4667results about "Fine working devices" patented technology

The invention provides a laser positioning method for improving gemstone cutting precision, and belongs to the technical field of gemstone cutting laser positioning. A gemstone crystal refractive index tensor model and a ray tracing algorithm are established to simulate a propagation path of light in a gemstone; a thermo-optic effect prediction model is adopted to predict a focus drift distance according to temperature distribution and laser power data and calculate wavefront predistortion phase distribution for compensation, and a zero-vibration input shaping filter is designed for a galvanometer scanning system to suppress residual vibration. A composite control strategy that feedforward control compensates inertia lag and feedback control corrects position errors is adopted to drive a galvanometer, the inherent frequency of a system is recognized through spectral analysis, and the scanning frequency is adjusted to avoid resonance. The technical problem that in the long-time machining process, due to the thermo-optic effect and vibration of a galvanometer scanning system, the laser focus point position generates accumulated drifting, and the cutting precision is reduced is solved.

The invention relates to a crack propagation method and a laser fragmentation method of a solid material, and the crack propagation method comprises the following steps: a pre-fixing process: respectively arranging fixed areas on two sides of a modified layer of the solid material obtained by laser modification; and applying force to at least one fixed area, and introducing mechanical stress into the crack expansion process of the modified layer, the laser fragmentation method comprises the following steps: a stripping process of forming a modified layer in a solid material by using laser; a crack propagation process of stripping the solid material with the modified layer by using the crack propagation method; and the residual solid is treated through grinding, laser and crack propagation in sequence. According to the crack propagation method, the two sides of the modified layer are mechanically controlled to generate relative movement, so that the crack is promoted to expand according to the preset mode, the stripping force is reduced, and the crack propagation method has the advantages of simple steps and convenience in subsequent stripping and is suitable for automatic continuous production; the laser fragmentation method has the advantage of high stripping efficiency.

To provide a workpiece conveying device and a workpiece processing apparatus capable of stably and reliably holding and conveying a workpiece whose state changes due to processing, while suppressing complication and increase in the size of the device.SOLUTION: A workpiece conveying device according to one embodiment of the present invention includes a plurality of holding parts 104 that hold a workpiece. The holding part includes a plurality of pieces of holding means (a vacuum pad being first holding means utilizing a pressure difference, and an electrostatic chuck 1042 being second holding means utilizing at least one of electrical means or magnetic means) that hold the workpiece from one surface side of the workpiece by different mechanisms.SELECTED DRAWING: Figure 6

The invention relates to the technical field of optical crystal repairing devices, and discloses a milling repairing device for optical crystal surface damage, which comprises a mounting seat, a manual lifting table is mounted on the outer side of the mounting seat, a positioning assembly is arranged on the upper side of the manual lifting table, and an electric sliding table is arranged at the lower end of the upper side of the mounting seat. And a repairing assembly is installed on the lower side of the electric sliding table, the positioning assembly comprises a workbench fixedly arranged at the upper end of the manual lifting table, a model groove is formed in the upper side of the workbench, a positioning groove is formed in the center of the model groove, and a plurality of openings are formed in the positions, close to the outer ring of the model groove, of the inner side of the workbench. According to the milling repair device for the surface damage of the optical crystal, through overall cooperative use, the situation that the concave face and the convex face of the optical lens are directly clamped, and the optical lens is prone to being damaged is avoided, meanwhile, side edge clamping is achieved, and side face repair work is avoided.

The utility model relates to a tensioning mechanism of a loop line cutting machine, which comprises a spring, a spring seat, a guide rod, a sliding block and a linear driving piece, one end of the guide rod is connected with the spring seat, the guide rod is sleeved with the spring, the other end of the guide rod penetrates through a limiting plate, and the limiting plate is assembled on the guide rod in a sliding mode; one end of the spring abuts against the spring seat, and the other end of the spring abuts against the limiting plate; the linear driving piece is arranged on the sliding block and can drive the sliding block to move in one direction, the limiting plate is connected with the sliding block, and the sliding block is provided with an installation part for installing a wire wheel. By the adoption of the tensioning mechanism, on the premise that the normal tensioning effect is achieved, the diamond loop line can be conveniently replaced, and then the production efficiency is improved.

The invention discloses a preparation method of a high-strength tungsten alloy wire with the length exceeding 150 km for photovoltaic silicon wafer cutting, and belongs to the technical field of tungsten wire manufacturing. The preparation method of the high-strength tungsten alloy wire comprises the following steps that ammonium paratungstate and lanthanum oxide are added into water to obtain a mixed solution, and the mixed solution is dried, calcined and reduced to obtain mixed tungsten powder; pressing the mixed tungsten powder into a rod shape, and sintering to obtain a sintered tungsten rod; annealing the sintered tungsten rod to obtain a completely recrystallized rod, and performing rotary swaging to obtain a rotary swaged tungsten rod; drawing the rotary swaged tungsten rod to obtain a tungsten filament with the diameter of 0.37-0.41 mm, and annealing to obtain a tungsten filament A; drawing the tungsten filament A to obtain a tungsten filament with the diameter of 0.16-0.18 mm, and annealing to obtain a tungsten filament B; and drawing the tungsten filament B to obtain a tungsten filament with the diameter of 36-38 microns, namely the high-strength tungsten alloy wire. The invention discloses an annealing process in a tungsten alloy wire drawing process, which can effectively reduce the generation of defects such as cracks in a machining process.

The embodiment of the invention provides a dicing saw cutting pressure control method and device based on dynamic pressure prediction and a dicing saw. The method comprises the steps that S1, real-time material characteristic parameters on a cutting path are obtained through a multi-source sensor; s2, based on the material characteristic parameters, a dynamic mapping model of material characteristics and cutting pressure is established, and output parameters are predicted pressure compensation values; s3, before a cutting tool reaches a pressure sudden change area, cutting pressure is adjusted in advance according to a predicted pressure compensation value output by the dynamic mapping model, meanwhile, an actual pressure value is detected in real time through a force sensor, and pressure deviation is corrected in combination with a control algorithm; and S4, carrying out staged pressure loading on the non-uniform doping region in the heterogeneous material. According to the method, the pressure sudden change point is predicted through the dynamic mapping model, the pressure is adjusted in advance in combination with a control algorithm, and the characteristics of the adaptive heterogeneous material are loaded in stages, so that the shear mark uniformity is remarkably improved, and the material damage risk is reduced.

The invention relates to the technical field of wire net monitoring, and particularly provides a method and device for processing small wire bow abnormity, a storage medium and electronic equipment. The method can comprise the steps that in the process that a cutting machine cuts a workpiece, the real-time wire bow value of a cutting head arc line area is obtained; the real-time wire bow value is compared with a wire bow threshold value, and whether wire bow abnormity exists or not is determined; and under the condition that the wire bow is abnormal, based on the type of a cutting wire, cutting parameters for adjusting the cutting machine are obtained, so that the cutting machine automatically adjusts the cutting process through the cutting parameters, the cutting parameters comprise at least one of a pay-off quantity parameter, a take-up quantity parameter, a take-up and pay-off speed parameter and a silicon rod speed parameter of the cutting wire. According to some embodiments of the invention, accurate detection and processing of the small wire bow can be realized, and normal work of the cutting machine is guaranteed.

The invention relates to a semiconductor wafer generation method, which comprises the following steps of: firstly, setting laser scanning times, and then respectively setting a scanning path and a dot spacing of each laser scanning; determining a laser scanning speed and a laser pulse repetition frequency based on a calculation rule preset for each laser scanning, and determining a corresponding modified point diameter, laser pulse energy and an offset distance of a laser focus relative to a preset stripping surface; the pulse laser is focused on a preset stripping surface in the crystal ingot or below the preset stripping surface, and n times of laser scanning are carried out, so that modified points and cracks are sequentially formed on the preset stripping surface; and stripping the crystal ingot along the preset stripping surface to obtain a wafer and a residual crystal ingot. The method not only can eliminate burrs at the edge of the wafer, but also can further reduce the material loss of laser stripping, and has the advantages of simple process conditions, good modified layer morphology, low wafer stripping difficulty and suitability for large-scale industrial application.

The invention discloses a main shaft system of a multi-wire cutting machine and a synchronous control method of the main shaft system, the multi-wire cutting machine comprises three main shafts and three driving rollers, the three main shafts are driven by three driving motors to rotate respectively, and the three driving rollers are installed on the three main shafts respectively; the driving motors are servo motors and can control the rotating speed of the main shaft and feed back the torque of the main shaft. The main shaft synchronous control method of the multi-wire cutting machine comprises the steps that torques fed back by the three main shafts are compared, when the torque fed back by one main shaft is too large, the rotating speeds of the other two main shafts are adjusted, the torques fed back by the three main shafts tend to be consistent, and the peripheral linear speeds of the three driving rollers tend to be consistent. In the invention, the cutting line is driven by multiple spindles, so that the load of each spindle can be equally divided, the linear speed of each spindle tends to be consistent, and the equipment can continuously and stably run.

A gemstone includes a crown, a pavilion, and a girdle disposed between the crown and the pavilion. The girdle has an elliptical cross-section with a major axis and a minor axis. The surface of the gemstone is generally divided into a number of groups of interlocking facets disposed at a variety of angles. The groups of facets comprising the surface of the crown generally include star facets, upper intermediate crown facets, lower intermediate crown facets, main crown facets, and upper girdle facets. The upper girdle facets generally abut an upper edge of the girdle. The groups of facets comprising the surface of the pavilion include culet-adjacent facets, candle facets, main pavilion facets, and lower girdle facets. The lower girdle facets generally abut a lower edge of the girdle.

A cutting device of a silicon rod cutting system, and the silicon rod cutting system. The cutting device includes: a support frame, installed on a machine base of the silicon rod cutting system; two cutting machine head mechanisms, wherein each cutting machine head mechanism is provided with a diamond wire, a cutting segment of the diamond wire is used for cutting a silicon rod from top to bottom while moving; and a feeding mechanism, wherein the support frame is connected with the two cutting machine head mechanisms by means of the feeding mechanism, and the two cutting segments are disposed opposite to each other; and the feeding mechanism is used for driving the two cutting machine head mechanisms to move towards and away from each other, so as to adjust the distance between the two cutting segments.

The invention discloses a weak-rigidity free-form surface monocrystalline silicon reflecting lens and a processing method thereof. The method comprises the following steps: obtaining a monocrystalline silicon block; cutting into blocks; diamond wire cutting; precisely grinding the back surface; performing slicing; the free-form surface sucker adsorbs the lens; precisely grinding the front surface into a cylindrical surface; polishing the magnetorheological elastomer; releasing the lens; the cylindrical sucker adsorbs the lens; precisely grinding and thinning the back surface; releasing the lens; cutting edges and carrying out wet etching on the back surface; and carrying out ion beam modification processing to achieve the final surface shape precision of the free-form surface. According to the X-ray reflecting lens machining method, the free-form surface weak-rigidity reflecting mirror is clamped and deformed into the cylindrical surface for machining, the whole process is ultra-precision grinding and polishing of the cylindrical surface, the machining method is simple and mature, the manufacturing cost is extremely low, dependence on an ultra-high-precision multi-axis linkage machine tool is completely eliminated, and the machining precision is greatly improved. And the machining efficiency is greatly improved, and the method is suitable for mass production of reflectors.

The invention provides a cutting height adjusting method and device of a cutting knife, wafer processing equipment and a medium, and relates to the technical field of wafer processing equipment.The method comprises the steps that the surface height difference between a sample silicon wafer on an auxiliary workbench and a to-be-processed wafer on a main working disc is measured; after the cutting knife cuts the sample silicon wafer to form a cutting mark, calculating a cutting depth value corresponding to the cutting mark; calculating the surface height information of the sample silicon wafer according to the cutting depth value of the cutting mark and the height information corresponding to the lowest point of the cutting knife when the cutting knife cuts the sample silicon wafer on the auxiliary workbench; and according to a preset cutting depth value, the surface height information of the sample silicon wafer and the surface height difference between the sample silicon wafer on the auxiliary workbench and the to-be-processed wafer, target cutting height information of the cutting knife when the cutting knife cuts the to-be-processed wafer is determined. After the height of the cutting knife is adjusted according to the target cutting height information, the cutting mark cut by the cutting knife has high-precision cutting depth.

The invention relates to the technical field of wafers, in particular to a wafer fixing device for a cutting machine, which comprises a rotary table and a wafer carrier, a first airway is arranged in the center of the turntable; a pore plate is arranged at the top of the rotary table; an air chamber communicated with the first air passage is formed between the pore plate and the rotary table; a plurality of second air channels are formed in the rotary table in the circumferential direction; a control valve for communicating the first air passage with each second air passage is arranged between the first air passage and the plurality of second air passages; the turntable is provided with a supporting table; the wafer carrier comprises a tightening ring arranged on the supporting table and a UV adhesive tape film arranged on the tightening ring; the UV adhesive tape film is provided with a plurality of air cavities communicating with the second air channels in a one-to-one correspondence mode in the circumferential direction. In this way, the centrifugal cleaning force is enhanced, cleaning dead corners are reduced, cutting chippings are easier to clean, the cleaning effect is better, and the cleaning efficiency and the product yield are improved.

The invention discloses a silicon carbide crystal cutting liquid supply device and a silicon carbide crystal cutting process, and relates to the technical field of silicon carbide machining.The silicon carbide crystal cutting liquid supply device comprises a liquid supply system, a control module and a first liquid supply pipeline used for spraying mortar to a cutting wire net; the second liquid supply pipeline is used for spraying mortar to the silicon carbide crystals; the nozzles B of the second liquid supply pipeline are positioned obliquely above the two sides of the cutting crystal; wherein the radius of the silicon carbide crystal is R, the transverse distance from the nozzle B of the second liquid supply pipeline to the cutting center is R + 20 mm to R + 200 mm, and the distance from the nozzle B of the second liquid supply pipeline to the vertical direction of the cutting center is R + 20 mm to R + 150 mm; and the first liquid supply pipeline and the second liquid supply pipeline are separately and independently controlled by the control module. The problems that in the existing silicon carbide crystal cutting process, the temperature control capability is insufficient, abrasive supply is insufficient, the cutting surface type quality is poor, and the productivity efficiency is low are solved.

The present invention provides a positioning mechanism for a crystal bar fixed-angle bonding machine, belonging to the technical field of semiconductor equipment. It solves the problem of low bonding accuracy of existing crystal bar fixed-angle bonding machines. The positioning mechanism of this crystal bar fixed-angle bonding machine includes a fixture for horizontally positioning a material plate and a correction reference vertical plate vertically arranged above the fixture and capable of rotating relative to the fixture. A positioning frame is connected to the correction reference vertical plate and can slide in a direction perpendicular to the plate surface of the correction reference vertical plate. A flexible suction cup capable of adsorbing the crystal bar is connected to the positioning frame. When the flexible suction cup adsorbs the crystal bar, the positioning frame can retract and make the crystal bar press against the correction reference vertical plate. A pressing block is also provided on the correction reference vertical plate. When the flexible suction cup adsorbs the crystal bar and the crystal bar presses against the correction reference vertical plate, the pressing block can descend and press the crystal bar tightly on the material plate. The bonding accuracy of this crystal bar fixed-angle bonding machine is higher.

A method is for dividing a plate-like workpiece in which devices are respectively formed in regions sectioned by a plurality of intersecting planned dividing lines. The method includes: forming a first cutting groove not reaching a rear surface of a workpiece by causing a rotating cutting blade to cut into from a front surface of the workpiece along the planned dividing lines; after forming the first cutting groove, forming a second cutting groove not reaching a bottom portion of the first cutting groove by causing the rotating cutting blade to cut into from the rear surface of the workpiece along the first cutting groove; and after forming the second cutting groove, dividing the workpiece along the planned dividing lines by applying external force to the workpiece.

The invention relates to the technical field of chip wafer processing, in particular to a cutting system capable of accurately positioning a chip wafer and a cutting method thereof.The cutting system comprises a cutting machine body, an image processing module, a sensor module, a motion control module, a focusing module and a data processing module, and the image processing module, the sensor module, the motion control module, the focusing module and the data processing module are installed on the cutting machine body; through cooperative work of the image processing module and the sensor module, the cutting system can accurately recognize the position and the edge of a chip, so that high-precision positioning is achieved, the cutting system can adapt to wafers of different thicknesses and different cutting requirements through the dynamic adjustment capacity of the motion control module and the focusing module, and the cutting precision is improved. The cutting precision is further improved, the system can quickly respond and adjust cutting parameters through real-time analysis and optimization suggestions of the data processing module, unnecessary downtime and waiting time are reduced, potential problems can be found and corrected in time through the real-time monitoring function of the sensor module, and the stability and reliability of the system are enhanced.

The invention provides a control method of wafer cutting fluid, which comprises the following steps of: adjusting the axial distance of a wire net grooved wheel based on the diameter of a crystal bar; the minimum flow of the cutting fluid is obtained; and the cutting fluid flow is controlled to be reduced and then increased along with the increase of the cutting depth. According to the control method for the wafer cutting fluid, the flow of the cutting fluid is quantified according to the relation between the cutting depth and the chord length of the wafer; and based on the relative position of the cutting position and the jet flow of the nozzle, the flow speed of the cutting liquid is automatically adjusted, the impact of the cutting liquid on the diamond wire net is reduced to the maximum extent, the stability of the diamond wire net is guaranteed, the cutting quality is improved, and the yield of silicon wafers can also be improved.

The invention relates to the technical field of hard and brittle material processing, and particularly provides a control method of a slicing machine, a computer readable storage medium and computer equipment. The slicing machine aims at solving the technical problem of how to judge that line hanging occurs in the process of retracting of a feeding mechanism when an existing slicing machine achieves automatic operation planned by an inventor. The slicing machine comprises a cutter feeding mechanism and a cutting mechanism wound with a cutting line, and the control method comprises the steps that under the condition that the cutter feeding mechanism ascends to a preset position relative to the cutting mechanism, image data at least containing the cutting line are collected; the image data are analyzed, and whether a cutting line is hung or not in the retracting operation period of the feed mechanism is judged; and under the condition that the cutting line is hung, at least adjusting operation parameters of tool retracting operation. By means of the structure, whether line hanging occurs in the retracting period of the cutter feeding mechanism or not can be judged in a visual collection mode instead of manual observation.

A sprayer for squaring crystal rod includes a first sprayer for wire guide wheel cleaning and a second sprayer for cutting, the first sprayer for wire guide wheel cleaning is disposed at a side of the wire guide wheel, and a liquid spray direction of the first sprayer for wire guide wheel cleaning corresponds to a wire guide groove of the wire guide wheel, so as to flush foreign matters in the wire guide groove in a process of squaring crystal rod; the second sprayer for cutting is disposed at a side of the crystal rod, and the second sprayer for cutting corresponds to a slit in the process of squaring crystal rod, and sprays the slit to discharge powder.

A splitting method of a solar cell comprises the steps that the solar cell is provided, the solar cell comprises an upper surface and a lower surface which are opposite to each other, and a scribing direction is set on the upper surface or the lower surface; first laser is adopted for scanning in the scribing direction, and the first laser enables the solar cell to be heated to generate pressure stress; meanwhile, cooling jet flow is sprayed in the scribing direction, the cooling jet flow enables the solar cell to be cooled to generate tensile stress, and along with movement of the first laser and the cooling jet flow, the center of the pressure stress and the center of the tensile stress do not coincide in the horizontal direction perpendicular to the scribing direction, so that the solar cell cracks in the scribing direction to form a fracture surface, and the fracture surface is formed. The section obliquely connects the upper surface and the lower surface. According to the splitting method of the solar cell, the fracture surface obliquely extends, and the method has the advantages of being smaller in roughness, free of raised grains and more thorough in edge isolation. The invention further provides a splitting and passivating method of the solar cell, the solar cell and splitting equipment.

The utility model relates to a revolving door structure of a wire cutting machine, which comprises a door body and a track, the upper end and the lower end of the door body are respectively provided with a pair of rollers, the pair of rollers are respectively close to two sides of the door body, the rollers are rotatably assembled on the door body, and the rotating axes of the rollers are along the vertical direction; the two rails are located on the upper side and the lower side of the door body respectively and provided with rail grooves, and the idler wheels can slide in the rail grooves. The rail is provided with a transverse section and a longitudinal section, the longitudinal section extends from the transverse section to the rear portion of the wire cutting machine, and the longitudinal section and the transverse section are in arc transition connection. According to the utility model, the door body is arranged to be opened in an inward rotation manner, and the door body is opened inwards, so that after the door body is opened, cooling liquid attached to the inner side of the door body does not fall to the ground on the outer side, but falls into a water collecting tank in the wire cutting machine, and therefore, the problem that the cooling liquid drips to the ground due to a manner of opening the door body outwards or directly taking down the door body 1 is solved; and the door body is convenient to open and close.

The invention discloses a deviation rectification method and system for wafer edge annular cutting, and the method comprises the following steps: placing a wafer on a workbench, and obtaining data through an image recognition system; the algorithm calculation system calculates a deviation distance and a rotation angle according to the identification data; coordinates of cutting in the front-back direction are calculated; the motion control system controls the workbench to move; and the system judges whether the deviation is continuously corrected until the T shaft rotates to the target position. According to the wafer edge annular cutting deviation rectifying method, the rotating position of the current cutting position is read in real time, the position of the Y axis is calculated in real time according to the rotating position, meanwhile, position deviation rectifying is conducted on the Y axis, annular cutting is achieved, and cutting precision and performance are improved.

The invention discloses a SiC-based device scribing and splitting method and a SiC-based device manufactured by the same, and belongs to the technical field of semiconductor processing. The method is used for dividing a wafer structure comprising a SiC substrate, a front process layer and a front metal pattern layer into a plurality of Die. Comprising the following steps: S1, pasting a film on the back surface of a wafer, and slotting the front surface of the wafer according to a preset cutting line; s2, pasting a film on the front surface of the wafer, and scribing the back surface of the wafer according to a preset cutting line; s3, pasting a film on the back surface of the wafer and carrying out front surface splitting operation; and S4, carrying out wafer film expansion operation. According to the invention, through the process of firstly grooving the front surface and then scribing the back surface, the front surface and the back surface of the wafer are enabled to form the cutting channels, thereby facilitating the splitting operation, avoiding the situation that the front surface is not provided with the cutting channels during the splitting, and causing the crushing of fragments, and improving the yield. Moreover, the cutting channels on the front surface and the back surface of the wafer do not need to be processed too deep, so that the overheating and abrasion consumption of the cutter wheel can be effectively relieved, and the scribing and splitting efficiency is improved.

A gemstone includes a crown, a pavilion, and a girdle disposed between the crown and the pavilion. The girdle has an octagon-shaped cross-section. The surface of the gemstone is generally divided into a number of groups of interlocking facets disposed at a variety of angles. The groups of facets comprising the surface of the crown generally include star facets, upper intermediate crown facets, lower intermediate crown facets, main crown facets, and upper girdle facets. The upper girdle facets generally abut an upper edge of the girdle. The groups of facets comprising the surface of the pavilion include culet-adjacent facets, candle facets, main pavilion facets, and lower girdle facets. The lower girdle facets generally abut a lower edge of the girdle.

The invention discloses a diamond wire jumper and wire bow detection system for a polycrystalline silicon multi-wire cutting machine, and relates to the field of solar cell panel production quality detection.The diamond wire jumper and wire bow detection system comprises an image acquisition module used for acquiring a diamond wire mesh image; the image processing module is used for identifying each diamond wire mesh image and determining whether the diamond wire jumps or not and the wire bow value; the image processing module is arranged in the industrial personal computer, and the industrial personal computer displays the wire jumping information of the diamond wire mesh surface and the wire bow value of the diamond wire mesh surface in real time; the centralized monitoring platform is used for receiving the processing information of the industrial personal computer, determining whether diamond wire jumping and wire bow value abnormity exist or not and outputting a result; by designing the automatic cutting machine diamond wire jumper and wire bow detection system, a traditional field worker manual detection mode is replaced, and the labor efficiency of a polycrystalline silicon cutting workshop is improved.

The invention provides a processing method of a light guide rod product, which comprises the following steps: providing a blank piece, and processing a first side surface and a second side surface which are adjacent; by taking the first side surface and the second side surface as references, the blank is mounted on a tool, and two end surfaces of the blank are processed by an upper disc to respectively obtain finished product end surfaces; coating the end surfaces of the two finished products to form coated end surfaces of the finished products; bonding an end face protection piece on the end face of the coated finished product, processing an opposite third side face to obtain a third finished product side face, and processing the first side face to obtain a first finished product side face; and side face protection pieces are bonded to the third finished product side face and the first finished product side face through wax, the opposite fourth side face is machined to obtain a fourth finished product side face, and the second side face is machined to obtain a second finished product side face. The problems that in the prior art, in the process that a light guide rod is machined through a matched disc, dismounting difficulty is large, and edge breakage control is not good are solved.

The invention relates to the technical field of wafer cutting, in particular to a high-stability wafer bearing platform for a wafer cutting machine, which comprises a first base, a lifting power part and a bearing table, the first base is provided with an accommodating groove; the lifting power piece is arranged in the accommodating groove; the bearing table comprises a driving ring and an objective table; the driving ring is rotationally arranged at the top of the first base; a plurality of driving tables are arranged at the edge position of the driving ring in the circumferential direction; a central shaft is arranged on the bottom surface of the objective table; the central shaft downwards penetrates through the driving ring, then extends into the accommodating groove and is connected with the output end of the lifting power piece; the central shaft is matched with the molded surface of the driving ring; a plurality of clamping assemblies in one-to-one correspondence with the driving tables are arranged at the edge position of the objective table in the circumferential direction; the clamping assembly can press a wafer placed on the top face of the objective table downwards and limit the wafer in the radial direction under the action of the driving table. According to the invention, the stability and reliability during wafer cutting or movement are improved.