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1201 results about "Stepper" patented technology

A stepper is a device used in the manufacture of integrated circuits (ICs) that is similar in operation to a slide projector or a photographic enlarger. The term "stepper" is short for step-and-repeat camera. Steppers are an essential part of the complex process, called photolithography, that creates millions of microscopic circuit elements on the surface of tiny chips of silicon. These chips form the heart of ICs such as computer processors, memory chips, and many other devices.

Method and apparatus for controlling photolithography overlay registration

A method for controlling a photolithography process includes providing a wafer having a first grating structure and a second grating structure overlying the first grating structure; illuminating at least a portion of the first and second grating structures with a light source; measuring light reflected from the illuminated portion of the first and second grating structures to generate a reflection profile; determining an overlay error between the first and second grating structures based on the reflection profile; and determining at least one parameter of an operating recipe for a photolithography stepper based on the determined overlay error. A processing line includes a photolithography stepper, a first metrology tool, and a controller. The photolithography stepper is adapted to process wafers in accordance with an operating recipe. The first metrology tool is adapted to receive a wafer having a first grating structure and a second grating structure overlying the first grating structure. The metrology tool includes a light source, a detector, and a data processing unit. The light source is adapted to illuminate at least a portion of the first and second grating structures. The detector is adapted to measure light reflected from the illuminated portion of the first and second grating structures to generate a reflection profile. The data processing unit is adapted to determine an overlay error between the first and second grating structures based on the reflection profile. The controller is adapted to determine at least one parameter of the operating recipe of the photolithography stepper based on the determined overlay error.
Owner:FULLBRITE CAPITAL PARTNERS

Seated stepper

The seated stepper is provided for exercising the lower body. The stepper includes a frame having opposite sides and a longitudinal axis, and a seat attached to the frame. First and second foot lever arrangements are pivotally coupled together on opposite sides of the frame to move alternately in forward and rearward directions towards forward and rearward positions. The foot lever arrangements have linearly moveable right and left foot receptacles adapted to be engaged by an exerciser's feet. First and second motion transfer arrangements are mounted on opposite sides of the frame and coupled to the foot lever arrangements for enabling reciprocating movement of one foot lever arrangement relative to the other foot lever arrangement. A transmission arrangement is mounted on the frame and is operably connected to the first and second motion transfer arrangements. The transmission arrangement includes upper and lower pulley and gear trains in meshing relationship with one another. A resistance structure is mounted to the frame and is operably connected to the transmission arrangement for resisting pivotal movement of each foot lever arrangement in one of the forward and rearward directions. The transmission arrangement enables either of the foot receptacles to be moved and prevents any inertia from the resistance structure from being transferred back to the foot lever arrangements.
Owner:NORTHLAND INDS

Mechanics sensor array calibrating apparatus and working method thereof

The present invention discloses a mechanical sensor array calibration device and the working method thereof. The device comprises locating transmission part and control part which is electrically connected with the locating transmission part; wherein, the locating transmission part comprises calibrated working platform and pressure head testing part; the pressure head testing part is connected with a force sensor through an extension head of a Z-directional linear stepper motor. Using the working method of the device adopts three stepper motors as the driving source; two stepper motors drive the coordinate motion of the slides on the guide rail to finish the location of coordinate point on the working platform; an extension of a linear stepper motor drives the pressure head to exert force on the tested sensor; when the force exerted by the pressure head achieves the set pressure valve, the singlechip collects the output of the tested sensor and the force sensor and the position coordinate of the tested sensor. The present invention is able to execute the choose and configuration of the calibrating mode and process according to the specific sensor array and the specific calibrating demand so as to enlarge the using range of the device.
Owner:ANHUI ZHONGKE BENYUAN INFORMATION TECH CO LTD

Parametric profiling using optical spectroscopic systems

A gallery of seed profiles is constructed and the initial parameter values associated with the profiles are selected using manufacturing process knowledge of semiconductor devices. Manufacturing process knowledge may also be used to select the best seed profile and the best set of initial parameter values as the starting point of an optimization process whereby data associated with parameter values of the profile predicted by a model is compared to measured data in order to arrive at values of the parameters. Film layers over or under the periodic structure may also be taken into account. Different radiation parameters such as the reflectivities Rs, Rp and ellipsometric parameters may be used in measuring the diffracting structures and the associated films. Some of the radiation parameters may be more sensitive to a change in the parameter value of the profile or of the films then other radiation parameters. One or more radiation parameters that are more sensitive to such changes may be selected in the above-described optimization process to arrive at a more accurate measurement. The above-described techniques may be supplied to a track/stepper and etcher to control the lithographic and etching processes in order to compensate for any errors in the profile parameters.
Owner:KLA TENCOR TECH CORP

Double-frequency grating interferometer displacement measurement system

The invention discloses a double-frequency grating interferometer displacement measurement system. The system comprises a double-frequency laser device, an interferometer, a measuring grating and an electrical signal processing portion. The measurement system achieves displacement measurement based on optical grating diffraction, the optical doppler principle and an optical beat frequency principle. The double-frequency laser device transmits double-frequency laser, the laser is divided into reference light and measuring light through a polarizing beam splitter, the measuring light transmits into a position of the measuring grating, positive and negative first-order diffraction occurs, diffraction light and the reference light form a beat frequency signal which contains displacement information in two directions at the position of a light detection unit, and linear displacement output is achieved through signal processing. According to the system, the sub-nanometer-grade or even higher grade of resolution ratio and accuracy can be achieved, and horizontal large-stroke displacement and horizontal displacement can be measured at the same time. The system has the advantages of being insensitive to the environment, high in measuring accuracy, small in volume and light in weight. The system serves as a lithography machine ultraprecise workpiece platform position measurement system, the comprehensive performance of the workpiece platform can be improved.
Owner:TSINGHUA UNIV +1

Cluster tool architecture for processing a substrate

Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, substrates processed in the cluster tool have a more repeatable wafer history, and also the cluster tool has a smaller system footprint. In one embodiment, the cluster tool is adapted to perform a track lithography process in which a substrate is coated with a photosensitive material, is then transferred to a stepper/scanner, which exposes the photosensitive material to some form of radiation to form a pattern in the photosensitive material, which is then removed in a developing process completed in the cluster tool. In track lithography type cluster tools, since the chamber processing times tend to be rather short, and the number of processing steps required to complete a typical track system process is large, a significant portion of the time it takes to process a substrate is taken up by the processes of transferring the substrates in a cluster tool between the various processing chambers. In one embodiment of the cluster tool, the cost of ownership is reduced by grouping substrates together and transferring and processing the substrates in groups of two or more to improve system throughput, and reduces the number of moves a robot has to make to transfer a batch of substrates between the processing chambers, thus reducing wear on the robot and increasing system reliability. In one aspect of the invention, the substrate processing sequence and cluster tool are designed so that the substrate transferring steps performed during the processing sequence are only made to chambers that will perform the next processing step in the processing sequence. Embodiments also provide for a method and apparatus that are used to improve the coater chamber, the developer chamber, the post exposure bake chamber, the chill chamber, and the bake chamber process results. Embodiments also provide for a method and apparatus that are used to increase the reliability of the substrate transfer process to reduce system down time.
Owner:SOKUDO CO LTD

System for scatterometric measurements and applications

Instead of constructing a full multi-dimensional look up table as a model to find the critical dimension or other parameters in scatterometry, regression or other optimized estimation methods are employed starting from a “best guess” value of the parameter. Eigenvalues of models that are precalculated may be stored and reused later for other structures having certain common characteristics to save time. The scatterometric data that is used to find the value of the one or more parameter can be limited to those at wavelengths that are less sensitive to the underlying film characteristics. A model for a three-dimensional grating may be constructed by slicing a representative structure into a stack of slabs and creating an array of rectangular blocks to approximate each slab. One dimensional boundary problems may be solved for each block which are then matched to find a two-dimensional solution for the slab. A three-dimensional solution can then be constructed from the two-dimensional solutions for the slabs to yield the diffraction efficiencies of the three-dimensional grating. This model can then be used for finding the one or more parameters of the diffracting structure in scatterometry. Line roughness of a surface can be measured by directing a polarized incident beam in an incident plane normal to the line grating and measuring the cross-polarization coefficient. The value of the one or more parameters may then be supplied to a stepper or etcher to adjust a lithographic or etching process.
Owner:KLA TENCOR TECH CORP

Reduction of laser speckle in photolithography by controlled disruption of spatial coherence of laser beam

Speckle of a laser beam is reduced by inserting an anti-speckle apparatus in the beam path to disrupt its spatial coherence while maintaining its temporal coherence. In one embodiment, the anti-speckle apparatus is a phase retarder plate bearing periodic optically-coated regions. Transmission or reflection of the beam through coated and uncoated regions causes an internal phase shift of first beam portions relative to second beam portions, thereby disrupting spatial coherence. Size and thickness of the coated regions can be carefully tailored to meet requirements of stepper and scanner equipment manufacturers for maximum allowable spatial coherence expressed as a minimum permissible number of coherent cells across the beam cross-section. An alternative embodiment of an anti-speckle apparatus is a scattering plate bearing a roughened surface. Transmission or reflection of the beam by the roughened surface disrupts the beam's spatial coherence. The correlation length and/or surface height of structures on the roughened surface of the scattering plate may be adjusted to achieve desired divergency and spatial coherence. A liquid matching medium or solid overcoating may be contacted with the roughened surface to adjust the index of refraction at the interface with the roughened surface. The anti-speckle apparatus may serve to outcouple the laser beam, as well, and a fly eye lens may be positioned after the anti-speckle appartus.
Owner:COHERENT GMBH
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