The invention discloses a high-bonding-strength conductive
adhesive and a preparation method and application thereof.The preparation method comprises the following steps that S1,
epoxy resin E51 is placed in a three-neck flask,
acetone is added, stirring is conducted till the
epoxy resin E51 is completely dissolved, and ethidene
diamine is slowly dropwise added; s2, under the protection of
nitrogen, heating to 70-80 DEG C, adding a catalyst
triphenylphosphine, carrying out a constant-temperature reaction, after the reaction is completed, cooling to 35-45 DEG C, adding deionized water, and stirring; s3,
acetone and unreacted
ethylenediamine are removed, then deionized water is used for washing, an obtained product is placed in a
vacuum drying oven to be dried, and amino modified
epoxy resin of faint yellow
viscous liquid is obtained; s4, mixing the amino modified epoxy resin with an anhydride curing agent, a conductive filler, a
diluent and a
coupling agent; and S5, fully stirring the mixture, carrying out vacuum defoaming, and uniformly stirring to obtain the conductive
adhesive. According to the invention, the shearing strength of the
chip and the
copper bracket can be improved to more than 30MPa.