124 results about "Thermal mechanical" patented technology

The invention provides a special-shaped air film hole thermal mechanical fatigue simulation part design method, which comprises the following steps of: 1, analyzing the strength and the service life of a turbine blade, and identifying a key part of the service life of a special-shaped air film hole; 2, determining that the thermal mechanical fatigue simulation piece is of a hollow structure; 3, parameters of a clamping part of the hollow simulation piece are stipulated; 4, determining the mechanical stress of the key part through three-dimensional finite element simulation of the turbine blade; 5, verifying the included angle between the principal stress direction and the growth direction of the key part of the simulation part; step 6, measuring stress by using a strain gauge under a normal-temperature initial mechanical load, and verifying whether the load is compliant or not; 7, performing three-dimensional finite element simulation analysis on the temperature field of the test piece and calculating thermal stress; 8, controlling the thermal stress distribution of the section of the simulation piece by controlling the temperature distribution; step 9, when cooling gas is introduced into the inner cavity of the special-shaped gas film hole simulation piece, carrying out a thermal mechanical fatigue test by adopting an in-phase mechanical-temperature load; and step 10, optimizing the structure of the special-shaped gas film hole and analyzing the strength.

The invention belongs to the technical field of aero-engine high-temperature part test, and particularly relates to a thermal mechanical composite fatigue test device in a turbine blade rotation environment, which comprises a high-temperature gas system, a stator system, a rotor system, a support system, a test system, an auxiliary system and a turbine rotor blade test piece, the high-temperature fuel gas system is used for providing a fuel gas environment for a turbine rotor blade test piece and controlling the high-low temperature circulation state of fuel gas, a combustion chamber is arranged at the front end of the high-temperature fuel gas system and provided with a double-oil-way nozzle, a fuel gas flowing system is arranged at the rear end of the high-temperature fuel gas system, and a blade grid structure is designed for the fuel gas flowing system according to the geometrical shape of a turbine rotor blade. And a spray cooling section is arranged at the rear part of the test section. The device is composed of six core systems including a high-temperature fuel gas system, a stator system, a rotor system, a supporting system, a testing system and an auxiliary system, all the systems work cooperatively, and integrated simulation of the high-temperature fuel gas environment, rotating centrifugal loads and heat-force synchronous circulation is achieved.

The invention provides a manufacturing method of a glass substrate with a conductive through hole and a chip packaging structure, and the method comprises the steps: providing a glass substrate which comprises a first surface and a second surface which are opposite to each other; forming a first through hole through which the first surface of the glass substrate penetrates to the second surface; forming a conductive column in the first through hole, wherein a gap is formed between the conductive column and the first through hole; and forming a buffer layer between the conductive column and the inner wall of the first through hole, wherein the buffer layer at least covers the inner wall of the first through hole and the side wall of the conductive column. According to the invention, through the method of firstly manufacturing the conductive column and then forming the buffer layer, the step of directly depositing a high-quality insulating film in the first through hole with relatively high difficulty and cost is avoided, the demand on deposition equipment is reduced, the material and time cost is saved, and the production yield is improved. Meanwhile, the buffer layer is actively filled between the conductive column and the glass substrate, so that the thermal mechanical stress is more effectively absorbed and released, and the product quality of the glass substrate with the conductive through hole is improved.

The invention discloses a high-performance zinc alloy with a gradient structure and a preparation method and application thereof, and belongs to the technical field of metal material processing. The high-performance zinc alloy with the gradient structure is characterized in that the grain sizes of upper, middle and lower areas of the alloy are in fine-coarse-fine distribution, the grain sizes of the upper and lower areas are smaller than or equal to 2 microns, the grain size of the central area is 5-20 microns, and the grain size of a transition area between the upper and lower areas and the central area is 2-15 microns; meanwhile, all the areas are accompanied with MnZn13 nano precipitated phases with the size smaller than or equal to 50 nm. The alloy shows excellent deformation resistance and thermal mechanical stability, the elasticity modulus of the alloy can at least reach 125 GPa, meanwhile, the alloy shows excellent corrosion resistance, and the alloy is particularly suitable for biomedical implantation instruments such as intravascular stents and bone nails.

The invention provides an anti-static knitted fabric based on charge gathering and directional guiding, a preparation method of the anti-static knitted fabric and a knitted fabric, and belongs to the technical field of knitted clothes. A first spinning component and a second spinning component are co-extruded through melt spinning to prepare composite fibers with a parallel composite structure, and the composite fibers are subjected to thermal mechanical treatment to obtain the composite yarn; the composite yarn is directionally introduced into a specific area of the fabric in a tuck-float stitch mode through an embedded weaving technology, and latent curl is activated through after-treatment. The moisture absorption expansion of the second spinning component is utilized to drive the composite yarn to macroscopically self-crimp, and the conductive filler inside is physically extruded to construct an efficient conductive skeleton, so that the humidity response adjustment and charge directional dispersion of the anti-static performance are realized, and the problems of fixed conductive state, local static accumulation and poor comfort of the existing fabric are effectively solved; and the safety and wearing experience of the clothes are improved.

The invention provides a power module packaging structure and a packaging process thereof. The power module packaging structure comprises an upper substrate; the heat dissipation bottom plate is arranged opposite to the upper base; the AMB substrate is arranged between the upper base body and the heat dissipation bottom plate; the power chip is arranged on the AMB substrate, a source electrode of the power chip is electrically connected with an external terminal through a copper clamping piece, and interconnection between the copper clamping piece and the source electrode of the power chip is achieved through a non-pressure silver sintering layer. The copper clamping pieces are adopted to replace traditional bonding wires, the non-pressure silver sintering interconnection technology is combined, the module layout is optimized in a collaborative mode, the on-resistance and parasitic inductance of the power module are remarkably reduced, meanwhile, the heat dissipation capacity and the thermal mechanical fatigue resistance reliability of the power module are greatly improved, and the service life of the power module is prolonged. Therefore, the bottleneck of performance and reliability of the existing SiC MOSFET power module in a high-frequency and large-current application scene is successfully solved.

The application relates to the technical field of austenitic stainless steel, in particular to high-strength and high-toughness austenitic stainless steel with large expansion and a preparation method thereof, alloy components of which are as follows in percentage by weight: C: 0.45-0.65 wt.%, Mn: 6.0-9.0 wt.%, Ni: 6.5-10.0 wt.%, Cr: 8.0-12.0 wt.%, Mo: 1.5-3.0 wt.%, V: 0.8-2.0 wt.%, Cu: 1.5-4.0 wt.%, Nb: 0.015-0.045 wt.% and Ti: 0.035-0.100 wt.%, and the balance is Fe. The thermal expansion coefficient of the obtained steel is superior to that of the prior art, the yield strength is greater than 950 MPa, the elongation after fracture is greater than 15%, no sensitization characteristics caused by grain boundary Cr carbide are generated, the steel is composed of pure FCC austenite with stable thermal mechanical properties, and no martensite and deformed austenite or austenite with high dislocation density appears.

The invention belongs to the technical field of metal materials, and relates to a CoNiVAlX (x is greater than or equal to 0 and less than or equal to 0.5) multi-principal-element heterostructure entropy alloy system and a preparation method thereof. The chemical composition (atomic percent) of the alloy contains Co, Ni, V, Al and a trace regulator, flexible matching of strength and toughness is realized in a wide temperature range of-263 DEG C to 800 DEG C by regulating the Al content and a thermal mechanical treatment process, and various mechanical states such as'high ductility-medium strength 'and'high strength-medium ductility' can be obtained; the preparation process is based on a mature metallurgical technology and does not depend on special equipment, and large-size stable preparation can be achieved. Tests prove that the alloy system is wide in toughness and adjustable, the toughness balance in a wide temperature range is realized, the application requirements in an extreme environment are met, and the alloy system has a good industrial popularization prospect.

The invention relates to the technical field of diode detection, and particularly discloses a silicon carbide diode detection device which comprises a box body, a support, an input shaft, a power assembly and a first gear, the support is arranged on the left side of the top end of the box body, and the bottom end of the input shaft is rotatably arranged in the middle of the bottom end of an inner cavity of the box body through a bearing; the power assembly is arranged on the left side of the bottom end of the inner cavity of the box body and used for providing rotation power for the input shaft, and the first gear is connected to the bottom end of the outer wall of the input shaft in a sleeving mode and locked through a jackscrew. The device fills the blank in the aspects of packaging level thermal mechanical reliability acceleration test and service life prediction of the silicon carbide diode in the prior art, and has the remarkable advantages of short test period, real simulated working condition, comprehensive evaluation dimension, safe and reliable operation and the like; and a powerful tool is provided for product research and development, quality control and reliability evaluation of the silicon carbide diode.

The invention relates to the technical field of inductor manufacturing, in particular to a 10kV three-element anti-resonance metering combined mutual inductor which comprises a mutual inductor body, a heat dissipation groove is formed in the bottom of the mutual inductor body, and an isolation box is arranged in the mutual inductor body. The side wall and the top of the isolation box are slidably connected with a first pressed plate and a second pressed plate correspondingly. An isolation plate I, an isolation plate II, a blocking plate I and a blocking plate II are arranged in the box from top to bottom; the limitation of a fixed heat dissipation mode in traditional inductor manufacturing is broken through, and a stress-heat dissipation self-adaptive adjusting mechanism is constructed; stress generated by materials such as epoxy resin, copper materials and silicon steel sheets due to difference of thermal expansion coefficients is sensed through a pressed plate, and different numbers of air inlets and vent holes are opened in an automatic linkage mode; intelligent switching from basic heat dissipation to enhanced fire dissipation is achieved, thermal mechanical stress is absorbed in all directions through a spring buffer system, the long-term reliability problem of internal cracks and insulation deterioration caused by material thermal mismatch in inductor manufacturing is solved, the service life of a product is prolonged, and the operation stability of the product is improved.

The invention belongs to the technical field of alloys, and provides a lightweight refractory multi-principal-element alloy with excellent high-temperature creep property, and a preparation method and application thereof. The general formula of the light refractory multi-principal-element alloy with the excellent high-temperature creep property is TiaVbAlcCrdMoe, wherein 43% < = a < = 48%, 43% < = b < = 48%, 2% < = c < = 8%, 2% < = d < = 8% and 1% < = e < = 5%, a + b + c + d + e = 100%, and a, b, c, d and e are mole percentages. The alloy presents an isometric crystal structure in a complete recrystallization state in a thermal mechanical treatment state, the phase structure is a single-phase body-centered cubic BCC structure, the alloy has low density and shows excellent creep property at 650 DEG C / 100 MPa, the creep time exceeds 90 h, and the creep elongation is lower than 10%.

The invention discloses an automatic testing and screening method for electronic components, which relates to the technical field of electronic engineering and microelectronics and comprises the following steps: generating a multi-dimensional stress field through a temperature control module, a humidity control module and an electromagnetic interference simulation module; calling a preset extreme working condition combination sequence based on the target application scene of the component; under a dynamic coupling environment, dominant parameters and recessive parameters including a dielectric relaxation spectrum, a carrier mobility transient response and a thermoacoustic emission signal are synchronously collected; inputting the hidden parameter time sequence data into physical failure models including an electrochemical corrosion model and a thermal mechanical fatigue model; dynamically adjusting the passing threshold of the test item according to the model output; the step of applying accelerated degradation excitation to the screened component comprises the following steps of: circulating a set temperature for a set number of times; applying a bias voltage-temperature stress; and repeating the step S2 to monitor the implicit parameter drift amount, and eliminating the device with out-of-tolerance drift. The device guarantee is provided for the fields of new energy automobiles, aerospace electronics and the like.

The invention relates to the technical field of life prediction, in particular to a high-voltage switch cabinet contact life management system based on digital twinning, which comprises a thermal behavior acquisition module, a conductive state construction module, a thermal loss dynamic evaluation module, a thermal disturbance response regulation and control module and a life mapping driving module. According to the method, temperature difference and time interval in an on-off period are collected, thermal stress change is calculated in combination with current density, thermal characteristics of materials are correlated, thermal behaviors of a contact are dynamically reflected, a conductive path boundary is reconstructed based on contact area and pressure offset, a through-flow state is accurately described, and heat accumulation and arc energy input are extracted. The method comprises the steps of analyzing a temperature trend under thermal diffusion lag, constructing a heat loss evolution curve, adjusting thermal conductivity distribution through a ratio of temperature rise to mass migration rate, improving local adaptability of thermal disturbance response, generating a life attenuation layer in combination with equivalent thermal mechanical load and fatigue tolerance, and enhancing dynamic nature and precision of evaluation. And accurate judgment and management of the degradation area are realized.

The invention relates to the technical field of electronic materials, in particular to a copper-clad plate resin composition with an ultralow-loss medium and a preparation method of the copper-clad plate resin composition. The composition comprises the following components: modified polyphenyl ether, dicyclopentadiene epoxy resin, trifunctional epoxy resin, active ester, cyanate ester, DMAP, spherical silicon dioxide and a POSS-silicon dioxide compound, the preparation method comprises the following steps: carrying out surface norbornenylation modification on bimodal spherical silicon dioxide, and carrying out click reaction on the bimodal spherical silicon dioxide and octa-aminophenyl polysilsesquioxane with tetrazinyl at the tail end to prepare a POSS-silicon dioxide compound, so as to construct an interface transition layer with gradient modulus. According to the invention, collaborative optimization of dielectric loss, thermal mechanical properties and interface bonding strength is realized, and the material has excellent properties of low dielectric loss, high thermal stability, high peel strength and the like, and is suitable for the fields of 5G communication, high-frequency electronic equipment and the like.

The invention relates to the technical field of cable materials, discloses a crosslinked polyethylene insulated power cable and a preparation method thereof, and aims to solve the problems that harmful by-products are introduced and complicated degassing is needed in the conventional chemical crosslinking material. According to the material, a hierarchical dual-network structure composed of a physical cross-linked network and a dynamic covalent cross-linked network is constructed through components such as matrix resin, a dynamic network functional monomer and a physical network functional nanofiller. The preparation method comprises the following steps: preparing a hierarchical network precursor by reactive grafting in a twin-screw extruder, and devolatilizing; in the cable extrusion process, network in-situ curing is achieved through cooling, and traditional high-temperature crosslinking and degassing steps are omitted. According to the scheme, crosslinking by-products are fundamentally avoided, it is ensured that the material has excellent electrical properties, thermal mechanical properties and long-term reliability, the preparation process is remarkably simplified, and meanwhile the material has the thermally induced self-repairing potential.

The present invention relates to a process for cooling and for the use of environmental heat, where the following steps are carried out, implemented in a thermodynamic machine: a) the working fluid being in steam state is adiabatically expanded (1-2), b) the working fluid being in wet-steam state is separated according to state into liquid (0) and steam (3) components, c) the temperature of the working fluid being in steam state (3) is increased by adiabatic compression (3-4), d) the working fluids of liquid (0) and steam (4) are compressed (4-1) and mixed at the same time, keeping the temperature of the steam (4) at a constant level by means of the compression, and generating steam (1) of stable state through the evaporation of the liquid (0), e) the process is repeated periodically.

The present application relates to the technical field of high-temperature structural component fatigue strength design and life assessment, and particularly relates to a low-cycle multi-axial fatigue life prediction method based on powder high-temperature alloy damage mechanism. The method comprises: for the dangerous point of the component under non-isothermal multi-axial cyclic loading, calculating pure fatigue damage, pure creep damage and fatigue-creep interaction damage caused by a single load cycle; accumulating the pure fatigue damage, the pure creep damage and the fatigue-creep interaction damage to obtain the total damage of the single load cycle; taking the inverse of the total damage to predict the total failure life of the component under non-isothermal multi-axial cyclic loading. The method of the present application realizes effective prediction of the low-cycle multi-axial fatigue life of the powder high-temperature alloy component by accurately decomposing the damage of the dangerous point under non-isothermal multi-axial cyclic loading, can more truly reflect the comprehensive prediction model of the failure physics of the powder high-temperature alloy under multi-axial thermal mechanical loading, and improves the accuracy and reliability of the life assessment.

The invention discloses a high-conductivity high-strength copper alloy thermal mechanical treatment strengthening process which comprises the following steps: firstly, heating a Cu-Ni-Be-Zr alloy cast ingot to 890-980 DEG C until the core part of the cast ingot reaches a set heating temperature, then compressing the cast ingot, carrying out water cooling at room temperature, and finally carrying out aging treatment and air cooling on the cast ingot at 480 DEG C * 3-480 DEG C * 8 hours; the Cu-Ni-Be-Zr alloy comprises the following components in percentage by weight: 1.6 to 2.5 percent of Ni, 0.25 to 0.5 percent of Be, 0.05 to 0.2 percent of Zr, not more than 0.1 percent of impurities and the balance of Cu. According to the method, the cast ingot of the Cu-Ni-Be-Zr alloy is directly subjected to thermal mechanical treatment and then subjected to aging, the process steps of forging, solid solution treatment and cold deformation in a traditional process are omitted, the performance of the treated Cu-Ni-Be-Zr alloy is basically consistent with that of the alloy obtained after the traditional production process is adopted, and therefore the Cu-Ni-Be-Zr alloy is obtained. The thermomechanical treatment combines the advantages of hot working and mechanical deformation, and the microstructure and performance of the alloy can be more efficiently improved.

The application belongs to the field of high-temperature alloy, and relates to a preparation method for improving the sustained load crack propagation resistance of powder nickel-based high-temperature alloy and parts thereof. According to the final composition of the alloy, two component alloys with a difference of more than 25 DEG C in the gamma prime phase solid solution temperature are selected, the powders of the two component alloys are uniformly mixed, and then hot isostatic pressing or other thermal mechanical processing methods are used to prepare the alloy and part blanks, and a heat treatment system is selected according to the gamma prime phase solid solution temperature of the two component alloys. The powder nickel-based high-temperature alloy and parts prepared by the method can coordinate and improve the sustained load crack propagation resistance of the material by adjusting the composition and proportion of the two component alloys, and the service performance and life of the prepared aero-engine turbine disc are improved.

The invention discloses a packaging structure and a forming method thereof. The packaging structure comprises a first rewiring structure, a second rewiring structure and a third rewiring structure, wherein the first rewiring structure comprises a dielectric layer and functional wires located in the dielectric layer; the functional chip is arranged on the first surface, and the functional chip is electrically connected with the first rewiring structure; and the stress control structure is located in the dielectric layer at the bottom of the functional chip, and the stress control structure is electrically isolated from the functional wires. The stress control structure can counteract the warping stress caused by the difference of the coefficient of thermal expansion (CTE) of materials, the warping degree of the packaging structure is reduced, and the introduction of the stress control structure enhances the overall mechanical strength of packaging, so that the cracking and layering risks caused by the thermal mechanical stress are reduced.

The application discloses a 1000MPa-grade extra-thick hydroelectric steel with low strain aging sensitivity, and chemical components and mass percentages of the steel include the following: C: 0.05%-0.13%, Si: 0.15%-0.35%, Mn: 0.8%-1.2%, Ni: 1.8%-2.2%, Cr: 0.3%-0.6%, Mo: 0.3%-0.6%, V: 0.03%-0.07%, Ti: 0.01%-0.03%, Nb: 0.02%-0.05%, Alt: 0.02-0.05%, S≤0.002%, P≤0.008%, N≤0.008%, and the rest is Fe and inevitable impurity elements. The application has the advantages that the steel plate can still maintain extremely low strain aging sensitivity after cold working deformation, and a stable dislocation network and nanometer precipitated phase are introduced by using a specific thermal mechanical treatment process.

The embodiment of the invention provides a packaging substrate, a chip packaging structure and electronic equipment, and relates to the technical field of electronic equipment. The packaging substrate comprises a glass core plate, a connecting layer and a protective layer. The glass core plate is provided with a through hole; the glass core plate comprises a first surface and a second surface which are opposite, and the through hole penetrates from the first surface to the second surface. The connecting layer comprises a first sub-layer and two second sub-layers, the first sub-layer is arranged on the inner wall of the through hole, the two second sub-layers are respectively arranged on the first surface and the second surface, and the two second sub-layers are respectively connected with the first sub-layer. At least part of the protective layer is arranged between the glass core plate and the second sub-layer. Wherein the hardness of the protective layer is larger than that of the glass core plate, or the elastic modulus of the protective layer is smaller than that of the glass core plate. According to the structure, the thermal mechanical stress borne by the glass core plate in the packaging substrate is reduced, so that the risk of cracking of the glass core plate is reduced.

The invention relates to the technical field of pressure-sensitive materials, in particular to a wide-range high-response pressure-sensitive material composite structure and a process optimization method. Comprising the following steps: immersing polymer particles into a conductive composite coating solution, mechanically stirring, ultrasonically dispersing, drying and curing to prepare particles with uniformly coated surfaces; the method comprises the following steps: melting particles by adopting a micro-fluidic spinning technology, extruding special-shaped cross-section fibers through a spinneret plate, stretching and shaping, and constructing a surface bulge structure. A plurality of fibers are twisted and stranded, the twisting direction is regulated and controlled to form a stable conductive net, and the periodic wavy linear single-strand pressure-sensitive wire is prepared through thermal mechanical shaping. The pressure-sensitive lines are subjected to warp and weft orthogonal weaving, butt-joint points are locally hot-pressed and fixed to form a latticed synaptic array and groove network, and the tip end is an arc-shaped micro-strain trigger area; and assembling a multi-layer functional fabric stacking structure, preparing an electrode layer, a pressure-sensitive layer and a packaging layer, and sequentially stacking the electrode layer, the pressure-sensitive layer and the packaging layer. According to the technical scheme, the range and response of the sensor in the tower can be improved.

The present application belongs to the technical field of valve, and discloses a valve device with variable temperature sensing capability and a thermal mechanical training method thereof. The valve device comprises, from top to bottom, an upper fixed shell, an upper limiting disc, an upper fixed flange disc, a deformation sheet, a lower fixed flange disc, a lower limiting disc and a lower fixed shell, wherein the upper fixed shell is connected with the lower fixed shell; the deformation sheet is connected with the upper fixed flange disc and the lower fixed flange disc through studs, and a limiting cylinder is arranged in the middle part of the deformation sheet; the deformation sheet is made of nickel-titanium alloy with double-way shape memory; the upper limiting disc and the lower limiting disc are respectively formed with an upper limiting groove and a lower limiting groove; the opposite ends of the limiting cylinder respectively pass through the upper fixed flange disc and the lower limiting flange disc and extend into the upper limiting groove and the lower limiting groove; and the upper limiting disc and the lower limiting disc limit and control the deformation sheet through the limiting cylinder and the upper limiting groove and the lower limiting groove. The present application solves the problem that the temperature sensing control capability of a temperature sensing valve is very single.

The present application relates to the technical field of plate performance testing, and particularly relates to a kind of plate edge durability test method;It comprises the following steps: cutting plate sample into standard size test piece;Using thermal mechanical analyzer respectively test the linear expansion coefficient of test piece edge material and base material;The test piece after processing is placed in environmental test chamber and is subjected to cyclic test;Test piece is fixed on load testing device, and constant load is applied along the direction perpendicular to the edge interface of plate plane;Using flatness tester to measure the overall warping of test piece, compare with the warping data before testing, calculate the warping change, evaluate the actual effect of plate balanced laminating process on preventing warping after edge sealing;Using weighted scoring method to calculate the comprehensive score of edge durability;Realize that the long-term durability of plate edge sealing under complex working conditions can be comprehensively and accurately evaluated, and provide scientific and comprehensive technical support for edge sealing process optimization, material selection and structure design.

The invention relates to the technical field of photovoltaics, and discloses a latticed packaging adhesive film for a perovskite assembly and a preparation process and application of the latticed packaging adhesive film. The latticed packaging adhesive film comprises a base film (packaging adhesive film) and a functional grid structure (namely a latticed concave structure or a latticed through hole structure formed on the surface of the packaging adhesive film), the grid-shaped sunken structure comprises a plurality of grid units (which are sunken parts or through holes) and grid lines for dividing the grid units, wherein the grid units are arranged in an array on the surface of the packaging adhesive film; the length and the width of the recesses or the through holes are both 10-500 microns, and the line width of the grid lines is 10-2990microns; and functional materials (at least one of a dry material, a stress buffering high polymer material, a nano barrier material and a light conversion material) are filled or coated in the recesses or the through holes. The latticed packaging adhesive film can solve the problems of thermal mechanical stress, water-oxygen lateral diffusion, poor interface stability and the like of the perovskite assembly, and the thermal mechanical reliability and long-term environmental stability of the perovskite assembly are remarkably improved.

The present application relates to the field of material science and engineering application technology, specifically to a kind of metal material thermal mechanical fatigue life fast prediction method based on hysteresis energy density.First, hysteresis curve is used to calculate hysteresis energy density, then the quantitative relationship between shape coefficient, stress variation range and plastic strain range between low cycle fatigue and thermal mechanical fatigue is used, to achieve the purpose of predicting thermal mechanical fatigue hysteresis energy density under the same mechanical strain amplitude by low cycle fatigue, finally, energy accumulation damage model is used to predict thermal mechanical fatigue life.The method carries out two groups of experiments for low cycle fatigue and thermal mechanical fatigue respectively, realizes the prediction of thermal mechanical fatigue life under different mechanical strain amplitudes by low cycle fatigue, establishes the correlation between low cycle fatigue and thermal mechanical fatigue by using the similarity between them in the process of cyclic loading, effectively reduces the experimental amount required for thermal mechanical fatigue life evaluation, and is applied to the thermal mechanical fatigue life prediction of high-temperature alloy and vermicular cast iron and other metal materials.

The utility model discloses a kind of three-dimensional interconnection structures based on wafer bump and gradient CTE transition, it is related to semiconductor packaging technical field, including hard board and chip, the trapezoidal cavity is formed by laser etching process to the hard board, and the bottom of shape cavity is formed by etching processing exhaust hole through hard board;The bottom of the chip is provided with flexible board, and the top of flexible board is formed with copper column bump by electroplating, the chip is connected with flexible board by copper column bump, the top of trapezoidal cavity is formed copper pad array by electroplating process;The utility model is etched cavity structure on hard board, chip flip chip is welded on copper bump array of flexible board, chip is embedded cavity after folding flexible board, it is applicable to Chiplet heterogenous integration, 2.5D / 3D packaging, high-frequency millimeter wave device etc. Scene, solve high-density wiring, thermal mechanical reliability and high-frequency signal transmission collaborative optimization problem of soft and hard board interconnection in semiconductor packaging.

The application discloses a preparation method of a heat-resistant and radiation-resistant ultra-fine grain martensitic steel and belongs to the field of metal structural materials. 12 The ceramic oxide powder replaces Y2O3 and Ti powder added in preparation of a traditional oxide dispersion strengthened steel (ODS); the ODS steel with an ultra-fine grain structure is prepared through high-energy ball milling and spark plasma sintering, and a martensitic structure is obtained through a special heat treatment process. Compared with the preparation processes of the traditional ODS steel and the martensitic steel, the method can obtain the martensitic structure with small grains without a complex thermal mechanical treatment process. The material has a tensile strength of 1000-1200 MPa at room temperature, has an elongation of 16-20%, and has a high-temperature strength of 280-320 MPa at 650 DEG C.

The invention discloses a multi-process thermal mechanical deformation monitoring and compensating system for an engine support, and relates to the technical field of image monitoring. The system firstly collects visible light and infrared data to generate a fusion image, and recognizes the chip shielding state of the surface of a workpiece; if yes, driving a physical cleaning device to perform directional cleaning until a judgment logic is met, and generating a hot historical log containing cleaning process data; calculating a current three-dimensional full-field deformation vector of the workpiece in combination with the recovered pure surface temperature field and a thermal history log; and finally extracting the displacement and rotation amount of the key feature points, and generating a machine tool coordinate system space transformation instruction for compensation. According to the method, the problems of infrared temperature measurement distortion caused by inner cavity chip accumulation under the minimal quantity lubrication working condition and thermal lag prediction deviation generated by internal heat accumulation after chip removal are solved.