8038 results about "Backplane" patented technology

The invention discloses an internet of things multi-protocol fusion limo intelligent control system, which relates to the field of limo intelligent control and comprises a hardware irrelevant layer, a multi-protocol adaptation layer, a data abstraction layer, a programmable logic layer, a security and redundancy mechanism and an edge AI module. According to the invention, a physical bus is packaged into an independent module, an MCU / SoC and a protocol transceiver are built in, hot plugging is realized through a standardized PC I e / EdgeConn backboard, a core processing board only exposes a unified backboard interface, module drive localization execution is realized, master control firmware does not need to sense protocol details, only the module needs to be replaced when a protocol is newly added, and the master control firmware or upper software does not need to be modified. The defect that the whole vehicle firmware needs to be refreshed when a bus is replaced in a traditional system is overcome, each protocol corresponds to an independent drive micro-service deployed in a containerization mode, the drive micro-service analyzes a message into a unified data model and uploads the unified data model to a data abstraction layer, a downlink control instruction is packaged and issued according to a target protocol, and it is guaranteed that the protocols are diversified and interfaces are consistent.

The invention discloses a quality management and control system for fabricated decoration construction, and the system comprises a sensing layer which constructs a multi-modal data collection network, carries out the three-dimensional real-time data synchronous collection through combining logistics API docking and an OCR recognition system, and constructs a construction process digital twin bottom plate; in the edge calculation layer, an edge node carries out lightweight processing on the original data; the cognitive layer is used for calling a Prolog rule through a process knowledge graph engine to reasone the feature snapshots, carrying out defect instant diagnosis and dynamic constraint propagation, outputting a root cause path with probability weight through three-stage verification, and quantifying intervention influence; the decision-making layer is used for constructing a dynamic prediction model based on a bidirectional LSTM and an attention mechanism, automatically activating a compensation mode when key interference is detected in combination with an anti-fact memory bank and a case-based reasoning compensator, and generating an alternative scheme of optimal cost / optimal construction period / comprehensive balance through a multi-target optimizer; and in the application layer, a Unity engine is utilized to develop the digital twinborn billboard.

The invention relates to an LED display device based on vertical stacking and a preparation method thereof, the display device comprises a driving backboard and a mother pixel, the mother pixel comprises a plurality of sub-pixels, one of a first type of electrode contact and a second type of electrode contact on the driving backboard is a common-pole contact, and the other one is a non-common-pole contact; the electric connectors comprise common-pole conductive parts and non-common-pole conductive parts, the non-common-pole conductive parts are configured to be electrically connected to the first ends of the corresponding sub-pixels and electrically connected with the corresponding non-common-pole contacts, and the common-pole conductive parts are configured to be electrically connected to the second ends of the sub-pixels and electrically connected with the common-pole contacts to form a common-pole structure; each of the copolar conductive part and the non-copolar conductive part comprises an interconnection conductive part, the interconnection conductive parts are located in the corresponding pixel layers, at least one interconnection conductive part comprises a core body, the core body is a compound semiconductor, and the core body is located in the first inner fence. The invention further discloses a preparation method. The production efficiency and quality of the LED display device can be improved.

A tray comprising a bottom panel defining a first bottom panel side, a second bottom panel side, a first bottom panel end, and a second panel bottom end; a first side panel extending upward from the first bottom panel side and a second side panel extending upward from the second bottom panel side; a first wing extending downward from the first side panel and a second wing extending downward from the second side panel; a first end panel arranged laterally between the first side panel and the second side panel, and a second end panel arranged laterally between the first side panel and the second side panel; wherein each of the first wing and the second wing are configured to engage at least one of the first end panel and the second end panel and support the bottom panel above a support surface.

The invention relates to the technical field of pole-mounted circuit breakers, and discloses a primary and secondary fusion complete pole-mounted circuit breaker which comprises a shell and further comprises a bottom plate, the shell is arranged on the bottom plate, a first containing groove is formed in the end face, in the length direction, of the bottom plate, a first gradienter is arranged in the first containing groove, and a second gradienter is arranged in the second containing groove. A second containing groove is formed in the end face, in the width direction, of the bottom plate, a second gradienter is arranged in the second containing groove, four supporting legs are arranged below the bottom plate, and an adjusting structure used for adjusting the positions of the supporting legs is arranged on the bottom plate.

The invention discloses a backboard system and a storage system, and relates to the technical field of backboards, the backboard system is provided with a plurality of storage device slots, each storage device slot is provided with a signal multiplexing circuit and a protocol switching processor corresponding to the storage device slot, and the storage device slots are used for plugging a first solid state disk or a second solid state disk. The first solid state disk is a solid state disk based on a first communication protocol, and the second solid state disk is a solid state disk which is directly connected with a host through an interconnection high-speed bus and is based on a second communication protocol; the signal multiplexing circuit is used for sending transmission data of a target communication protocol to the host, and the target communication protocol is a first communication protocol or a second communication protocol; and the protocol switching processor is used for switching the communication protocol of the signal multiplexing circuit according to the pin signal of the protocol identification pin of the corresponding storage equipment slot. The overall efficiency of the storage system can be improved.

The invention discloses a stamp hole and LGA combined board card, and relates to the technical field of embedding. Comprising a core board and a bottom board, the bottom board is provided with a bonding pad corresponding to the core board in position, and the bonding pad is used for welding the core board and the bottom board; the core board comprises a board card body, and the board card body is provided with a plurality of stamp holes, a plurality of LGA packaging pads, a plurality of LGA special pads, a positioning hole and a shielding cover welding module. The mode of combining the stamp hole and the LGA is used as the connection mode of the core board, and the advantages of the stamp hole and LGA packaging are achieved at the same time.

The invention relates to an LED display device based on vertical stacking and a preparation method thereof. The display device comprises a driving backboard and a mother pixel, the mother pixel comprises a plurality of sub-pixels, one of a first type of electrode contact and a second type of electrode contact on the driving backboard is a common-pole contact, and the other one of the first type of electrode contact and the second type of electrode contact on the driving backboard is a non-common-pole contact; the non-common-pole conductive pieces are configured to be electrically connected to the first ends of the corresponding sub-pixels and electrically connected with the corresponding non-common-pole contacts, and the common-pole conductive pieces are configured to be electrically connected to the second ends of the sub-pixels and electrically connected with the common-pole contacts to form a common-pole structure; each of the copolar conductive part and the non-copolar conductive part comprises at least one interconnection conductive part, a compound semiconductor region is arranged in the pixel layer where the interconnection conductive part is located, a backfill hole is formed in the compound semiconductor region, and the backfill hole is filled with the interconnection conductive part. The invention further discloses a preparation method. The stability and reliability of the LED display device can be improved, and the LED display device is more convenient to process.

The invention relates to an LED display device based on vertical stacking and a preparation method thereof, the display device is provided with a driving back plate and a mother pixel, the mother pixel comprises a plurality of sub-pixels, the driving back plate comprises a first type of electrode contacts and a second type of electrode contacts, and electric connecting pieces comprise copolar conductive pieces and non-copolar conductive pieces. Each non-copolar conductive piece corresponds to a different sub-pixel; one of the first type of electrode contacts and the second type of electrode contacts is a common-pole contact, and the other one is a non-common-pole contact; the driving backboard comprises a plurality of non-common-pole contacts, the plurality of non-common-pole contacts are divided into at least two ring groups, and each ring group corresponds to different sub-pixels; the non-co-polar conductive members are configured to be electrically connected to the non-co-polar contacts in the ring groups of the respective corresponding sub-pixels, and the co-polar conductive members are configured to be electrically connected to the co-polar contacts to form a co-polar structure. The invention further discloses a preparation method. According to the invention, the problem of overhigh local current density in the display device is effectively improved, and the reliability and stability of the device are effectively improved.

The invention relates to a cooling device for cooling an electrical and / or electronic assembly (2), said cooling device comprising: a top plate (3) and a bottom plate (4), the bottom plate (4) being a deep-drawn component having a depression (40), the top plate (3) and the bottom plate (4) being arranged such that, due to the depression (40) a cooling channel (5) is formed between the top plate (3) and the bottom plate (4), the top plate (3) and the bottom plate (4) being connected to one another at a contact region (8) outside the depression (40), it being possible for a cooling fluid flow of a cooling fluid to flow through the cooling channel (5) along the longitudinal direction (11), the cooling device (1) also comprising at least one turbulator (6) that is arranged inside a turbulator section (56) of the cooling channel (5). According to the invention, a turbulence portion (61) for generating local turbulence in the flow of the cooling fluid and a blocking region (62) for locally blocking the flow of the cooling fluid are formed on the turbulator (6).

A cooler includes a plurality of protrusions disposed on a top plate surface of a top plate, protruding in a depth direction toward a bottom plate surface of a bottom plate in a flow path of refrigerant formed between the top plate surface and the bottom plate surface, and including first and second protrusions that are spaced apart from each other in a flowing direction in which the refrigerant flows in the flow path, a frame connecting the top plate to the bottom plate and having wall surfaces surrounding the plurality of protrusions, and a wall disposed on the bottom plate surface and protruding in the depth direction, between the first and second protrusions. The wall is respectively connected to a pair of the wall surfaces at opposite ends thereof in a width direction orthogonal to the flowing direction. The wall is spaced apart from the top plate surface.

A primary and secondary fusion complete column-mounted circuit breaker convenient to disassemble and assemble relates to the technical field of electric power engineering and comprises a quick disassembly and assembly mechanism and a quick lifting mechanism. The rapid disassembly and assembly mechanism comprises a triangular support, a pole-mounted circuit breaker, a circuit breaker base, a limiting bottom plate, a sliding rod, a spring, an unfolding assembly and a clamping assembly. The pole-mounted circuit breaker is fixedly installed on the circuit breaker base, a plurality of sliding rods are arranged on the side face of the circuit breaker base, and the sliding rods are in sliding connection with round holes in the limiting bottom plate; during use and installation, the limiting bottom plate can be stretched out and drawn back so as to adapt to the widths of different triangular supports, the circuit breaker base can be stably installed on the triangular supports, meanwhile, after the width, corresponding to the triangular supports, of the limiting bottom plate is adjusted, the clamping plates can slide towards the two sides in a tool-free mode, and the circuit breaker base can be stably installed on the triangular supports. And the round rod on the clamping plate clamps the round hole in the triangular bracket, so that the fixation of the circuit breaker base is completed.

A cooling plate for cooling chip having redundant cooling fluid circulation. A primary fluid cooling loop removes heat directly from the chip. A secondary cooling loop acts as a condenser for two phase cells, thus removing heat from the chip indirectly. The cold plate may be fabricated as two parts: bottom plate and top plate where is the fluid is divided to primary stream to the bottom plate and secondary stream to top cooling plate. Two-phase, self-contained cells may be partly immersed in the primary cooling loop and partly immersed in the secondary loop. Fluid ports circulate cooling fluid by having one orifice coupled to the primary cooling loop and one orifice coupled to the secondary cooling loop.

The invention discloses a multi-wafer photoelectric hybrid chip mounter, and relates to the technical field of chip mounting. The transfer table module is arranged in the middle of the top of the mounting bottom plate, and a visual system module used for calibrating the angle of the chip is mounted on the transfer table module; the plurality of wafer table modules are arranged on the surface of the mounting bottom plate at intervals, and the wafer table modules are used for supporting chips; the chip transfer module is arranged between the transfer table module and at least one wafer table module; according to the invention, the modules are arranged around the transfer table module, after the chip transfer module rotates, chips needing to be calibrated are sent to the transfer table from the wafer table modules, the chip mounting head firstly picks up chips not needing to be calibrated from one of the wafer table modules, then picks up the calibrated chips through the transfer table, and then sends the two kinds of chips to a bonding area together. According to the layout, the module spacing and the chip moving stroke are shortened, so that the steps of material taking, calibration and the like can be synchronously carried out.

The present invention discloses a mobile terminal punching mechanism, including a main support seat, a bottom plate, a transverse sliding block, a terminal mold transverse driving device, a terminal feed track, a terminal mold seat, an upper terminal punching knife, an upper terminal punching knife punch, a lifting driving seat, an upper terminal punching knife lifting driving device, a lower terminal punching knife and a terminal feed toggle device. The present invention is reasonably designed, and the terminal mold transverse driving device can drive the entire terminal mold installed on the transverse sliding block to move laterally, so that the upper terminal punching knife and the lower terminal punching knife can move and punch the terminal in sequence. The present invention can punch the terminal while moving, without the need for a wire clamp to move, which is convenient for other workstations or other mechanisms to perform corresponding operations during the temporary pause of the wire clamp, greatly improving the production speed and production efficiency.

The utility model belongs to the technical field of server architecture design, and particularly provides a heterogeneous computing system, a server and a data center, the system comprises a switching unit and at least two types of computing units, the number of the computing units of each type is a plurality, all the computing units are standard high-speed serial computer expansion bus board cards, and the switching unit is provided with a plurality of high-speed serial computer expansion bus slots; and all the computing units are respectively connected with the high-speed serial computer expansion bus slots on the switching unit. The computing unit is designed in the form of a PCIe card, the appearance form of a general server mainboard in the past is changed, different types of computing units can be conveniently subjected to heterogeneous system construction on a Switch bottom plate, and the heterogeneous computing system capable of being freely matched and deployed can improve the utilization efficiency of computing resources.

The invention discloses a hardware equipment anomaly detection and fault prediction method and system, and relates to the technical field of server room operation and maintenance, and the system comprises a data collection module which is used for collecting CPU utilization rate, memory utilization rate, fan rotation speed and mainboard temperature indexes in real time from baseboard management controller (BMC) equipment; the graph causal modeling module is used for modeling the correlation and causal relationship among multiple equipment indexes to form a causal graph structure; the time sequence prediction module is used for predicting the equipment operation state in a period of time in the future through graph convolution and a causal attention mechanism; the anomaly detection module is used for generating an anomaly score and identifying a potential fault based on the deviation between a predicted value and a real value; and the alarm module is used for feeding an abnormal detection result back to the operation and maintenance system to realize early warning and decision support. The abnormal detection accuracy is remarkably improved, faults are predicted in advance, the interpretability of the causal relationship between equipment is provided, and the operation and maintenance risk of a machine room is reduced.

The present application provides a complex programmable logic device (CPLD)-based data processing method and system, and a computing device. The CPLD is arranged on a hard disk backplane of a server, and the hard disk backplane supports a universal backplane management (UBM) protocol; the hard disk backplane comprises an HFC connector for connecting to a RAID controller and a DFC connector for connecting to a hard disk slot, and the CPLD is connected to the HFC connector and the DFC connector, respectively. The method comprises: when a hard disk is inserted into the hard disk slot, determining an interface type of the hard disk according to a signal level transmitted by the DFC; processing interaction data between the RAID controller and the hard disk according to the hard disk interface type, wherein the interaction data comprises data indicating the hard disk interface type, data indicating a hard disk state and read / write operation command data; and transmitting the processed data to the RAID controller or the hard disk so as to achieve hard disk management, wherein the hard disk comprises a hard disk of an SAS / SATA / NVME interface type. In this way, new logic functionality is added to an existing logic chip of the hard disk backplane to achieve the functionality of the UBM protocol.

A disclosed nondestructive testing device for internal defects of a copper-aluminum composite board comprises a base plate, the base plate is connected with a C-shaped frame through an integral moving device, the upper end and the lower end of the C-shaped frame are respectively provided with an X-ray source and a ray detector, and the X-ray source and the ray detector are oppositely arranged; a signal conversion device, a high-voltage power supply and a control host are further arranged on the bottom plate, the high-voltage power supply is connected with the X-ray power supply, and the ray detector is in electric signal connection with the control host through the signal conversion device. The X-ray principle is utilized to irradiate the copper-aluminum composite board, the density difference in the board is reflected through the X-ray imaging board, the internal defects of the board are automatically judged through an algorithm, X-rays penetrate through the detected board and do not affect or damage the board, and the non-contact detection mode is compared with a destructive detection means, so that the detection accuracy is improved. The problem that a product is damaged in the detection process is solved.

The invention discloses a printed circuit stiffening plate processing device which comprises a bottom plate, a shell is fixedly connected to the middle of the upper end of the bottom plate, symmetrical moving grooves are formed in the upper end of the shell, moving blocks used for centering and positioning a stiffening plate are slidably connected to inner cavities of the moving grooves, and a placement table is arranged in the middle of the upper end of the shell. And a piston is vertically and slidably connected to the middle of an inner cavity of the placement table, a driving mechanism is arranged below the placement table, and when the driving mechanism rotates clockwise, the piston moves downwards after the moving block is driven to be close to the reinforcing plate. Under the action of elasticity, the connecting plate can synchronously get close to the position of the placement table, at the moment, the connecting plate can drive the positioning rod to synchronously get close to the position where the stiffening plate is located, and even if the shape of the stiffening plate is irregular and the position state of the stiffening plate is inclined during placement, the stiffening plate can be elastically clamped and centered through the positioning rod; and the thin reinforcing plate is prevented from warping under the action of clamping force.

The invention discloses a server, a cable monitoring system, method and device thereof and a storage medium, and relates to the technical field of servers, and the method comprises the steps: setting a detection module in the server to monitor the connection state of a cable between a switch board and a backboard; when abnormal connection is detected, the control module starts a preset delay window to filter instantaneous interference, re-check is carried out after the window is finished to confirm the authenticity of the abnormity, and finally, the execution module carries out accurate positioning and prompts information of a specific abnormal cable, so that the problem that a connection fault can only be found after power-on and cannot be positioned is solved; the beneficial effect of improving the efficiency and precision of detecting the connection state of the cable is achieved.

The invention relates to the field of antenna welding devices, in particular to an RFID antenna tail end pin welding device which comprises a bottom plate, a welding gun arranged on the upper side of the bottom plate, a center column fixedly installed in the center of the upper side of the bottom plate, a transposition mechanism used for rapidly switching welding point positions and a correcting mechanism used for correcting the tail end of an antenna. The rotating base plate, the discharging base and the pushing assembly in the transposition mechanism are matched, circumferential rotation of the rotating base plate is matched with radial sliding of the discharging base, the discharging base drives a circuit board on the discharging base to slide once every time the rotating base plate rotates by a circle, and therefore automatic switching of welding point positions is achieved; the clamping plate, the pressing wheel and the wedge-shaped piece in the correcting mechanism are adopted, the wedge-shaped piece triggers the moving assembly to drive the clamping plate to clamp and straighten the tail end of the antenna, meanwhile, the pressing wheel downwards presses the tail end of the antenna, the problem of insufficient soldering or poor contact caused by antenna bending in the welding process is effectively solved, and the welding quality is ensured.

The invention relates to a matrix type semiconductor lead frame linear full-automatic magazine loading machine, and belongs to the technical field of semiconductor frame lead automatic magazine loading. Comprising a bottom plate, and a graphite boat strip carrying table, a lead frame conveying carrying table and a magazine carrying table are sequentially arranged on the bottom plate. The graphite boat carrying platform is provided with an ejector rod used for unlocking the graphite boat and the lead frame, and the lead frame conveying platform is provided with conveying belts corresponding to the magazine platforms one to one. A first horizontal linear module is erected on the bottom plate, a sliding part of the first horizontal linear module is provided with a second vertical linear module, and the lower part of a sliding part of the second vertical linear module is connected with a lead frame suction plate. Compared with manual operation, the production efficiency can be effectively improved, and the problems of misloading of the magazine, damage to the magazine or a chip and the like caused by manual operation are avoided.

The invention is suitable for the field of communication technology improvement, and provides an encryption communication method and system used between EtherCAT slave station nodes, an OTP / nonvolatile storage, an encryption scrambling unit and a decryption descrambling unit are integrated in an EtherCAT slave station chip of a coupler and an I / O module, and encryption / decryption of an EtherCAT message is achieved on the hardware level; xOR operation or an AES algorithm is adopted for encryption, and a secret key is stored in an unmodifiable storage unit; and meanwhile, a parallel architecture of an encrypted network and a standard network is constructed, so that the standard interaction between the slave station node and the master station is not influenced by encrypted communication. The system solves the contradiction of poor real-time performance of a private protocol and easy plaintext communication plagiarism in the prior art, realizes the effects of no real-time performance loss, strong communication exclusiveness and flexible compatibility, and is suitable for an EtherCAT high-speed backplane bus system under industrial 4.0.

To provide a game board featuring a board.SOLUTION: In a game board having a certain board, the certain board has a first surface, and a second surface opposite to the first surface, a first circuit component is mounted on the first surface and a second circuit component is mounted on the second surface, a second lead of the second circuit component projects from the first surface, the height from the first surface to the end of the first circuit component is first length, the height from the first surface to the end of the second lead is second length, and the second length is longer than the first length.SELECTED DRAWING: Figure 343

The invention belongs to the technical field of radiators, and particularly relates to a radiator for a power semiconductor and an assembling method thereof. The radiator comprises a heat dissipation bottom plate, a heat dissipation plate and a heat dissipation shell, the heat dissipation bottom plate is used for connecting the power semiconductor device and the heat dissipation plate, the heat dissipation bottom plate and the heat dissipation plate form a heat dissipation bottom plate-heat dissipation plate combination body through a vacuum brazing or pressure sintering process, and the heat dissipation bottom plate-heat dissipation plate combination body is reliably connected with the heat dissipation shell; the heat dissipation bottom plate is made of a material with a thermal expansion coefficient similar to that of the power semiconductor device; a window is arranged on the heat dissipation bottom plate, a protruding part is arranged at the position, corresponding to the window, of the heat dissipation plate, and the protruding part of the heat dissipation plate penetrates through the window to make contact with the power semiconductor device. According to the radiator, the titanium alloy or the tungsten copper alloy with the thermal expansion coefficient similar to that of the power semiconductor device is adopted as the heat dissipation bottom plate, and the protruding parts on the heat dissipation plate penetrate through the windows of the heat dissipation bottom plate to be in direct contact with the power semiconductor device, so that the heat dissipation efficiency can be improved.

The invention provides a semiconductor lead frame material box conveying device, and belongs to the technical field of semiconductor device production, the semiconductor lead frame material box conveying device comprises a bearing mechanism which comprises a connecting column and a circular bottom plate sleeving the bottom of the peripheral side of the connecting column, the peripheral side of the connecting column is provided with an even number of pairs of vertical first baffles in a circumferential array mode, and a second baffle is arranged between each pair of first baffles; the connecting column is rotationally connected to a rotating shaft, the top of the rotating shaft penetrates out of the top of the connecting column, and the connecting column is driven by a rotating mechanism to rotate; the two pushing ends of the two-way pushing mechanism are connected with the two pushing plates correspondingly, and the top of the two-way pushing mechanism is connected with the telescopic end of a lifting mechanism; the conveying belt is arranged on one side of the circular bottom plate, and the conveying direction of the conveying belt is parallel to the diameter of the circular bottom plate; the horizontal linear mechanisms are arranged below the circular bottom plate at intervals, and the movable ends are connected with the bottom of the rotating shaft. The device can automatically convey the lead frame material boxes to the material box bearing areas of a plurality of core bonding devices in the core bonding process, and the core bonding and feeding efficiency is improved.

One embodiment of a device mount orients a display device. The device mount comprises a backplate with a first surface for removably coupling the display device and a bottom plate having a first surface coupling an input mechanism. An upper support panel couples to a second surface of the backplate and the bottom plate. The upper support panel rotates about a first hinge and a second hinge to support the backplate as the backplate is raised relative to the bottom plate. A lower support panel couples to a second surface of the backplate and the bottom plate. As the backplate is raised relative to the bottom plate, the lower support panel rotates about a third hinge and a fourth hinge and the backplate rotates about the third hinge away from a first face of the lower support panel to rest against a second face of the lower support panel.

A socket includes a housing with a bottom plate portion and a frame body portion standing at edges of the bottom plate portion and extending along the edges. The frame body portion serves as a locator in an in-plane direction of the bottom plate portion in mounting an electronic component. The bottom plate portion and the frame body portion are integrally molded into the housing. The socket includes a plurality of contacts supported by the bottom plate portion. The socket includes a spring member including a supported portion supported by a first side of the frame body portion and a spring portion that elastically deforms by being pushed by the electronic component, pressing the electronic component against a second side opposite to the first side.