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209 results about "Surface contour" patented technology

Curved surface contour analysis method for laser multi-axis linkage machining and related equipment

The invention relates to a curved surface contour analysis method and related equipment for laser multi-axis linkage machining, and the method comprises the following steps: carrying out the curved surface reconstruction of a target curved surface workpiece based on a three-dimensional point cloud data set, and obtaining a digital curved surface model; performing shape analysis on the digital curved surface model to obtain a curved surface feature descriptor, and if the curved surface feature descriptor does not meet an expected geometric characteristic standard, performing spectral decomposition on the digital curved surface model based on the curved surface feature descriptor to obtain a contour feature spectrum; performing path planning on the contour characteristic spectrum based on a geodesic theory to obtain a processing track sequence; and performing kinematics solution on the processing track sequence to obtain linkage control parameters of each axis, and adjusting the linkage control parameters of each axis based on the expected geometric characteristic standard, thereby solving the technical problem that the processed curved surface workpiece cannot reach the expected geometric characteristic standard due to lack of an effective curved surface contour analysis method.
Owner:SHENZHEN XINHUA PENG LASER EQUIP CO LTD

Stamping part surface roughness detection method and system based on image recognition

The invention provides a stamping part surface roughness detection method and system based on image recognition, and the method comprises the steps: building a surface contour database according to a metal square lattice standard model stamped by a texturing die, obtaining the actual contour data of the surface of a stamping part, comparing the difference between the actual contour and the metal square lattice standard model, and determining the surface roughness of the stamping part. The method comprises the following steps: obtaining a microscopic deformation feature distribution image, optimizing the microscopic deformation feature distribution image, calculating probability distribution of each pixel point belonging to real surface roughness or microscopic deformation, obtaining a continuous microscopic deformation area mask, calculating a deviation between an actual contour and an ideal surface as a corrected roughness value, and aiming at the corrected roughness value, obtaining a microscopic deformation feature distribution image; according to the characteristics of the stamping part, the surface is divided into a plurality of characteristic areas, when new stamping part surface data is input, the surface roughness grade is judged through the surface quality evaluation model, and the stamping part surface roughness detection method is beneficial to improving the stamping part surface roughness detection precision.
Owner:SVOLT ENERGY TECHNOLOGY CO LTD

Contour accuracy compensation method and system for precision hot-press forming mold

The present invention relates to a contour accuracy compensation method and system for a precision hot-press forming mold. The method comprises: delineating grids on a three-dimensional model of a hot-press forming mold to obtain mold surface grid data; performing curvature analysis to obtain a high-curvature region and a low-curvature region; performing high-density sampling on the high-curvature region, and performing low-density sampling on the low-curvature region, so as to obtain a sampling point set; using a coordinate measuring machine to perform three-dimensional coordinate measurement on the sampling point set to obtain surface contour data; performing comparative analysis on the surface contour data and a theoretical model to obtain a contour error distribution; on the basis of the contour error distribution, using an inverse distance weighted interpolation algorithm to perform interpolation operation on an entire mold surface to obtain a mold surface compensation amount distribution; and on the basis of the mold surface compensation amount distribution, correcting the three-dimensional model of the hot-press forming mold to generate a compensated mold processing model. The implementation of the present invention realizes intelligent and automated contour accuracy compensation.
Owner:SHENZHEN CHANGFENG LASER SWORD MOULD CO LTD

Method, system and equipment for detecting finished product forming degree of rubber part and medium

The invention relates to a rubber part finished product forming degree detection method, system and equipment and a medium, and belongs to the technical field of rubber part forming degree detection. The molding degree detection method comprises the following steps: receiving surface point cloud data and surface geometric position information of a to-be-detected rubber part; constructing a three-dimensional surface contour model of the rubber part to be detected; mapping the surface pressure distribution data to the three-dimensional surface contour model, and detecting a pressure abnormal distribution area; extracting light scattering characteristic data according to the optical image data; comparing the light scattering characteristic data with the pressure abnormal distribution area to obtain a defect area analysis result; dynamic deformation characteristics of the rubber part to be tested under the dynamic environment simulation test are obtained; marking the three-dimensional surface contour model, and constructing a comprehensive feature model of the rubber part to be detected; and carrying out difference analysis on the comprehensive feature model to obtain a feature difference result of the to-be-detected rubber part, and generating a forming degree scoring report of the to-be-detected rubber part. According to the invention, the molding degree of the rubber part can be accurately detected.
Owner:HUBEI KAILIANG NEW MATERIAL TECH CO LTD

Part surface contour reconstruction method based on global fitting optimization

The invention belongs to the technical field of high-precision scanning intelligent equipment, and particularly relates to a part surface contour reconstruction method based on global fitting optimization. A high-precision three-dimensional contour is generated for fitting of a large free-form surface, firstly, a preliminary curved surface is generated by adopting a curved surface contour fitting optimization algorithm according to data acquired based on a laser two-way point cloud scanning technology, then smoothing processing of the curved surface contour is realized based on a fairing optimization algorithm, and finally, the generated curved surface is evaluated. And if the precision is within the deviation range, taking the curved surface as a final curved surface. The fairing optimization algorithm is put forward to carry out overall fairing processing on the fitted initial curved surface from the overall situation aiming at the condition that the curved surface is in non-fairing forms such as local unevenness, violent normal vector jitter and overlarge curvature change, and the high-precision fitting requirement of the large free-form curved surface can be met.
Owner:CHINA NUCLEAR POWER OPERATION TECH CORP

Device based on contour in-situ measurement fitting and adaptive efficient grinding method

The invention discloses a device based on contour in-situ measurement fitting and an adaptive efficient grinding method, and belongs to the technical field of part machining. The device comprises a grinding wheel contour measuring system used for measuring and fitting the outer contour of a grinding wheel and an angle precision positioning system used for measuring the contour, the size and the profile position of a part. Firstly, a part is installed, in-situ measurement and fitting of the surface profile of the part are carried out, and the included angle between the axis and the machine tool spindle axis is calculated; secondly, a grinding wheel is installed, and dynamic balance is adjusted; then, carrying out in-situ measurement and fitting to obtain the contour of the working surface of the grinding wheel, and carrying out minimum removal amount shaping on the grinding wheel; and finally, after adaptive grinding is carried out, the surface profile of the machined part is measured in situ again, and whether the requirement is met or not is detected. By measuring the original outlines of the adaptive part and the grinding wheel in situ, the problems of large-volume removal of the part and long dressing time of the grinding wheel in the grinding process are solved.
Owner:SHENYANG AIRCRAFT CORP

Intelligent ink jet control system and method, robot and storage medium

The invention relates to the technical field of ink jet control, and discloses an intelligent ink jet control system and method, a robot and a storage medium. The method comprises the following steps: firstly, acquiring surface contour data and color information of an object to be jetted through a laser ranging device, and constructing an object surface feature vector; a target ink jet area is determined through area spray adaptability evaluation; then, semantic information of ink jet content is obtained, semantic element weights are calculated, and ink jet parameter constraints including an ink droplet size threshold value, an information level presentation rule and the like are generated in combination with a target area range; generating an intelligent ink-jet scheme according to the constraint, and controlling an ink-jet device to form a target pattern; and finally, a moving path of the moving mechanical arm is generated based on a cubic spline interpolation algorithm, and the target pattern acts on the target area. The method can adapt to complex surface forms and various materials, the ink jet process is accurately controlled, patterns are accurately presented and stably attached, and the ink jet effect and the information transmission effectiveness are improved.
Owner:SHENZHEN XINGFULI ENTERPRISE LTD

Method and system for detecting surface defects of sheet metal part before coating

The invention discloses a method and system for detecting surface defects of a sheet metal part before coating, and the method comprises the following steps: S1, multi-modal data collection: synchronously collecting three-dimensional point cloud data and a hyperspectral image of the surface of the sheet metal part through a laser three-dimensional contourgraph and a hyperspectral camera, and recording environment illumination and temperature parameters at the same time; s2, data preprocessing: performing denoising and smoothing processing on the three-dimensional point cloud, extracting surface contour features, and performing defective pixel repair, waveband selection and reflectivity correction on the hyperspectral image; according to the surface defect detection method and system before coating of the sheet metal part, through multi-modal data acquisition and fusion of the three-dimensional morphology and the hyperspectral features, compared with traditional single visual detection, the surface defects of the sheet metal part can be more comprehensively and accurately recognized, particularly, tiny defects and oxide layer defects which are difficult to distinguish by naked eyes, the recognition rate is remarkably increased, and the detection accuracy is improved. And by adopting the lightweight deep learning model, the detection precision is ensured, and the reasoning speed is improved at the same time.
Owner:武汉市天胤机电设备有限公司

Grinding wheel surface profile and abrasive particle distribution state detection method and system

The invention discloses a grinding wheel surface profile and abrasive particle distribution state detection method and system, and the method comprises the steps: sampling and collecting point clouds of a grinding wheel circumferential surface region, and obtaining original sampling data; performing noise reduction processing on the obtained original sampling data to obtain point cloud data; performing two-dimensional projection and frequency domain processing on the point cloud data after noise reduction processing; the features extracted from the frequency domain are remapped to the three-dimensional space, and different surface areas are identified through a density clustering algorithm; performing curved surface fitting by adopting a least square method, calculating a reference surface and evaluating surface features; according to the obtained datum plane and the evaluated surface features, the surface profile and distribution state of the grinding wheel are evaluated, evaluation parameters comprise the maximum surface profile height # imgabs0 #, the abrasive particle distribution density # imgabs1 #, the abrasive particle distribution uniformity # imgabs2 # and the abrasive particle spacing statistical parameter # imgabs3 #, and the contour and abrasive particle distribution density of the surface of the grinding wheel in the circumferential direction can be accurately and efficiently detected.
Owner:XI AN JIAOTONG UNIV

Three-dimensional display method and system for XRF element scanning result

The invention discloses a three-dimensional display method and system for XRF element scanning results. The method comprises the following steps: 1) performing three-dimensional scanning on a target object by using a three-dimensional XRF scanning system at a currently selected angle, and recording spectral data and three-dimensional position information of each scanning point; 2) calculating the relative content of each element distribution in a scanning position area corresponding to the target object according to the spectral data of each scanning point; according to the three-dimensional position information of each scanning point, generating a three-dimensional point cloud conforming to the surface contour of the target object at the current selected angle; 3) mapping each element existing in the target object calculated at the current angle to an RGB color space, and generating a three-dimensional element distribution diagram with colors; 4) changing the angle and repeating the steps 1-3) once; and 5) splicing the colored three-dimensional element distribution diagrams corresponding to the plurality of different angles to obtain a complete colored three-dimensional element distribution diagram of the target object. According to the invention, scanning blurring and distortion are avoided.
Owner:INST OF HIGH ENERGY PHYSICS CHINESE ACAD OF SCI

System and method for estimation of object planar dimensions for autonomous handling of objects

A method for autonomous handling of an object involves acquiring sensor data to produce a point cloud of a scene including one or more objects at a first location. An object instance is segmented in the point cloud utilizing an instance segmentation mask. The object instance represents an individual object to be transported by a controllable physical device. Using points in the segmented point cloud, a direction of a main plane is determined, which represents a placement surface of the object. A set of points in the segmented point cloud defining an extent of the main plane is projected with respect to a normal of the main plane, to create a 2D image. The 2D image is processed to generate a contour defining an outline of the placement surface, from which planar dimensions of the placement surface are estimated to inform a placement of the object by the physical device.
Owner:SIEMENS AG +1

System and method for surface finishing

To provide systems and methods for surface finishing.SOLUTION: A system for automated sanding of a surface of a component includes a model generator, a model analyzer, and a path planner. The model generator is configured to generate a model representing at least a portion of a surface of a component. The model analyzer is configured to analyze the model to determine waviness of the surface. The path planner is configured to generate a sanding plan.SELECTED DRAWING: Figure 2
Owner:THE BOEING CO

Method for testing roughness coefficient of slope structural surface

The invention discloses a slope structural surface roughness coefficient testing method. The method comprises the core steps of structural surface pretreatment, rebound detection, contour curve drawing, roughness measurement and the like. Measuring areas are divided and identified, an average rebound value is obtained by using a rebound apparatus, a surface profile is drawn in combination with a profile curvimeter, and a roughness coefficient JRCn is read by using a multi-range roughness ruler and an electronic subdivision technology; in addition, parameters such as rock wall strength and normal stress can be obtained through a point load instrument, a vibrating wire strain gauge and the like, shear strength is calculated in combination with a Barton-Bandis mode, data of multiple measuring areas are integrated, and dynamic correction results of environmental parameters are associated. According to the method, the test precision and efficiency are improved, data integration and full-period management are realized, and a reliable basis is provided for slope stability evaluation.
Owner:宁波宁大地基处理技术有限公司

A system and method for measuring flatness and warpage of a surface

The present invention describes a novel system (100) and method for measuring the flatness and warpage of a surface (108) of a product. The system (100) comprises a sensing unit (104) with a plurality of sensors (106) mounted onto it, which detect surface undulations through contact and / or non-contact measurement processes. These sensors (106) output a voltage signal proportional to the depth of warpage detected. The voltage signal is then processed in the signal processing module (110) of the display module (102). The display module displays the measured surface readings on a display screen (112) and includes a sensor detection module to detect the type of sensors attached to the sensing unit (104). In an alternate embodiment, a 2D sensor module is provided with a matrix of position sensors built into the sensing unit, allowing for surface contour mapping and 2D undulation measurement along the entire face of the machined part.
Owner:DASARI GANESHRAM

Automatic ceramic glazing control system and method integrating machine vision and trajectory planning

The invention discloses an automatic ceramic glazing control system and method fusing machine vision and track planning, and relates to the technical field of ceramic production automation, and the method comprises the steps: obtaining basic information and glazing demand information of to-be-glazed ceramic; according to the automatic ceramic glazing control system and method fusing machine vision and trajectory planning, three-dimensional data are obtained by shooting ceramic images from multiple angles and scanning, the three-dimensional features of surface profiles, textures and tiny defects can be accurately captured, even pits and protrusions can be recognized, and when a glazing path is planned, the glazing quality is greatly improved. The angle of the nozzle can be adjusted in real time according to the surface morphology of the ceramic to ensure that glaze is sprayed perpendicular to an arc-shaped surface and a special-shaped surface, and meanwhile, the moving speed of the nozzle and the glaze output quantity are matched to avoid material consumption deviation per unit area; the glazing thickness uniformity and the coverage area precision are improved through mutual cooperation, the problems that coating of special-shaped ceramics is missed, and the thickness fluctuation of curved-surface products is large are solved, and the percent of pass of complex ceramic products is remarkably improved.
Owner:JIANGXI JIAWO HOUSEHOLD PROD CO LTD

Three-dimensional pipe surface contour interference detection method and system

The invention discloses a three-dimensional pipe surface contour interference detection method and system, which are suitable for interference identification and screening of complex contours in a laser pipe cutting and nesting process. The method comprises the steps that the surface of a three-dimensional pipe is unfolded into a two-dimensional plane; a dynamic grid division structure is constructed based on the median of the contour size, and space region division and contour mapping are achieved; the contour retrieval efficiency is optimized through a Hash index and condition triggering type grid reconstruction mechanism; an improved GJK algorithm is adopted to carry out interference judgment on any contour pair, the algorithm supports dynamic decomposition of a concave contour through an ear cutting method, a virtual closed edge is constructed for a non-closed contour to participate in detection, meanwhile, a contour geometric center is utilized to guide search direction initialization, and convergence efficiency is improved. The method can quickly and accurately detect the interference relationship among multiple types of three-dimensional contours, has the advantages of high adaptability, high operation efficiency, reliable detection result and the like, and is suitable for scenes such as automatic laser cutting path planning and drawing preprocessing.
Owner:NANJING CHAOYING NEW ENERGY TECH CO LTD +1

Measurement device and measurement method

A measurement device includes an analyzer configured to analyze a diffraction image of X-rays scattered from a subject; estimate a surface contour shape of a measurement area of the subject; extract feature data from shape information, and determine shape parameters for representing the surface contour shape; calculate a theoretical scattering intensity of each of the scattered X-rays when values of the shape parameters are changed; calculate a difference between a measured scattering intensity of each scattered X-ray and the corresponding theoretical scattering intensity, and generate a regression model of a relationship between a corresponding value of the shape parameter and the difference for each shape parameter; extract one shape parameter candidate value reducing the difference from the regression model, and calculate a theoretical scattering intensity of the shape parameter candidate value; and estimate the value of the shape parameter minimizing the difference while repeatedly changing the shape parameter candidate value.
Owner:KIOXIA CORP

A synchronous installation process for multiple arches

The application relates to a multi-arch synchronous installation process, which comprises the following steps: S1. Dividing arches into at least one middle section and multiple side sections according to the arch span required by a tunnel, and hingedly connecting the middle section and the side section at the inner arc sides of the two or hingedly connecting the middle section and another middle section at the inner arc sides of the two; S2. Welding cross ribs and meshes on the middle section and the side section; S3. Hoisting the middle section and the side section hingedly connected thereto into the tunnel together, lifting the middle section to make the middle section fit the tunnel dome, lifting the side section to make the side section fit the upper part of the tunnel side, locking the middle section and the side section or the middle section and another middle section, and supporting the connecting part of the two along the arc surface contour; and S4. Installing another side section on the ground of the tunnel side to support the side section connected with the middle section, and locking the two adjacent side sections. The application has the effect of significantly improving the shearing resistance of the joint part of the multi-arch, thereby improving the bearing capacity and the structural stability of the multi-arch.
Owner:CHINA RAILWAY 11TH BUREAU GRP CORP LTD +1

Assembly joint surface construction method considering wavelet and fractal

The invention relates to the technical field of machining part non-ideal surface generation, and particularly discloses a wavelet and fractal-considered assembly junction surface construction method which comprises the following steps: S1, according to an ideal mathematical model of an assembly junction surface, S2, comparing calculation methods of different fractal parameters, S3, aiming at the part assembly junction surface in different machining modes, calculating fractal fractal parameters according to a calculation method of the different fractal parameters; s4, the assembly junction surface is regarded as a structure formed by superposition of contours of different scales, S5, a power spectrum analysis method is introduced to analyze the surface contour curve characteristics of the assembly junction surface, and S6, according to the isotropic or anisotropic properties of the surface of the assembly junction surface in different machining modes, the surface contour curve characteristics of the assembly junction surface are analyzed. The statistical distribution characteristic parameters determined in the step S3 are introduced into characterization of the assembly joint surface; and S7, the contour curve characteristic parameters extracted in the step S4 are associated with the fractal parameters determined in the step S2. According to the method, multi-scale decomposition is carried out on the assembly joint surface through wavelet transform, and the specificity information of the roughness contour, the waviness contour and the shape error contour can be effectively extracted.
Owner:AVIC SAC COMML AIRCRAFT

Surface profile determination and inspection based on leed and layer imaging

PendingCN122422824AAlgorithmParticle beam
In low-energy electron diffraction (LEED), electron diffraction patterns are detected, and images can be formed based on electrons reflected and diffracted from a sample surface. Diffraction patterns can be generated by the interaction of relatively localized coherent electron beams incident on the sample surface (e.g., a selected region of the sample surface). Information from the diffraction patterns can be used to determine (or reconstruct) the structure on the sample surface. Advantageously, selected-area LEED (SA-LEED) or a combination of LEED and stacked imaging (to generate a series of diffraction patterns, each associated with a given particle beam position, wherein particle beams centered at adjacent positions partially overlap) can be used to determine the surface structure of semiconductor wafers via lensless imaging for defect inspection and / or other purposes.
Owner:ASML NETHERLANDS BV

A method for constructing an assembly joint surface considering wavelet and fractal

The application relates to the technical field of non-ideal surface generation of machined parts, and particularly discloses a construction method of an assembly joint surface considering wavelet and fractals, which comprises the following steps: S1, according to an ideal numerical model of the assembly joint surface; S2, comparing calculation methods of different fractal parameters; S3, aiming at the assembly joint surface of parts under different machining modes; S4, regarding the assembly joint surface as a structure formed by superposition of different scale contours; S5, introducing a power spectrum analysis method to analyze the surface contour curve characteristics of the assembly joint surface; S6, according to the isotropic or anisotropic properties of the assembly joint surface under different machining modes, introducing the statistical distribution characteristic parameters determined in step S3 into the representation of the assembly joint surface; and S7, associating the contour curve characteristic parameters extracted in step S4 with the fractal parameters determined in step S2. Through multi-scale decomposition of the assembly joint surface by wavelet transform, the specific information of the roughness contour, the waviness contour and the shape error contour can be effectively extracted.
Owner:AVIC SAC COMML AIRCRAFT

Surface roughness quantification method with hidden surface and readable storage medium

The invention provides a surface roughness quantification method with a hidden surface and a readable storage medium. The method comprises the following steps: acquiring an initial binary image; wherein the initial binary image comprises a surface profile curve with a hidden surface; fitting according to the surface profile curve to obtain a theoretical datum line; obtaining a reference binary image and an actual binary image corresponding to the reference binary image according to the theoretical reference line and the surface profile curve; the theoretical information entropy is obtained through calculation according to the reference binary image, the actual information entropy is obtained according to the actual binary image, the relative information entropy of the actual information entropy relative to the theoretical information entropy is obtained with the theoretical information entropy as the reference, and the relative information entropy is used for representing the surface roughness with the hidden surface. According to the method, the surface roughness of the hidden surface is quantified through the relative information entropy, and the surface roughness of different parts can be quantitatively evaluated by comparing the relative information entropy of the different parts.
Owner:AECC COMML AIRCRAFT ENGINE CO LTD

Wafer notch detection method, device, equipment and medium

The invention provides a wafer notch detection method and device, equipment and a medium. The detection method comprises the following steps: acquiring a profile curve of a notch of a to-be-detected wafer; intersection points of straight lines where two bevel edges in the profile curve of the notch are located and the main surface profile line of the wafer in the profile curve are obtained; an auxiliary circle where an arc curve at the top end of the notch is located in the profile curve of the notch is obtained; determining values of evaluation parameters of the notch according to the straight line where the two bevel edges are located, the distance between the straight line where the two bevel edges are located and the intersection point of the main surface contour line of the wafer in the contour curve, the radius of the auxiliary circle and the endpoint of an arc curve at the top end of the notch; and detecting whether the profile morphology of the notch of the wafer to be detected is abnormal or not according to the value of the evaluation parameter of the notch and a set reference value.
Owner:XIAN ESWIN MATERIAL TECHNOLOGY CO LTD +1

Curved surface inner hole profiling machining tool based on lathe

The utility model discloses a curved surface inner hole profiling machining tool based on a lathe, the middle part of a boring cutter rod of the tool is hinged with one end of a support, and the other end of the support is fixed on a tool rest. The boring cutter is vertically fixed to one end of the boring cutter rod, the other end of the boring cutter rod is hinged to the rolling wheel, and one end of an elastic pressing mechanism vertically arranged in the middle of the boring cutter rod abuts against one side of the support. The explorator is positioned and fixed on the explorator seat, one end of the explorator seat is horizontally fixed on one end head of the conical shaft, the outer edge of the roller is propped against a curved surface on one side of the explorator, a cutting edge of a semicircular plate at one end of the boring cutter is propped against the bottom surface of a blank hole of a workpiece, and a curved surface contour line of the explorator is matched with a curved surface inner hole generatrix of the workpiece. The distance L1 from the center of the semicircular plate to the center of the roller pin is equal to the distance L2 from the center of the hinge pin to the center of the roller pin, and the radius R1 of the semicircular plate is equal to the radius R2 of the roller. The machining difficulty of the curved surface inner hole is greatly reduced, the machining cost is remarkably reduced, and the machining efficiency and the machining quality are improved.
Owner:CSSC MARINE POWER

Method for improving overlay offset of epitaxial layer, super junction device and manufacturing method of super junction device

The invention provides a method for improving overlay offset of an epitaxial layer, a super junction device and a manufacturing method of the super junction device. According to the method for improving the overlay offset of the epitaxial layers, at least two of a plurality of epitaxial layers serve as alignment layers, mark patterns used for photoetching alignment are manufactured in the alignment layers, the mark patterns are grooves located in the alignment layers, the mark pattern of the lower alignment layer affects the top surface contour of the first region of the upper alignment layer, and the mark pattern of the upper alignment layer is formed outside the first region, so that the photoetching overlay offset value of the plurality of epitaxial layers can be reduced, the photoetching rework rate can be reduced, the production cost can be reduced, and the production cycle can be shortened. According to the manufacturing method of the super junction device, mark patterns are arranged in a plurality of epitaxial layers by using the method for improving the overlay offset of the epitaxial layers. The super junction device is manufactured by using the manufacturing method of the super junction device.
Owner:CHINA RESOURCES MICROELECTRONICS (CHONGQING) CO LTD

Aerodynamic Profile body and associated flying object

The invention relates to an aerodynamic profile body with an outer flow surface for flow through a fluid, wherein the aerodynamic profile body comprises:a first surface layer and a second surface layer, which form at least part of the outer flow surface and are designed to be flexible in an end section of the aerodynamic profile body,a connection arrangement that flexibly connects the first surface layer to the second surface layer of the profile body in the end section, andan actuator device with at least one actuator provided in an interior of the aerodynamic profile body which interacts with at least one of the surface layers in the flexible end section in such a way that the cross-section of the aerodynamic profile body in the flexible end section can be changed by the at least one actuator,characterized in thatthe outer flow surface of at least one of the surface layers in the flexible end section has, at least in sections, a surface profile that extends parallel to the direction of flow.
Owner:DEUTSCHES ZENTRUM FÜR LUFT UND RAUMFAHRT E V

Method for determining position of seepage-proofing line for seepage around dam

The invention discloses a method for determining the position of a dam-surrounding seepage-proofing line, which comprises the following steps of: 1) drilling, and carrying out a seepage test and underground water level long-term observation in a drill hole; 2) drawing a contour line relative to the top surface of the impervious layer based on the result of the penetration test; based on the long-term observation data of the underground water level, an underground water level equal water level line is drawn; (3) based on the groundwater surface equal water level and the opposite impervious layer top surface contour line, a dam-surrounding seepage-proofing line is preliminarily planned; and (4) determining a dam-surrounding seepage prevention line. According to the method, the drilling coordinates are combined with detailed and comprehensive hydrogeological conditions such as underground water and rock-soil body permeability, and the optimal dam-surrounding seepage prevention line position is determined by comparing two schemes of the initially-planned underground water surface and the relatively-impervious layer top surface, so that the seepage prevention line position is determined on the premise that the dam-surrounding seepage safety is guaranteed. And the anti-seepage route is shortened, the engineering amount of the anti-seepage curtain is reduced, and the construction treatment cost is saved.
Owner:CHANGJIANG GEOTECHNICAL ENG CORP +1

Construction method and system of earth surface contour line model

The invention relates to a construction method and system of a surface contour line model. The construction method comprises the following steps: S1, determining at least one ground object of a plant, and dividing the plant according to the number of the selected ground objects to form sub-plants; s2, according to the record of the factory file, screening the geometries belonging to each sub-factory, and leaving the geometries meeting a predetermined elevation condition; s3, simplifying the factory file according to a mode of only retaining the elevation of the sub-factory and the geometry meeting the predetermined elevation condition, and outputting the factory with the geometry meeting the predetermined elevation condition; and S4, carrying out fusion on the generated ContoursNew contour line set and the topographic file. The construction system can execute the construction method and comprises one or more of the following hardware: a data loading module, a space calculation module, a graphic processing unit and a storage array.
Owner:DMS CORP

Bonding detection device and bonding detection method

The invention discloses a bonding detection device and method. The bonding detection device comprises a detection device which is used for at least collecting partial side surface contour data of a to-be-detected bonding wafer located on the side surface of the detection device; the controller is configured to fit distance contour lines from the vertexes of the side arc surfaces of the upper wafer and the lower wafer to the detection device respectively according to the partial side surface contour data; according to the distance contour line, the distance mean value difference of the upper wafer and the lower wafer is obtained; in response to the fact that the distance mean value difference exceeds a sliding sheet threshold value, judging that the bonding wafer is subjected to sliding sheet; and determining the bonding precision of the bonded wafer according to a bonding precision threshold value in response to the fact that the distance mean value difference is smaller than the slip sheet threshold value. According to the wafer bonding precision detection method and device, the constraint conditions of wafer bonding precision detection can be reduced, the state of the bonding wafer can be automatically detected even if the front face of the bonding wafer is blocked, therefore, the wafer falling and breaking conditions in the carrying process are avoided, and the bonding detection precision result can be improved.
Owner:PIOTECH (HAINING) SEMICON EQUIP CO LTD