The utility model discloses an anti-residue filling device, relates to
soldering flux production technical field, including mounting frame, filling subassembly and anti-dripping subassembly, the rear side of mounting frame is fixed with the rear support plate, and the top of rear support plate is equipped with the
material storage box, the bottom of
material storage box is connected with the flow control valve through the pipeline, the flow control valve is connected with the filling subassembly through the pipeline, and the anti-dripping subassembly is connected with the filling subassembly through the pipeline. A flow control valve is installed on the upper side of the base, a feeding
pipe is connected to the lower portion of the flow control valve, the front portion of the feeding
pipe communicates with a filling material
pipe, a filling head is arranged at the bottom of the filling material pipe, a filling
assembly is installed on the upper side of the filling material pipe, and an anti-dripping
assembly is installed below the filling material pipe. According to the anti-residue filling device, the receiving hopper of the hollow hemispherical structure is located below the filling head of the filling pipe and can receive the filling head, and on the contrary, in the filling process, a small amount of scaling
powder in the receiving hopper can be synchronously dropped into a filling container below through a discharging
nozzle of the 60-degree inclined receiving hopper; and therefore, the situation of material waste can be prevented while the scaling
powder is prevented from leaking and leaking.