37 results about "Anti-reflective coating" patented technology

The application belongs to InGaAs infrared focal plane detector, and provides a preparation method of a new type of InGaAs short-wave infrared detector. After growing P electrode, N electrode, P type metal and N type metal to form ohmic contact, growing connecting layer metal, thinning and polishing InP substrate to form a flat mirror surface, corresponding photoetching on a readout circuit wafer, growing lower electrode metal and indium column, and then carrying out metal stripping; InP epitaxial wafer PDA and readout circuit are uniformly glued, protected, and diced to form independent single; PDA and readout circuit are inversely interconnected to form an infrared detector, and secondary polishing treatment and growth of anti-reflection coating are carried out. The indium column is grown at the end of the readout circuit, and one-step photoetching can be completed. The PDA chip end can reduce the growth of the lower electrode, the growth of the indium column, and the growth of the corresponding passivation layer and the opening of the passivation layer. The process steps are reduced, the probability of defects is reduced, the production cost is reduced, and the final yield of the product is further improved.

A lens includes a lens portion, an anti-reflection (AR) coating layer disposed on a surface of the lens portion, and a water-repellent layer disposed on a surface of the AR coating layer. The water-repellent layer includes an inorganic layer having a plurality of pores and an organic layer at least partially disposed in the plurality of pores. The inorganic layer includes silicon oxynitride (SiOxNy).

The invention relates to an exterior trim part (1) of a vehicle, comprising a thin-walled cover element (2) for covering and protecting a device (3) for emitting and / or receiving electromagnetic waves against environmental influences, wherein the cover element (2) has an intended visible side (A) and an inner side (B) opposite the visible side (A) and is configured such that it can be penetrated by electromagnetic waves of at least one electromagnetic wavelength in the range of 100 nm to 1600 nm, wherein the cover element (2) furthermore has at least one carrier layer (4) made of a polymer material which is transparent or partially transparent to the electromagnetic waves, and having at least one layer (5) of an anti-reflection coating and / or anti-reflection structuring, which is designed in such a way that it reduces the reflection of the provided electromagnetic waves off the cover element (2), wherein the layer (5) is arranged at least on the region (X) of the carrier layer (4) through which the electromagnetic waves are to pass, wherein the wall thickness of the cover element (2) is in a range of 1 mm to 8 mm, preferably in the range of 1.5 mm to 5 mm.

An optical article comprising a coating system that imparts anti-reflective properties and hydrophobic properties to the optical article. The coating system includes a hard coating layer on a lens substrate, and alternating layers of a low refractive index metal oxide and a high refractive index metal oxide deposited on the hard coating layer as an anti-reflective coating, or alternating layers of a medium refractive index metal oxide and a high refractive index metal oxide deposited on the hard coating layer as an anti-reflective coating. A fluorine-free hydrophobic coating composition is deposited on the anti-reflective coating to reduce the surface free energy of the anti-reflective surface of the optical article and to improve the overall cleaning performance of the lens surface by rendering the lens surface hydrophobic.

A beam combining device, enabled to combine a first beam with a second beam of a different spectrum into a combined beam, where the combination may be obtained through a device comprising two antireflective coating, a dichroic filter coating, and a reflective coating arranged on a substrate.

To provide an anti-reflective coating that is easy to manufacture. [Solution] An anti-reflective film 100 formed on the optical surface of a substrate 200, having first to fourth layers arranged sequentially from the substrate 200 side, wherein the refractive index of the fourth layer 4 decreases as it moves away from the substrate 200, and when the refractive indices of the first to third layers at a wavelength of 550 nm are n1, n2, and n3 respectively, and the maximum refractive index of the fourth layer 4 at a wavelength of 550 nm is n4, then n1 > n2, n2<n3、n3> The condition n4 is satisfied.

This application provides a method for avoiding slit defects in mask patterns during self-aligned dual-patterning processes, comprising: Step 1, providing a substrate, and sequentially forming an interlayer dielectric layer, an anti-reflection coating, a titanium nitride layer, a TEOS layer, and a patterned sacrificial layer on the substrate; Step 2, forming a mask layer within the gaps between the patterned sacrificial layers; Step 3, after removing the patterned sacrificial layers, performing a first etching using the mask layer as a mask until the exposed TEOS layer is removed, wherein the mask layer is not etched through during the first etching process; Step 4, performing a second etching using the TEOS layer as a mask until the exposed titanium nitride layer is removed, thereby forming the mask pattern. According to this application, the generation of slit defects can be effectively avoided, while simultaneously expanding the CD window (distance between lithographic patterns).

This application provides a semiconductor device and a method for manufacturing the same, as well as an electronic device. The method includes: providing a substrate comprising a gate and / or a source and a drain; sequentially forming a first insulating material layer, a spin-coated carbon layer, an anti-reflective coating, and a patterned photoresist layer on the substrate; using the patterned photoresist layer as a mask, etching the anti-reflective coating and the spin-coated carbon layer to form a first via exposing a portion of the first insulating material layer; performing a deposition process to form a second insulating material layer at least on the sidewalls of the first via to define a second via; using the second insulating layer as a mask, etching the first insulating material layer at the bottom of the second via to expose the gate and / or the source and drain. The solution of this application can reduce the critical size of the second via, improve the integration and reliability of the device, and also repair linewidth roughness, line edge roughness, and roundness defects.

An image sensor includes a p-type silicon layer, a silicon layer disposed on the p-type silicon layer, a p-type SiGe layer disposed on the p-type silicon layer, a boron layer disposed on the p-type SiGe layer, and an anti-reflective coating disposed on the boron layer. Trenches can be formed in the image sensor such that the boron layer is disposed in the trenches.

An article is described herein including a substrate with a first major surface and a second major surface and an infrared-reflective-visible-anti-reflective (IRVAR) coating disposed on the first major surface, the IRVAR coating including a plurality of multilayer sections, each of the multilayer sections disposed successively with respect to one another on the first major surface, each multilayer section comprising at least two layers exhibiting unique indices of refraction. The IRVAR coating exhibits a maximum hardness that is greater than or equal to 4 GPa. The article exhibits (i) an average transmittance that is greater than or equal to 90.0% across a wavelength range of from 450 nm to 900 nm and (ii) an average transmittance through the article that is less than or equal to 85% across a wavelength range of from 1200 nm to 1800 nm.

The utility model discloses an environmental light interference's infrared receiving tube of gathering light line type, including package shell, condenser lens, infrared photosensitive chip, connecting wire and conducting strip, the package shell includes base plate and cover shell, is equipped with the welding tin tray on the conducting strip, and infrared photosensitive chip is connected with the welding tin tray through the connecting wire, and the condenser lens is located on the cover shell, and the four around of condenser lens is equipped with plane part, and the plane part has coated extinction coating, and the rest part of condenser lens except plane part has coated anti -reflection coating. The utility model discloses the electric connection structure of setting infrared photosensitive chip, conducting strip and welding tin tray in package shell, can realize the stable output of infrared signal, and the plane part of condenser lens has coated extinction coating, and the rest part has coated anti -reflection coating, and extinction coating can absorb the interference visible light and stray infrared light of side, reduce the influence of environmental light interference, and anti -reflection coating can reduce interface reflectivity, improve the transmittance of target direction incident infrared light.

The present application relates to composite films having an anti-reflective coating. The present invention provides a composite film that can include a first transparent substrate and a first anti-reflective coating overlying a first surface of the first transparent substrate. The first anti-reflective coating can include a first UV-curable acrylate binder, a photoinitiator component, and silica nanoparticles dispersed within the first anti-reflective coating. The first anti-reflective coating can further include a ratio of ACl SiO2 / AC1 B of at least about 0.01 and not greater than about 1.3. The composite film can further have a VLT of at least about 93.0% and a haze value of not greater than about 3%.

This disclosure relates to a lens. The lens includes a lens portion, an anti-reflective (AR) coating disposed on a surface of the lens portion, and a waterproof layer disposed on a surface of the AR coating. The waterproof layer includes an inorganic layer having multiple pores and an organic layer at least partially disposed within the multiple pores. The inorganic layer includes silicon oxynitride (SiO2). x N y ).

The present invention is directed to an article comprising an optical cover assembly. The optical cover assembly comprises: (A) a substrate comprising an outer surface and an opposing inner surface; (B) an optional first coating layer applied directly to at least the outer surface of the substrate; (C) an anti-reflective coating stack comprising at least one coating layer; and (D) a topmost coating layer comprising a fluorosilane polymer on the outer surface of the substrate. The optical cover assembly demonstrates hydrophobicity and extended UV durability, and serves as a component of at least one of a vehicle, a light sensor, a LiDAR detector, a motion sensor, a vision camera, a backup camera, a security camera, an IR camera, a headlight, a taillight, a signal light, a RADAR emitter, a RADAR detector, an aircraft landing light, and a gas detector.

The application provides a method for improving mask pattern CD uniformity of a self-aligned double patterning process, comprising the following steps: step one, providing a substrate, and sequentially forming a to-be-etched film layer, a hard mask layer, a sacrifice layer, an anti-reflection coating layer and a patterned photoresist layer on the substrate; step two, etching the anti-reflection coating layer and the sacrifice layer in sequence until the hard mask layer is exposed, with the patterned photoresist layer as a mask; step three, performing over-etching on the lower part of the patterned sacrifice layer, so that the pattern of the sacrifice layer is in the shape of an inverted trapezoid; step four, forming sidewalls on both sides of the sacrifice layer after removing the patterned photoresist layer and the anti-reflection coating layer; and step five, etching the hard mask layer with the sidewalls as a mask to form a mask pattern after removing the sacrifice layer. The mask pattern is in the shape of a symmetrical trapezoid, thereby improving the mask pattern CD uniformity.

This invention provides a spectral camera capable of capturing spectral images with suppressed ghosting effects. [Solution] The spectroscopic camera 1 comprises a plurality of planar elements including an etalon, a first lens group positioned on the object side of the etalon, a second lens group positioned on the image side of the etalon, and an image sensor that receives light that has passed from the etalon through the second lens group. Parallel light collimated by the first lens group is incident on the plurality of planar elements, and the second lens group constitutes an imaging optical system that forms an image on the image sensor of the light that has passed through the plurality of planar elements. In the plurality of planar elements into which the parallel light is incident, there are two or fewer Fresnel reflection interfaces where an anti-reflective coating is not provided.

The present disclosure relates to metrology measurement systems and related methods. In one or more embodiments a measurement system is provided. The measurement system includes a stage operable to retain an object and a light engine disposed above the stage. The light engine includes a light source directed towards the object, a first lens operable to collimate or focus a light from the light source, a reticle tray disposed between the light source and the first lens, and a reticle coupled to a reticle tray. The reticle includes a pattern and an anti-reflective coating disposed on the reticle. The coating is aligned with the pattern.

The application belongs to the technical field of InGaAs infrared focal plane detector, and particularly provides a preparation method of an InGaAs short-wave infrared detector. First, primary grinding and polishing are performed on an InGaAs epitaxial wafer with a lower electrode to obtain a smooth mirror surface, then indium columns are grown, and the wafer is sliced and cleaved into independent PDA chips; flip-chip interconnection is performed with corresponding readout circuits; the flip-chip soldered chips are thinned and polished again, and an anti-reflection coating (ARC) is grown at the PDA chip end to improve the quantum efficiency of the detector. The infrared detector prepared by the method can greatly reduce chip surface scratches and other pollution, and improve the performance of the infrared detector.

Foldable apparatus are described herein that include hard coating disposed on a first major surface of a foldable substrate comprising a glass-based material. A substrate thickness of the foldable substrate is from greater than or equal to 20 micrometers to less than or equal to 300 micrometers. The hard coating includes an inorganic material exhibiting a hardness greater than or equal to 8 GigaPascals as measured by a Berkovich Indenter Hardness Test. The foldable apparatus can achieve a parallel plate distance in millimeters equal to 0.1 times the substrate thickness in micrometers. In aspects, the hard coating can include an optical stack that includes an anti-reflective coating with a thickness from greater than or equal to 10 nanometers to less than or equal to 10 micrometers. In aspects, the foldable apparatus can further comprise an anti-fingerprint coating disposed on the hard coating.

The application relates to the technical field of low-radiation toughened glass, and particularly discloses a temporary layer protective film of a low-radiation toughened glass substrate and a preparation method thereof. The protective film comprises a glass substrate, a functional coating and a polymer temporary layer; the functional coating is composed of silver-containing metal layers and anti-reflection coating layers which are alternately stacked; the temporary layer is formed by curing an acrylate composition and does not contain inorganic fillers and siloxane additives and can be completely decomposed at 550-720 DEG C. The preparation method comprises the following steps: forming the functional coating through magnetron sputtering, preparing a liquid mixture with a specific viscosity, performing ultraviolet curing after roll coating into a film, and then performing stepwise temperature sintering and double-sided blowing cooling. The composition of the application can be used for dynamic protection of the functional coating in the toughening process through specific organic component design, and has the core advantages of high-temperature residue-free decomposition; in addition, the preparation method of the application optimizes the dynamic protection mechanism of the temporary layer in the toughening process through material component and process cooperation.

Foldable apparatus are described herein that include hard coating disposed on a first major surface of a foldable substrate comprising a glass-based material. A substrate thickness of the foldable substrate is from greater than or equal to 20 micrometers to less than or equal to 300 micrometers. The hard coating includes an inorganic material exhibiting a hardness greater than or equal to 8 GigaPascals as measured by a Berkovich Indenter Hardness Test. The foldable apparatus can achieve a parallel plate distance in millimeters equal to 0.1 times the substrate thickness in micrometers. In aspects, the hard coating can include an optical stack that includes an anti-reflective coating with a thickness from greater than or equal to 10 nanometers to less than or equal to 10 micrometers. In aspects, the foldable apparatus can further comprise an anti-fingerprint coating disposed on the hard coating.

Disclosed herein is methods and apparatus for recording a holographic waveguide utilizing an inverted holographic master technique. In some embodiments, an apparatus for recording a holographic waveguide is provided. The apparatus may include a source of light configured to provide a recording beam; a master substrate with a non-grating modulated surface and a grating modulated surface, wherein the grating modulated surface is opposite to the non-grating modulated surface and is configured to diffract the recording beam; a bottom substrate with opposing light transmitting surfaces coated with anti-reflection coatings overlaying the grating modulated surface of the substrate and separated from the master substrate by a gap; and an exposure cell containing holographic recording material directly facing the non-grating modulated surface of the master substrate. Advantageously, the inverted holographic master technique mitigates the effects of unwanted reflected exposure light.

The present invention discloses an anti-reflective coating composition, its preparation method and application, wherein the anti-reflective coating composition comprises a polymer having at least one structural unit represented by formula (1).

This invention belongs to the field of semiconductor processing and manufacturing technology, and provides a semiconductor fabrication method and a semiconductor device. The semiconductor fabrication method includes forming a positive photoresist on one side of a first surface of a substrate with trench openings, filling the trenches with the positive photoresist; then inverting the positive photoresist to obtain a negative photoresist; and forming a second photoresist on the side of the negative photoresist away from the substrate, wherein the second photoresist at least partially overlaps with the vertical projection of the trench bottom onto the substrate, and has a first distance from the trench sidewall. By filling the trenches with a photoresist material with inversion function and inverting it before photolithography on the trenched structure, the material can be used as an anti-reflective coating as it cannot be removed by development after global inversion. After the second photoresist is placed on its surface, normal photolithography processes can be performed using the second photoresist. This method can significantly improve the process window for semiconductor photolithography.

A cap has a recess configured to accommodate a laser diode and includes: a front wall that defines a front side of the recess, at least a portion of the front wall being formed of a material that transmits laser light to be emitted from the laser diode; a rear wall that defines a rear side of the recess, the rear wall being opposed to the front wall; a main body that that defines an upper side and lateral sides of the recess defining a cavity and is connected to the front wall and the rear wall; and an antireflection coating provided on a surface of the front wall. Lower end surfaces, respectively, of the front wall, the rear wall, and the main body define a bonding surface of the cap.

The present invention relates to an antireflection film–coated transparent substrate that comprises a transparent substrate and an antireflection film that is provided on one principal surface of the transparent substrate. The antireflection film–coated transparent substrate has a luminous reflectance of no more than 1.0%, a luminous transmittance of 85.0%–91.0%, and an average transmittance of at least 78.0% for light of wavelengths of 900–1000 nm.

Described herein is a display article comprising: a substrate comprising a thickness and a major surface; a textured surface region; and an anti-reflective coating disposed on the textured surface region. The textured surface region comprises structural features and an average texture height (R text ) from 50 nm to 300 nm. The substrate exhibits a flare of less than 5% and a transmittance haze of less than 40% at 0° angle of incidence as measured by PPD 140 ). The anti-reflective coating comprises alternating high refractive index layers and low refractive index layers. Each of the low refractive index layers comprises a refractive index less than or equal to 1.8 and each of the high refractive index layers comprises a refractive index greater than 1.8. The article also exhibits a first surface average photopic specular reflectance (%R) of less than 0.3% at any angle of incidence from about 5° to 20° from normal at visible wavelengths.

This utility model discloses an ultra-low loss semi-steel cable, belonging to the technical field of semi-steel cable. The semi-steel cable includes an inner conductor, an insulation layer, an outer conductor, and a sheath layer sequentially arranged outside the inner conductor. The outer conductor covers the outside of the insulation layer and includes a first copper layer, a nickel layer, and a second copper layer arranged sequentially from the inside to the outside. A micro-nano anti-reflective coating is applied to the outer surface of the outer conductor. An installation cylinder is fitted onto the end of the sheath layer. An annular installation groove is formed on the inner wall of one end of the installation cylinder. Multiple limiting blocks are arranged within the annular installation groove, and the limiting blocks are connected to the annular installation groove by springs. The outer conductor of this utility model is a composite structure of a first copper layer, a nickel layer, and a second copper layer arranged from the inside to the outside, with a micro-nano anti-reflective coating on its surface. The three-layer metal structure provides good conductivity, corrosion resistance, and shielding effectiveness. The micro-nano anti-reflective coating reduces signal reflection, enhances shielding, improves wear resistance and corrosion resistance, and optimizes the overall electromagnetic performance and durability of the cable.

A temperature-tolerant, shock and vibration resistant absolute pressure sensor may be constructed by joining a ruggedized lens assembly and optical fiber assembly to create a stable beam of collimated light. The lens may be captured by brazing or welding to high-strength spherical metal components. The light delivery assembly may be comprised of a metal-jacketed optical fiber, ceramic ferrule, and metal alignment sleeves that are mechanically and / or chemically joined to one another using high temperature sealing glass preforms or brazing materials. The optical fiber assembly may be joined to the lens assembly securing the end face of the optical fiber in the operative focal position relative to the lens. The joined assembly results in a structure where no parts are subject to movement even at extreme temperatures or when subjected to severe shock and vibration. All the air-to-glass interfaces may have anti-reflection coatings to reduce optical losses, back reflection, and false signals. This rugged collimated beam assembly may be joined to a sensor assembly comprised of a diaphragm and window which comprise a Fabry-Perot interferometer. The external wetted surfaces of the diaphragm may be coated to reflect the radiant energy or with passive conductive and convective arrangements to keep the sensor cool and to minimize the long-term change in sensitivity of the diaphragm due to oxidation. The resulting sensors can be further enhanced by attaching the sensor to an absolute, hermetically sealed connector comprised of a lens assembly which is aligned and welded to the sensor transducer body. The resulting sensors can be further enhanced with windows for collecting UV energy and may use wide spectral band optical fibers to multiplex UV, visible, and IR energy from the sensing environment. These enhancements can be used to detect the presence of a flame and to make temperature measurements resulting in safety-certified optical sensors for use in many harsh industrial applications.

An array substrate includes a substrate, an active layer on the substrate, a first insulating layer on the active layer, a first anti-reflective coating layer on the first insulating layer, a second insulating layer on the first anti-reflective coating layer, a source on the second insulating layer, and a drain on the second insulating layer. The source includes a first electrode portion and a second electrode portion. The drain includes a third electrode portion and fourth electrode portion. An orthographic projection of the second electrode portion or the fourth electrode portion on the substrate overlaps with an orthographic projection of the first anti-reflective coating layer on the substrate.