7929 results about "Bonding strength" patented technology

A method for making a wire package for use as staples or brads is recited as forming a plurality of round wires, forming a plurality of flattened bonding sides on each wire to prepare even bonding surfaces on each wire and bonding each wire to an adjacent wire by adhering the surfaces of each wire. Each staple includes two or more flat surfaces to improve the bonding strength of each staple. A package of diverging staples or brads are formed using the flat bonding surfaces

Provided are a method for producing a film, which is satisfactory in productivity, exhibits high gas-barrier property immediately after production, and has excellent adhesive strength between constituent layers while maintaining the excellent gas-barrier property, and a gas-barrier film, which is obtained by the method. The method for producing a gas-barrier film includes the steps of; (1) forming an inorganic thin film by a vacuum deposition method on at least one surface of a base film; (2) forming a thin film by a plasma CVD method on the inorganic thin film formed in the step (1); and (3) forming an inorganic thin film by the vacuum deposition method on the thin film formed in the step (2), in which each of the steps (1) and (3), and the step (2) are sequentially carried out at a pressure of 1×10⁻⁷ to 1 Pa, and at a pressure of 1×10⁻³ to 1×10² Pa, respectively.

Adhesion defects between a single crystal semiconductor layer and a support substrate are reduced to manufacture an SOI substrate achiving high bonding strength between the single crystal semiconductor layer and the support substrate. Plasma is produced by exciting a source gas, ion species contained in the plasma are added from one surface of a single crystal semiconductor substrate, and thereby forming a damage region in the single crystal semiconductor substrate; forming an insulating layer over one surface of the single crystal semiconductor substrate; a support substrate is bonded so as to face the single crystal semiconductor substrate with the insulating layer therebetween; the single crystal semiconductor substrate is heated to separate the single crystal semiconductor substrate into a single crystal semiconductor layer bonded to the support substrate and a single crystal semiconductor substrate, in the damage region; and the single crystal semiconductor layer bonded to the support substrate is pressed.

A coil component 1 includes a substrate 2, a planar spiral conductor 10a formed on a top surface 2t of the substrate 2, a lead conductor 11a connected to an outer peripheral end of the planar spiral conductor 10a, a dummy lead conductor 15a formed on the top surface of the substrate 2 and between an outermost turn of the planar spiral conductor 10a and an end 2X₂ of the substrate 2 and free from an electrical connection with another conductor within the same plane, external electrodes 26a and 26b arranged in parallel with the top surface of the substrate 2, and a bump electrode 25a formed on a surface of the lead conductor 11a and connects the lead conductor 11a with the external electrode 26a. The external terminals 26a and 26b have a larger area than the bump electrodes 15a and 15b for securing a bonding strength.

The invention presents a touch panel disposed at the display screen side of a liquid crystal display device or the like, and excellent in surface smoothness and environmental resistance. In marginal outer circumferential part 400B for adhering and fixing first transparent substrate 21 and second transparent substrate 31 face to face, insulating layer 27 for correction of step difference is disposed in order to make uniform the film thickness. Adhesive layer 29 is disposed on insulating layer 27, and first transparent substrate 21 and second transparent substrate 31 are adhered to each other. As a result, the adhesion fixing state if stabilized, and the adhesion strength is enhanced, and a touch panel suitable for car-mount unit excellent in surface smoothness and environmental resistance can be presented.

A soft solder flowing into the recesses of a semiconductor thin film LED provides: (a) increased bonding strength and better mechanical durability, (b) improved heat dissipation, (c) enhanced light extraction when the LED film is bonded to a new carrier. Annealing localized islands of absorbing metal creates an ohmic contact. Those isolated islands are inter-connected by a layer of a highly reflective metal. This design enables a significant absorption reduction within the LED device and leads to a significant improvement of light extraction. Additionally, the light extraction efficiency of an isotropic light emitting device is improved via surface shaping of the device by a 2D-array of micro-lenses and photonic band gap structure. For manufacturability purpose the making of micron-size lenses of the surface of the chip may preferably be performed as a final step, preferably with optical lithography.

The invention provides a self-leveling polymer cement base repair mortar which is used for repairing cracks of a concrete building. The self-leveling polymer cement base repair mortar comprises the following components in part by weight: 25 to 60 parts of cement, 40 to 70 parts of sand, 1 to 5 parts of redispersible rubber powder, 0.2 to 1.0 part of interface reinforcing agent, 0.1 to 0.5 part of water-retaining agent, and 0.1 to 1 part of water reducing agent; the self-leveling polymer cement base repair mortar has high self-leveling performance; after the building is repaired by the mortar, the whole flatness is high, surface finishment is uniform, and the decoration performance is high; the mortar has high crack infiltration capacity, can infiltrate the crack with the length of less than 1mm, has high bonding strength between the mortar and the original concrete, and does not fall off after being dried and hardened; and after being hardened, the mortar has micro expansion performance, and can compensate the partial shrinkage of concrete, improve the impermeability of the concrete, and is suitable for crack repairing of the concrete.

Implantable medical devices having a polymer gradient coating capable of controllably releasing at least one pharmaceutical compound to a localized area are disclosed. More specifically, the gradient coatings comprise at least two layers where at least one of these layers incorporates at least one pharmaceutical compound. Each of the layers of the gradient coating has at least one physical property affecting the releasability of the pharmaceutical compound incorporated therein that differs from that of at least one other layer. These physical properties include, but are not limited to, solubility constants, molecular weights, elution profiles, and bonding strengths.

The present invention relates to a heat dissipation structure board and a module using this heat dissipation structure used for purpose required of high reliability such as a hybrid vehicle or an electric vehicle and to a method of manufacturing the heat dissipation structure. A resin structure is disposed on a lead frame constituting a heat dissipation board and an odd-shaped electronic component or the like mounted on this lead frame or the like to cover up the lead frame and the odd-shaped electronic component or the like, and this resin structure is fixed to a metal plate, a chassis of a device and the like to constitute the heat dissipation structure board as a whole, whereby fixing strengths of fixing the lead frame and the odd-shaped electronic component or the like, a bonding strength at an interface between the lead frame and the heat transfer layer and the like can be reinforced.

The present invention provides a bonding wire improved in formability of a ball part, improved in bondability, good in loop controllability, improved in bonding strength of a wedge connection, securing industrial production ability as well, and mainly comprised of copper which is more inexpensive than gold wire, that is, provides a bonding wire for a semiconductor device comprised of a bonding wire having a core material having copper as its main ingredient and a surface covering layer over the core material and of a conductive metal of a composition different from the core material, characterized in that the surface covering layer has as its main ingredients two or more types of metals selected from gold, palladium, platinum, rhodium, silver, and nickel and the surface covering layer has a concentration gradient of one or both of a main ingredient metal or copper in the wire radial direction.

A hollow golf club head enables to increase the bonding strength of an outer shell member made of metal and an outer shell member made of fiber reinforced plastic. The hollow golf club head comprises a hollow golf club having a head body of a hollow structure formed by bonding the metallic outer shell member and the fiber reinforced plastic outer shell member, wherein the fiber reinforced plastic outer shell member is bonded to both faces of the bonding portion of the metallic outer shell member.

The invention belongs to the field of building materials, relates to a use of a nano-material in a building exterior wall heat-retaining system and provides a nano-material-containing high-strength high-heat insulation exterior wall inorganic heat-retaining face brick. The nano-material-containing high-strength high-heat insulation exterior wall inorganic heat-retaining face brick is characterized in that nano-particles are used so that compressive strength, tensile strength and bonding strength are improved. The nano-material-containing high-strength high-heat insulation exterior wall inorganic heat-retaining face brick is prepared by adding a nano-material having a nanoscale particle size into a mixed system of cement, an auxiliary gel material, a polymer binder, an inorganic light heat-retaining material, fibers and water, uniformly mixing, carrying out pressing molding of the mixture, carrying out organic polymer crosslinking and cement hydration drying, and carrying out waterproof layer coating. The nano-material-containing high-strength high-heat insulation exterior wall inorganic heat-retaining face brick has the advantages of excellent flame resistance, high compressive strength, high tensile strength, high bonding strength and good insulation effects.

Conventional heat bonding and anodic bonding require heating at high temperature and for a long time, leading to poor production efficiency and occurrence of a warp due to a difference in thermal expansion, resulting in a defective device. Such a problem is solved. An upper wafer 7 made of glass and a lower wafer 8 made of Si are surface-activated using an energy wave before performing anodic bonding, thereby performing bonding at low temperature and increasing a bonding strength. In addition, preliminary bonding due to surface activation is performed before main bonding due to anodic bonding is performed in a separate step or device, thereby increasing production efficiency, and enabling bonding of a three-layer structure without occurrence of a warp.

A robotic apparatus and method for treatment of system of conduits and lateral sub-conduits comprising a remotely controlled robotic vehicle which navigates main conduits which delivers a series of tools to locations within the conduit. The mule's tools comprise a variety of devices including a tape head and a transport housing for a second remotely controlled robotic vehicle, or mouse which can be deployed for traversing and treating sub-conduits. Further, a method to install one or more small diameter flexible elongate members, such as conductors or sheathes to the inside of the system of conduits comprises advancing an elongate member through the conduit system with the mule or mouse, anchoring the elongate member and then taping the elongate member with the taping head while retreating out of the conduit. Preferably the tape is pre-shaped to minimize wrinkling upon application and more preferably, greater security and tape bonding strength is achieved by spraying over the tape and elongate member.

An individual package of an absorbent article permits a base end of a tape to be bonded with sufficiently large bonding strength without complicating packaging process and increasing manufacturing cost. The absorbent article is wrapped by a package sheet having side edge portions and end edges, and one end edge is overlapped over the other end edge. The package sheet is sealed along the side edge portions, a base end of a tape is fixed on the surface of the package sheet located outside in an overlapping portion, and a free end of the tape extends across one end edge and is releasably adhered on the outer surface of the package sheet adjacent one end edge. The package sheet has a surface, on which the base end of the tape is fixed, the surface being smoothed by a smoothing process.

In imprint lithography, the mold is coated with a surface release layer for a non-sticking separation. Bonding strength of the release layer to the mold depends on the cleanness of the surface and the process of release layer deposition. In accordance with the invention, the mold is disposed in an evacuable chamber, cleaned to remove surface organic contamination and coated with the surface release layer in a chamber, all without relocation or undesired time delay. The chamber encloses a support chuck for the mold or substrate, a surface cleaner unit adjacent the support, a heating source adjacent the support, and advantageously, sensors of measuring chamber pressure, vapor partial pressure and moisture concentration. A vapor source connected to the chamber supplies release surfactant vapor. The mold is cleaned, and the cleaning is followed by vapor phase deposition of the surfactant. The mold is advantageously heated. Typical ways of cleaning include exposure to ozone or plasma ion etch. Surfactant vapor may be generated by liquid surface vaporization, liquid injection or spray vaporization. A surface adhesion promoter can be coated on the substrate by a similar method with the same apparatus.

The invention discloses a solar panel back film and a technique for manufacturing the same. The back film comprises a PET film substrate with thickness of between 100 and 350 micrometers, wherein, fluoropolymer coatings with thickness of between 15 and 30 micrometers are coated on both sides of the substrate; an adhesive layer with thickness of between 0.5 and 5 micrometers is coated on the fluoropolymer coating on one side; the fluoropolymer coatings are obtained by direct coating of mixed latex which is obtained through mixture of various raw material compositions according to the mixture ratio and subsequent grinding treatment on the PET film substrate; the compositions by mass ratio of the raw materials of the fluoropolymer coatings are 30 to 55 percent of fluoride coating materials, 20 to 40 percent of solvent, 2 to 6 percent of cross-linking agent and curing agent and 15 to 40 percent of filling. The technique greatly improves the bonding strength between a back film layer and a layer, improves the ageing resistance, the weathering resistance of products, simultaneously improves the insulativity and the vapor permeability resistance due to the design of a multilayered structure and also can design and modify the performance and the appearance of the products as required.

An electronic device in which a protective plate has sufficient bonding strength and that has improved ease of disassembly and a mobile phone having the electronic device. The electronic device has a housing 102 with an opening 116, a mounting member (reinforcement plate 117) arranged on an inner circumference of the housing opening 116 and mounted on the housing 102, a cover (protective plate 113) adhered and fastened to a peripheral edge (bottom part 115) of the housing opening 116 of the housing 102 and to the mounting member (reinforcement plate 117) and closing the housing opening 116 of the housing 102, and a display device 120 arranged inside the housing 102 so as to face the cover (protective plate 113) with at least a portion of the display inserted in the opening 116.

A lead-free solder alloy substantially contains Sn and Ti, and has a temperature of a liquidus line of not greater than 400° C. The lead-free solder alloy contains no toxic lead and has sufficient bonding strength to oxide materials such as glass and ceramics.

A long life balloon formed from a lamination. The lamination includes a polyester film with a total thickness of 4 μm to 12 μm. The polyester film includes a biaxially oriented polyester core layer and at least one amorphous copolyester skin layer. The lamination also includes a sealant layer and a gas barrier layer on an opposite side of the polyester film from the sealant layer. The oxygen transmission rate of the balloon is less than 0.1 cc/100 sqin/day, a bonding strength of the gas barrier layer to the surface of the polyester film is more than 300 g/in at dry conditions, a sealing strength of the balloon is more than 3.5 kg/in, and a floating time of the balloon is more than 20 days.

A method of bonding includes using a bonding layer having a fluorinated oxide. Fluorine may be introduced into the bonding layer by exposure to a fluorine-containing solution, vapor or gas or by implantation. The bonding layer may also be formed using a method where fluorine is introduced into the layer during its formation. The surface of the bonding layer is terminated with a desired species, preferably an NH2 species. This may be accomplished by exposing the bonding layer to an NH4OH solution. High bonding strength is obtained at room temperature. The method may also include bonding two bonding layers together and creating a fluorine distribution having a peak in the vicinity of the interface between the bonding layers. One of the bonding layers may include two oxide layers formed on each other. The fluorine concentration may also have a second peak at the interface between the two oxide layers.

The invention relates to a polymer wear-resistance coating material, which is a coating material consisting of a component A and a component B, wherein the component B is a solidifier, and the weight part of the component B is 2 to 10 percent of that of the component A; the component A consists of 40 to 80 weight parts of a main ingredient which is one or more mixed in random ratio of silicon carbide, fused zirconia alumina, fused sub-white corundum, fused brown aluminium oxide, fused white corundum and fused mullite, 1 to 5 weight parts of an auxiliary material which is one or more mixed in a random ratio of asbestos powder, glass-ceramic powder, titanium white, aluminium oxide powder and mica powder, 0.5 to 2 weight parts of reinforcing agent which is one ore more mixed in a random ratio of polypropylene fibers, glass fibers and carbon fibers, and 10 to 20 weight parts of a bonding agent which is polyurethane modified epoxy resin. The construction and use of the coating material are convenient and quick, the bonding strength of the coating material is high and the use cost of the coating material is low; and the coating material has high wear resistance, corrosion resistance and air corrosion resistance.

To fabricate a semiconductor device, a pattern of recesses and lands is formed on a copper sheet as a matrix sheet, and BGA pads are formed on the lands on the copper sheet. An insulating layer is formed on the copper sheet to transfer the pattern of recesses and lands from the copper sheet to the insulating layer for thereby forming recesses in the insulating layer and placing BGA pads in the recesses in the insulating layer. Vias are formed through the insulating layer, and a conductive layer serving as circuits and interconnections is formed, the conductive layer being connected to the BGA pads by the vias. When the copper sheet is removed, the BGA pads are positioned within the recesses in the insulating layer. The BGA pads have surfaces positioned higher than the bottom of the recesses and lower than the surface of the insulating layer. A semiconductor chip is mounted on the conductive layer, and solder balls are joined to the BGA pads. Both the productivity of a process of mounting the solder balls and the bonding strength of the solder balls are increased.

A ceramic electronic component (20) having surface conductor films (23) and side-surface conductor films (24) excellent in burning shrinkage, bonding strength, solder heat resistance, solder wettability and the like. A method of producing a ceramic electronic component which uses a conductive paste containing as a main component Ag-based metal powder, the surface of the metal powder being coated with an organic metal compound or a metal oxide having as a constituting element any one selected from a group consisting of Al, Zr, Ti, Y, Ca, Mg and Zn, to form conductor films (23, 24 25) on a ceramic base material (21). A side-surface conductor film-forming paste differs form a surface conductor film-forming paste in that (1) the former paste has a relatively small coating amount of the organic metal compound or metal oxide and/or (2) contains either at least one kind of inorganic oxide powder as an accessory composition or a comparatively high percentage of the inorganic oxide powder.

The invention discloses sand-in-water colorful imitation stone paint. The invention provides sand-in-water colorful imitation stone paint which has a thick coating, high bonding strength, good water resistance, ageing resistance and good storage stability and is a technical progress in the paint industry. The paint is prepared by preparing a crosslinking agent, a dispersing agent, cellulose, a defoaming agent, bactericide, a pH (potential of hydrogen) regulator, a thickening agent, an antifreezing agent, a film formation assistant, a setting agent, titanium dioxide, colored sand and emulsion into a protection glue solution, base paint and a continuous phase and mixing the protection glue solution, the base paint and the continuous phase uniformly. In the paint, the crosslinking agent is an elastomer and nano gel with high grade of transparency, high viscosity and high thixotropy; after the colored sand is added to the paint, colored particle hardness of the paint is adjustable; the paint is suitable for various colors and patterns; and the paint has the advantages of good storage stability, no color bleeding, high possibility of granulation, good water resistance, lasting weatherability, crack resistance high stone imitation degree, simple construction, low cost and workhour saving.

The invention provides a waterborne epoxy modified emulsified asphalt concrete for a steel bridge surface and a preparation method thereof. The waterborne epoxy modified emulsified asphalt concrete for the steel bridge surface is prepared by the following steps of: adding waterborne epoxy resin, a curing agent, and a stabilizing agent into modified emulsified asphalt, continuously stirring until the mixture is uniform, and shearing to obtain waterborne epoxy resin modified emulsified asphalt emulsion; and stirring coarse aggregate and fine aggregate in a container, adding the waterborne epoxyresin modified emulsified asphalt and then stirring, adding a filler and then mixing and stirring, and adding cement and stirring to obtain the waterborne epoxy modified emulsified asphalt concrete. A paving material prepared by the method has the characteristics of environment-friendliness, low volatile organic compound (VOC), low energy consumption, high bonding strength with a steel plate, high cryogenic stabilization, excellent water stability performance, high tenacity, and high fatigue resistance performance.

The invention relates to a building wall insulation composite board and a preparation method of the building wall insulation composite board, and belongs to the technical field of building energy-saving insulation materials and preparation methods. A wall insulation hard foam polyurethane composite board comprises inner cores, protective layers coated on the peripheries of the inner cores and interface layers coated on the upper surfaces and the lower surfaces of the protective layers in an attached mode. The inner cores are vacuum insulation boards. The preparation method of the wall insulation hard foam polyurethane composite board comprises preparation of interface coiled materials: coating prepared flame-retarded polymer mucilage on base materials to produce the interface coiled materials, and manufacturing of the protective layers and the wall insulation hard foam polyurethane composite board. The insulation composite board has good thermal insulation performance, waterproof performance and heat insulation performance, can satisfy 65% requirements of building energy efficiency very well, is high in bonding strength and convenient to construct and operate, greatly increases overall fireproof performance of the whole wall heat-insulation system after being arranged on a wall, and can be widely applied to the inner portions of walls, outer walls, and roof covering thermal insulation systems, heat insulation systems and waterproof systems.

The present invention is intended to provide a glass article with a metal member joined thereto in which an electroconductive coating film is formed on at least a part of the surface of the glass article by baking a silver paste that includes Ag particles and a glass frit, a joining plane of the metal member is fixed onto the electroconductive coating film with a lead-free solder alloy containing Sn as a main component, and the lead-free solder alloy contains at least 1.5 mass % of Ag, which prevents the appearance of the electroconductive coating film and the bonding strength from degrading. Furthermore, in the present invention, when using a metal member having at least two joining planes, the total area of the joining planes is set within a range of 37 mm² to 50 mm², which allows high bonding strength between the glass article and metal member to be maintained while using the lead-free solder alloy. Moreover, in the present invention, the volume of the lead-free solder alloy to be provided on each joining plane is set to be 1.0 to 2.0 times the product of the area of the joining plane concerned and the thickness of the lead-free solder alloy, which prevents cracks from occurring in the glass article.

A method for preparing alkali lignin modified phenol-formaldehyde resin comprises the following steps: phenol, a first batch of formaldehyde solution, alkali lignin, metal oxide and dilution water are added into a reactor; a second batch of formaldehyde solution is added into the reactor; and a third batch of formaldehyde solution and a first batch of alkaline solution are added, formaldehyde trapping agent and a second batch of alkaline solution are added, and then material is discharged after cooling. The invention adopts the copolymerization technique to prepare an alkali lignin phenol formaldehyde adhesive, lignin and the phenol are added simultaneously, obtained hydroxymethylated lignin is reacted with hydroxymethyl phenol, a small part of the obtained hydroxymethylated lignin participates in the polycondensation of the hydroxymethyl phenol to form a main chain, and a large part of the obtained hydroxymethylated lignin forms branch chains through graft copolymerization, therefore, the lignin is introduced into a molecular chain and the aim of modifying phenol-formaldehyde resin is achieved. The invention can replace the use of 30-50 percent of the phenol, realizes stable and easy reaction control and easy industrial production; the bonding strength satisfies the requirements of national I-level plates; formaldehyde release reaches E0 level; therefore, the invention provides a new approach to the development of environment-friendly biomass-based wood adhesive and resource utilization of waste materials.

The invention relates to ultraviolet curing liquid state optical cement which is prepared from the components in parts by mass as follows: 40-70 parts of polyurethane acrylate oligomer, 20-40 parts of (methyl) acrylic ester, 0.1-5 parts of photoinitiator, 1-10 parts of silane coupling agent and 0-10 parts of assistant. The invention further provides a preparation method of the ultraviolet curing liquid state optical cement. Besides the characteristics of transparent appearance, stable viscosity, low energy required for curing, quick curing speed, high refractive index and the like, the ultraviolet curing liquid state optical cement provided by the invention further has the excellent characteristics of great bonding strength, low hardness after curing, good flexibility and excellent weather ability.