The utility model discloses a scribing
machine's half-piece
cutting mechanism, including scribing support,
manipulator and half-piece output module, be equipped with jacking motor and jacking frame on scribing support, jacking motor moves back and forth along scribing support, the drive end of jacking motor is connected with
cam, the
cam is located in the middle of jacking frame, and the
cam is located in the middle of jacking frame. A scribing
laser head and a scribing detection camera are arranged in the middle of the scribing support, the half-
wafer output module comprises a half-
wafer transverse moving module, a half-
wafer vertical moving module and a half-wafer suction rod, the half-wafer vertical moving module is installed at the driving end of the half-wafer transverse moving module, the half-wafer suction rod is installed at the driving end of the half-wafer vertical moving module, and a half-wafer suction
nozzle is fixed to the half-wafer suction rod. According to the half-wafer
cutting mechanism of the scribing
machine, the whole
silicon wafer is placed in the scribing area through the mechanical arm,
laser cutting is carried out on the whole
silicon wafer from the middle through
laser, and preparation is made for follow-up series
welding of the half
silicon wafer.