81 results about "Thermal mechanical" patented technology

The invention provides a special-shaped air film hole thermal mechanical fatigue simulation part design method, which comprises the following steps of: 1, analyzing the strength and the service life of a turbine blade, and identifying a key part of the service life of a special-shaped air film hole; 2, determining that the thermal mechanical fatigue simulation piece is of a hollow structure; 3, parameters of a clamping part of the hollow simulation piece are stipulated; 4, determining the mechanical stress of the key part through three-dimensional finite element simulation of the turbine blade; 5, verifying the included angle between the principal stress direction and the growth direction of the key part of the simulation part; step 6, measuring stress by using a strain gauge under a normal-temperature initial mechanical load, and verifying whether the load is compliant or not; 7, performing three-dimensional finite element simulation analysis on the temperature field of the test piece and calculating thermal stress; 8, controlling the thermal stress distribution of the section of the simulation piece by controlling the temperature distribution; step 9, when cooling gas is introduced into the inner cavity of the special-shaped gas film hole simulation piece, carrying out a thermal mechanical fatigue test by adopting an in-phase mechanical-temperature load; and step 10, optimizing the structure of the special-shaped gas film hole and analyzing the strength.

The invention belongs to the technical field of aero-engine high-temperature part test, and particularly relates to a thermal mechanical composite fatigue test device in a turbine blade rotation environment, which comprises a high-temperature gas system, a stator system, a rotor system, a support system, a test system, an auxiliary system and a turbine rotor blade test piece, the high-temperature fuel gas system is used for providing a fuel gas environment for a turbine rotor blade test piece and controlling the high-low temperature circulation state of fuel gas, a combustion chamber is arranged at the front end of the high-temperature fuel gas system and provided with a double-oil-way nozzle, a fuel gas flowing system is arranged at the rear end of the high-temperature fuel gas system, and a blade grid structure is designed for the fuel gas flowing system according to the geometrical shape of a turbine rotor blade. And a spray cooling section is arranged at the rear part of the test section. The device is composed of six core systems including a high-temperature fuel gas system, a stator system, a rotor system, a supporting system, a testing system and an auxiliary system, all the systems work cooperatively, and integrated simulation of the high-temperature fuel gas environment, rotating centrifugal loads and heat-force synchronous circulation is achieved.

The invention provides an anti-static knitted fabric based on charge gathering and directional guiding, a preparation method of the anti-static knitted fabric and a knitted fabric, and belongs to the technical field of knitted clothes. A first spinning component and a second spinning component are co-extruded through melt spinning to prepare composite fibers with a parallel composite structure, and the composite fibers are subjected to thermal mechanical treatment to obtain the composite yarn; the composite yarn is directionally introduced into a specific area of the fabric in a tuck-float stitch mode through an embedded weaving technology, and latent curl is activated through after-treatment. The moisture absorption expansion of the second spinning component is utilized to drive the composite yarn to macroscopically self-crimp, and the conductive filler inside is physically extruded to construct an efficient conductive skeleton, so that the humidity response adjustment and charge directional dispersion of the anti-static performance are realized, and the problems of fixed conductive state, local static accumulation and poor comfort of the existing fabric are effectively solved; and the safety and wearing experience of the clothes are improved.

The invention provides a power module packaging structure and a packaging process thereof. The power module packaging structure comprises an upper substrate; the heat dissipation bottom plate is arranged opposite to the upper base; the AMB substrate is arranged between the upper base body and the heat dissipation bottom plate; the power chip is arranged on the AMB substrate, a source electrode of the power chip is electrically connected with an external terminal through a copper clamping piece, and interconnection between the copper clamping piece and the source electrode of the power chip is achieved through a non-pressure silver sintering layer. The copper clamping pieces are adopted to replace traditional bonding wires, the non-pressure silver sintering interconnection technology is combined, the module layout is optimized in a collaborative mode, the on-resistance and parasitic inductance of the power module are remarkably reduced, meanwhile, the heat dissipation capacity and the thermal mechanical fatigue resistance reliability of the power module are greatly improved, and the service life of the power module is prolonged. Therefore, the bottleneck of performance and reliability of the existing SiC MOSFET power module in a high-frequency and large-current application scene is successfully solved.

The invention belongs to the technical field of alloys, and provides a lightweight refractory multi-principal-element alloy with excellent high-temperature creep property, and a preparation method and application thereof. The general formula of the light refractory multi-principal-element alloy with the excellent high-temperature creep property is TiaVbAlcCrdMoe, wherein 43% < = a < = 48%, 43% < = b < = 48%, 2% < = c < = 8%, 2% < = d < = 8% and 1% < = e < = 5%, a + b + c + d + e = 100%, and a, b, c, d and e are mole percentages. The alloy presents an isometric crystal structure in a complete recrystallization state in a thermal mechanical treatment state, the phase structure is a single-phase body-centered cubic BCC structure, the alloy has low density and shows excellent creep property at 650 DEG C / 100 MPa, the creep time exceeds 90 h, and the creep elongation is lower than 10%.

The invention relates to the technical field of life prediction, in particular to a high-voltage switch cabinet contact life management system based on digital twinning, which comprises a thermal behavior acquisition module, a conductive state construction module, a thermal loss dynamic evaluation module, a thermal disturbance response regulation and control module and a life mapping driving module. According to the method, temperature difference and time interval in an on-off period are collected, thermal stress change is calculated in combination with current density, thermal characteristics of materials are correlated, thermal behaviors of a contact are dynamically reflected, a conductive path boundary is reconstructed based on contact area and pressure offset, a through-flow state is accurately described, and heat accumulation and arc energy input are extracted. The method comprises the steps of analyzing a temperature trend under thermal diffusion lag, constructing a heat loss evolution curve, adjusting thermal conductivity distribution through a ratio of temperature rise to mass migration rate, improving local adaptability of thermal disturbance response, generating a life attenuation layer in combination with equivalent thermal mechanical load and fatigue tolerance, and enhancing dynamic nature and precision of evaluation. And accurate judgment and management of the degradation area are realized.

The present application relates to the technical field of high-temperature structural component fatigue strength design and life assessment, and particularly relates to a low-cycle multi-axial fatigue life prediction method based on powder high-temperature alloy damage mechanism. The method comprises: for the dangerous point of the component under non-isothermal multi-axial cyclic loading, calculating pure fatigue damage, pure creep damage and fatigue-creep interaction damage caused by a single load cycle; accumulating the pure fatigue damage, the pure creep damage and the fatigue-creep interaction damage to obtain the total damage of the single load cycle; taking the inverse of the total damage to predict the total failure life of the component under non-isothermal multi-axial cyclic loading. The method of the present application realizes effective prediction of the low-cycle multi-axial fatigue life of the powder high-temperature alloy component by accurately decomposing the damage of the dangerous point under non-isothermal multi-axial cyclic loading, can more truly reflect the comprehensive prediction model of the failure physics of the powder high-temperature alloy under multi-axial thermal mechanical loading, and improves the accuracy and reliability of the life assessment.

The invention discloses a high-conductivity high-strength copper alloy thermal mechanical treatment strengthening process which comprises the following steps: firstly, heating a Cu-Ni-Be-Zr alloy cast ingot to 890-980 DEG C until the core part of the cast ingot reaches a set heating temperature, then compressing the cast ingot, carrying out water cooling at room temperature, and finally carrying out aging treatment and air cooling on the cast ingot at 480 DEG C * 3-480 DEG C * 8 hours; the Cu-Ni-Be-Zr alloy comprises the following components in percentage by weight: 1.6 to 2.5 percent of Ni, 0.25 to 0.5 percent of Be, 0.05 to 0.2 percent of Zr, not more than 0.1 percent of impurities and the balance of Cu. According to the method, the cast ingot of the Cu-Ni-Be-Zr alloy is directly subjected to thermal mechanical treatment and then subjected to aging, the process steps of forging, solid solution treatment and cold deformation in a traditional process are omitted, the performance of the treated Cu-Ni-Be-Zr alloy is basically consistent with that of the alloy obtained after the traditional production process is adopted, and therefore the Cu-Ni-Be-Zr alloy is obtained. The thermomechanical treatment combines the advantages of hot working and mechanical deformation, and the microstructure and performance of the alloy can be more efficiently improved.

The application belongs to the field of high-temperature alloy, and relates to a preparation method for improving the sustained load crack propagation resistance of powder nickel-based high-temperature alloy and parts thereof. According to the final composition of the alloy, two component alloys with a difference of more than 25 DEG C in the gamma prime phase solid solution temperature are selected, the powders of the two component alloys are uniformly mixed, and then hot isostatic pressing or other thermal mechanical processing methods are used to prepare the alloy and part blanks, and a heat treatment system is selected according to the gamma prime phase solid solution temperature of the two component alloys. The powder nickel-based high-temperature alloy and parts prepared by the method can coordinate and improve the sustained load crack propagation resistance of the material by adjusting the composition and proportion of the two component alloys, and the service performance and life of the prepared aero-engine turbine disc are improved.

The application discloses a 1000MPa-grade extra-thick hydroelectric steel with low strain aging sensitivity, and chemical components and mass percentages of the steel include the following: C: 0.05%-0.13%, Si: 0.15%-0.35%, Mn: 0.8%-1.2%, Ni: 1.8%-2.2%, Cr: 0.3%-0.6%, Mo: 0.3%-0.6%, V: 0.03%-0.07%, Ti: 0.01%-0.03%, Nb: 0.02%-0.05%, Alt: 0.02-0.05%, S≤0.002%, P≤0.008%, N≤0.008%, and the rest is Fe and inevitable impurity elements. The application has the advantages that the steel plate can still maintain extremely low strain aging sensitivity after cold working deformation, and a stable dislocation network and nanometer precipitated phase are introduced by using a specific thermal mechanical treatment process.

The embodiment of the invention provides a packaging substrate, a chip packaging structure and electronic equipment, and relates to the technical field of electronic equipment. The packaging substrate comprises a glass core plate, a connecting layer and a protective layer. The glass core plate is provided with a through hole; the glass core plate comprises a first surface and a second surface which are opposite, and the through hole penetrates from the first surface to the second surface. The connecting layer comprises a first sub-layer and two second sub-layers, the first sub-layer is arranged on the inner wall of the through hole, the two second sub-layers are respectively arranged on the first surface and the second surface, and the two second sub-layers are respectively connected with the first sub-layer. At least part of the protective layer is arranged between the glass core plate and the second sub-layer. Wherein the hardness of the protective layer is larger than that of the glass core plate, or the elastic modulus of the protective layer is smaller than that of the glass core plate. According to the structure, the thermal mechanical stress borne by the glass core plate in the packaging substrate is reduced, so that the risk of cracking of the glass core plate is reduced.

The invention relates to the technical field of pressure-sensitive materials, in particular to a wide-range high-response pressure-sensitive material composite structure and a process optimization method. Comprising the following steps: immersing polymer particles into a conductive composite coating solution, mechanically stirring, ultrasonically dispersing, drying and curing to prepare particles with uniformly coated surfaces; the method comprises the following steps: melting particles by adopting a micro-fluidic spinning technology, extruding special-shaped cross-section fibers through a spinneret plate, stretching and shaping, and constructing a surface bulge structure. A plurality of fibers are twisted and stranded, the twisting direction is regulated and controlled to form a stable conductive net, and the periodic wavy linear single-strand pressure-sensitive wire is prepared through thermal mechanical shaping. The pressure-sensitive lines are subjected to warp and weft orthogonal weaving, butt-joint points are locally hot-pressed and fixed to form a latticed synaptic array and groove network, and the tip end is an arc-shaped micro-strain trigger area; and assembling a multi-layer functional fabric stacking structure, preparing an electrode layer, a pressure-sensitive layer and a packaging layer, and sequentially stacking the electrode layer, the pressure-sensitive layer and the packaging layer. According to the technical scheme, the range and response of the sensor in the tower can be improved.

The present application belongs to the technical field of valve, and discloses a valve device with variable temperature sensing capability and a thermal mechanical training method thereof. The valve device comprises, from top to bottom, an upper fixed shell, an upper limiting disc, an upper fixed flange disc, a deformation sheet, a lower fixed flange disc, a lower limiting disc and a lower fixed shell, wherein the upper fixed shell is connected with the lower fixed shell; the deformation sheet is connected with the upper fixed flange disc and the lower fixed flange disc through studs, and a limiting cylinder is arranged in the middle part of the deformation sheet; the deformation sheet is made of nickel-titanium alloy with double-way shape memory; the upper limiting disc and the lower limiting disc are respectively formed with an upper limiting groove and a lower limiting groove; the opposite ends of the limiting cylinder respectively pass through the upper fixed flange disc and the lower limiting flange disc and extend into the upper limiting groove and the lower limiting groove; and the upper limiting disc and the lower limiting disc limit and control the deformation sheet through the limiting cylinder and the upper limiting groove and the lower limiting groove. The present application solves the problem that the temperature sensing control capability of a temperature sensing valve is very single.

The present application relates to the technical field of plate performance testing, and particularly relates to a kind of plate edge durability test method;It comprises the following steps: cutting plate sample into standard size test piece;Using thermal mechanical analyzer respectively test the linear expansion coefficient of test piece edge material and base material;The test piece after processing is placed in environmental test chamber and is subjected to cyclic test;Test piece is fixed on load testing device, and constant load is applied along the direction perpendicular to the edge interface of plate plane;Using flatness tester to measure the overall warping of test piece, compare with the warping data before testing, calculate the warping change, evaluate the actual effect of plate balanced laminating process on preventing warping after edge sealing;Using weighted scoring method to calculate the comprehensive score of edge durability;Realize that the long-term durability of plate edge sealing under complex working conditions can be comprehensively and accurately evaluated, and provide scientific and comprehensive technical support for edge sealing process optimization, material selection and structure design.

The invention relates to the technical field of photovoltaics, and discloses a latticed packaging adhesive film for a perovskite assembly and a preparation process and application of the latticed packaging adhesive film. The latticed packaging adhesive film comprises a base film (packaging adhesive film) and a functional grid structure (namely a latticed concave structure or a latticed through hole structure formed on the surface of the packaging adhesive film), the grid-shaped sunken structure comprises a plurality of grid units (which are sunken parts or through holes) and grid lines for dividing the grid units, wherein the grid units are arranged in an array on the surface of the packaging adhesive film; the length and the width of the recesses or the through holes are both 10-500 microns, and the line width of the grid lines is 10-2990microns; and functional materials (at least one of a dry material, a stress buffering high polymer material, a nano barrier material and a light conversion material) are filled or coated in the recesses or the through holes. The latticed packaging adhesive film can solve the problems of thermal mechanical stress, water-oxygen lateral diffusion, poor interface stability and the like of the perovskite assembly, and the thermal mechanical reliability and long-term environmental stability of the perovskite assembly are remarkably improved.

The present application relates to the field of material science and engineering application technology, specifically to a kind of metal material thermal mechanical fatigue life fast prediction method based on hysteresis energy density.First, hysteresis curve is used to calculate hysteresis energy density, then the quantitative relationship between shape coefficient, stress variation range and plastic strain range between low cycle fatigue and thermal mechanical fatigue is used, to achieve the purpose of predicting thermal mechanical fatigue hysteresis energy density under the same mechanical strain amplitude by low cycle fatigue, finally, energy accumulation damage model is used to predict thermal mechanical fatigue life.The method carries out two groups of experiments for low cycle fatigue and thermal mechanical fatigue respectively, realizes the prediction of thermal mechanical fatigue life under different mechanical strain amplitudes by low cycle fatigue, establishes the correlation between low cycle fatigue and thermal mechanical fatigue by using the similarity between them in the process of cyclic loading, effectively reduces the experimental amount required for thermal mechanical fatigue life evaluation, and is applied to the thermal mechanical fatigue life prediction of high-temperature alloy and vermicular cast iron and other metal materials.

The utility model discloses a kind of three-dimensional interconnection structures based on wafer bump and gradient CTE transition, it is related to semiconductor packaging technical field, including hard board and chip, the trapezoidal cavity is formed by laser etching process to the hard board, and the bottom of shape cavity is formed by etching processing exhaust hole through hard board;The bottom of the chip is provided with flexible board, and the top of flexible board is formed with copper column bump by electroplating, the chip is connected with flexible board by copper column bump, the top of trapezoidal cavity is formed copper pad array by electroplating process;The utility model is etched cavity structure on hard board, chip flip chip is welded on copper bump array of flexible board, chip is embedded cavity after folding flexible board, it is applicable to Chiplet heterogenous integration, 2.5D / 3D packaging, high-frequency millimeter wave device etc. Scene, solve high-density wiring, thermal mechanical reliability and high-frequency signal transmission collaborative optimization problem of soft and hard board interconnection in semiconductor packaging.

The invention discloses a multi-process thermal mechanical deformation monitoring and compensating system for an engine support, and relates to the technical field of image monitoring. The system firstly collects visible light and infrared data to generate a fusion image, and recognizes the chip shielding state of the surface of a workpiece; if yes, driving a physical cleaning device to perform directional cleaning until a judgment logic is met, and generating a hot historical log containing cleaning process data; calculating a current three-dimensional full-field deformation vector of the workpiece in combination with the recovered pure surface temperature field and a thermal history log; and finally extracting the displacement and rotation amount of the key feature points, and generating a machine tool coordinate system space transformation instruction for compensation. According to the method, the problems of infrared temperature measurement distortion caused by inner cavity chip accumulation under the minimal quantity lubrication working condition and thermal lag prediction deviation generated by internal heat accumulation after chip removal are solved.

The invention discloses an anti-warping IC carrier plate with an edge supporting structure, and the anti-warping IC carrier plate remarkably reduces the warping deformation of a substrate through the design of edge special holes and thermal mechanical compensation. The H-shaped copper column frame and the gradient aperture / spacing design can compensate according to the asymmetry degree of a substrate pattern, so that the warping of the whole board is reduced; v-shaped or Y-shaped holes are designed according to angles, directional support and bending moment resistance are generated, and corner warping is particularly restrained; a shape memory polymer (SMP) or a thermal shrinkage and cold expansion insert containing a negative thermal expansion (NTE) filler is embedded in a specific position, shrinks at a high temperature to enable the substrate to normally release residual stress, and recovers the supporting property at a room temperature; the existing process of the PCB is continued, special equipment does not need to be newly added, and mass production is easy; under the double compensation of the structure and the material, the metal / polymer in the substrate is crystallized in a low-stress environment, and the overall stability of the substrate is improved.

The application discloses a kind of thermomechanical fatigue crack propagation rate test methods, the present application utilizes DCPD method to sample electric potential is calibrated: first, calibrate crack length a and the corresponding relation curve a-U of electric potential U, multiple crack lengths need to be calibrated;Second, calibrate the corresponding relation curve U-t of electric potential U and time t under temperature cycle of each crack length;Finally, through thermomechanical fatigue (TMF) experiment, the real-time corresponding relation curve U-t of electric potential U and time t in crack propagation process is obtained, time t is converted into cycle number N, is substituted into a-U and obtains a-N relationship curve. Meanwhile, another group of a-N curve is obtained by using long-focus microscope visual method. The crack propagation data obtained by visual method is used to correct and modify the a-N curve data obtained by DCPD measurement, so as to realize accurate and efficient measurement of thermomechanical fatigue crack propagation rate.

The application discloses an L12 phase reinforced FCC type multi-component alloy and a preparation method thereof, and belongs to the field of high-entropy alloys and preparation technologies thereof.The L12 phase reinforced FCC type multi-component alloy comprises the following components in percentage of atoms: 42-45% of Ni, 21-24% of Co, 7-10% of Fe, 9-12% of Al, 10-13% of Ti and 1-3% of B.The application uses high-purity pure metals as raw materials, and through simple thermal mechanical treatment, a structure of "fine crystal + annealing twin crystal + L12 phase" is constructed, so that the toughening of the FCC type high-entropy alloy is realized, the room temperature yield strength of the alloy reaches 1063 MPa, the room temperature tensile strength reaches 1696 MPa, and the fracture elongation reaches 25.9%.

The invention discloses a liquid metal flexible connection method and a flexible connection structure. The method mainly comprises the following steps of: manufacturing a solder mask layer on the surface of a chip to form a patterned chip bonding pad; preparing a circuit board; a liquid metal bump array or a linear pattern is manufactured through the piezoelectric driving type piezoelectric driving injection valve; mounting a chip; performing low-temperature backflow interconnection; and finally, bottom glue filling and curing are carried out. The interconnection structure provided by the invention adopts a sandwich composite structure of chip-liquid metal / bottom filling glue-circuit board. Wherein the liquid metal layer can decouple thermal strain between different materials at an interface, and meanwhile, excellent electric conduction and heat conduction performance is kept. The structure can effectively eliminate the thermal mechanical stress generated by the chip bonding layer, significantly reduce the shear stress between the chip and the circuit board, and improve the reliability and stability of the packaging structure.

The present application relates to a kind of aero-engine turbine blade thermal mechanical fatigue examination section non-uniform stress field debugging method, comprising (1) determining turbine blade three-dimensional model, turbine blade fixture three-dimensional model is established in computer software and is assembled, according to turbine blade stress field examination requirement to determine the range of stress of each examination point of examination section;(2) determine the parameter that influences examination section stress field distribution as variable, extract initial sample point and calculate to obtain the real response of these sample points and construct sample library;(3) according to the sample information in sample library, construct the proxy model between variable and response, utilize proxy model output the optimal parameter that influences examination section stress field distribution;(4) carry out test on fatigue testing machine, adjust fixture position and fatigue testing machine load, to obtain the test blade examination section stress field that meets the requirement.The present application reduces test cost by the method of adjusting and determining fixture position and testing machine load in finite element software.

The utility model discloses a thermal mechanical analyzer for injection products, which comprises a bearing table, a bearing shell mounted at the top of the bearing table, a heating plate mounted inside the bearing shell, a fixed support fixedly mounted at the top of the bearing table, an outer wall of a pressing rod slidably sleeved with the bearing shell, and a mounting case fixedly mounted on the fixed support. An air cylinder for driving the pressing rod to move is installed in the installation machine box, the bearing assembly is arranged in the bearing shell, and the first end cover and the second end cover are connected to the ends of the injection molding part in a sleeving mode correspondingly. The bearing shell, the heating plate, the bearing assembly and the pressing rod are used in a matched mode, the first end cover and the second end cover can carry out butt joint bearing on the end portion of an injection molding product, and therefore when the injection molding part is extruded by the pressing rod, the situation that the injection molding part adheres to the bearing shell and the pressing rod is avoided, and the service life of the injection molding part is prolonged. And the stability of the injection molding part during testing can be improved through the guide rod, the connecting block and the locking assembly.

The application relates to the technical field of metal matrix composite material preparation, in particular to a super-high-strength gradient structure Ni-Ti-based composite material and a preparation method thereof, the Ni-Ti-based composite material has a three-dimensional gradient structure; the preparation method comprises the following steps: S1, preparing Ni-Ti pre-alloyed powder; S2, mixing the Ni-Ti pre-alloyed powder with TiB2 ceramic particles; S3, hot-pressing sintering; and S4, performing thermal mechanical treatment on the Ni-Ti-based memory alloy composite material. The novel Ni-Ti-based shape memory alloy composite material is prepared by the method combining low-energy ball milling, hot-pressing sintering and thermal mechanical treatment, has super-high strength and excellent shape memory performance, does not need high-precision additive manufacturing equipment, has simple preparation process and relatively low cost; meanwhile, the method can be used for preparing large-size material, and hundreds of kilograms of Ni-Ti-based composite material filaments can be prepared at one time, and the manufacturing efficiency is high.

The invention discloses a chip packaging structure, a manufacturing method of the chip packaging structure and electronic equipment. The chip packaging structure comprises a chip, a lead frame and a packaging layer, the back surface of the chip is attached to the upper surface of the lead frame; the packaging layer is attached to the upper surface of the lead frame, and the chip is wrapped by the packaging layer; a first bonding pad is arranged on the front surface of the chip, an electric bonding pad is arranged on the lead frame, the first bonding pad is electrically connected with the electric bonding pad through a bonding wire, and the front surface of the chip is opposite to the back surface of the chip; a first stress buffer layer is arranged in at least partial area where the packaging layer is attached to the chip, and the first stress buffer layer is used for releasing heat engine stress between the packaging layer and the chip; a second stress buffer layer is arranged in at least part of the area where the packaging layer is attached to the lead frame, and the second stress buffer layer is used for releasing heat engine stress between the packaging layer and the lead frame. According to the invention, the heat engine stress between the packaging layer and the chip and the lead frame can be reduced.

The invention relates to an Al-Ce-Zr series heat-resistant aluminum alloy and a thermal mechanical treatment method thereof, and belongs to the technical field of metal material processing and alloy design, and the aluminum alloy comprises the following components in percentage by mass: 5-12wt% of Ce, 0.1-0.5 wt% of Zr and lt, and the balance of Al and inevitable impurities. % of inevitable impurity elements and the balance of Al; the method comprises the following steps that S1, raw materials are smelted in a vacuum induction smelting furnace and cast into an as-cast alloy ingot; (S2) the as-cast alloy ingot is subjected to hot extrusion at the temperature of 400-450 DEG C, and the deformation amount is larger than 80%; s3) preserving the heat of the extruded profile at 300-350 DEG C for 1-5 hours, and carrying out pre-recovery annealing and air cooling; and (S4) the profile obtained after pre-recovery annealing is subjected to heat preservation for 10-30 hours at the temperature of 200-250 DEG C, low-temperature stable annealing and air cooling are conducted, a final product is obtained, the annealing temperature after hot extrusion is controlled to be below the recrystallization starting temperature, the material is guided to be subjected to the recovery process instead of the recrystallization process, and a matrix structure with fine subcrystals with the average size being 0.5-2.0 micrometers as a main body is successfully constructed.

The invention belongs to the technical field of metal composite material preparation, and relates to an interface strengthening magnesium alloy based on LPSO phase in-situ generation as well as a preparation method and application of the interface strengthening magnesium alloy based on LPSO phase in-situ generation, and the interface strengthening magnesium alloy based on LPSO phase in-situ generation comprises a GW103K magnesium alloy plate and an AZ31 magnesium alloy plate which are sequentially laminated and combined, and in the interface area of the GW103K magnesium alloy plate and the AZ31 magnesium alloy plate, one side of the GW103K magnesium alloy plate is provided with a banded structure generated in situ by a 14H-LPSO phase. By combining heterogeneous material interface diffusion and thermal mechanical deformation, controllable construction of an LPSO strengthening phase in a heterogeneous interface preset area is achieved, and the comprehensive mechanical property of the obtained interface strengthened magnesium alloy is excellent.

The present application relates to the technical field of digital twinning, in particular to a building energy consumption simulation and prediction method and system based on digital twinning, comprising the following steps: identifying a step excitation starting time generated by a device state jump, calculating a thermal response lag time of a physical and virtual environment, correcting a thermal inertia parameter according to a time lag deviation to establish a dynamic calibration model, and generating an energy consumption trend prediction sequence in combination with a weather forecast. In the present application, the step time is determined by monitoring the operating state jump, the thermal response lag is calculated in combination with the measured temperature data, the deviation is obtained by comparing the lag time of the virtual environment, the thermal inertia parameter of the digital twinning model is iteratively updated using the deviation, a dynamic calibration mechanism is constructed to eliminate the influence of parameter misalignment, the thermal mechanical behavior of the virtual model is ensured to be highly consistent with the entity building, the predictive simulation is carried out according to the dynamic calibration model, and the scheduling plan and the weather forecast are imported to efficiently generate the building energy consumption trend prediction sequence.

The present invention is relative to a thermal machine (100), operating with a thermal fluid for realizing a thermodynamic cycle, comprising a power unit (1) and a motor circuit (10). The power unit comprises a first operating chamber (3A) and a second operating chamber (3B), housing power transformation organs connected with each other by means of a drive shaft (8). The thermal machine comprises also a lubrication branch (50), operatively active on a casing (2) of the power unit and configured for being affected by a first flow of the thermodynamic fluid for lubricating at least the drive shaft.