comprises a base material and the epoxy resin composition which is attached to the base material through soaking and drying. The laminated board made of the epoxy resin composition comprises a plurality of laminated prepregs, wherein each prepreg comprises a base material and the epoxy resin composition which is attached to the base material through soaking and drying. The invention has the advantages of high heat resistance, high fire retardancy, low dielectric constant, low dielectric loss, excellent high-frequency dielectric properties and the like, and is suitable to be used as a high frequency circuit substrate material.

A method for preparing meta- PPTA paper includes forming a sizing material by adding 5-95 wt. % of meta- PPTA staple fiber into water and forming another sizing material by adding 5-95 wt. % of meta- PPTA precipitated fiber in water, mixing two said sizing materials, laying prepared sizing material on screen for forming, pressing and drying, pressing and polishing in high temperature for forming.

A method for enhancing the dielectric properties of an electrical cable segment having a central stranded conductor encased in a polymeric insulation jacket and an interstitial void volume in the region of the conductor, including filling the interstitial void volume with a dielectric property-enhancing fluid at a pressure below the elastic limit of the polymeric insulation jacket, and confining the fluid within the interstitial void volume at a residual pressure greater than about 50 psig, with the pressure being imposed along the entire length of the segment but below the elastic limit of the polymeric insulation jacket. Preferably, the residual pressure is sufficient to expand the interstitial void volume along the entire length of the cable segment by at least 5%.

The invention discloses a microwave dielectric ceramic and a preparation method thereof. The microwave dielectric ceramic is mainly composed of ZrO2, TiO2 and Nb2O5; the microwave dielectric property of the microwave dielectric ceramic can be improved by selectively adding MgO, CoO, ZnO, NiO and MnO2; the chemical constitution formula of the ceramic is xZrO3-YTiO2-zA(1+W) / 3Nb(2-w) / 2O3; in formula (I), A is one or more elements of Mg, Co, Zn, Ni and Mn; x, y and z are molar ratios, wherein x is between 0.2 and 0.7, y is between 0.2 and 0.6,, z is between 0.1 and 0.2, and, x plus y plus z is equal to 1; numerical range of w is l between 0 and 0.5. According to the microwave dielectric ceramic and the preparation method thereof, the ceramic has the characteristics that the dielectric constant is high, the loss is low, and the temperature coefficient is close to zero, and is liable to sinter; the preparation method has the characteristics that the price of raw materials is low, and a technology during production is simple.

The invention discloses a thermosetting resin composition for an integrated circuit. The thermosetting resin composition comprises (a) 10-60 parts of an allyl modified bismaleimide resin prepolymer, (b) 10-40 parts of an anhydride compound, (c) 10-50 parts of benzoxazine resin, (d) 5-50 parts of epoxy resin, (e) 5-50 parts of a fire retardant, (f) 0-5 parts of a curing accelerator and (g) 0-35 parts of inorganic stuffing, wherein the number-average molecular weight of the allyl modified bismaleimide resin prepolymer is 1500-8000 g / mol. The resin composition provided by the invention keeps high heat resistance and high Tg characteristic of the allyl modified bismaleimide resin prepolymer, and achieves UL94V-0 level in halogen-free flame retardant aspect on the basis of low phosphorus content, and simultaneously, has low dielectric constant of the anhydride; and therefore, the resin composition is capable of meeting the requirements of the production process of high-performance printed circuit boards such as a high-density interconnected integrated circuit package.

The invention discloses a low-dielectric constant glass fiber, which comprises the following parts: 50- 60% SiO2, 6.0-9.5% Al2O3, 30.5-35% B2O3, 0-1.5% Na2O, 0-1.5% K2O, 0-1.5% Li2O, 0-5% CaO, 0-5% MgO, 0.5-2.5% ZnO, 0.5-5% TiO2. When the frequency is 1MHz under indoor temperature, the dielectric constant is 3.9-4.4, which is fit for high-density wiring circuit board.

The invention discloses a modified hot setting resin and a preparation method thereof. In parts by weight, the modified hot setting resin is obtained by evenly mixing 100 parts of hot setting resin, 0-100 parts of curing agent, 0-1 part of curing catalyzer, and 1-100 parts of hyperbranched silicon resin containing active functional groups at the temperature of 30-200 DEG C. The modified hot setting resin has high storage stability, processability and reactiveness and sufficiently integrates the performance advantages of hyperbranched polymer and polysiloxane, and thereby the obtained modified hot setting resin has high tenacity, more prominent thermostability and excellent dielectrical property as well as damp heat resistance. The preparation method of the modified hot setting resin has wide applicability, simple operating process and easy molding.

The invention relates to a computed tomography (CT) scanning heterogeneous model testing system. The system comprises a CT scanning system, a displacement system, an overburden pressure system, a pressure measurement system, a heterogeneous multilayer core clamp holder and a metering system, wherein the heterogeneous multilayer core clamp holder consists of a shell, a rubber cylinder, a core left plug, a core right plug, a left fixing sleeve, a right fixing sleeve, a left fastening sleeve, a right fastening sleeve and a fixed bracket; the core right plug is provided with a plurality of liquid outlets; each liquid outlet is respectively aligned with one layer of core model; and a strip liquid outlet sealing gasket is formed on the core right plug, which correspond to a seam between two adjacent layers of core models, so that liquid flow passing through each layer of core model flows out from the corresponding liquid outlet of each layer of core model, and thus, intraformational heterogeneous water displacing oil layered measurement is realized. By the CT scanning system, the real-time on-line monitoring of the on-way distribution of saturation of fluid on each layer section in a heterosphere is realized so as to observe the interlayer communication phenomenon.

The invention relates to a thermosetting resin composition. The thermosetting resin composition comprises (A) polyphenylene ether resin; (B) epoxy resin; (C) a curing agent and (D) an initiating agent. The thermosetting resin composition can also comprise a compound which simultaneously contains an epoxy group and an olefinic bond type unsaturated group, the curing agent, a flame retardant, an accelerant and the like. The thermosetting resin composition has the characteristics of low dielectric constant and dielectric loss, high heat resistance, flame retardance and the like, and is suitable for laminated boards and the like for prepregs and printed circuits.

The invention relates to an epoxy resin composition as well as a prepreg and a copper-foil-clad laminated board prepared by using the same. The epoxy resin composition comprises the following essential components: (A) epoxy resin containing a naphthol structure, (B) an active ester serving as a curing agent, and (C) a curing accelerant. Because epoxy resin at least contains the naphthol structure in the molecular structure, the epoxy resin composition provided by the invention has higher functionality degree and high glass transition temperature; at the same time, the naphthol group structure is introduced to the molecular structure, thus the cured product has low water absorptivity and low expansion coefficient; due to the active ester serving as the curing agent, the advantages that the a polar group is not generated during the reaction between the active ester and epoxy, thus the dielectric properties are excellent and moisture and heat resistance are good are fully exerted; and in addition, because of the epoxy resin containing the special naphthol structure, the hydroscopicity of the resin cured product is further reduced and the dielectric loss value of the cured product is lowered. The prepreg and the copper-foil-clad laminated board provided by the invention have excellent dielectric properties, moisture and heat resistance and high glass transition temperature.

A sintering aid for a low-temperature cofired medium ceramic material is composed of, by weight, 31%-45% of silicon dioxide, 1%-10% of boron oxide, 5.1%-10% of zinc oxide, 18%-30% of aluminum oxide, 11%-24% of alkaline earth metallic oxide and 5%-15% of oxide with the general formula of R2O3, wherein R refers to at least one of lanthanum, cerium, praseodymium, neodymium, samarium, europium and dysprosium, and the alkaline earth metallic oxide refers to one of magnesium oxide, calcium oxide, barium oxide and strontium oxide. Adding the sintering aid into the low-temperature cofired medium ceramic material enables the prepared low-temperature cofired medium ceramic to have excellent thermal mechanical performance and dielectric performance. In addition, the invention provides the low-temperature cofired medium ceramic material and application thereof and a method for preparing the low-temperature cofired medium ceramic.

The invention discloses a high-flexible polymer matrix composite membrane with high energy density and a preparation method thereof. The composite membrane is composed of a polymer matrix and core-shell structured nano-fibre dispersed in the polymer matrix; the core layer of the core-shell structured nano-fibre is ceramic fibre; the shell layer is an organic matter coated layer, wherein the mass percentage of the polymer matrix is 50-95%; and the mass percentage of the core-shell structured nano-fibre is 5-50%. The polymer matrix and the core-shell structured nano-fibre are composited into the membrane by adopting a solution blending and tape casting method or a bidirectional membrane pulling method, so that a flexible polymer matrix composite material having the advantages of being good in dielectric property, high in breakdown field strength and high in energy density is obtained. The dielectric constant of the composite material can be modulated to 10-40 by adjusting the content of nano ceramic fibre; simultaneously, the dielectric loss Tan delta is kept to be less than 5%, the breakdown field strength is more than 210 kV / mm, and the energy density is 2-6 kJ / L; and the composite material is a material which can be used for capacitors and high power static energy storage.

The invention relates to a fluororesin mixture, a copper-clad plate prepared therefrom and a manufacturing method thereof. The fluororesin mixture contains the following two substances as necessary components in 100 parts by weight of an organic solid substance: 90-99 parts of polytetrafluoroethylene (PTFE) emulsions and 1-10 parts of polytetrafluoroethylene perfluoroalkyl vinyl ether (PFA) emulsions. The copper-clad plate prepared from the fluororesin mixture comprises a plurality of superimposed varnished cloths and copper foil coating one or two surfaces of the varnished cloths, and each varnished cloth comprises a glass fiber cloth and the fluororesin mixture attached to the dipped and dried glass fiber cloth. The fluororesin mixture is prepared by using the PTFE emulsions as main resins and can dip the glass fiber cloths many times under the condition that the PTFE sintering temperature is330 DEG C to prepare the vanished cloths, and the vanished cloths prepared from the fluororesin mixture has the advantages of good gum dipping quality, level surface, flexibility and easy operation; and besides, the copper-clad plate made from the fluororesin mixture has excellent dielectric performance which meets the dielectric performance requirement of the high-frequency communication field for a base plate material, and has simple making method and process and is beneficial to industrial continuous production.

The invention relates to an epoxy resin composition and a high-frequency circuit board manufactured thereby. The epoxy resin composition comprises the following solid components: (A) cyanate compound or prepolymer thereof, wherein the molecule of the cyanate compound contains at least two cyanato groups; (B) active ester; and (C) epoxy resin containing a naphthol structure; calculated in solid component in parts by weight, the total amount of the component (A), i.e. the cyanate compound containing at least two cyanato groups in the molecule thereof or the prepolymer thereof, and the component (B), i.e. active ester, is 10-70 parts by weight, and the amount of the component (C), i.e. epoxy resin containing naphthol structure, is 30-90 parts by weight, wherein the weight ratio of the component (A), i.e. the cyanate compound containing at least two cyanato groups in the molecule thereof or the prepolymer thereof, to the component (B), i.e. active ester, is (0.2-5):1. The high-frequency circuit board manufactured by using the epoxy resin composition of the invention comprises a plurality of layers of prepregs which are overlapped mutually, and copper foils which are compressed on the two sides respectively; and each of the plurality of layers of prepregs comprises a base material and the epoxy resin composition which is adhered to the base material through impregnation and drying.

An apparatus and method for the treatment of chronic wounds using electromagnetic energy. The apparatus includes a generator and at least one applicator. The generator can produce electromagnetic energy and the applicator can apply the electromagnetic energy produced by the generator. A detector is disposed on the applicator that can measure the field strength of the electromagnetic energy applied.

The invention discloses a thermoset resin composition, comprising the following ingredients of: bifunctional groups or polyfunctional group epoxy resin, phenylethylene-maleic anhydride copolymer (SMA) as a curing agent, diallyl bisphenol A-like allylphenol as a co-curing agent and a toughening agent, low-bromine or high-bromine BPA-type epoxy resin or tetrabromobisphenol A (TBBPA or TBBA) as a fire retardant, a proper accelerator and a solvent. The inventive resin composition has, after being cured, relatively low dielectric property and superior thermal reliability and toughness, includes, in contrast to a cooper clad laminate manufactured by reinforcing materials such as glass fiber cloth, relatively low dielectric constant (called Dk for short) and electric loss tangent (called Df for short), high Tg, high thermal cracking temperature (called Td for short), excellent toughness and favorable PCB processibility, is quite suitable for manufacturing the cooper clad laminate for PCB and prepreg, and can also applied to general uses of the epoxy resin, such as molding plastics and the like, and to composite materials for construction, automobile and aviation.

The invention relates to a halogen-free Tg resin composite and a presoaked material and a laminated board made by adopting the composite. Counted by part by weight of organic solid matters, the halogen-free high-Tg resin composite contains the following components according to part by weight: (A) 10 to 50 parts by weight of cyanate resin; (B) 10 to 50 parts by weight of at least one compound withdihydro-benzoxazine ring; (C) 10 to 50 parts by weight of at least one kind of bismaleimides resin; (D) 10 to 50 parts by weight of at least one kind of poly-epoxy compound; and (E) 5 to 30 parts by weight of at least one kind phosphonium flame retardant. The halogen-free high-Tg resin composite has the performances of low water absorption, low CTE (coefficient of thermal expansion), high Tg, good dielectric property and the like, and the presoaked material and laminated board made by adopting the composite has the characteristics of high vitrification transition temperature, low CTE, low dielectric constant, low water absorption, high thermal resistance and the like, thus being application to multi-layer circuit boards.

There is provided a multilayer ceramic capacitor including a ceramic body having first and second side surfaces facing each other, and third and fourth end surfaces connecting the first and second side surfaces, a plurality of internal electrodes formed in the ceramic body and having one ends thereof exposed to the third end surface or the fourth end surface, and first and second side margin parts formed from the first and second side surfaces to edges of the internal electrodes, wherein in a width direction of the ceramic body, both edges of the internal electrodes include oxide regions, the oxidation regions of an internal electrode contributing to capacitance formation except for uppermost and lowermost internal electrodes among the internal electrodes have a maximum length Lmax of 3 μm or less, and a standard deviation in length is 1 μm or less.

The invention provides a phosphorus-containing flame retardant composition, including: a hypophosphite compound, a DOPO derivative and a polyphosphazene compound. The composition as a flame retardant can play a synergistic effect of several phosphorus-containing compounds, realizes halogen-free flame retardance under small addition amount and reaches level V-0. The invention also provides a contains a polyphenyl ether resin composition containing the above phosphorus-containing flame retardant compositions and a prepreg and a copper clad laminated board prepared from the same. After curing, the polyphenyl ether resin composition achieves flame retardance of V-0 grade under the condition to which the halogen flame retardant does not apply and keeps good dielectric property and heat resistance of polyphenyl ether resin; the prepreg and copper clad laminated board made from the composition have good dielectric property and heat resistance, and realize halogen-free flame retardance to UL 94-V0 grade while ensuring excellent heat resistance and dielectric property; and the composition is applicable to the field of high speed and high frequency printed circuit board, and is in line with the future requirements of green and environmental protection.

The invention relates to a radome with the enhanced ultra-high molecular weight polyethylene (UHMWPE), the preparation method and the application thereof. The radome can be made of a composite material with the enhanced UHMWPE fabric and also be made of the glued joint of a surface material and a sandwich material through a cementing compound with the solidification temperature being below 130 DEG C, wherein the surface material is the composite material with the enhanced UHMWPE, and the sandwich material is the material with low density and low dielectric property. The radome not only good has mechanical property and high wave transmissivity, but also is weather resist, therefore, the radome can provide protection for a radar antenna in terrible conditions and prolong the service life thereof.