257results about "Fine working devices" patented technology

The utility model discloses a kind of semiconductor thermoelectric material cutting device, including frame, the inside of the frame is provided with hydraulic cylinder, the telescopic end of the hydraulic cylinder is connected with bottom plate, the top of the bottom plate is fixedly connected with fixed column, the top of the fixed column is fixedly connected with clamping mechanism, the inside of the frame is provided with shell, the side of the frame is fixedly connected with scale plate. Through the above structure, some semiconductor thermoelectric materials can be solved when cutting, material loosening or offset may occur, avoid the problem that instability may occur when cutting, and avoid the problem that the quality of material cannot be guaranteed, can solve part of semiconductor thermoelectric materials when cutting, may appear the case that staff needs to measure material length by oneself, avoid the problem that semiconductor thermoelectric material after cutting may need secondary accurate cutting, and avoid the problem of cost increase that appears in secondary cutting.

The utility model relates to monocrystalline silicon processing technical field, and disclose a cutting silicon core blanking device for monocrystalline silicon processing, including guide table, guide chute, protective layer, transport device, conveyer belt, fixed clamp holder, adjustable clamp holder, limit hole, screw shaft, clamping layer, nut, in the utility model, when the monocrystalline silicon rod is cut by diamond wire and forms the silicon wafer blanking, the silicon wafer can be buffered and received by the protective layer and downwardly rolls and guides, and the fixed clamp holder and adjustable clamp holder on the conveyer belt correspond to the position of guide chute, at this time, the silicon wafer can roll down and fall into the fixed clamp holder and adjustable clamp holder between the guide chute and be collected, and the clamping layer between the fixed clamp holder and adjustable clamp holder can clamp and protect the falling silicon wafer, and the adjustable clamp holder can be located outside the screw shaft and slide and adjust to adapt to the silicon wafer thickness, when the transport device drives the conveyer belt and starts conveying, the silicon wafer between the fixed clamp holder and adjustable clamp holder can be automatically collected and conveyed.

A state monitoring system of a wire saw that has a first processing roller and a second processing roller, a wire that is stretched between the first processing roller and the second processing roller, and a moving member that moves the workpiece in such a manner that the workpiece is pressed against the wire between the first processing roller and the second processing roller while the wire is being moved, the state monitoring system of the wire saw comprising a detection data acquisition unit that acquires detection data of a first wire sensor that detects the amount of wire fed to the first processing roller and detection data of a second wire sensor that detects the amount of wire fed from the second processing roller, an inference unit that infers the state of the wire based on the amount of wire fed and the amount of wire fed, and an output unit that outputs the inference result of the inference unit.

This utility model relates to the field of chip processing technology, and discloses a chip dicing pressure control structure, a chip dicing machine, and a factory. The chip dicing pressure control structure includes: a displacement plate that fixes the chip dicing blade and slides on a guide rail; a pressure sensor whose sensing end contacts the displacement plate and moves in real time via the displacement plate to obtain the real-time processing pressure of the chip dicing blade; a power structure that drives the displacement plate to slide along the guide rail; a controller that is signal-connected to the power structure and the pressure sensor; the controller receives the real-time processing pressure of the chip dicing blade transmitted by the pressure sensor in real time, compares the real-time processing pressure with the set processing pressure, and moves the displacement plate via the power structure to make the real-time processing pressure equal to the set processing pressure. This application forms a closed-loop control through real-time and precise control of the chip dicing pressure, without the need for manual intervention. The processing pressure is monitored by the pressure sensor in conjunction with the controller, ensuring the stability of the chip dicing process.

The application belongs to the technical field of wafer processing, and particularly relates to a vacuum holding system of a comprehensive control wafer dicing machine. The system comprises a cutting platform and a vacuum control pipeline, and further comprises: a vacuum holding control pipeline, one end of the vacuum holding control pipeline being in communication with the atmosphere, the other end of the vacuum holding control pipeline being in communication with a wafer stage of the cutting platform, a first vacuum generator, a first electromagnetic valve and a first check valve being arranged on the vacuum holding control pipeline; an electromagnetic valve control circuit, the electromagnetic valve control circuit being used for controlling the first electromagnetic valve to be turned on when the vacuum control pipeline fails; and a check valve control circuit, the check valve control circuit being used for controlling the first check valve to be turned on when the vacuum control pipeline fails. When the vacuum control pipeline fails, the vacuum state of the wafer stage of the cutting platform is maintained through the vacuum holding control pipeline, and an alarm is realized, so that loss caused by vacuum degree drop is prevented.

This invention relates to a highly efficient automated splicing system for indium antimonide short crystal rods, belonging to the field of semiconductor material processing technology. Specifically, it relates to a highly efficient bonding and slicing technology for multiple short crystal rods of indium antimonide, indium phosphide, and other materials. The system includes a crystal rod conveying unit, a crystal orientation and size measurement unit, a splicing planning module, a buffer plate selection and adhesive application unit, and a crystal rod posture adjustment and bonding unit. This system achieves full automation from crystal rod loading to long rod assembly unloading. One operator can simultaneously manage three machines, requiring only periodic material replenishment; this reduces labor requirements by more than 80% compared to traditional manual splicing.

The utility model relates to waste liquid filtration technical field, concretely relates to a kind of high-efficiency filtering mechanism of nine knife head cutting machine, applied to the liquid inlet of filter box, including the cylinder and filter ball connected with each other, the cylinder is inserted in the liquid inlet on the box, the filter ball is exposed outside the liquid inlet, the filter ball includes round plate and connecting ring, and multiple arc rods are welded between round plate and connecting ring circumferentially, to form the spherical structure of closed and bottom end opening, and there is interval between the adjacent two arc rods to form filter gap, so that filter ball can circumferentially filter the debris and waste in cutting process. The utility model, by setting filter ball, increase the filtering area, if debris and waste are many, can form accumulation in bottom, and do not affect the filtering effect of upper half, can effectively filter the debris and waste generated in cutting process, prevent clogging, reduce the work intensity of production staff.

The application discloses a multifunctional small multi-wire cutting machine, which comprises an outer cover, an operation box, a base, a rack, a take-up and pay-off assembly, a roller assembly and a workbench assembly; the base is fixedly connected with the rack, the rack is fixedly connected with the take-up and pay-off assembly and the roller assembly, and the base is fixedly connected with the workbench assembly; the take-up and pay-off assembly comprises a second servo motor; the multifunctional small multi-wire cutting machine is designed, the need for manual intervention is reduced through an automatic wire unwinding mechanism and an intelligent tension control system, the operation complexity and the labor cost are reduced, small-batch production and sample trial production are more economical and efficient, the roller assembly adopts a modular design, the wire guide wheel can be flexibly disassembled and adjusted according to processing requirements, and the whole mechanical structure does not need to be disassembled, the design enables the equipment to quickly adapt to cutting requirements of different thickness specifications and different cutting modes, and production flexibility is significantly improved.

The disclosure provides a silicon wafer cutting method, a silicon wafer and a material plate. The method is used for cutting a silicon rod body, the adhesive surface of the silicon rod body is bonded to the material plate, the adhesive surface of the silicon rod body has a first area exposed outside the material plate in a direction perpendicular to the axial direction of the silicon rod body; and at least part of the first area is sprayed during the cutting process. By spraying at least part of the first area exposed outside the material plate during the cutting process, the cutting process can be further changed on the basis of effectively cooling the silicon rod body during the cutting process, which is beneficial to improve the cutting efficiency, and can also improve the liquid carrying capacity and heat dissipation capacity during the cutting process, reduce the silicon wafer edge collapse and hidden cracks caused by heat accumulation, and improve the silicon wafer quality and quality consistency.

The application discloses a substrate processing method, a light emitting diode manufacturing method, a substrate and a light emitting diode. The substrate processing method comprises the following steps: providing a crystal bar to be cut; cutting the crystal bar to obtain a substrate; the substrate surface type of the substrate comprises an easy-to-repair position; and the warping position of the substrate corresponds to the easy-to-repair position of the substrate; fixing the substrate to a polishing head; and polishing the substrate. According to the anisotropy of the crystal, the easy-to-repair surface type is obtained, and the warping position of the substrate is controlled to correspond to the easy-to-repair position of the substrate surface type during the cutting process. In the subsequent polishing process, the warping position can be repaired. Since the warping position is located at the easy-to-repair position of the substrate surface type, the repair grinding amount of the substrate surface type can be reduced, and the surface type repair capability is improved.

The present invention provides a cutting device that reduces the amount of cutting chips remaining on the front surface of a workpiece after cutting the workpiece while supplying a liquid to the cutting tool and the workpiece on one side. The workpiece is cut while supplying a liquid from directly above the upper end of the cutting tool toward the upper end. In this case, the liquid mostly exits the cutting tool in a direction approximately parallel to the front surface of the workpiece, and then reaches the front surface of the workpiece due to air resistance and gravity. Therefore, the speed of most of the liquid slows down before it comes into contact with the front surface of the workpiece. As a result, in the present invention, even if the cutting chips attached to the vicinity of the outer periphery of the cutting tool exit from the cutting tool and are carried into the liquid as an opportunity to come into contact with the liquid, the possibility of the cutting chips included in the liquid sticking and remaining on the front surface of the workpiece can be reduced.

To provide a wafer manufacturing method that can efficiently manufacture wafers and can solve such a problem that wafer manufacturing is uneconomical.SOLUTION: A wafer manufacturing method includes: a first peel-off layer forming step of forming a first peel-off layer by applying a laser beam having a wavelength transmittable through an ingot while positioning a focus spot of the laser beam at a first depth from an end face of the ingot for fabricating a larger-diameter wafer to be fabricated; a second peel-off layer forming step of forming a second peel-off layer for fabricating a smaller-diameter wafer by applying the laser beam while positioning the focus spot of the laser beam at a second depth which is smaller than a diameter of the ingot and shallower than the first depth, from the end face of the ingot; a separating wall forming step of forming an annular first separating wall along an outer periphery of the smaller-diameter wafer by applying the laser beam while positioning the focused spot of the laser beam on an annular area extending from the end face of the ingot to the second peel-off layer; and a wafer manufacturing step of manufacturing the wafer by peeling off the larger-diameter wafer from the first peel-off layer and separating the smaller-diameter wafer from the second peel-off layer and the first separating wall.SELECTED DRAWING: Figure 4

The application relates to the technical field of cutting devices, and discloses a cutting device for semiconductor material processing, which comprises a machine box and a rectangular plate fixedly connected to the inner wall of the machine box, and further comprises a cutting part arranged on the rectangular plate, two lower pressing parts which are mirror-symmetrically arranged on the rectangular plate, a plurality of positioning parts arranged on the rectangular plate, a clamping part arranged on the rectangular plate, and a supporting plate arranged on the top of the machine box. The lower pressing part is arranged, so that the existing cutting device can be conveniently vertically pressed during use, the vibration and offset force generated during cutting can be offset, the wafer is not prone to warping, loosening or cutting mispositioning, and the stability of wafer processing is improved.

This utility model relates to the field of silicon core cutting technology, and particularly to a wire steering module, including a first steering assembly for cooperating with at least two sets of adjacent guide wheel modules for wiring. Wire I enters through the first steering assembly, then proceeds through the first guide wheel assembly to a set of guide wheel modules for wiring, then through the second guide wheel assembly to another set of guide wheel modules for wiring, and finally exits through the first steering assembly. This utility model has one steering assembly corresponding to two sets of guide wheel modules, enabling wiring for two sets of adjacent guide wheel modules. For a cutting table with six positions, only one wire steering is required, which shortens the overall wiring length compared to two steering operations and reduces the risk of diamond wire breakage.

To prevent a damage of a glass plate loaded on a pallet in an upright orientation.SOLUTION: A method of manufacturing a glass plate includes a cutting step S3 of removing an end part Ga of a glass plate G1 in a width direction with the glass plate G1 supported in an upright orientation. The cutting step S3 includes a scribing step, and a bending and dividing step. In the scribing step, a scribe line SL2 is formed so that a maximum depth of a median crack MC in an intermediate part MP1 of the scribe line SL2 is shallower than that in a bottom part BP1 of the scribe line SL2.SELECTED DRAWING: Figure 2

Transfer device (100) for a cutting device (1), wherein the cutting device (1) has a machining unit (2) which has at least one clamping table (10) for holding a workpiece (200), a transfer means (80) for feeding the workpiece (200) to the machining unit (2) and a cutting blade changing means (3) for changing a cutting blade (21); wherein the transfer device (100) is set up for use in transferring a new cutting blade (21) as a replacement component to the machining unit (2); the transfer device (100) has a plurality of receiving sections (101), each configured to receive the new cutting blade (21) and the cutting blade (21) replaced by the cutting blade changing means (3); and the transfer device (100) is set up to be transferred by the transfer means (80) to transfer the workpiece (200).

A wafer ring cutting device, comprising: an operation table, the operation table having a wafer mounting position and a supporting shaft, and a wafer to be processed having a first surface and a second surface opposite to each other; a cutting platform, the cutting platform being arranged on the first surface and being adapted to cut a supporting ring on the wafer to be processed; and a UV irradiation platform, the UV irradiation platform being arranged on the supporting shaft on the second surface, and the center of the cutting platform and the center of the UV irradiation platform being concentric in a direction perpendicular to the surface of the wafer to be processed. By arranging the cutting platform and the UV irradiation platform on the first surface and the second surface of the operation table respectively, and the center of the cutting platform and the center of the UV irradiation platform being concentric, the cutting and the UV irradiation are both performed on the same operation table, the transmission error is reduced, the processing cost is lowered, and the UV irradiation platform can accurately irradiate on the supporting ring after cutting, thereby improving the processing accuracy.

The application discloses a fixed semiconductor wafer cleaving device, which has a scribing device and a splitting device, and the two parts have fixing mechanisms and processing mechanisms respectively and can move along guide rails. A wafer mounting mechanism is arranged in the middle of the cleaving device, a wafer is fixed on the wafer mounting mechanism through a wafer ring, vacuum adsorption is carried out by a scribing fixing mechanism, and a scribing processing mechanism is used for scribing the wafer at a specified position. A splitting fixing mechanism supports the wafer at the lower part of the wafer mounting mechanism, a ceramic knife of a splitting processing mechanism is pressed against the back of a scribe mark of the wafer, the wafer is cleaved and fractured along the scribe mark, and thus the automatic processing of the fixed wafer is realized.

This invention discloses a processing method for complex structures of high-temperature resistant transparent windows. The aim is to address the challenges of obtaining non-standard thicknesses and processing irregularly shaped structures from existing high-temperature resistant transparent materials. The processing method includes: 1. Preparing a blank of the target thickness through cutting to thin or bonding to thicken it; 2. Precision cutting of the blank; 3. Rough grinding of the pre-formed blank using a diamond micro-powder abrasive to form the irregular structure, followed by rough polishing and fine polishing; or laser etching of the pre-formed blank using a pulsed laser to form the irregular structure; 4. Cleaning sequentially using an alkaline cleaning solution, deionized water, and anhydrous ethanol. This invention provides two technical routes for processing irregularly shaped structures: "mechanical rough grinding + fine polishing" and "pulsed laser fine etching," achieving high-precision forming of complex structures such as bosses and concave platforms, effectively reducing cracks, chipping, and thermal damage, while simultaneously meeting the requirements for obtaining non-standard thicknesses and high-quality processing.

The application provides a tool for processing a hard and brittle material complex polyhedron and a numerical control cutting forming processing method thereof. The saw blade and the cutter bar are designed, so that the tool can be used on a numerical control machine tool, so that numerical control saw cutting of the hard and brittle material complex shape is possible. The numerical control saw cutting strategy and saw cutting parameter calculation of the hard and brittle material complex shape are used, and the saw cutting forming of the hard and brittle material complex shape is realized.

This invention provides a crystalline material processing method that produces a large number of wafers in a single slicing procedure through highly efficient parallel slicing. [Solution] The crystalline material processing method includes forming a subsurface laser damage 434 at a first mean depth position to form a crack propagating outward from at least one subsurface laser damage pattern inside the substrate 430, then imaging the top surface 433 of the substrate with an imaging device 4, analyzing the image to identify conditions indicating the presence of crack-free areas within the substrate, and performing one or more procedures in response to the analysis.

This invention provides a monocrystalline silicon wafer, comprising a wafer body, the wafer body including multiple straight-walled portions and multiple chamfered portions, the straight-walled portions and chamfered portions being alternately connected end-to-end, the chamfered portions being straight lines, and the straight line formed by connecting any end of a chamfered portion to the center point of the wafer body intersecting the line of the wafer body. <110> The angle between crystal orientations is not less than 0.35° and not greater than 3.2°. The beneficial effect of this invention is that the monocrystalline silicon wafer has a chamfered portion, and the chamfered portion is straight-line in shape, which avoids poor positioning of the monocrystalline silicon wafer during downstream battery electrode printing and battery module assembly, and avoids misalignment during monocrystalline silicon wafer splicing; at the same time, during the preparation of the monocrystalline silicon rod, a grinding method is adopted in which the monocrystalline silicon rod does not rotate but the grinding wheel rotates, resulting in good consistency of the grinding curvature of the edges of the monocrystalline silicon rod.

This invention discloses a high-precision automatic segmentation and ring wire cutting device for silicon carbide wafers, specifically relating to the field of ring wire cutting technology. The device includes a protective housing, on one side of which a PLC controller is fixedly installed. An operating frame is fixedly installed inside the protective housing, and two feed frames are arranged on the top surface of the operating frame. By symmetrically arranging annular diamond wires on both sides of the operating frame, the silicon carbide ingot is placed between the two annular diamond wires. Combined with a dual-sided synchronous feed mechanism driven by forward and reverse threaded screws, the feed frames on both sides maintain the same feed speed and displacement during cutting. When the annular diamond wires on both sides simultaneously cut into the ingot, the cutting forces are equal in magnitude and opposite in direction, canceling each other out inside the ingot and preventing additional bending moments. This structure effectively solves the problems of ingot bending and deformation due to uneven force during unilateral cutting, and the easy initiation of cracks in high-stress areas at the edges, reducing the cracking risk of ultra-hard and brittle silicon carbide materials during the cutting process.

The utility model relates to the field of silicon wafer diamond wire cutting, especially to a prevent silicon wafer diamond wire cutting equipment that breaks. Including base, the upper surface of base is installed with processing frame, one side of base is installed with support, the upper end of support is installed with controlling means, the output of controlling means is installed with wire cutting device, the inside of processing frame is equipped with auxiliary structure, the auxiliary structure includes two slide rails, two slide rails are fixedly connected with processing frame, the inner wall sliding connection of slide rail has two sliding blocks, two sliding blocks are fixedly connected with the side of approaching each other of link plate, the upper surface fixedly connected with screw rod of link plate. The utility model provides a prevent silicon wafer diamond wire cutting equipment that breaks has can be convenient in the fixed when cutting silicon wafer, not only can the loss of silicon wafer processing be less, but also can increase the precision advantage of silicon wafer processing.

The application provides a method for controlling the shape of a cut silicon wafer by multi-wire cutting, and relates to the technical field of control methods for cutting silicon wafers. A second water cooling cavity is arranged in the axial direction of a main roller, a first water cooling cavity is opened on a rack, and the expansion amount of the main roller and the rack is monitored by a monitoring part. Cold water with a second predetermined temperature curve and a first temperature curve is introduced into the second water cooling cavity and the first water cooling cavity, and the temperature curve of the mortar liquid is matched, so that the position deviation and the displacement deviation of the main roller caused by the relative displacement of the position deviation and the displacement deviation of the main roller due to the thermal expansion of the crystal ingot are prevented, the large shape variable of the cut silicon wafer is prevented, and the expansion conditions of the crystal ingot in different cutting areas caused by the expansion of the rack are positively and negatively compensated. As a result, the shape of the whole cutting process is controllable, the flatness of the silicon wafer is improved, the NT 10*10 and NT 2*2 of the silicon wafer are reduced, and the nano is improved, so that the warp value of the silicon wafer is reduced as a whole, the area is flat, and the quality of the silicon wafer is better.

To provide a method for manufacturing chips that can divide the metal layer. [Solution] The chip manufacturing method comprises: a wafer unit fixing step 301 for fixing a sheet of a wafer unit including a wafer having a metal layer on its back surface and a sheet attached to the back surface of the wafer, with a division starting point formed along the division line; a clamping step 302 for clamping a first region adjacent to the first division line, which is the division line to be divided on the wafer unit, from the front and back sides of the wafer unit with clamping members; a first division step 303 for pressing a second region adjacent to the first division line on the opposite side of the clamping members, along the division line, with a pressing bar from the front side of the wafer; and a second division step 304 for pressing a position in the second region closer to the division line than the position pressed in the first division step 303, along the division line, with a pressing bar from the front side.

The present application discloses a fixing method and a fixture for wafer cutting, which comprises the following steps: providing a fixing fixture, the fixing fixture has an opening and a receiving cavity, a plurality of bearing components are arranged on the periphery of the opening; filling a fixing material in a liquid state into the receiving cavity, so that the surface of the fixing material filled in the receiving cavity does not exceed the side of the bearing component away from the receiving cavity; providing a wafer to be cut; placing the wafer to be cut on the bearing component, the first surface of the wafer faces the fixing material, and the functional area part is immersed in the fixing material; and solidifying the fixing material. The functional area of the wafer is completely covered by the fixing material in a liquid state, and the wafer is cut after the fixing material is solidified. The solidified fixing material can not only protect the functional area of the wafer, but also reduce the influence of the cutting blade force on the wafer during the cutting process, and reduce the possibility of abnormal sharp corners caused by the position deviation of the wafer.