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17944 results about "Bonding strength" patented technology

Bonding Strength. Bonding strength is defined as the maximum force born by unit bonding area, which mainly depends on the own strength of adhesives (cohesive power) and the adhesive strength (adhesive power) between adhesives and adherends.

Thin film device transfer method, thin film device, thin film integrated circuit device, active matrix board, liquid crystal display, and electronic apparatus

A thin film device fabrication method in which a thin film device formed on a substrate are transferred to a primary destination-of-transfer part and then the thin film device is transferred to a secondary destination-of-transfer part. A first separation layer (120) made of such a material as amorphous silicon is provided on a substrate (100) which allows passage of laser. A thin film device (140) such as TFTs are formed on the substrate (100). Further, a second separation layer (160) such as a hot-melt adhesive layer is formed on the thin film devices (140), and a primary destination-of-transfer part (180) is mounted thereon. The bonding strength of the first separation layer is weakened by irradiation with light, and the substrate (100) is removed. Thus, the thin film device (140) is transferred to the primary destination-of-transfer part. Then, a secondary destination-of-transfer part (200) is attached onto the bottom of an exposed part of the thin film device (140) via an adhesive layer (190). Thereafter, the bonding strength of the second separation layer is weakened by such means as thermal fusion, and the primary destination-of-transfer part is removed. In this manner, the thin film device (140) can be transferred to the secondary destination-of-transfer part (200) while maintaining layering relationship with respect to the substrate (100).
Owner:SAMSUNG ELECTRONICS CO LTD

Nano-material-containing high-strength high-heat insulation exterior wall inorganic heat-retaining face brick

The invention belongs to the field of building materials, relates to a use of a nano-material in a building exterior wall heat-retaining system and provides a nano-material-containing high-strength high-heat insulation exterior wall inorganic heat-retaining face brick. The nano-material-containing high-strength high-heat insulation exterior wall inorganic heat-retaining face brick is characterized in that nano-particles are used so that compressive strength, tensile strength and bonding strength are improved. The nano-material-containing high-strength high-heat insulation exterior wall inorganic heat-retaining face brick is prepared by adding a nano-material having a nanoscale particle size into a mixed system of cement, an auxiliary gel material, a polymer binder, an inorganic light heat-retaining material, fibers and water, uniformly mixing, carrying out pressing molding of the mixture, carrying out organic polymer crosslinking and cement hydration drying, and carrying out waterproof layer coating. The nano-material-containing high-strength high-heat insulation exterior wall inorganic heat-retaining face brick has the advantages of excellent flame resistance, high compressive strength, high tensile strength, high bonding strength and good insulation effects.
Owner:平湖市法而特建筑保温科技有限公司
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