1065results about "Fine working devices" patented technology

The invention provides a laser positioning method for improving gemstone cutting precision, and belongs to the technical field of gemstone cutting laser positioning. A gemstone crystal refractive index tensor model and a ray tracing algorithm are established to simulate a propagation path of light in a gemstone; a thermo-optic effect prediction model is adopted to predict a focus drift distance according to temperature distribution and laser power data and calculate wavefront predistortion phase distribution for compensation, and a zero-vibration input shaping filter is designed for a galvanometer scanning system to suppress residual vibration. A composite control strategy that feedforward control compensates inertia lag and feedback control corrects position errors is adopted to drive a galvanometer, the inherent frequency of a system is recognized through spectral analysis, and the scanning frequency is adjusted to avoid resonance. The technical problem that in the long-time machining process, due to the thermo-optic effect and vibration of a galvanometer scanning system, the laser focus point position generates accumulated drifting, and the cutting precision is reduced is solved.

The invention provides a precise air floating main shaft based on small hole throttling. The precise air floating main shaft comprises a cylinder barrel, a shell, a rotating shaft, a front radial air floating bearing, a rear radial air floating bearing, a front axial thrust air floating bearing, a rear axial thrust air floating bearing, a driving motor, a broach mechanism and various sensors. A reciprocating type spiral groove is formed in the outer circle of the cylinder barrel and forms a spiral cooling water channel with the shell, and the rear end cover is integrated with an air inlet interface, an air outlet interface, a cooling water interface and an air control interface; compressed gas is throttled through an axial gas path and a small hole to form a high-rigidity gas film to support the rotating shaft, and cooling water flows in the spiral water path to take away heat; the control module is based on rotating speed, displacement, temperature and pressure signals, adopts a thermal-mechanical coupling model and a predictive control algorithm, adaptively adjusts air supply pressure and cooling water flow, and is suitable for semiconductors and ultra-precision machining equipment. Through the collaborative design of the small hole throttling air bearing, the reciprocating type spiral cooling water channel and multi-sensor intelligent control, the rigidity, the heat stability and the operation reliability of the main shaft are greatly improved, and the high-precision ultra-precision machining device is suitable for long-term high-rotating-speed and high-precision ultra-precision machining.

The invention relates to the technical field of precision machining control, and discloses an intelligent control method for a cutting path of a scribing machine, which comprises the following steps: acquiring a load current signal of a main shaft servo motor in real time and storing the load current signal into a sliding window data queue; performing weighted differential calculation to obtain a real-time load change rate representing a load trend, and calculating an average absolute deviation to obtain an oscillation state quantity representing load dispersion; querying based on a preset nonlinear gain scheduling relationship to obtain a first speed regulation coefficient and an oscillation suppression coefficient; according to the method, an orthogonal dual-channel feed-forward control mechanism is constructed in the same data window, and multiplication cooperation of weighted differential and dispersion statistics is utilized, so that a feed speed set value is corrected in real time; the problems of phase lag and response mismatch of conventional feedback control in the case of transient impact and microcosmic oscillation of hard and brittle materials are solved.

The application discloses a silicon wafer cutting method and a silicon wafer, relates to the technical field of silicon wafer cutting, and is used for reducing the damage of a cutting line to a silicon wafer in the process of lifting the silicon wafer. The silicon wafer cutting method comprises the following steps: providing a silicon rod and a carrier plate; driving the silicon rod to move downward relative to a cutting line, so that the cutting line cuts the silicon rod to obtain a plurality of silicon wafers; and lifting the silicon wafers upward relative to the cutting line, wherein the movement mode of the cutting line in the carrier plate and the movement mode of the cutting line after the cutting line is separated from the carrier plate are different.

A silicon wafer processing device (100) and system (200). The silicon wafer processing device comprises a plurality of main rollers (10) arranged in sequence and cutting wires (20) wound around the periphery of the main rollers (10), wherein the cutting wires (20) form a wire mesh between the main rollers (10), and the wire mesh comprises a plurality of wiring areas arranged in sequence in the axial direction of the main rollers (10); the main rollers (10) are each provided with a plurality of wire grooves for winding the cutting wires (20); the plurality of wiring areas comprise a first area (a1) and a second area (a2), with the wiring spacing of the cutting wires (20) in the second area (a2) being greater than that of the cutting wires (20) in the first area (a1); thus, the increase in a wire bow and the limitation of a cutting force caused by lateral force concentration are reduced, and for the cutting wires (20) at the head of the first area (a1), the problems of wire overlapping and wire breakage between same and the adjacent cutting wires (20) can be effectively avoided.

Methods and systems for processing semiconductor workpieces are provided. In one example, a system includes one or more laser source(s) having emission parameters configured to induce a nonthermal lattice modification in a semiconductor workpiece and one or more energy source(s) having different emission parameters relative to the laser source(s). The system is configured to induce a treatment region in the semiconductor workpiece with a laser emission from the laser source(s). The system is further configured to induce a damage region at the treatment region with an energy exposure from the energy source(s). In some examples, the system is further configured to perform a pre-separation treatment process on the damage region and, subsequent to the pre-separation treatment process, separate the semiconductor workpiece along the damage region using a removal process to produce one or more semiconductor die.

The present invention relates to a breaking device (10) for solar cells (SC), comprising a support device (1) defining a support plane (11) for a solar cell (SC) to be broken, and at least one ejector bar (2a-2e) and at least one hold-down bar (3a-3d) with a breaking edge (31). The at least one ejector bar (2a-2e) and the at least one hold-down bar (3a-3d) extend along a transverse direction (T), are spaced apart from each other along a longitudinal direction (L) and are each coupled to a drive unit (4) by means of which the ejector bar (2a-2e) can be raised beyond the support plane (11) and the hold-down bar (3a-3d) can be lowered in the direction of the support plane (11), so that a solar cell (SC) to be broken can be broken into at least two solar cell strips (SCS1-SCS5) by raising the ejector bar (2a-2e) at the breaking edge (31) of the hold-down bar (3a-3d).Furthermore, a plant (100) for processing solar cells (SC), in particular a plant for manufacturing solar modules, a method for breaking solar cells (SC) and a method for producing a shingled solar cell arrangement are disclosed.

The utility model relates to the technical field of wire cutting, and discloses a diamond wire cutting machine traction system which comprises a base, a diamond wire and a placing frame, the top of the base is fixedly connected with a supporting frame, the two sides of the top end of the supporting frame are rotationally connected with a wire inlet wheel and a wire outlet wheel respectively, and an encoder is arranged on one side of the wire outlet wheel. A first tension adjusting assembly and a second tension adjusting assembly are arranged on the two sides of one end of the supporting frame correspondingly, the first tension adjusting assembly and the second tension adjusting assembly each comprise a fixing support, and one side of each fixing support is rotationally connected with a first tension wheel and a fixed wheel. A traditional traction servo motor is omitted, a high-precision encoder is additionally arranged on a wire outlet wheel and serves as a constant-speed wheel to control stable operation of a whole wire net, a traction shaft cannot form a slipping effect in the whole operation process of equipment, and therefore the service life of the traction shaft is greatly prolonged, and the occupied area is reduced.

The invention relates to a method for separating a plurality of semiconductor material wafers from workpieces during a number of wafer separation operations for an associated workpiece separation process per workpiece by means of a wire saw comprising a wire gate of moving wire sections of a saw wire stretched between two wire guide rollers, wherein each of the wire guide rollers is mounted between a fixed bearing and a floating bearing, comprising the step of carrying out the wafer separation operations of the current workpiece separation process on the current workpiece by temperature-controlling the fixed bearing of the respective wire guide roller during the current workpiece separation process according to a previously determined WGTC temperature curve within the method, which was determined on the basis of a weighted determination of historical data from past workpiece separation processes.wherein, in each of the disc cutting operations, sawing is carried out in a cutting area of ​​the workpiece at a substantially constant cutting speed within the range of 2000 µm / min to 3000 µm / min. The invention further relates to a disc made of semiconductor material, which is produced in particular by the sawing method according to the invention, wherein the disc has a TTV value in the range of 6.0 µm to 58.5 µm, preferably in the range of 10.8 µm to 30.5 µm, and more preferably in the range of 12.9 µm to 25.6 µm.

The utility model discloses a zirconia porcelain block cutting machine clamp, including: handle, clamping subassembly, locating piece and mounting subassembly, the clamping subassembly is provided on one side of handle, the clamping subassembly is used for fixing zirconia porcelain block position, locating piece is fixedly connected to the bottom of handle, mounting subassembly is provided at the bottom of locating piece, and the mounting subassembly is used for mounting zirconia porcelain block. The mounting assembly is used for fixing the position of the positioning block; the clamping assembly comprises a fixing ring, a clamping block and a driving piece, the fixing ring is fixedly connected to one end of the handle, and the clamping block is connected into the fixing ring in a penetrating mode. Through the design of the handle, the clamping assembly, the positioning block and the mounting assembly, the positioning block is fixed on the zirconium oxide porcelain block wire cutting machine through the mounting assembly during use, and the positions of the handle and the clamping assembly are fixed through the positioning block; in the using process, a zirconium oxide ceramic block needing to be cut is clamped and fixed through the clamping assembly, so that the thickness of a cut slice is uniform.

The present application provides an ejector, a processing device, and a cleaning device, which can suppress a decrease in suction force in a case where liquid intrudes into the inside of the ejector and inexpensively perform processing or cleaning of an object to be processed. The ejector generates a suction force, the ejector having: an inflow pipe having a plurality of openings formed at a front end thereof from which a drive fluid is ejected; an outflow pipe having a receiving port that receives the drive fluid ejected from the openings at a position opposite to the front end of the inflow pipe; and a main body portion that surrounds around the openings and the receiving port, having a suction passage that suctions an external fluid to the inside.

The application provides a kind of milling device and method for optical crystal, it is related to milling technical field, including rack, the outside of the rack is provided with positioning mechanism, the positioning mechanism includes mounting bracket and connecting plate, the lower surface of the mounting bracket is rotatably connected with rotating ring by bearing, the rotating ring is fixedly connected with connecting plate, the outer surface of the rotating ring is fixedly connected with incomplete gear ring, the outer surface of the mounting bracket is rotatably connected with multiple support rods by bearing, the positioning cylinder is synchronized and combined, only single wheel is opened and closed in whole process, the rest positioning wheel always keeps clamping state.This section cooperates to realize the accurate coaxial positioning of crystal, double fixing structure prevents loosening, single wheel is opened and closed bit by bit, which avoids interference of milling cutter, does not affect milling operation, ensures continuous clamping of non-milling area, completely prevents crystal deviation, simultaneously adapts to positioning needs of optical crystal of different sizes, positioning process does not need manual adjustment, and stability is strong and adaptability is wide.

The utility model discloses a kind of semiconductor thermoelectric material cutting device, including frame, the inside of the frame is provided with hydraulic cylinder, the telescopic end of the hydraulic cylinder is connected with bottom plate, the top of the bottom plate is fixedly connected with fixed column, the top of the fixed column is fixedly connected with clamping mechanism, the inside of the frame is provided with shell, the side of the frame is fixedly connected with scale plate. Through the above structure, some semiconductor thermoelectric materials can be solved when cutting, material loosening or offset may occur, avoid the problem that instability may occur when cutting, and avoid the problem that the quality of material cannot be guaranteed, can solve part of semiconductor thermoelectric materials when cutting, may appear the case that staff needs to measure material length by oneself, avoid the problem that semiconductor thermoelectric material after cutting may need secondary accurate cutting, and avoid the problem of cost increase that appears in secondary cutting.

A method of processing a monocrystalline semiconductor work piece includes: applying pulses of laser light to a first main surface of the monocrystalline semiconductor work piece, the pulses of laser light penetrating the first main surface and forming modified regions in a separation zone within the monocrystalline semiconductor work piece, each modified region being delimited by a subcritical crack that surrounds an inner part in which the monocrystallinity of the semiconductor work piece is altered; controlling the pulses of laser light such that the subcritical cracks of adjacent ones of the modified regions are non-overlapping for at least half of the modified regions formed in the monocrystalline semiconductor work piece; and after inducing the subcritical cracks, forming at least one crack that connects the subcritical cracks. Additional work piece splitting techniques and techniques for compensating work piece deformation that occurs during the splitting process are also described.

The utility model relates to monocrystalline silicon processing technical field, and disclose a cutting silicon core blanking device for monocrystalline silicon processing, including guide table, guide chute, protective layer, transport device, conveyer belt, fixed clamp holder, adjustable clamp holder, limit hole, screw shaft, clamping layer, nut, in the utility model, when the monocrystalline silicon rod is cut by diamond wire and forms the silicon wafer blanking, the silicon wafer can be buffered and received by the protective layer and downwardly rolls and guides, and the fixed clamp holder and adjustable clamp holder on the conveyer belt correspond to the position of guide chute, at this time, the silicon wafer can roll down and fall into the fixed clamp holder and adjustable clamp holder between the guide chute and be collected, and the clamping layer between the fixed clamp holder and adjustable clamp holder can clamp and protect the falling silicon wafer, and the adjustable clamp holder can be located outside the screw shaft and slide and adjust to adapt to the silicon wafer thickness, when the transport device drives the conveyer belt and starts conveying, the silicon wafer between the fixed clamp holder and adjustable clamp holder can be automatically collected and conveyed.

The application provides a wafer stripping device and a wafer stripping method. The wafer stripping device comprises a detection mechanism, an adjusting mechanism, a wind knife structure and a control device. The detection mechanism comprises a first driving device, a first moving piece and a detection device. The first moving piece is connected to the first driving device and the detection device. The first driving device drives the first moving piece to move the detection device to detect the position of the wafer and output a detection signal. The adjusting mechanism comprises a second driving device and a second moving piece connected to the second driving device. The wind knife structure comprises a fixed plate and a wind knife. The fixed plate is provided with a groove. The wind knife is installed on the fixed plate through the groove. The top of the wind knife is connected to the second moving piece. The control device is electrically connected to the first driving device and the second driving device. The control device is configured to receive the detection signal output by the detection device, determine the inclination angle of the wafer according to the detection signal, and control the second driving device to drive the wind knife to adjust to a target angle according to the inclination angle of the wafer.

The invention discloses a semiconductor product cutting method and system and a cutting control device, and the cutting method comprises the following steps: obtaining a target vacuum adsorption force according to the obtained target vacuum adsorption force required for cutting a semiconductor product; the opening degree of a control valve arranged at the air suction end of the water ring vacuum pump and / or the connecting pipeline is controlled so that the adsorption jig can generate target vacuum adsorption force; acquiring a detection signal of a pressure sensor between the semiconductor product and the adsorption jig, and determining whether a pressure value corresponding to the detection signal meets the requirement or not; if yes, the cutting mechanism is controlled to conduct cutting; if not, the opening degree of the control valve is adjusted so that the pressure value corresponding to the detection signal can meet the requirement. According to the invention, the corresponding target vacuum adsorption force can be generated according to different semiconductor products, and the vacuum degree and the detection signal of the pressure sensor are combined to regulate and control the adsorption force, so that the actual use requirements of different vacuum adsorption forces of different products can be met, and the vacuum adsorption force can be efficiently regulated and controlled.

The application relates to the technical field of wafer dicing, and provides an adsorption work disc for a dicing machine, a wafer adsorption control method and the dicing machine. The adsorption work disc comprises a disc body and a sealing support. The disc body comprises a base and an adsorption part. The adsorption part is located above the base and is connected with the base to form a gas guide channel. The adsorption part comprises a plurality of adsorption units. The adsorption units are communicated with the gas guide channel. An installation groove is arranged at the edge area of the adsorption part. The installation groove is arranged at the edge of the adsorption work disc, and the sealing support is arranged in the groove. The sealing support supports the edge of the wafer. The sealing support has certain flexibility. When the wafer is adsorbed, the edge of the wafer will not be warped due to the reverse abutting force. Meanwhile, a relatively closed space is formed between the wafer and the adsorption part of the adsorption work disc and the sealing support, so that the adsorption efficiency and adsorption effect of the adsorption units on the middle area of the wafer are improved.

The invention discloses a single crystal silicon rod slicing device, and relates to the technical field of single crystal silicon processing, the single crystal silicon rod slicing device comprises a processing base, a supporting table, a silicon rod placing rack and a linkage cutting assembly, the supporting table is installed on the processing base through a first supporting stand column, and the silicon rod placing rack is arranged on the top of the supporting table through a second supporting stand column; the linkage cutting assembly and the U-shaped support are installed on the table top of the supporting table. The core of the device is that when the linkage cutting assembly drives the single crystal silicon rod to move quantitatively, the diamond cutting line completes slicing synchronously, and the cut silicon wafer falls off through the discharging channel and falls into the discharging water tank after being buffered by the rubber rod on the driving disc. According to the device, cyclic operation is achieved through precise transmission of the bevel gear, the belt pulley, the gear and the rack in cooperation with the elastic reset mechanism, the structure is simplified, the slicing efficiency and continuity are improved, the thickness uniformity and edge integrity of the silicon wafer are guaranteed, the breakage rate is reduced, machining parameters can be adjusted by replacing the corresponding gear, environment friendliness and adaptability are both considered, and practicability is high.

The invention relates to the technical field of composite material machining, in particular to a variable-amplitude machining system and method for a SiCf / SiC composite material, and the variable-amplitude machining system for the SiCf / SiC composite material comprises a machine tool, an ultrasonic transducer capable of adjusting the amplitude and a tool; the machine tool is used for clamping a target workpiece; the ultrasonic transducer is mounted on a main shaft of the machine tool and stably rotates along with the main shaft; the cutter is installed on the ultrasonic transducer and used for machining the target workpiece in the set feeding direction; the ultrasonic transducer is used for changing the ultrasonic amplitude according to different machining positions in the machining process. According to the method, the amplitude can be adjusted in the machining process of the SiCf / SiC composite material according to different texture characteristics shown by different positions of the SiCf / SiC composite material, so that machining damage is reduced, the machining quality is guaranteed, and the good machining effect is achieved.

The utility model relates to the field of crystal bar flaw piece recovery, in particular to a crystal bar flaw piece material taking mechanism and a crystal bar processing system.The crystal bar flaw piece material taking mechanism comprises two material taking modules which are arranged in a bilateral symmetry mode, each material taking module comprises a supporting frame and a material receiving unit which are arranged at the bottom, a supporting plate is arranged on each supporting frame, and the two material taking modules are symmetrical; the supporting plate is vertically arranged, and the top end of the supporting plate is a sharp end and can be in direct contact with a crystal bar; a first reference surface and a second reference surface which are perpendicular to each other are established by taking the central axis of the crystal bar as a reference, the crystal bar subjected to squaring comprises a square bar and crystal bar edge pieces on the left side and the right side, the distance between the gravity center of each crystal bar edge piece and the first reference surface is L1, the distance between the tip end of each crystal bar edge piece and the first reference surface is L2, and L1 is larger than L2; and the material receiving unit is obliquely arranged and is used for receiving the poured crystal bar edge skin. Cost and maintenance difficulty can be reduced, stability is guaranteed, edge skins are prevented from being collided in the placing process, and the edge breakage phenomenon is reduced.

The present application provides a kind of breaking device, in the case where repeatedly breaking, can better carry out breaking each time execution.The breaking device has: motor, rotates in horizontal plane;Action conversion mechanism, the lifting action of breaking rod is converted into the rotating action of motor;Motor control unit, controls the action of motor;Torque detection unit, detects the torque of motor;And breaking processing unit, by controlling the action of each part of breaking device, executes breaking to breaking object;By using motor control unit to make motor rotate in the state that breaking object is arranged and fixed to support portion in the state that one main surface is contacted with support portion, make breaking rod drop to the position of the other main surface of breaking object and corresponding to the forming position of scribe, according to the torque change detected by torque detection unit when breaking rod drops, it is judged that breaking object has completed breaking.

The invention discloses a bubble generating mechanism, a micro-nano bubble host comprising the bubble generating mechanism and application of the bubble generating mechanism in the processing technology of photovoltaic cells. The bubble generating mechanism comprises an outer shell and an inner shell which are sleeved with each other, a liquid flow channel allowing liquid to flow through is formed in the middle of the inner shell and comprises a first flow channel, a throat part and a second flow channel, and the end, close to the second end, of the first flow channel is connected with the throat part; the inner diameter of the throat portion does not exceed the inner diameter of the end, close to the second end, of the first flow channel, the inner diameter of the second flow channel is gradually increased in the direction close to the second end, the inner surface of the second flow channel is a smooth wall face, the air inlet flow channel communicates with the liquid flow channel in the circumferential direction, and the air inlet flow channel communicates with the throat portion in the circumferential direction. And the inner surface of at least partial area of the first flow channel is a spiral flow channel. The bubble generating mechanism can ensure that the generated micro-nano bubbles are smaller in particle size and more stable.

The utility model provides a wire wheel tensioning device for a diamond wire slicing machine. The portal frame is in a C shape with a downward opening, and the portal frame can be arranged in the upper cavity in an up-down sliding mode. The lifting assembly controls the portal frame to move up and down. The cutting mechanism comprises a driving assembly, a driving wheel, a tensioning wheel, two supporting wheels and a cutting line. The driving wheel, the tensioning wheel and the supporting wheel are all rotationally arranged at the four corners of the portal frame, and the cutting line is installed on the driving wheel, the tensioning wheel and the supporting wheel. The tensioning mechanism comprises a tensioning sliding block and an electric telescopic rod, a sliding groove extending in the left-right direction is formed in one corner of the portal frame, the tensioning sliding block is installed on the tensioning sliding block in a sliding mode, and the tensioning wheel is installed on the tensioning sliding block in a rotating mode. The electric telescopic rod is installed on the portal frame and connected with the tensioning sliding block. And the tensioning mechanism can adjust the tightness of the cutting line, so that different cutting process requirements can be met, and the effect of improving the cutting quality and the cutting efficiency is achieved.

A state monitoring system of a wire saw that has a first processing roller and a second processing roller, a wire that is stretched between the first processing roller and the second processing roller, and a moving member that moves the workpiece in such a manner that the workpiece is pressed against the wire between the first processing roller and the second processing roller while the wire is being moved, the state monitoring system of the wire saw comprising a detection data acquisition unit that acquires detection data of a first wire sensor that detects the amount of wire fed to the first processing roller and detection data of a second wire sensor that detects the amount of wire fed from the second processing roller, an inference unit that infers the state of the wire based on the amount of wire fed and the amount of wire fed, and an output unit that outputs the inference result of the inference unit.

The utility model provides an automatic feeding device of a bar digging machine, which comprises a hanger plate and a bar digging machine body arranged below the hanger plate, and further comprises a flexible feeding component arranged between the hanger plate and the bar digging machine body, the flexible feeding assembly comprises a mounting plate mounted above the bar digging machine body, a set of sliding columns arranged above the mounting plate, piston cylinders slidably connected to the outer portions of the sliding columns, and a pushing structure arranged below the hanging plate and used for enabling the sliding columns to push the bar digging machine body to conduct flexible feeding. The guide assemblies are arranged on the left side and the right side of the bar digging machine body. By arranging the flexible feeding assembly, the bar digging machine body can be pushed to feed through the pressure of gas, when the bar digging machine body makes contact with a sapphire material, due to the fact that the gas has compressibility, flexible buffering can be formed in the piston barrel, the bar digging machine body is not subjected to rigid impact during feeding, and it is avoided that impact force is generated to damage the sapphire material; the appearance quality of the sapphire product is further improved.

The invention provides a wafer cutting edge searching and positioning device and wafer cutting equipment, and relates to the technical field of wafer cutting, the wafer cutting edge searching and positioning device comprises a wafer cutting table, an irradiation lamp strip and a lens assembly, the irradiation lamp strip is arranged at the edge of the wafer cutting table, a first polaroid is arranged on the light emitting side of the irradiation lamp strip, and a second polaroid is arranged on the light emitting side of the irradiation lamp strip; the irradiation lamp strip emits polarized light towards the adhesive film layer and the edge of the wafer; the lens assembly is arranged above the wafer cutting table, a second polaroid is arranged on the light incident side of the lens assembly, and the polarization direction of the second polaroid is perpendicular to the polarization direction of the first polaroid. Compared with the prior art, the embodiment of the invention utilizes the irradiation lamp strip and the first polaroid to emit polarized light, and the second polaroid can filter out the light emitted by the adhesive film and only retain the reflected light at the edge of the wafer, so that the outline of the wafer can be clearly identified, the edge of the wafer can be accurately identified, the edge searching abnormal alarm is reduced, and the edge searching passing rate is increased; and the subsequent cutting precision and yield are improved.

The present application relates to the technical field of silicon wafer production, in particular to a cutting method of silicon wafer and application thereof. The method comprises: (a) transferring new wire to a take-up wheel, paying out the new wire on the take-up wheel to perform first knife reverse cutting, and recycling primary old wire to a pay-off wheel; (b) paying out the primary old wire on the pay-off wheel to perform first knife forward cutting, and recycling secondary old wire to the take-up wheel; (c) transferring the primary old wire stored on the pay-off wheel to the take-up wheel, transferring the new wire stored on the pay-off wheel to the take-up wheel, paying out the new wire and the primary old wire on the take-up wheel to perform second knife reverse cutting, and recycling the tertiary old wire obtained by the second knife reverse cutting to the pay-off wheel; and (d) paying out the tertiary old wire on the pay-off wheel to perform second knife forward cutting, and recycling quaternary old wire to the take-up wheel. The method has the advantages of low wire consumption, small old wire surplus amount of the pay-off wheel, high production efficiency, short wire transfer time, etc.

This utility model relates to the field of chip processing technology, and discloses a chip dicing pressure control structure, a chip dicing machine, and a factory. The chip dicing pressure control structure includes: a displacement plate that fixes the chip dicing blade and slides on a guide rail; a pressure sensor whose sensing end contacts the displacement plate and moves in real time via the displacement plate to obtain the real-time processing pressure of the chip dicing blade; a power structure that drives the displacement plate to slide along the guide rail; a controller that is signal-connected to the power structure and the pressure sensor; the controller receives the real-time processing pressure of the chip dicing blade transmitted by the pressure sensor in real time, compares the real-time processing pressure with the set processing pressure, and moves the displacement plate via the power structure to make the real-time processing pressure equal to the set processing pressure. This application forms a closed-loop control through real-time and precise control of the chip dicing pressure, without the need for manual intervention. The processing pressure is monitored by the pressure sensor in conjunction with the controller, ensuring the stability of the chip dicing process.

The application belongs to the technical field of wafer processing, and particularly relates to a vacuum holding system of a comprehensive control wafer dicing machine. The system comprises a cutting platform and a vacuum control pipeline, and further comprises: a vacuum holding control pipeline, one end of the vacuum holding control pipeline being in communication with the atmosphere, the other end of the vacuum holding control pipeline being in communication with a wafer stage of the cutting platform, a first vacuum generator, a first electromagnetic valve and a first check valve being arranged on the vacuum holding control pipeline; an electromagnetic valve control circuit, the electromagnetic valve control circuit being used for controlling the first electromagnetic valve to be turned on when the vacuum control pipeline fails; and a check valve control circuit, the check valve control circuit being used for controlling the first check valve to be turned on when the vacuum control pipeline fails. When the vacuum control pipeline fails, the vacuum state of the wafer stage of the cutting platform is maintained through the vacuum holding control pipeline, and an alarm is realized, so that loss caused by vacuum degree drop is prevented.