5327 results about "Backplane" patented technology

The invention discloses an internet of things multi-protocol fusion limo intelligent control system, which relates to the field of limo intelligent control and comprises a hardware irrelevant layer, a multi-protocol adaptation layer, a data abstraction layer, a programmable logic layer, a security and redundancy mechanism and an edge AI module. According to the invention, a physical bus is packaged into an independent module, an MCU / SoC and a protocol transceiver are built in, hot plugging is realized through a standardized PC I e / EdgeConn backboard, a core processing board only exposes a unified backboard interface, module drive localization execution is realized, master control firmware does not need to sense protocol details, only the module needs to be replaced when a protocol is newly added, and the master control firmware or upper software does not need to be modified. The defect that the whole vehicle firmware needs to be refreshed when a bus is replaced in a traditional system is overcome, each protocol corresponds to an independent drive micro-service deployed in a containerization mode, the drive micro-service analyzes a message into a unified data model and uploads the unified data model to a data abstraction layer, a downlink control instruction is packaged and issued according to a target protocol, and it is guaranteed that the protocols are diversified and interfaces are consistent.

The invention discloses a quality management and control system for fabricated decoration construction, and the system comprises a sensing layer which constructs a multi-modal data collection network, carries out the three-dimensional real-time data synchronous collection through combining logistics API docking and an OCR recognition system, and constructs a construction process digital twin bottom plate; in the edge calculation layer, an edge node carries out lightweight processing on the original data; the cognitive layer is used for calling a Prolog rule through a process knowledge graph engine to reasone the feature snapshots, carrying out defect instant diagnosis and dynamic constraint propagation, outputting a root cause path with probability weight through three-stage verification, and quantifying intervention influence; the decision-making layer is used for constructing a dynamic prediction model based on a bidirectional LSTM and an attention mechanism, automatically activating a compensation mode when key interference is detected in combination with an anti-fact memory bank and a case-based reasoning compensator, and generating an alternative scheme of optimal cost / optimal construction period / comprehensive balance through a multi-target optimizer; and in the application layer, a Unity engine is utilized to develop the digital twinborn billboard.

The invention relates to an LED display device based on vertical stacking and a preparation method thereof, the display device comprises a driving backboard and a mother pixel, the mother pixel comprises a plurality of sub-pixels, one of a first type of electrode contact and a second type of electrode contact on the driving backboard is a common-pole contact, and the other one is a non-common-pole contact; the electric connectors comprise common-pole conductive parts and non-common-pole conductive parts, the non-common-pole conductive parts are configured to be electrically connected to the first ends of the corresponding sub-pixels and electrically connected with the corresponding non-common-pole contacts, and the common-pole conductive parts are configured to be electrically connected to the second ends of the sub-pixels and electrically connected with the common-pole contacts to form a common-pole structure; each of the copolar conductive part and the non-copolar conductive part comprises an interconnection conductive part, the interconnection conductive parts are located in the corresponding pixel layers, at least one interconnection conductive part comprises a core body, the core body is a compound semiconductor, and the core body is located in the first inner fence. The invention further discloses a preparation method. The production efficiency and quality of the LED display device can be improved.

A tray comprising a bottom panel defining a first bottom panel side, a second bottom panel side, a first bottom panel end, and a second panel bottom end; a first side panel extending upward from the first bottom panel side and a second side panel extending upward from the second bottom panel side; a first wing extending downward from the first side panel and a second wing extending downward from the second side panel; a first end panel arranged laterally between the first side panel and the second side panel, and a second end panel arranged laterally between the first side panel and the second side panel; wherein each of the first wing and the second wing are configured to engage at least one of the first end panel and the second end panel and support the bottom panel above a support surface.

The invention discloses a backboard system and a storage system, and relates to the technical field of backboards, the backboard system is provided with a plurality of storage device slots, each storage device slot is provided with a signal multiplexing circuit and a protocol switching processor corresponding to the storage device slot, and the storage device slots are used for plugging a first solid state disk or a second solid state disk. The first solid state disk is a solid state disk based on a first communication protocol, and the second solid state disk is a solid state disk which is directly connected with a host through an interconnection high-speed bus and is based on a second communication protocol; the signal multiplexing circuit is used for sending transmission data of a target communication protocol to the host, and the target communication protocol is a first communication protocol or a second communication protocol; and the protocol switching processor is used for switching the communication protocol of the signal multiplexing circuit according to the pin signal of the protocol identification pin of the corresponding storage equipment slot. The overall efficiency of the storage system can be improved.

The invention relates to an LED display device based on vertical stacking and a preparation method thereof. The display device comprises a driving backboard and a mother pixel, the mother pixel comprises a plurality of sub-pixels, one of a first type of electrode contact and a second type of electrode contact on the driving backboard is a common-pole contact, and the other one of the first type of electrode contact and the second type of electrode contact on the driving backboard is a non-common-pole contact; the non-common-pole conductive pieces are configured to be electrically connected to the first ends of the corresponding sub-pixels and electrically connected with the corresponding non-common-pole contacts, and the common-pole conductive pieces are configured to be electrically connected to the second ends of the sub-pixels and electrically connected with the common-pole contacts to form a common-pole structure; each of the copolar conductive part and the non-copolar conductive part comprises at least one interconnection conductive part, a compound semiconductor region is arranged in the pixel layer where the interconnection conductive part is located, a backfill hole is formed in the compound semiconductor region, and the backfill hole is filled with the interconnection conductive part. The invention further discloses a preparation method. The stability and reliability of the LED display device can be improved, and the LED display device is more convenient to process.

The invention relates to an LED display device based on vertical stacking and a preparation method thereof, the display device is provided with a driving back plate and a mother pixel, the mother pixel comprises a plurality of sub-pixels, the driving back plate comprises a first type of electrode contacts and a second type of electrode contacts, and electric connecting pieces comprise copolar conductive pieces and non-copolar conductive pieces. Each non-copolar conductive piece corresponds to a different sub-pixel; one of the first type of electrode contacts and the second type of electrode contacts is a common-pole contact, and the other one is a non-common-pole contact; the driving backboard comprises a plurality of non-common-pole contacts, the plurality of non-common-pole contacts are divided into at least two ring groups, and each ring group corresponds to different sub-pixels; the non-co-polar conductive members are configured to be electrically connected to the non-co-polar contacts in the ring groups of the respective corresponding sub-pixels, and the co-polar conductive members are configured to be electrically connected to the co-polar contacts to form a co-polar structure. The invention further discloses a preparation method. According to the invention, the problem of overhigh local current density in the display device is effectively improved, and the reliability and stability of the device are effectively improved.

The invention relates to a cooling device for cooling an electrical and / or electronic assembly (2), said cooling device comprising: a top plate (3) and a bottom plate (4), the bottom plate (4) being a deep-drawn component having a depression (40), the top plate (3) and the bottom plate (4) being arranged such that, due to the depression (40) a cooling channel (5) is formed between the top plate (3) and the bottom plate (4), the top plate (3) and the bottom plate (4) being connected to one another at a contact region (8) outside the depression (40), it being possible for a cooling fluid flow of a cooling fluid to flow through the cooling channel (5) along the longitudinal direction (11), the cooling device (1) also comprising at least one turbulator (6) that is arranged inside a turbulator section (56) of the cooling channel (5). According to the invention, a turbulence portion (61) for generating local turbulence in the flow of the cooling fluid and a blocking region (62) for locally blocking the flow of the cooling fluid are formed on the turbulator (6).

The invention discloses a hardware equipment anomaly detection and fault prediction method and system, and relates to the technical field of server room operation and maintenance, and the system comprises a data collection module which is used for collecting CPU utilization rate, memory utilization rate, fan rotation speed and mainboard temperature indexes in real time from baseboard management controller (BMC) equipment; the graph causal modeling module is used for modeling the correlation and causal relationship among multiple equipment indexes to form a causal graph structure; the time sequence prediction module is used for predicting the equipment operation state in a period of time in the future through graph convolution and a causal attention mechanism; the anomaly detection module is used for generating an anomaly score and identifying a potential fault based on the deviation between a predicted value and a real value; and the alarm module is used for feeding an abnormal detection result back to the operation and maintenance system to realize early warning and decision support. The abnormal detection accuracy is remarkably improved, faults are predicted in advance, the interpretability of the causal relationship between equipment is provided, and the operation and maintenance risk of a machine room is reduced.

The present application provides a complex programmable logic device (CPLD)-based data processing method and system, and a computing device. The CPLD is arranged on a hard disk backplane of a server, and the hard disk backplane supports a universal backplane management (UBM) protocol; the hard disk backplane comprises an HFC connector for connecting to a RAID controller and a DFC connector for connecting to a hard disk slot, and the CPLD is connected to the HFC connector and the DFC connector, respectively. The method comprises: when a hard disk is inserted into the hard disk slot, determining an interface type of the hard disk according to a signal level transmitted by the DFC; processing interaction data between the RAID controller and the hard disk according to the hard disk interface type, wherein the interaction data comprises data indicating the hard disk interface type, data indicating a hard disk state and read / write operation command data; and transmitting the processed data to the RAID controller or the hard disk so as to achieve hard disk management, wherein the hard disk comprises a hard disk of an SAS / SATA / NVME interface type. In this way, new logic functionality is added to an existing logic chip of the hard disk backplane to achieve the functionality of the UBM protocol.

The invention discloses a printed circuit stiffening plate processing device which comprises a bottom plate, a shell is fixedly connected to the middle of the upper end of the bottom plate, symmetrical moving grooves are formed in the upper end of the shell, moving blocks used for centering and positioning a stiffening plate are slidably connected to inner cavities of the moving grooves, and a placement table is arranged in the middle of the upper end of the shell. And a piston is vertically and slidably connected to the middle of an inner cavity of the placement table, a driving mechanism is arranged below the placement table, and when the driving mechanism rotates clockwise, the piston moves downwards after the moving block is driven to be close to the reinforcing plate. Under the action of elasticity, the connecting plate can synchronously get close to the position of the placement table, at the moment, the connecting plate can drive the positioning rod to synchronously get close to the position where the stiffening plate is located, and even if the shape of the stiffening plate is irregular and the position state of the stiffening plate is inclined during placement, the stiffening plate can be elastically clamped and centered through the positioning rod; and the thin reinforcing plate is prevented from warping under the action of clamping force.

The invention is suitable for the field of communication technology improvement, and provides an encryption communication method and system used between EtherCAT slave station nodes, an OTP / nonvolatile storage, an encryption scrambling unit and a decryption descrambling unit are integrated in an EtherCAT slave station chip of a coupler and an I / O module, and encryption / decryption of an EtherCAT message is achieved on the hardware level; xOR operation or an AES algorithm is adopted for encryption, and a secret key is stored in an unmodifiable storage unit; and meanwhile, a parallel architecture of an encrypted network and a standard network is constructed, so that the standard interaction between the slave station node and the master station is not influenced by encrypted communication. The system solves the contradiction of poor real-time performance of a private protocol and easy plaintext communication plagiarism in the prior art, realizes the effects of no real-time performance loss, strong communication exclusiveness and flexible compatibility, and is suitable for an EtherCAT high-speed backplane bus system under industrial 4.0.

To provide a game board featuring a board.SOLUTION: In a game board having a certain board, the certain board has a first surface, and a second surface opposite to the first surface, a first circuit component is mounted on the first surface and a second circuit component is mounted on the second surface, a second lead of the second circuit component projects from the first surface, the height from the first surface to the end of the first circuit component is first length, the height from the first surface to the end of the second lead is second length, and the second length is longer than the first length.SELECTED DRAWING: Figure 343

The invention provides a semiconductor lead frame material box conveying device, and belongs to the technical field of semiconductor device production, the semiconductor lead frame material box conveying device comprises a bearing mechanism which comprises a connecting column and a circular bottom plate sleeving the bottom of the peripheral side of the connecting column, the peripheral side of the connecting column is provided with an even number of pairs of vertical first baffles in a circumferential array mode, and a second baffle is arranged between each pair of first baffles; the connecting column is rotationally connected to a rotating shaft, the top of the rotating shaft penetrates out of the top of the connecting column, and the connecting column is driven by a rotating mechanism to rotate; the two pushing ends of the two-way pushing mechanism are connected with the two pushing plates correspondingly, and the top of the two-way pushing mechanism is connected with the telescopic end of a lifting mechanism; the conveying belt is arranged on one side of the circular bottom plate, and the conveying direction of the conveying belt is parallel to the diameter of the circular bottom plate; the horizontal linear mechanisms are arranged below the circular bottom plate at intervals, and the movable ends are connected with the bottom of the rotating shaft. The device can automatically convey the lead frame material boxes to the material box bearing areas of a plurality of core bonding devices in the core bonding process, and the core bonding and feeding efficiency is improved.

One embodiment of a device mount orients a display device. The device mount comprises a backplate with a first surface for removably coupling the display device and a bottom plate having a first surface coupling an input mechanism. An upper support panel couples to a second surface of the backplate and the bottom plate. The upper support panel rotates about a first hinge and a second hinge to support the backplate as the backplate is raised relative to the bottom plate. A lower support panel couples to a second surface of the backplate and the bottom plate. As the backplate is raised relative to the bottom plate, the lower support panel rotates about a third hinge and a fourth hinge and the backplate rotates about the third hinge away from a first face of the lower support panel to rest against a second face of the lower support panel.

A display panel has a display area and a peripheral area outside the display area, and the peripheral area has a fan-out area extending to a direction away from the display area and having a binding area. The display panel includes: a driving backplane including a substrate, a circuit layer disposed on a side of the substrate, and a plurality of bonding pads in the binding area, one of the bonding pads including a first bonding sub-pad and a second bonding sub-pad, the first bonding sub-pad being disposed on a side of the substrate away from the circuit layer, the second bonding sub-pad being disposed on a side of the substrate away from the first bonding sub-pad and overlapping with the first bonding sub-pad; and a light-emitting device disposed on a side of the circuit layer away from the substrate and located in the display area.

The invention relates to a cooling device for cooling an electrical and / or electronic assembly (2), said cooling device comprising: a top plate (3) and a bottom plate (4), the bottom plate (4) being a deep-drawn component comprising a depression (40), the top plate (3) and the bottom plate (4) being arranged such that, due to the depression (40), a cooling channel (5) is formed between the top plate (3) and the bottom plate (4), the top plate (3) and the bottom plate (4) being connected to one another at a contact region (8) outside the depression (40), it being possible for a cooling fluid flow of a cooling fluid to flow through the cooling channel (5), the cooling device (1) further comprising at least one turbulator (6) arranged inside the depression (40) of the cooling channel (5), the turbulator (6) adjoining a bottom surface (44) in the depression (40) of the bottom plate (4) and the bottom surface (44) facing the top plate (3). According to the invention, the bottom plate (4) comprises an embossment (7) in a bending region (43) on the edge of the bottom surface (44).

The invention provides a dual-network collaborative event sequence automatic testing method and device and a storage medium. The method comprises the following steps: generating a trigger identifier associated with a first pulse as a time reference; slave station logs are collected on the secondary backboard bus side, and communication messages are collected on the primary communication network side; correcting time offset and time drift of the primary communication network and the secondary backplane bus to generate a primary event sequence and a secondary event sequence; performing consistency comparison on the primary event sequence and the secondary event sequence under a unified time base to obtain a consistency comparison result; calculating an interval between adjacent events, comparing the interval with an expected interval to obtain a time scale precision checking result, and calculating an event resolution result; and calculating the time delay between the request and the response and counting the pairing rate to obtain a redundant pairing statistical result. According to the invention, end-to-end automatic testing, unified time base alignment, dual-network consistency verification, redundant request, response quantification and millisecond-level event resolution can be realized.

A light source a backplane including drive circuits formed thereon, an array of micro-light emitting diodes (micro-LEDs) bonded to the backplane, and an array of micro-lenses on the array of micro-LEDs. Each micro-LED of the array of micro-LEDs includes a mesa structure that includes a p-doped semiconductor layer, an n-doped semiconductor layer, an active region between the p-doped semiconductor layer and the n-doped semiconductor layer, and a dielectric layer underneath the p-doped semiconductor layer or the n-doped semiconductor layer and surrounding the active region. In some embodiments, the center of the active region of a micro-LED of the array of micro-LEDs is horizontally offset from the center of the mesa structure of the micro-LED and the center of a corresponding micro-lens of the array of micro-lenses.

The invention discloses a tight-lock coupler intelligent tensile testing machine and a testing method thereof, and belongs to the technical field of tight-lock coupler test.The tight-lock coupler intelligent tensile testing machine comprises a mounting bottom plate and an electric control cabinet, and a support for supporting a tight-lock coupler to be detected is mounted on the surface of the mounting bottom plate; a tensile connecting frame for connecting the tight-lock coupler is mounted on the surface of the bottom plate on one side of the support, an integrated design of'tensile force detection and visual detection 'is innovatively adopted, mechanical parameter acquisition and visual deformation observation are combined, traditional mechanical data such as tensile force and displacement are obtained, and visual characteristics such as fine deformation and crack initiation are captured; precise synchronization of pulling force application, displacement collection and camera shooting is achieved through the synchronous controller, the real-time corresponding relation of pulling force-displacement-visual deformation is established, the problems that an existing device is single in detection dimension and poor in data relevance are solved, and the potential quality hazard checking capacity and the persuasion of a detection result are improved.

A backplane connector includes a housing and a number of mounting modules. The housing includes a base defining a number of receiving grooves. The mounting modules are assembled to the receiving grooves. Each mounting module includes an insulating body, a terminal module installed in the insulating body, and a metal shield surrounding member sleeved on the insulating body. The metal shield surrounding member includes a surrounding portion and a mounting portion extending downwardly from the surrounding portion. The surrounding portion is formed by four side walls so as to form a fully-enclosed shielding cavity. As a result, the shielding effect and the grounding return effect of the backplane connector are improved.

The invention belongs to the technical field of connectors, and particularly relates to a CPU connector for a printer computer, which comprises a first butt joint part arranged on a bottom plate of an upper cover; the second butt joint part is arranged on the base, and the second butt joint part is in butt joint with the first butt joint part in a matched mode, so that the upper cover and the base are accurately installed; the locking component comprises a second locking part arranged on the first butt joint part and a first locking part arranged on the base, and further comprises a guide reset assembly, one end of the guide reset assembly is connected to the base, and the other end of the guide reset assembly is connected to the first locking part; according to the invention, by arranging a matching butt joint structure of the first butt joint part and the second butt joint part and combining the first locking part, the second locking part and the guide reset assembly in the locking component, rapid and accurate installation and automatic locking of the upper cover and the base are realized, extra operation tools or complex measures do not need to be adopted, and the working efficiency is improved. The problem of time consumption caused by dependence on auxiliary tool driving in the prior art is effectively solved.

The utility model discloses a direct current contactor stroke parameter detection system, which relates to the technical field of direct current contactor detection, comprises a bottom plate, and is characterized by further comprising a positioning clamping mechanism arranged on the bottom plate, an intelligent detection mechanism and an automatic material changing mechanism arranged on the bottom plate and acting on the positioning clamping mechanism, the automatic material changing mechanism comprises a rotating table, a stand column, a transverse plate and an oval concave suction cup. According to the utility model, through the arrangement of the positioning and clamping mechanism, the intelligent detection mechanism and the automatic reloading mechanism acting on the positioning and clamping mechanism, automatic detection of stroke parameters of the DC contactor is realized, and the microswitch effectively eliminates the influence of overshoot and a reset spring of a displacement sensor on the stroke parameters; the data display meter performs zero clearing on the data, performs acquisition and operation on over-travel data when a main feeler lever of the contactor is opened and whole-travel data when the main feeler lever is completely opened, and displays the data on the panel; on the basis of ensuring the detection precision, the detection time and the equipment cost are obviously reduced.

The invention provides semiconductor manufacturing equipment and a control method thereof, and the method comprises the steps: arranging a lifting bottom plate surrounding a rotating device outside a cavity, arranging a plurality of lifting mechanisms on the lifting bottom plate, and obtaining a plurality of out-of-cavity distances between the lifting bottom plate and a cavity bottom plate through a distance measurement device; the distances outside the cavities are synchronously obtained, whether base horizontal adjustment needs to be carried out or not is judged according to the distances outside the cavities, if yes, a target lifting mechanism needing lifting control and corresponding lifting control parameters are determined according to the distances outside the cavities, and the lifting control parameters comprise target compensation displacement; the current rotating speed of the base is obtained, and the running speed upper limit of running of the target lifting mechanism is obtained in the second calibration relation according to the current rotating speed of the base; and controlling the target lifting mechanism to obtain the target compensation displacement corresponding to the operation speed upper limit motion. When the base is leveled, the production takt and efficiency are prevented from being influenced, and the film forming quality on the substrate is prevented from being influenced.

The utility model discloses a two-way domestic CPU (central processing unit) server, which comprises a mainboard module, a front backboard module, a first RISER card module, a second RISER card module and a third RISER card module, wherein the mainboard module, the front backboard module, the first RISER card module, the second RISER card module and the third RISER card module are arranged in a server case. According to the two-way domestic CPU server, PCIE signal resources directly output by a CPU device are distributed to an MCIO connector and a PCIE slot in the mainboard module, then the MCIO connector in the mainboard module is connected to each RISER card module or a front backboard module in a high-speed cable mode, meanwhile, PCIE GEN4.0 resource signals output by the CPU device are oppositely inserted into the RISER card modules, and the PCIE GEN4.0 resource signals output by the CPU device are connected to the RISER card modules or the front backboard module. According to the technical scheme, the number of PCIE NVMe SSD disks on the front backboard module and the number of PCIE cards on the RISER card module can be flexibly switched, the purpose that the number of the PCIE NVMe SSD disks and the number of the PCIE cards are switched through the same mainboard module is achieved, and meanwhile the problem that the PCIE NVMe SSD disks cannot be supported in the prior art is solved.

The invention relates to the technical field of semiconductor packaging, and provides a vapor chamber, a heat dissipation cover and a packaging structure, and the vapor chamber comprises a housing which is provided with a vacuum inner cavity, the inner surface of the housing is provided with a first capillary layer, and the housing comprises a first bottom plate and a second bottom plate which are oppositely arranged; the supporting column is arranged in the vacuum inner cavity of the shell, the two ends of the supporting column are connected with a first bottom plate and a second bottom plate respectively, and a second annular capillary layer connected with the first capillary layer is arranged on the outer side face of the supporting column; the supporting column is provided with an inclined side wall, and the cross sectional area of the supporting column is gradually reduced from one side of the first bottom plate to one side of the second bottom plate; and the condensate is positioned in the vacuum inner cavity of the shell. The heat dissipation effect is better improved by arranging the supporting columns with the inclined side walls, and the cross sectional areas of the supporting columns are gradually reduced from one side of the first bottom plate to one side of the second bottom plate.

The utility model relates to an automatic positioning jig for router shell surface printing, which comprises a bottom plate, a lifting adjusting assembly is arranged on the bottom plate, and the lifting end of the lifting adjusting assembly is fixedly connected with a supporting frame. A first positioning material blocking assembly and a second positioning material blocking assembly which are the same in structure are arranged on the portions, located on the two adjacent sides of the supporting frame, of the bottom plate, and the first positioning material blocking assembly comprises a positioning blocking base, a blocking rolling wheel and a bolt assembly. An elastic positioning assembly is arranged at the position, opposite to the included angle formed by the first positioning material blocking assembly and the second positioning material blocking assembly, of the bottom plate, the elastic positioning assembly comprises a positioning air cylinder, a follow-up positioning base, a positioning roller and a sliding block, and a spring is arranged between the follow-up positioning base and the sliding block. The clamping device has the advantages that the clamping device can adapt to positioning and clamping treatment of router shells of different specifications and sizes, the router shells cannot be deformed and damaged in the clamping process, and the machining quality of products is improved.

The utility model relates to the technical field of electronic product assembly, and discloses magnetic part assembly equipment, which comprises a stripping mechanism, a transfer mechanism and a pressure maintaining mechanism, the stripping mechanism comprises a bottom plate, a material storage seat, a driving device and a pushing piece, and the pushing piece is arranged in a chute of the bottom plate in a sliding manner; the driving device is used for driving the pushing piece to slide; the storage seat is used for placing a magnetic part string; the pushing piece is provided with a first step and a second step, the first step is used for bearing the magnetic part string, and the second step is used for stripping single magnetic parts at the bottom; the transferring mechanism is used for transferring the single magnetic parts to the pressure maintaining mechanism; the pressure maintaining mechanism comprises a bearing table and a pressure head assembly, the bearing table is provided with a product positioning groove used for positioning a to-be-machined product, and the pressure head assembly is used for pressing the single magnetic part on the to-be-machined product. By means of the magnetic part stripping device, efficient stripping of magnetic parts can be achieved, the situation that discharging cannot be achieved due to incoming material damage is avoided, automatic pressure maintaining can be conducted on bonding of the magnetic parts, and the bonding strength and the assembling efficiency are improved.

The invention provides an audio frequency integrated signal processing system based on a VPX architecture, and the system comprises a case which accords with the OpenVPX standard and is internally provided with a backboard, and the backboard is integrated with a high-speed serial RapidIO bus and an Ethernet interface; the plurality of heterogeneous computing board cards are connected into the case through VPX slots, the board cards are in point-to-point communication through high-speed serial RapidIO buses, and the heterogeneous computing board cards comprise different types of computing chips and execute different types of audio signal processing tasks; and the multi-machine stacking expansion module is connected with the case through a backboard Ethernet interface, and is connected with an external processor through the backboard Ethernet interface to carry out distributed calculation when it is detected that the calculation capability of any heterogeneous calculation board card cannot meet the audio signal processing requirement. By implementing the scheme, the overall signal processing efficiency of the system can be improved, and the error-tolerant rate and reliability of the system can be improved.