119 results about "Error map" patented technology

A three dimensional (3D) magnetic resonance imaging (MRI) system (100) performs object-induced geometric distortion correction. The MRI system performs (202) a 3D MRI pulse sequence to acquire a first 3D MR image of an examination region containing at least a portion of a subject and performs (202) the 3D MRI pulse sequence a second time to acquire a second 3D MR image of the examination region A computer system (110) computes (210) a voxel error map based on a phase difference between the first and second 3D MR images and corrects (212) voxel positions in one of the 3D MR images in accordance with the voxel error map.

Validating the error map of a CMM using a calibrated probe including a stylus, the probe capable of rotation about at least one axis, includes placing a calibration artifact on a table of the CMM, the table having an upper surface in an XY plane; positioning a Z-ram of the CMM in a first calibration position and a second calibration position with respect to the artifact such that the stylus contacts the artifact; calculating a measured value representing the measured length between the first and second calibration positions; calculating a nominal value based on the length of the stylus of the probe; comparing the nominal value to the measured value; and updating the error map of the CMM if the measured value differs from the nominal value by more than a predetermined value. The probe and / or the stylus moves relative to the Z-ram such that the calibration artifact remains stationary while the Z-ram is positioned in the first calibration position and the second calibration position.

An automated dimensional inspection system is provided that modifies sensor planning based on real-time measurement feedback. The dimensional inspection system includes a sensor planner, an error map generator, and a sensor affixed to a movable member. The sensor planner is adapted to receive three dimensional design data for a workpiece to be measured and generate path data in part based on the dimensional design data for the workpiece, where the path data is indicative of a path for moving the sensor in relation to the surface of the workpiece. The error map generator is adapted to receive the dimensional design data and the three dimensional measurement data for the workpiece, and determine error data between the measurement data and the dimensional design data. Based on the error data, the sensor planner is able to further modify the path data for the sensor to increase the measurement accuracy.

A series of nominally identical production workpieces is measured on a measuring apparatus. To correct for temperature variations, one of the workpieces forms a master artefact, the dimensions of which are known. The artefact is measured on the measuring apparatus at two or more temperatures, producing two or more corresponding sets of measured dimensional values of the master artefact at the respective temperatures. One or more error maps, look-up tables, or functions are generated which relate the measured dimensional values of the artefact to the known dimensions of the artefact. The error map(s), look-up table(s) or function(s) are dependent on the respective temperatures at which the artefact was measured. Correction values derived from the error map(s), look-up table(s) or function(s) are used to correct the measurements of production workpieces in the series. These correction values are determined in dependence upon the temperature at which the workpiece measurements were obtained.

A block-based image compression method and encoder / decoder circuit compresses a plurality of pixels having corresponding original color values and luminance values in a block according to different modes of operation. The encoding circuit includes a luminance-level-based representative color generator to generate representative color values for each of a plurality of luminance levels derived from the corresponding luminance levels to produce at least a block color offset value and a quantization value. According to mode zero, each of the pixels in the block is associated with one of the plurality of generated representative color values to generate error map values and a mode zero color error value. According to mode one, representative color values for each of at least three luminance levels are also generated to produce at least three representative color values, corresponding bitmap values and a mode one color error value. A mode based compressed data generator is capable of operating in mode zero and / or one and produces block color mode zero data when the mode zero color error value is less than the mode one color error value, otherwise block color mode one data.

A system and method that enables testing of circuitry using an externally generated signature. An external tester is arranged external to a device under test (DUT). Such external tester is operable to input test data to the DUT, receive output data from the DUT, and generate a signature for at least a portion of such received output data. The external tester compares the generated signature with an expected signature to determine whether the DUT is functioning as expected. If the generated signature fails to match an expected signature, then error data can be written to an error map log. Preferably, further interaction with the DUT is not required after detecting that a generated signature fails to match an expected signature in order to perform such error evaluation. Thus, error evaluation can be performed concurrently with testing of the DUT. Mask data may be stored in a compressed form, and decompressed and used for masking certain non-deterministic output bits in generating the signature.

A series of nominally identical workpieces is received from a manufacturing process and measured on a measuring apparatus. They are received at a non-ambient temperature because of heat introduced during the manufacturing process, but they are placed on the measuring apparatus in a repeatable manner, e.g. by a robot, such that their non-ambient temperatures when measured are repeatable. One of the workpieces is measured as a reference workpiece at the non-ambient temperature, and these measurements are compared to calibrated values obtained from an external source, in order to generate an error map or error function. The error map or error function is used to correct measurements of subsequent workpieces of the series which are measured at the repeatable non-ambient temperature.

A tomogram taken on an imaging path of a tomograph is corrected by using sets of tomogram correction data for neighbouring positions on that path, in an interpolative process. An error map of a tomograph is built up by comparing tomograms of a phantom with the expected appearance of the phantom at the tomogram positions. Also provided is a phantom having a body with one or more imaging fluid receptacles formed therein.

An automated dimensional inspection system is provided that modifies sensor planning based on real-time measurement feedback. The dimensional inspection system includes a sensor planner, an error map generator, and a sensor affixed to a movable member. The sensor planner is adapted to receive three dimensional design data for a workpiece to be measured and generate path data in part based on the dimensional design data for the workpiece, where the path data is indicative of a path for moving the sensor in relation to the surface of the workpiece. The error map generator is adapted to receive the dimensional design data and the three dimensional measurement data for the workpiece, and determine error data between the measurement data and the dimensional design data. Based on the error data, the sensor planner is able to further modify the path data for the sensor to increase the measurement accuracy.

A reticle consisting of a 2-dimensional array of standard overlay targets is exposed several times onto a photoresist coated silicon wafer using a photolithographic scanner. Next, the overlay targets are measured for placement error using a conventional overlay metrology tool. The resulting overlay error data is then fed into a software program that generates the lens contribution to the intra-field error map for the photolithographic projection scanning system.

A projection lens distortion error map is created using standard overlay targets and a special numerical algorithm. A reticle including a 2-dimensional array of standard overlay targets is exposed several times onto a photoresist coated silicon wafer using a photolithographic stepper. After exposure, the overlay targets are measured for placement error using a conventional overlay metrology tool. The resulting overlay error data is then supplied to a software program that generates a lens distortion error map for the photolithographic projection system.

A method of calibrating an angular measurement scale in a motorised articulated scanning head (16) using a reference artefact (40; 60; 80) is described. The method comprises the step of rotating a surface sensing device, such as a scanning probe (28), mounted on the scanning head (16) about at least one axis (A1, A2) of the scanning head (16) to move the surface sensing device into a plurality ofdifferent angular orientations relative to the reference artefact (40; 60; 80). A step is then performed of measuring, with the surface sensing device, at least one property of the reference artefact(40; 60; 80) at each of the different angular orientations. An error map or function is then created for at least one measurement scale of the scanning head using the properties of the reference artefact (40; 60; 80) measured and optionally known or calibrated properties of that reference artefact (40; 60; 80). The method may comprise use of co-ordinate positioning apparatus, such as a co-ordinate measuring machine (14), to move the scanning head (16). The reference artefact (40; 60; 80) may comprise a single feature or an array of features (46; 66).

Methods are described for measuring series of nominally identical production workpieces on a dimensional measuring apparatus such as a coordinate measuring machine. One master workpiece of the series is calibrated, to provide correction values which are used to build an error map of the measuring apparatus. This map is used to correct measurements not only of subsequent nominally identical workpieces of the same series, but also of multiple different subsequent series of different workpieces. Each subsequent series also has a master workpiece which is calibrated and used to further build the error map. As this process is repeated over time, the error map becomes more and more densely populated. In due course, it becomes possible to dispense with the use of a calibrated master workpiece, because measurements can be corrected using error values which already exist in the error map.

Validating the error map of a CMM using a calibrated probe including a stylus, the probe capable of rotation about at least one axis, includes placing a calibration artifact on a table of the CMM, the table having an upper surface in an XY plane; positioning a Z-ram of the CMM in a first calibration position and a second calibration position with respect to the artifact such that the stylus contacts the artifact; calculating a measured value representing the measured length between the first and second calibration positions; calculating a nominal value based on the length of the stylus of the probe; comparing the nominal value to the measured value; and updating the error map of the CMM if the measured value differs from the nominal value by more than a predetermined value. The probe and / or the stylus moves relative to the Z-ram such that the calibration artifact remains stationary while the Z-ram is positioned in the first calibration position and the second calibration position

A system for generating and utilizing a look-up mechanism consisting of one or more phase difference error maps, tables and / or mathematical models calculates the respective maps, tables and / or models by placing a short baseline or ultra-short baseline antenna array in a known location and known orientation, determining angles of incidence of incoming GNSS satellite signals with respect the antenna array and calculating expected carrier phase differences between respective pairs of antennas, calculating measured carrier phase differences between the respective pairs of antennas, and determining carrier phase difference errors using the expected and measured carrier phase differences. The carrier phase difference errors are then recorded in the look-up mechanism, with the maps and, as appropriate, look-up tables for the respective pairs of antennas being indexed by angles of incidence. Thereafter, the system utilizes the look-up mechanism when determining the unknown orientation of the antenna structure. For respective pairs of antennas, the system enters the look-up mechanism based on angles of incidence determined from a calculated orientation, and uses the retrieved values in the calculation of a corrected orientation, to compensate for phase distortion.

A self-calibration method and apparatus for on-axis rotary encoders comprising the steps of: receiving output signals from a detector during a spindle-free response period, the signals including a plurality of data sets wherein each data set comprises the periods between sampling events occurring in one revolution of the encoder at an angular speed, selecting a data set pair from the output signals, wherein the data set pair contains two linearly uncorrelated data sets; defining a model of the angular distances between each sampling event occurring in one revolution of the encoder as a function of one or more damping coefficients and the periods between each sampling event as contained in the data set pair; solving the model for the angular distances for the data set pair using circular closure and dynamic reversal techniques; and establishing an encoder error map using the selected solved angular distances from the model.

A wafer stage overlay error map is created using standard overlay targets and a special numerical algorithm. A reticle including a 2-dimensional array of standard overlay targets is exposed several times onto a photoresist coated silicon wafer using a photolithographic exposure tool. After exposure, the overlay targets are measured for placement error using a conventional overlay metrology tool. The resulting overlay error data is then supplied to a software program that generates a 2-dimensional wafer stage distortion and yaw overlay error map.

Embodiments of the disclosure provide methods and system for correcting lithographic film stress / strain variations on a semiconductor substrate using laser energy treatment process. In one embodiment, a method for correcting film stress / strain variations on a substrate includes performing a measurement process in a metrology tool on a substrate to obtain a substrate distortion or an overlay error map, determining dose of laser energy in a computing system to correct film stress / strain variations or substrate distortion based on the overlay error map, and providing a laser energy treatment recipe to a laser energy apparatus based on the dose of laser energy determined to correct substrate distortion or film stress / strain variations.

Methods are described for measuring series of nominally identical production workpieces on a dimensional measuring apparatus such as a coordinate measuring machine. One master workpiece of the series is calibrated, to provide correction values which are used to build an error map of the measuring apparatus. This map is used to correct measurements not only of subsequent nominally identical workpieces of the same series, but also of multiple different subsequent series of different workpieces. Each subsequent series also has a master workpiece which is calibrated and used to further build the error map. As this process is repeated over time, the error map becomes more and more densely populated. In due course, it becomes possible to dispense with the use of a calibrated master workpiece, because measurements can be corrected using error values which already exist in the error map.

Embodiments of the present invention enable fault detection in a printed dot-pattern image. Certain applications of the present invention are its use in various embodiments of a system for inspection of a printed circuit board (“PCB”) substrate. In embodiments, a generated distortion map is based on a comparison of a reconstructed dot-pattern image, a simulated reference bitmap, and an error map representing differences between the reconstructed dot-pattern image and the reference bitmap. In embodiments, the pixels of the distortion map are color coded to identify the locations and types of aberrations that were discovered as a result of the comparison.

A signal evaluation method according to the present invention is a method for evaluating a read signal, retrieved from an information recording medium, based on a binarized signal generated from the read signal by a PRML method. The method includes the steps of: detecting the patterns of multiple paths associated with the binarized signal and merging into the same state; getting the ideal value of a correct pattern associated with the binarized signal and that of an erroneous pattern that is similar to, but different from, the correct pattern; calculating the difference between a distance from the ideal value of the correct pattern to the read signal and a distance from that of the erroneous pattern to the read signal; calculating, based on the difference, an expected error rate for each predetermined group of patterns by the PRML method; and calculating a standard deviation that is associated with a total error rate, which is obtained by adding together the error rates of the predetermined groups of patterns, and that is used for evaluating the read signal.

A method and system for enterprise memory management of memory modules of a computer system. The method includes scanning memory chips of a memory module for errors, analyzing a scrub error map corresponding to a scrubbing operation of the memory module, generating a scrub map summary based upon the scrub error map analyzed, creating an error history map by adding the scrub map summary generated, analyzing the error history map created and tracking a chip location for each memory chip of the memory module including errors, and determining a scrubbing algorithm of the memory module based on the analyzed error history map. The enterprise memory management system includes a plurality of computers each including memory modules, and an enterprise memory manager which collects and analyzes error history maps corresponding to each computer and determines a scrubbing algorithm of the memory modules of each computer.

A self-calibration method and apparatus for on-axis rotary encoders comprising the steps of: receiving output signals from a detector during a spindle-free response period, the signals including a plurality of data sets wherein each data set comprises the periods between sampling events occurring in one revolution of the encoder at an angular speed, selecting a data set pair from the output signals, wherein the data set pair contains two linearly uncorrelated data sets; defining a model of the angular distances between each sampling event occurring in one revolution of the encoder as a function of one or more damping coefficients and the periods between each sampling event as contained in the data set pair; solving the model for the angular distances for the data set pair using circular closure and dynamic reversal techniques; and establishing an encoder error map using the selected solved angular distances from the model.

A call distribution system, suitable for use in a network supporting a telemarketing call center, maintains call counts at a global data server and at a number of transaction servers which are connected in common to the global data server. A choice is made of either the global count or the local count to be used in addressing a distribution map which determines the destination for a particular call. The distribution map may be a minimum error map which minimizes the deviation from a planned distribution ratio wherever a call sequence is terminated.

Embodiments of the disclosure provide apparatus and methods for localized stress modulation for overlay and edge placement error (EPE) using electron or ion implantation. In one embodiment, a process for correcting overlay error on a substrate generally includes performing a measurement process in a metrology tool on a substrate to obtain a substrate distortion or an overlay error map, determining doping parameters to correct overlay error or substrate distortion based on the overlay error map, and providing a doping recipe to a doping apparatus based on the doping parameters determined to correct substrate distortion or overlay error. Embodiments may also provide performing a doping treatment process on the substrate using the determined doping repair recipe, for example, by comparing the overlay error map or substrate distortion with a database library stored in a computing system.