23 results about "Yield rate" patented technology

The utility model relates to the technical field of pipe fitting production dies, in particular to a rubber-coated pipe fitting die capable of improving appearance quality, which comprises a rear die core, a first cavity positioned in the rear die core, a front die core and a second cavity positioned in the front die core. The second cavity is communicated with the first cavity and forms a product cavity for forming a product, a mold sticking surface is arranged on the wall surface of the first cavity, a concave part is arranged on the mold sticking surface, and the mold sticking surface is used for adsorbing a formed workpiece on the wall surface of the first cavity after mold opening. By sacrificing the surface precision of a small part of the surface without the smoothness requirement, the workpiece is stably adsorbed on the first cavity, so that the success rate of the clamping operation of the manipulator is increased, the workpiece is prevented from naturally falling under the action of gravity and being collided to generate deformation, and the working efficiency is improved. And the yield and the surface smoothness of the formed workpiece are effectively improved.

The application discloses a forging method of a wide and thick plate rolling mill supporting roller, belongs to the technical field of wide and thick plate rolling mill supporting roller manufacturing, and is used for solving at least one problem that in the prior art, the forging deformation and the surface quality of an oversized ingot are difficult to be considered, the excess metal at a bulging position is accumulated to the center to form deep layer folding, and the material yield rate and reliability of an oversized supporting roller are poor. The forging method comprises the following steps: providing a blank, pressing the blank, pre-drawing the blank after the blank is pressed, obtaining a square blank, upsetting the square blank in the height direction along the axial direction, obtaining an upset blank, compacting and drawing the upset blank, obtaining a compacted and drawn blank, drawing the compacted and drawn blank to the diameter of a forged roller body to obtain a basic blank, finally drawing the two ends of the basic blank to form a roller neck, and obtaining a final forged product. The application can be used for the forging of the wide and thick plate rolling mill supporting roller.

This invention relates to the field of material mixing injection molding technology, specifically a creep forming method for mixing injection molding carbon fiber sheet products, comprising the following steps: shaping by applying force with a robotic arm; controlling the temperature to keep the material under stress below plastic deformation for a long time, and continuously baking at a constant temperature to achieve the shaping effect; and correcting the material using a shaping fixture. The main process is to shape the material through creep. This invention has a reasonable technical approach and improves the yield rate of production.

The application relates to the technical field of steel rolling, and discloses a hot continuous rolling strip head thickness deviation control method and device and electronic equipment. The method comprises the following steps: acquiring an actual head thickness value of a current strip in a hot continuous rolling mill rolling process and a target head thickness value of the current strip; determining a head thickness deviation value of the current strip according to the actual head thickness value and the target head thickness value; acquiring an actual rolling force of the current strip and a calculated rolling force of the current strip; determining a rolling force deviation value of the current strip according to the actual rolling force and the calculated rolling force; and determining a target set rolling force of a next coil of the current strip according to the head thickness deviation value and the rolling force deviation value. The technical scheme disclosed by the application can effectively improve the strip head thickness deviation problem caused by the rolling force setting calculation deviation, reduce the thickness out-of-tolerance occurrence rate, improve the product thickness control precision and the yield rate.

The application provides a method for reducing wafer orientation deviation after cutting, which comprises the following steps: dividing a wire cutting machine into multiple groups, obtaining a wire cutting deviation rule of the wire cutting machine in different horizontal zero target ranges, and cutting a to-be-cut wafer rod by matching the corresponding wire cutting machine according to the wire cutting deviation rule, so as to reduce the wafer orientation deviation after cutting. For products with a wafer specification of ≤±0.1°, the defective rate is reduced from 3.5% to below 0.5%. For ultra-high specification products with a wafer specification of ≤±0.05°, the yield rate is above 98.5%.

The present invention provides a substrate processing method that can form a groove line without cracks at a high yield rate and then change it into a groove line with cracks even for a brittle material substrate with an extremely thin plate thickness. The substrate processing method of the present invention includes: a first step of forming a groove line without cracks by pressing and fixing a scribing tool of a fixed blade and moving it in a forward direction from a position of a substrate that is apart from an edge inward as a scribing start point and a scribing end point; and a second step of forming an auxiliary line by pressing and moving a cutter wheel in a manner that intersects at an acute angle of 3 to 25 degrees with the groove line in a direction opposite to the forward direction from the intersection position to guide a crack to the groove line from the intersection position, thereby changing the groove line into a crack line with cracks.

The application discloses a processing method of a compound semiconductor wafer, which comprises the following steps: attaching the compound semiconductor wafer to a carrier film, fixing the carrier film in a fixing ring, and packaging the edge of the carrier film through the fixing ring to form a bearing assembly; and performing a cutting process, a film expanding process, an etching process and a carrier film retraction process in the form of the bearing assembly. In the continuous process, the wafer is maintained in the form of a bearing assembly, the distance between the crystal grains is expanded after pre-expanding, so that the side wall of the cutting path can be etched clean, the yield rate meets the standard, then the carrier film is retracted to the initial state and is suitable for subsequent process steps, the bearing structure of the wafer does not need to be replaced, the process is simplified, the production cost is reduced, and the production efficiency is improved.

The utility model discloses a punching die structure for punching the side wall of an annular structure, an upper die is provided with two slotting tools, a lower die is provided with a punching sliding block, two transmission sliding blocks and two reset pieces, the punching sliding block is arranged on the inner side of the projection of an upper die plate, the side wall of the punching sliding block is provided with a side punch, and the transmission sliding blocks are in transmission connection with the reset pieces and can be in transmission connection with the slotting tools during die assembly. According to the utility model, a hole groove on the side wall can be formed by punching from the inner side to the outer side of a product, the displacement of the side punch can be guided and limited to prevent the side punch from scratching the inner wall of the product, the forming yield is ensured, the overall layout of the die is compact, the space of the lower die can be fully utilized, and the purpose of reducing the size of the lower die is achieved; therefore, the assembling precision of matched parts on the die can be improved, the machining precision of all parts can be properly reduced, the die manufacturing cost is reduced, the die manufacturing period is shortened, and the production efficiency is improved.

The present application provides an OLED display panel and an OLED display panel manufacturing method forming at least one crack-proof recess surrounding a display region on an array substrate. When the OLED display panel performs a laser cutting process to a cutting line region on the array substrate, cracks generated from the cutting line region is interrupted by the crack-proof recess and therefore cannot extend into a deep inside of a non-display region, and cannot further extend into the display region, which prevents a technical issue of a lowered yield rate due to extension of cracks into the display region.

Task: In a zipper, when forming a top stopper in one piece, which has a leaf and a body of the top stopper, injection molding on a pair of bands facilitates the filling of the molten resin into the space of the cavity corresponding to the leaf and improves the yield rate. Means of solution: An upper stopper (3) is formed in one piece by injection molding on a pair of bands (4) and comprises a body (6) of the upper stopper, a boundary section (8), and a leaf (7) projecting from the surface of the pair of bands and arranged successively towards the top. The body of the upper stopper is annular in the forward / backward direction, with a lower portion of the annular shape being openable and closed, and has a sprue mark (6G) on the inner surface of the annular shape. The boundary section extends, with respect to the two ends (6a), in the width direction of the upper surface of the body of the upper stopper from the inside to the leaf. A thickness (t8) of the boundary section and a thickness (t7) of the leaf decrease in this order.The left and right side surfaces (71) of the leaf have such a shape that they run from the boundary section upwards to the outside in the latitude direction, which is the transverse direction.

The invention discloses an intelligent ingot type selection method and device for a cast ingot, electronic equipment and a storage medium. The method comprises the steps that target information, at least one process rule and at least one production rule are obtained, the target information comprises contract order information, and the contract order information comprises at least one candidate ingot type of a cast ingot; according to the target information, determining a target process rule from the at least one process rule and determining a target production rule from the at least one production rule; under the target process rule and the target production rule, the yield corresponding to each candidate ingot type in the at least one candidate ingot type is determined; and according to the yield corresponding to each candidate ingot type, determining a target ingot type of the mold cast ingot. According to the embodiment of the invention, the optimal ingot type of the mold cast ingot is intelligently selected from the ingot types of the candidate mold cast ingots according to the yield, so that the ingot type selection of the mold cast ingot is dynamically adjusted according to the contract order, the yield is high, the variable contract order requirements can be quickly responded, and the efficiency is high.

This application relates to the field of welding technology, specifically to a welding method and apparatus for straight seam steel pipes. The method includes: collecting the values ​​of process parameters, joint gap, and joint height at each moment; obtaining preset process parameters and their corresponding standard process parameters; determining a joint defect index based on the difference between the standard process parameters and the process parameters at the current moment, and determining whether correction is needed; determining the general joint gap difference and general joint height difference of a class of defects based on the difference between the joint condition of each defect and the joint condition of a defect-free joint with the same process parameters; determining a possible defect index based on the similarity to the current moment; obtaining a reasonable joint condition based on the possible defect index, and obtaining a corrected welding current and a corrected arc voltage; and performing welding based on the corrected welding current and corrected welding voltage. This application improves the yield rate of straight seam steel pipe welding.

This application discloses a beveling machine, addressing the problem that existing beveling machines have poor adaptability to non-straight pipes, resulting in low beveling accuracy when directly processed. The beveling machine includes a base; a clamping assembly disposed on the base, the clamping assembly having at least three jaws to jointly clamp the first end of the pipe; a limiting assembly disposed on the base or the clamping assembly, the limiting assembly operably fitting onto the second end of the pipe, the first end and the second end of the pipe forming an included angle; and a cutting tool assembly disposed on the base for cutting the first end of the pipe. This application improves the accuracy of the cutting tool assembly in processing the first end of the pipe, improves the beveling accuracy of the pipe, and increases the yield rate.

This application provides a method, related apparatus, and medium or program product for determining employee operational competence, including: acquiring information from multiple production work orders of a target employee, each production work order including the operational difficulty level of the production equipment operated by the target employee and the number of completed production batches; determining the yield rate and production efficiency compliance rate corresponding to each production equipment group in the multiple production equipment groups based on the information, where each production equipment group is a collection of production equipment categorized according to operational difficulty level; determining the production equipment group for which the target employee's operation meets the standards based on the yield rate and production efficiency compliance rate corresponding to each production equipment group in the multiple production equipment groups; obtaining a determination result; and judging the target employee's operational competence based on the determination result. The embodiments of this application can accurately and quickly determine the level of an employee's operational competence.

The invention discloses a flexible RFID tag production process, antenna forming is divided into preforming before chip binding and final forming after chip binding through adjustment of a process sequence, the core method of the process is to remove redundant materials except for a tag antenna line type on the basis of ensuring the yield, the purpose of flexibility of an RFID tag is achieved, and the production efficiency of the flexible RFID tag is improved. In order to guarantee the yield, a traditional process route is innovated, antenna forming is set after chip binding, and only antenna preforming is performed before chip binding, so that the yield during antenna forming is guaranteed while chip binding is achieved, a flexible RFID tag is obtained, and a reliable process route is provided for manufacturing various flexible RFID tags.

The application provides a uniform temperature plate, an electronic device and a manufacturing method of the uniform temperature plate, and aims to solve the problems of complicated production process and low yield rate of the existing uniform temperature plate with a gap. When the uniform temperature plate is laser welded, the laser welding head is suspended above the second cover plate, the laser beam emitted by the laser welding head is perpendicular to the third part of the second cover plate and deviates from the surface of the first cover plate, the laser spot is moved around the accommodation cavity formed by the first recess and the second recess along the edge area of the third part on the second cover plate by controlling the movement of the laser welding head in a plane, and the first part of the first cover plate and the third part of the second cover plate are welded together, so that the edge sealing of the shell can be completed. In the welding process, the welding parameters (such as welding focal length, laser power, etc.) do not need to be adjusted, one-time welding forming can be realized, and the welding efficiency, the yield rate and the stability of the uniform temperature plate can be improved.

The invention discloses a production monitoring method for an integrally-formed magnetic-copper co-fired inductor, relates to the technical field of production monitoring, is used for solving the problems that the consistency of products is reduced and the yield is low, and is characterized in that in the powder mixing and coating process, the matching weight of soft magnetic powder and the additive amount of an insulating agent are collected, and the mixing uniformity characteristic is evaluated in combination with the powder mixing time; the complete trend of a chemical reaction is analyzed by detecting the coating treatment temperature, the insulation grade is generated by combining the additive amount of an insulating agent, whether a coating curing monitoring mechanism is triggered or not is judged by combining the uniform mixing characteristic and the insulation grade, the default coating thickness of the copper conductor is obtained after triggering, and the copper conductor is corrected through the insulation resistance and the coating colloid concentration. And the pressure resistance of the coating is classified according to the corrected thickness, when the pressure resistance is high, the forming density and the cooling rate are detected, the cracking state is evaluated according to the cooling rate, the magnetic conductivity is collected when the coating is not cracked, the product abnormity is judged by combining the forming density, and the product consistency and the yield are improved.

This invention relates to the field of alloy material processing technology and discloses a sintering method for a toothed cemented carbide thin cutting tool. After the cutting tool blank is prepared, it undergoes gradient heating sintering. The sintering conditions are as follows: a graphite column is placed in the blank hole, the temperature is raised from room temperature to 620℃ for dewaxing, and then the temperature is raised to 1420℃-1460℃ and held for 0.5-1 h under pressure. This invention addresses the shortcomings of existing technologies by using graphite column assistance combined with gradient sintering. The segmented heating controls grain growth, and the final pressure sintering improves density. The synergistic effect of these two methods is far superior to single parameter adjustment, enabling the cutting tool to possess both high hardness and high fracture toughness, achieving the required mechanical properties. By fixing the center positioning, the eccentricity of the inner hole is avoided, which leads to the wobbling of the outer tooth profile, reducing the deformation of tooth tip height, tooth thickness, and tooth profile angle, and improving the consistency of the cutting edge profile. The 0~0.01mm micro-gap design ensures both support and deformation suppression, while also preventing cracking during blank sintering, significantly improving the yield rate.

The utility model relates to the technical field of injection molding product detection, in particular to detection equipment for detecting the qualification rate of injection molding products, and the detection equipment comprises a detection box, one side of the inner wall of the detection box is rotatably matched with a material conveying belt, and one side of the inner wall of the detection box is fixedly connected with an adjusting seat located on the upper side of the material conveying belt; one side of the adjusting seat is in sliding fit with a lifting plate, and the lifting plate is fixedly connected with a lens camera group. According to the utility model, by arranging the spring, the tightening plate, the linkage rope, the positioning seat and the like, an injection product can be tightened and positioned when being conveyed to a detection area, so that a workpiece can be kept at a proper position with a lens camera group during each detection, the position deviation caused by transportation is effectively avoided, and the detection efficiency is improved. The probability that one end is not in the image or the actual shooting angle is inconsistent with the preset angle is reduced, the accuracy of image acquisition is ensured, and the detection precision is further ensured.

The utility model relates to cutting equipment technical field, concretely relates to a cutting-off frock, including operation platform, the top of operation platform is provided with casing one and casing two, be provided with cutting gap between casing one and casing two, the below of casing two is provided with cutting knife and color identifier, compares with the cutting mode of the color after the identification of conventional utilization manpower again according to the setting length, can reduce the eye strength of operating personnel, relieves the fatigue of operation, and simultaneously still can avoid the phenomenon of cutting length confusion to occur when there is the wire of similar color, improves the production efficiency of product simultaneously, can guarantee the production yield rate still.

A material characteristic value prediction system that can predict material characteristic values with high accuracy is provided. Also provided is a method of manufacturing a metal sheet that can improve the product yield rate, by changing manufacturing conditions of subsequent processes. The material characteristic value prediction system (100) includes a material characteristic value predictor configured to acquire input data including line output factors in a metal sheet manufacturing line, disturbance factors, and component values of a metal sheet being manufactured, and predict material characteristic values of the manufactured metal sheet using a prediction model configured to take the input data as inputs, wherein the prediction model includes a machine learning model generated by machine learning and configured to take the input data as inputs and output production condition factors, and a metallurgical model configured to take the production condition factors as inputs and output the material characteristic values.