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49939results about "Laser beam welding apparatus" patented technology

Copper conductor annealing process employing high speed optical annealing with a low temperature-deposited optical absorber layer

A method of forming a conductor in a thin film structure on a semiconductor substrate includes forming high aspect ratio openings in a base layer having vertical side walls, depositing a dielectric barrier layer comprising a dielectric compound of a barrier metal on the surfaces of the high aspect ratio openings including the vertical side walls, depositing a metal barrier layer comprising the barrier metal on the first barrier layer, depositing a main conductor species seed layer on the metal barrier layer and depositing a main conductor layer. The method further includes annealing the main conductor layer by (a) directing light from an array of continuous wave lasers into a line of light extending at least partially across the thin film structure, and (b) translating the line of light relative to the thin film structure in a direction transverse to the line of light. The method of Claim 1 further comprising, prior to the annealing step, depositing an amorphous carbon optical absorber layer on the main conductor layer. The step of depositing an amorphous carbon optical absorber layer includes introducing a carbon-containing process gas into a reactor chamber containing the substrate in a process zone of the reactor, applying RF source power to an external reentrant conduit of the reactor to generate a reentrant toroidal RF plasma current passing through the process zone and applying a bias voltage to the substrate.
Owner:APPLIED MATERIALS INC

System and method for servoing robots based upon workpieces with fiducial marks using machine vision

A system and method for servoing robot marks using fiducial marks and machine vision provides a machine vision system having a machine vision search tool that is adapted to register a pattern, namely a trained fiducial mark, that is transformed by at least two translational degrees and at least one mon-translational degree of freedom. The fiducial is provided to workpiece carried by an end effector of a robot operating within a work area. When the workpiece enters an area of interest within a field of view of a camera of the machine vision system, the fiducial is recognized by the tool based upon a previously trained and calibrated stored image within the tool. The location of the work-piece is derived by the machine vision system based upon the viewed location of the fiducial. The location of the found fiducial is compared with that of a desired location for the fiducial. The desired location can be based upon a standard or desired position of the workpiece. If a difference between location of the found fiducial and the desired location exists, the difference is calculated with respect to each of the translational axes and the rotation. The difference can then be further transformed into robot-based coordinates to the robot controller, and workpiece movement is adjusted based upon the difference. Fiducial location and adjustment continues until the workpiece is located the desired position with minimum error.
Owner:COGNEX TECH & INVESTMENT

Thin film device transfer method, thin film device, thin film integrated circuit device, active matrix board, liquid crystal display, and electronic apparatus

A thin film device fabrication method in which a thin film device formed on a substrate are transferred to a primary destination-of-transfer part and then the thin film device is transferred to a secondary destination-of-transfer part. A first separation layer (120) made of such a material as amorphous silicon is provided on a substrate (100) which allows passage of laser. A thin film device (140) such as TFTs are formed on the substrate (100). Further, a second separation layer (160) such as a hot-melt adhesive layer is formed on the thin film devices (140), and a primary destination-of-transfer part (180) is mounted thereon. The bonding strength of the first separation layer is weakened by irradiation with light, and the substrate (100) is removed. Thus, the thin film device (140) is transferred to the primary destination-of-transfer part. Then, a secondary destination-of-transfer part (200) is attached onto the bottom of an exposed part of the thin film device (140) via an adhesive layer (190). Thereafter, the bonding strength of the second separation layer is weakened by such means as thermal fusion, and the primary destination-of-transfer part is removed. In this manner, the thin film device (140) can be transferred to the secondary destination-of-transfer part (200) while maintaining layering relationship with respect to the substrate (100).
Owner:SAMSUNG ELECTRONICS CO LTD
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