14296 results about "Backplane" patented technology

A device includes a backplane and a plurality of elements arranged on the backplane. The plurality of elements form an irregular pattern. The backplane includes a plurality of circuits. The plurality of elements are coupled to the plurality of circuits by conductive vias that are regularly spaced.

Methods, apparatus, devices, subsystems, and systems for holographically displaying three-dimensional objects are provided. In one aspect, a system includes a display and a controller. The display includes: a backplane having a plurality of circuits and a plurality of display elements arranged on the backplane. The plurality of display elements form an irregular pattern. Each of the plurality of display elements is coupled to a respective circuit of the plurality of circuits. The controller is coupled to the display and configured to transmit at least one control signal to at least one display element of the display for modulating at least one property of the at least one display element.

Methods, apparatus, devices, subsystems, and systems for holographically displaying three-dimensional objects are provided. In one aspect, a system includes a display and a controller. The display includes: a backplane having a plurality of circuits and a plurality of display elements arranged on the backplane. The plurality of display elements form an irregular pattern. Each of the plurality of display elements is coupled to a respective circuit of the plurality of circuits. The controller is coupled to the display and configured to transmit at least one control signal to at least one display element of the display for modulating at least one property of the at least one display element.

Methods, apparatus, devices, subsystems, and systems for holographically displaying three-dimensional objects are provided. In one aspect, a system includes a display and a controller. The display includes: a backplane having a plurality of circuits and a plurality of display elements arranged on the backplane. The plurality of display elements form an irregular pattern. Each of the plurality of display elements is coupled to a respective circuit of the plurality of circuits. The controller is coupled to the display and configured to transmit at least one control signal to at least one display element of the display for modulating at least one property of the at least one display element.

Methods, apparatus, devices, subsystems, and systems for holographically displaying three-dimensional objects are provided. In one aspect, a system includes a display and a controller. The display includes: a backplane having a plurality of circuits and a plurality of display elements arranged on the backplane. The plurality of display elements form an irregular pattern. Each of the plurality of display elements is coupled to a respective circuit of the plurality of circuits. The controller is coupled to the display and configured to transmit at least one control signal to at least one display element of the display for modulating at least one property of the at least one display element.

Methods, apparatus, devices, subsystems, and systems for holographically displaying three-dimensional objects are provided. In one aspect, a system includes a display and a controller. The display includes: a backplane having a plurality of circuits and a plurality of display elements arranged on the backplane. The plurality of display elements form an irregular pattern. Each of the plurality of display elements is coupled to a respective circuit of the plurality of circuits. The controller is coupled to the display and configured to transmit at least one control signal to at least one display element of the display for modulating at least one property of the at least one display element.

The present invention relates to the field of semiconductor carrier technology, and in particular to a wafer box with a protective limiting device, which includes a bottom plate, a wafer storage box, a box cover, and a limiting assembly. The limiting assembly includes a limiting seat, a top assembly, a rotating plate, a limiting frame, and a rotating wheel. The limiting seat includes a connecting cross bar, a connecting arm, and a top blocking plate. The top assembly includes a connecting portion, a top protrusion, a connecting rod, a tensile sheet, and a reinforcing rib. Compared with the prior art, the present invention is provided with the wafer storage box for inserting wafers, and the limiting assembly is provided to top the wafers, thereby effectively preventing the wafers from being damaged. At the same time, by providing the top assembly, the top action has a protective limit, thereby preventing the rigid top from damaging the wafers. By providing the wafer storage box for loading 6-inch wafers, the cooperation of the fixing portion and the fixing assembly enables 6-inch wafers to be transported on an 8-inch wafer production line.

The invention discloses an internet of things multi-protocol fusion limo intelligent control system, which relates to the field of limo intelligent control and comprises a hardware irrelevant layer, a multi-protocol adaptation layer, a data abstraction layer, a programmable logic layer, a security and redundancy mechanism and an edge AI module. According to the invention, a physical bus is packaged into an independent module, an MCU / SoC and a protocol transceiver are built in, hot plugging is realized through a standardized PC I e / EdgeConn backboard, a core processing board only exposes a unified backboard interface, module drive localization execution is realized, master control firmware does not need to sense protocol details, only the module needs to be replaced when a protocol is newly added, and the master control firmware or upper software does not need to be modified. The defect that the whole vehicle firmware needs to be refreshed when a bus is replaced in a traditional system is overcome, each protocol corresponds to an independent drive micro-service deployed in a containerization mode, the drive micro-service analyzes a message into a unified data model and uploads the unified data model to a data abstraction layer, a downlink control instruction is packaged and issued according to a target protocol, and it is guaranteed that the protocols are diversified and interfaces are consistent.

An automatic device for automatically assembling a retainer ring, which relates to the field of product assembly. The automatic device comprises a housing clamping mechanism and a retainer ring transition mechanism, which are fixed to an apparatus bottom plate. The housing clamping mechanism comprises a platform base fixed to the apparatus bottom plate and a clamping assembly arranged on the platform base, the clamping assembly being configured to clamp and fix a connector to the platform base. The retainer ring transition mechanism comprises a first transition block and a first driving mechanism, wherein a transition hole is provided in the first transition block; the inner diameter D1 of the top of the transition hole is greater than the outer diameter of a retainer ring, the inner diameter D2 of the bottom of the transition hole is smaller than the outer diameter of the retainer ring, and a tapered hole section with the inner diameter gradually being reduced is present between the top and the bottom of the transition hole, such that the diameter of the transition hole transitions downwards to D2; and the first transition block is driven by the first driving mechanism to move to a position above the platform base, such that the retainer ring directly faces an engagement slot of the connector. The automatic device solves the problems of low speed and low efficiency of when a retainer ring is mounted, and has the advantages of good assembly quality and high assembly efficiency.

The invention discloses a cable structure strength detection device and method, and relates to the field of cable structure detection.The cable structure strength detection device comprises a bottom plate, a plurality of supporting pieces are arranged at the upper end of the bottom plate, a main plate is arranged at the upper ends of the supporting pieces jointly, side plates are symmetrically arranged on the two sides of the main plate, and a lead screw is rotationally connected between the side plates jointly; the clamping assembly is arranged on the lead screw and used for clamping the cable. Through mutual cooperation of a limiting plate and a second air bag, air in the second air bag uniformly enters the first air bag through a communicating pipe, the air in the first air bag is increased, the air pressure in the first air bag is increased to apply pressure to the surface of the cable, and in the process of stretching the cable, the larger the stretching distance is, the larger the pressure to the surface of the cable is. Meanwhile, the surface of the cable can be prevented from being damaged through clamping of the first air bag, the accuracy of a cable detection result is improved, and pulling force is indirectly applied to the cable through the clamping plate.

The invention discloses a quality management and control system for fabricated decoration construction, and the system comprises a sensing layer which constructs a multi-modal data collection network, carries out the three-dimensional real-time data synchronous collection through combining logistics API docking and an OCR recognition system, and constructs a construction process digital twin bottom plate; in the edge calculation layer, an edge node carries out lightweight processing on the original data; the cognitive layer is used for calling a Prolog rule through a process knowledge graph engine to reasone the feature snapshots, carrying out defect instant diagnosis and dynamic constraint propagation, outputting a root cause path with probability weight through three-stage verification, and quantifying intervention influence; the decision-making layer is used for constructing a dynamic prediction model based on a bidirectional LSTM and an attention mechanism, automatically activating a compensation mode when key interference is detected in combination with an anti-fact memory bank and a case-based reasoning compensator, and generating an alternative scheme of optimal cost / optimal construction period / comprehensive balance through a multi-target optimizer; and in the application layer, a Unity engine is utilized to develop the digital twinborn billboard.

The invention relates to an LED display device based on vertical stacking and a preparation method thereof, the display device comprises a driving backboard and a mother pixel, the mother pixel comprises a plurality of sub-pixels, one of a first type of electrode contact and a second type of electrode contact on the driving backboard is a common-pole contact, and the other one is a non-common-pole contact; the electric connectors comprise common-pole conductive parts and non-common-pole conductive parts, the non-common-pole conductive parts are configured to be electrically connected to the first ends of the corresponding sub-pixels and electrically connected with the corresponding non-common-pole contacts, and the common-pole conductive parts are configured to be electrically connected to the second ends of the sub-pixels and electrically connected with the common-pole contacts to form a common-pole structure; each of the copolar conductive part and the non-copolar conductive part comprises an interconnection conductive part, the interconnection conductive parts are located in the corresponding pixel layers, at least one interconnection conductive part comprises a core body, the core body is a compound semiconductor, and the core body is located in the first inner fence. The invention further discloses a preparation method. The production efficiency and quality of the LED display device can be improved.

The invention discloses a polishing device and method for removing burrs at an outer port of a blind hole of a circuit board, and relates to the technical field of polishing burrs at an outer port of an inner blind hole of the circuit board, the polishing device comprises a guide column, a mounting seat and a lifting oil cylinder which are sequentially and fixedly arranged on a bottom plate from left to right, and a positioning groove is formed in the top surface of the mounting seat; two polishing mechanisms are arranged on the lifting plate, the polishing mechanism located on the left side comprises a center rod welded to the bottom surface of the lifting plate, a sleeve welded to the outer cylindrical surface of the center rod and a driven gear rotationally installed outside the sleeve, and a plugging head is fixedly arranged at the bottom of the center rod; the driven gear of the grinding mechanism on the left side is meshed with the driven gear of the grinding mechanism on the right side, and the driven gear of the grinding mechanism on the right side is further connected with a driving assembly. The grinding device has the beneficial effects that the grinding quality is greatly improved, and the grinding efficiency is greatly improved.

A tray comprising a bottom panel defining a first bottom panel side, a second bottom panel side, a first bottom panel end, and a second panel bottom end; a first side panel extending upward from the first bottom panel side and a second side panel extending upward from the second bottom panel side; a first wing extending downward from the first side panel and a second wing extending downward from the second side panel; a first end panel arranged laterally between the first side panel and the second side panel, and a second end panel arranged laterally between the first side panel and the second side panel; wherein each of the first wing and the second wing are configured to engage at least one of the first end panel and the second end panel and support the bottom panel above a support surface.

A system includes a housing and a first circuit board positioned inside the housing. The housing has a top panel, a bottom panel, a left side panel, a right side panel, a front panel, and a rear panel. The front panel is at an angle relative to the bottom panel in which the angle is in a range from 30 to 150°. The first circuit board has a length, a width, and a thickness, in which the length is at least twice the thickness, the width is at least twice the thickness, and the first circuit board has a first surface defined by the length and the width. The first surface of the first circuit board is at a first angle relative to the bottom panel in which the first angle is in a range from 30 to 150°. The first surface of the first circuit board is substantially parallel to the front panel or at a second angle relative to the front panel in which the second angle is less than 60°. The system includes a first data processing module and a first optical interconnect module both electrically coupled to the first circuit board. The optical interconnect module is configured to receive first optical signals from a first optical link, convert the first optical signals to first electrical signals, and transmit the first electrical signals to the first data processing module.

The invention relates to the technical field of pole-mounted circuit breakers, and discloses a primary and secondary fusion complete pole-mounted circuit breaker which comprises a shell and further comprises a bottom plate, the shell is arranged on the bottom plate, a first containing groove is formed in the end face, in the length direction, of the bottom plate, a first gradienter is arranged in the first containing groove, and a second gradienter is arranged in the second containing groove. A second containing groove is formed in the end face, in the width direction, of the bottom plate, a second gradienter is arranged in the second containing groove, four supporting legs are arranged below the bottom plate, and an adjusting structure used for adjusting the positions of the supporting legs is arranged on the bottom plate.

A base plate includes a support part, a bottom plate part, and a wall part. The wall part includes a first wall part and a second wall part above the first wall part. The first wall part includes a first wall surface and a support surface spreading from an upper end of the first wall surface to a radially outer side. The second wall part includes a second wall surface and a recess recessed to the radially outer side from the second wall surface. The recess is defined by a space enclosed by a recess wall surface located on the radially outer side of the second wall surface and extending upward from the support surface, a recess top surface connecting from an upper end of the recess wall surface to the second wall surface, and a recess support surface facing the recess top surface in an axial direction.

A universal channel drain fitting that allows an installer to easily and quickly modify the fitting to provide a plurality of fitting functions. The universal fitting has a base with base panel and a leg assembly. The base panel has a panel opening and the leg assembly has a plurality of upwardly extending legs. The base removably supports a top cap, a bottom cap, two end caps and two side caps that each have a plate section and a component section. The legs define a plurality of leg pairs that support the end caps and side caps, the plate section of which are slidably received in slots associated with each leg member. A top cap is secured to the leg assembly and a bottom cap is secured to the panel opening. The component sections block fluid flow or allow fluid to pass in a desired direction through the universal fitting.

The invention provides a wafer testing device capable of being rapidly maintained, and relates to the technical field of semiconductors, the wafer testing device comprises a fixed plate, the fixed plate is provided with a control module, and a power supply module, a probe card, a heating lifting module and at least one testing module which are connected with the control module, and a wafer to be tested is integrally arranged in the probe card. The power supply module is connected with the probe card to supply power to the to-be-tested wafer, a heater and a probe are arranged in the heating lifting module, and the heating lifting module is used for driving the to-be-tested wafer in the probe card to be in contact with the probe and heating the to-be-tested wafer. The test module comprises a bottom plate which is in push-pull connection with the fixed plate along the first direction and a switch array measurement assembly which is arranged on the bottom plate and is in plug-in connection with the bottom plate along the second direction, and the switch array measurement assembly is used for testing different parameters of the to-be-tested wafer when the to-be-tested wafer is in contact with the probe. The switch array measurement assembly is in plug-in connection with the bottom plate, and the bottom plate is in push-pull connection with the fixed plate, thereby facilitating the replacement of the test module, and achieving the quick disassembly and assembly.

The invention discloses a backboard system and a storage system, and relates to the technical field of backboards, the backboard system is provided with a plurality of storage device slots, each storage device slot is provided with a signal multiplexing circuit and a protocol switching processor corresponding to the storage device slot, and the storage device slots are used for plugging a first solid state disk or a second solid state disk. The first solid state disk is a solid state disk based on a first communication protocol, and the second solid state disk is a solid state disk which is directly connected with a host through an interconnection high-speed bus and is based on a second communication protocol; the signal multiplexing circuit is used for sending transmission data of a target communication protocol to the host, and the target communication protocol is a first communication protocol or a second communication protocol; and the protocol switching processor is used for switching the communication protocol of the signal multiplexing circuit according to the pin signal of the protocol identification pin of the corresponding storage equipment slot. The overall efficiency of the storage system can be improved.

Methods, apparatus, devices, subsystems, and systems for holographically displaying three-dimensional objects are provided. In one aspect, a system includes a display and a controller. The display includes: a backplane having a plurality of circuits and a plurality of display elements arranged on the backplane. The plurality of display elements form an irregular pattern. Each of the plurality of display elements is coupled to a respective circuit of the plurality of circuits. The controller is coupled to the display and configured to transmit at least one control signal to at least one display element of the display for modulating at least one property of the at least one display element.

The invention discloses a stamp hole and LGA combined board card, and relates to the technical field of embedding. Comprising a core board and a bottom board, the bottom board is provided with a bonding pad corresponding to the core board in position, and the bonding pad is used for welding the core board and the bottom board; the core board comprises a board card body, and the board card body is provided with a plurality of stamp holes, a plurality of LGA packaging pads, a plurality of LGA special pads, a positioning hole and a shielding cover welding module. The mode of combining the stamp hole and the LGA is used as the connection mode of the core board, and the advantages of the stamp hole and LGA packaging are achieved at the same time.

A handle for securing a tray of a computing system comprises a baseplate and a locking pin. The baseplate can be movably coupled to the tray and be movable between a first position and a second position. The first position prevents removal of the tray and the second position allows removal of the tray. The locking pin extends from the baseplate and can be coupled to a first portion of the tray when the baseplate is in the first position, and a second portion of the tray when the baseplate is in the second position. The locking pin is movable in a first direction relative to the baseplate to be coupled to the first portion of the tray and the second portion of the tray, and a second direction relative to the baseplate to be uncoupled from the first portion of the tray and the second portion of the tray.

The invention belongs to the technical field of valves, and particularly relates to a pneumatic on-off and back-suction integrated valve for quantitative gluing of semiconductors and a working method thereof.The pneumatic on-off and back-suction integrated valve for quantitative gluing of semiconductors comprises a valve body, a back-suction diaphragm and an on-off diaphragm are arranged above and below a flow channel respectively, and a back-suction diaphragm and a back-suction diaphragm are arranged above and below the flow channel respectively; the lower cavity bottom plate is connected with the lower end of the valve body, a lower piston connected with the on-off diaphragm is arranged in the lower cavity bottom plate, and the lower piston drives the on-off diaphragm to ascend through elastic force so as to cut off the flow channel; and the air cylinder body is connected with the upper end part of the valve body, and an upper piston connected with the back-suction diaphragm is arranged in the air cylinder body. And the lower piston descends to squeeze gas in the cavity below the lower piston into the annular cavity below the on-off diaphragm, so that the on-off diaphragm is buffered, and the impact force borne by the on-off diaphragm is reduced.

The invention relates to the technical field of power supply backboards, and discloses a self-adaptive redundancy regulation and control expandable power supply backboard, the backboard main body is internally provided with a plurality of mounting holes in a penetrating manner, the backboard main body comprises a redundancy regulation and control system, and the redundancy regulation and control system comprises a fault detection module, a fault diagnosis module and a control module, the power supply backplane is used for monitoring load data on the power supply backplane in real time and detecting whether a fault occurs; the redundancy calculation module is used for calculating a redundancy index according to the real-time load data; the power supply module regulation and control module is used for regulating the working state of the power supply module according to the redundancy index output by the redundancy calculation module so as to ensure the power supply stability of the system; and the power supply module is mounted on the power supply back plate in a detachable connection manner. By adopting the self-adaptive redundancy regulation and control system of the power supply backboard, the technical effect of intelligently optimizing the power supply load and redundancy configuration is achieved by monitoring and dynamically regulating the working state of the power supply module in real time.

A multi-point synchronous automatic measurement system for lateral deformation of a foundation pit enclosure. The system comprises a pipeline (1), two or more measurement devices (2) and an acquisition and transmission device (3), wherein each measurement device (2) comprises a supporting frame, an inclined rod (23) and a sensor (24); the pipeline (1) is buried into a foundation pit enclosure structure (4), and the pipeline (1) has a rectangular cross-section; oppositely arranged engagement grooves (11) for fixing the supporting frame are provided in the pipeline (1), the engagement grooves (11) are axially arranged to extend along the entire length of the pipeline (1), and a bottom plate is provided at the bottom of the engagement groove (11); the supporting frame comprises four rod members, and adjacent rod members are connected by means of a rotation shaft (25) to form a rectangular structure; the two or more measurement devices (2) are sequentially arranged in the pipeline (1) from bottom to top; the inclined rod (23) is arranged on the diagonal of the supporting frame of each measurement device (2); the sensor (24) for measuring a change in length of the inclined rod (23) is arranged on the inclined rod (23); all the sensors (24) are connected to the acquisition and transmission device (3); and the acquisition and transmission device (3) sends measurement data from each sensor (24) to a cloud server. In this way, multi-point synchronous measurement of lateral deformation of the foundation pit enclosure structure (4) can be realized.

The invention relates to an LED display device based on vertical stacking and a preparation method thereof. The display device comprises a driving backboard and a mother pixel, the mother pixel comprises a plurality of sub-pixels, one of a first type of electrode contact and a second type of electrode contact on the driving backboard is a common-pole contact, and the other one of the first type of electrode contact and the second type of electrode contact on the driving backboard is a non-common-pole contact; the non-common-pole conductive pieces are configured to be electrically connected to the first ends of the corresponding sub-pixels and electrically connected with the corresponding non-common-pole contacts, and the common-pole conductive pieces are configured to be electrically connected to the second ends of the sub-pixels and electrically connected with the common-pole contacts to form a common-pole structure; each of the copolar conductive part and the non-copolar conductive part comprises at least one interconnection conductive part, a compound semiconductor region is arranged in the pixel layer where the interconnection conductive part is located, a backfill hole is formed in the compound semiconductor region, and the backfill hole is filled with the interconnection conductive part. The invention further discloses a preparation method. The stability and reliability of the LED display device can be improved, and the LED display device is more convenient to process.

The utility model provides SMIF box loading equipment, relates to the technical field of semiconductor equipment, and is designed for solving the problem that the posture of a port door cannot meet the high-precision loading requirement of an SMIF box due to the existing SMIF box loading equipment. The SMIF box loading equipment comprises a bearing device, a lifting device and an opening and closing device, the bearing device comprises a back plate, a port door fixedly connected to the back plate and an adjusting assembly used for adjusting the pitching angle and the left-right deflection angle of the back plate 101, and the port door is used for bearing an SMIF box; the lifting device comprises a supporting frame and a detection assembly arranged on the supporting frame, the supporting frame is arranged on the back plate in a lifting mode, and the detection assembly is used for detecting wafer state parameters of the wafer containing cavity when the supporting frame ascends; the opening and closing device is used for separating the box cover from the base plate and connecting the box cover with the supporting frame in a linkage mode and enabling the box cover to be connected with the base plate and separating the box cover from the supporting frame in a linkage mode. By adjusting the posture of the back plate, the port door can meet the high-precision loading requirement of the SMIF box.

A display panel comprises a driving backplane, a first electrode layer, and a separation layer, disposed on the side of the driving backplane same as the first electrode layer. The separation layer includes a support layer and a cutoff layer. Each of the first electrodes is exposed by the support layer. An orthographic projection of the cutoff layer on the driving backplane and an orthographic projection of the first electrode on the driving backplane are spaced apart. The separation layer is includes a cut groove including a first groove located on the support layer and a second groove located on the cutoff layer, and an orthographic projection of at least one side wall of the second groove on the driving backplane is located between orthographic projections of boundaries of two side walls of the first groove away from a surface of the driving backplane on the driving backplane.

The utility model relates to the technical field of electronic components, and discloses an electronic component with a quick-release structure, which comprises an electronic component, a bottom plate is fixedly mounted at the bottom of the electronic component, a movable assembly is arranged in the electronic component and comprises a fixed rod, the fixed rod is fixedly mounted in the electronic component, and the bottom plate is fixedly mounted on the bottom plate. According to the electronic element with the quick disassembly structure, when the electronic element is quickly disassembled, the electronic element can be pressed to drive the fixing rod at the bottom to slide downwards, and when the fixing rod slides downwards, the inserting rod can be driven to slide downwards in the fixing block; therefore, an abutting block on the surface of the inserting rod is driven to abut against a limiting rod in the fixing block, the limiting rod is driven to slide towards the direction away from the inserting rod, limitation of the base plate on the electronic components is relieved, the effect of facilitating maintenance and replacement of the electronic components in the later period is enhanced, and the working efficiency is improved.