The invention discloses a packaging
bonding process basket level
process time accurate control method and a related device, and the method comprises the steps: carrying out the one-to-one mapping of basket physical slot positions and virtual slot positions, and setting the basket level
process time, the batch level
process time and the
single chip level process time; obtaining the
time sequence correlation information of the
wafer in each virtual slot, and dynamically calculating the
processing sequence of each basket under the process time of the basket level, the batch level and the single
wafer level based on a multi-factor
priority scheduling algorithm according to the
time sequence correlation information of the
wafer in each virtual slot; and in the process of
machining according to the
machining sequence of the lifting baskets, the
machining sequence of the lifting baskets, the batches and the single pieces is dynamically adjusted. According to the invention, the
processing sequence of lifting baskets, batches and single wafers is dynamically adjusted, so that the continuity and consistency of the wafers in the production process can be better ensured. By considering the
time sequence association information, the wafer quality difference caused by an improper
processing sequence can be avoided, and the overall product quality is improved.