8124 results about "Memory module" patented technology

Chip stacks with decreased conductor length and improved noise immunity are formed by laser drilling of individual chips, such as memory chips, preferably near but within the periphery thereof, and forming conductors therethrough, preferably by metallization or filling with conductive paste which may be stabilized by transient liquid phase (TLP) processes and preferably with or during metallization of conductive pads, possibly including connector patterns on both sides of at least some of the chips in the stack. At least some of the chips in the stack then have electrical and mechanical connections made therebetween, preferably with electroplated solder preforms consistent with TLP processes. The connections may be contained by a layer of resilient material surrounding the connections and which may be formed in-situ. High density circuit packages thus obtained may be mounted on a carrier by surface mount techniques or separable connectors such as a plug and socket arrangement. The carrier may be of the same material as the chip stacks to match coefficients of thermal expansion. High-density circuit packages may also be in the form of removable memory modules in generally planar or prism shaped form similar to a pen or as a thermal conduction module.

A memory module controller for providing interface between a system memory controller and a plurality of memory devices on a memory module. The memory module includes first interface circuitry and control logic. The first interface circuitry is configured to receive from the system memory controller a first memory transaction in a first format. The control logic is coupled to the first interface circuitry and configured to convert the first memory transaction into a second memory transaction in a second format for the plurality of memory devices. The second format of the second memory transaction is different than the first format of the first memory transaction.

A Small Computer System Interface (SCSI) transport for fabric backplane enterprise servers provides for local and remote communication of storage system information between storage sub-system elements of an ES system and other elements of an ES system via a storage interface. The transport includes encapsulation of information for communication via a reliable transport implemented in part across a cellifying switch fabric. The transport may optionally include communication via Ethernet frames over any of a local network or the Internet. Remote Direct Memory Access (RDMA) and Direct Data Placement (DDP) protocols are used to communicate the information (commands, responses, and data) between SCSI initiator and target end-points. A Fibre Channel Module (FCM) may be operated as a SCSI target providing a storage interface to any of a Processor Memory Module (PMM), a System Control Module (SCM), and an OffLoad Module (OLM) operated as a SCSI initiator.

In a memory module including a plurality of DRAM chips which transmit/receive a system data signal with a predetermined data width and at a transfer rate and which transmit/receive an internal data signal having a larger data width and a lower transfer rate as compared with the system data signal, it has become clear that there is a restriction on the transfer rate of the system data signal and that speeding-up cannot be expected. A current consumption in a plurality of DRAMs constituting the memory module is large, and this is also a factor for hindering the speeding-up. There is obtained a memory module in which a plurality of DRAM chips are stacked on an IO chip and in which each DRAM chip is connected to the IO chip by a through electrode and which comprises a constitution for mutually converting the system data signal and the internal data signal in each DRAM chip by the IO chip. In this constitution, a wiring between the DRAM chips can be shortened, and DLL having a large current consumption may be disposed only on the IO chip.

A computer system includes a controller coupled to a plurality of memory modules each of which includes a memory hub and a plurality of memory devices divided into a plurality of ranks. The memory hub is operable to configure the memory module to simultaneously address any number of ranks to operate in a high bandwidth mode, a high memory depth mode, or any combination of such modes.

A system for interfacing with a co-processor or input/output device is disclosed. According to one embodiment, the system includes a computer processing unit, a memory module, a memory bus that connects the computer processing unit and the memory module, and a co-processing unit or input/output device, wherein the memory bus also connects the co-processing unit or input/output device to the computer processing unit.

Integrated circuits utilizing standard commercial packaging are arranged on a printed circuit board to allow the production of 1-Gigabyte and 2-Gigabyte capacity memory modules. A first row of integrated circuits is oriented in an opposite orientation to a second row of integrated circuits. The integrated circuits in a first half of the first row and in the corresponding half of the second row are connected via a signal trace to a first register. The integrated circuits in a second half of the first row and in the corresponding half of the second row are connected to a second register. Each register processes a non-contiguous subset of the bits in each data word.

A computer system includes a plurality of memory modules that contain semiconductor memory, such as DIMMs. The system includes a host/data controller that utilizes an XOR engine to store data and parity information in a striped fashion on the plurality of memory modules to create a redundant array of industry standard DIMMs (RAID). The host/data controller also interleaves data on a plurality of channels associated with each of the plurality of memory modules. The system implements error interrupt control, ECC error reporting, cartridge error power down procedures in response to command errors, storage of error information in unused segments of each DIMM, hot-pug procedure indicator and remote tagging capabilities of memory cartridges and DIMMs.

A system and method for creating an integrated digital media management and reproduction device comprised of a database with key data values for a plurality of records, and a module with search controls that include sets of compound parallel attribute queries that can execute instructions for a data category, and concurrently retrieve and display records across a plurality of related categories—thereby revealing the associations between discrete records. The invention also has a plurality of software instantiated media players which, through instructions managed by a “master container” design, function as if they were dynamically aware of user actions and the quantifiable states of each other player object—and respond according to logic rules, visually guiding event workflow. The system has a memory module for storing query information, a processor configured to retrieve data, a display unit for retrieved data and a digital-to-analog converter for providing capability for connection to loudspeakers.

An integrated circuit to serialize local data and selectively merge it with serialized feed-through data into a serial data stream output that includes a parallel-in-serial-out (PISO) shift register, a multiplexer, and a transmitter. The PISO shift register serializes parallel data on a local data bus into serialized local data. The multiplexer selectively merges serialized local data and feed-through data into a serial data stream. The transmitter drives the serial data stream onto a serial data link. In another embodiment of the invention, a method for a memory module includes receiving an input serial data stream; merging local frames of data and feed-through frames of data together into an output serial data stream in response to a merge enable signal; and transmitting the output serial data stream on a northbound data output to a next memory module or a memory controller. Other embodiments of the invention are disclosed and claimed.

A modular electronic assembly for integration with a pneumatic tire includes a mounting patch, a power source, and at least one electronic device supported by a substrate. The mounting patch is preferably adapted for positioning on the inner liner of a pneumatic tire, and the power source is at least partially embedded in the mounting patch. Such embedded positioning of the battery results in an overall structure with a lower center of gravity than previous tire electronics assemblies, thus having increased mechanical stability and survivability in a tire environment. Electronic device(s) supported on the substrate may receive power from the power source, which in some embodiments corresponds to one or more batteries. The substrate supporting the at least one electronic device may be attached to the mounting patch by a variety of fashions. Exemplary attachment configurations may correspond to an adhesive layer, a hook and loop tape combination, or physical interconnection via terminals extending from the power source through the support substrate. Exemplary electronic devices may include such components as condition-responsive devices including transducers, acoustic devices, sensors, etc. for sensing certain environmental conditions such as temperature and/or pressure, tire revolution counters, vehicle speed sensors, sidewall deflection sensors, tire displacement sensors, microprocessors, memory modules, RFID transponders, light assemblies, data transmitters and/or receivers, and power, supply components. Selected of the electronic devices (including one or more antennas associated with any RF devices) may be encapsulated by a non-conductive rubber or elastic material to facilitate effective transmission characteristics. Conductive springs, flexible conductive elastomer or fatigue-resistance metal may be used to interconnect various electronic components (such as an RF device to an antenna).

A memory module includes an array of N memory devices, each memory device having M data pins, where N is greater than M, and M and N are positive integers; and N bit lines traversing the array of N memory devices, such that each one of the N bit lines is connected to M of the N memory devices.

One embodiment sets forth an interface circuit configured to manage refresh command sequences that includes a system interface adapted to receive a refresh command from a memory controller, clock frequency detection circuitry configured to determine the timing for issuing staggered refresh commands to two or more memory devices coupled to the interface circuit based on the refresh command received from the memory controller, and at least two refresh command sequence outputs configured to generate the staggered refresh commands for the two or more memory devices