2814 results about "Thin layer" patented technology

A surgical instrument for being endoscopically or laparoscopically inserted to a surgical site for simultaneous stapling and severing of tissue includes electrically actuated deployment of buttress pads held on inner surfaces of upper and lower jaws of a staple applying assembly. Thereby, thick or thin layers may be stapled and severed without improper staple formation nor with nonoptimal deployment of the buttress pads. Electroactive polymer (EAP) actuated latches, an EAP channel, or a rigid channel with an EAP pinch lock reliably hold the buttress pad until deployment is desired with a low force to separate the stapled and severed buttress pad/tissue combination with the respective EAP mechanism activated for deployment.

Thin films are formed by formed by atomic layer deposition, whereby the composition of the film can be varied from monolayer to monolayer during cycles including alternating pulses of self-limiting chemistries. In the illustrated embodiments, varying amounts of impurity sources are introduced during the cyclical process. A graded gate dielectric is thereby provided, even for extremely thin layers. The gate dielectric as thin as 2 nm can be varied from pure silicon oxide to oxynitride to silicon nitride. Similarly, the gate dielectric can be varied from aluminum oxide to mixtures of aluminum oxide and a higher dielectric material (e.g., ZrO₂) to pure high k material and back to aluminum oxide. In another embodiment, metal nitride (e.g., WN) is first formed as a barrier for lining dual damascene trenches and vias. During the alternating deposition process, copper can be introduced, e.g., in separate pulses, and the copper source pulses can gradually increase in frequency, forming a transition region, until pure copper is formed at the upper surface. Advantageously, graded compositions in these and a variety of other contexts help to avoid such problems as etch rate control, electromigration and non-ohmic electrical contact that can occur at sharp material interfaces. In some embodiments additional seed layers or additional transition layers are provided.

A method of manufacture of a thin layer electrochemical cell (FIGS. 12, 14) comprising the steps of:forming an aperture (11) extending through a sheet (1) of electrically resistive material, said aperture defining a side wall of the cell,mounting a first thin electrode layer (13) to one side of the sheet and extending over aperture (11) whereby to define a cell first end wall,mounting a second thin electrode layer (13) to the other side of the sheet and extending over aperture (11) whereby to define a second cell end wall in substantial overlying registration with the first electrode, andproviding means (16) for admission of a liquid into the cell.

This invention relates to antireflective coatings comprising polymeric polyoxyalkylenated colorants. More particularly, the present invention relates to antireflective coatings for utilization in forming thin layers between reflective substrates and photoresist coatings. Such antireflective coatings are very useful and beneficial within the production and fabrication of semiconductors through photolithographic procedures due to the liquid, non-crystallizing nature of polyoxyalkylenated colorants, and the lack of potentially damaging counterions, metals, and/or electrolytes within the inventive antireflective colored coatings. The inventive coatings may also be applied on lenses, mirrors, and other optical components. Methods of forming such antireflective coatings are also contemplated within this invention.

Organic vertical-cavity surface-emitting lasers ("OVCSELs"), in which a thin layer of organic material is disposed between highly reflective mirrors to thereby form a vertical cavity within a stacked arrangement. The lasers of the present invention each comprise a first mirror layer; a layer of active organic material over the first mirror layer; and a second mirror layer over the layer of first active organic material. The active organic material lases when pumped to thereby produce laser light. The present invention provides for optical semiconductor lasers with desired properties such as narrow bandwidth emission, the minimal use of active organic materials, and the facilitation of wavelength tuning and electrical pumping.

A protective, biocompatible coating or encapsulation material protects and insulates a component or device intended to be implanted in living tissue. The coating or encapsulation material comprises a thin layer or layers of alumina, zirconia or other ceramic, less than 25 microns thick, e.g., 5-10 microns thick. The alumina layer(s) may be applied at relatively low temperature. Once applied, the layer provides excellent hermeticity, and prevents electrical leakage. Even though very thin, the alumina layer retains excellent insulating characteristics. In one embodiment, an alumina layer less than about 6 microns thick provides an insulative coating that exhibits less than 10 pA of leakage current over an area 75 mils by 25 mils area while soaking in a saline solution at temperatures up to 80° C. over a three month period.

Provided is a method of fabricating a semiconductor wafer. The method includes preparing a substrate wafer having a non-single-crystalline thin layer; disposing at least one single crystalline pattern adjacent to the non-single-crystalline thin layer on the substrate wafer; and forming a material layer contacting the single crystalline pattern on the non-single-crystalline thin layer.

A vapor phase deposition method and apparatus for the application of thin layers and coatings on substrates. The method and apparatus are useful in the fabrication of electronic devices, micro-electromechanical systems (MEMS), Bio-MEMS devices, micro and nano imprinting lithography, and microfluidic devices. The apparatus used to carry out the method provides for the addition of a precise amount of each of the reactants to be consumed in a single reaction step of the coating formation process. The apparatus provides for precise addition of quantities of different combinations of reactants during a single step or when there are a number of different individual steps in the coating formation process. The precise addition of each of the reactants in vapor form is metered into a predetermined set volume at a specified temperature to a specified pressure, to provide a highly accurate amount of reactant.

An apparatus and method for supporting, positioning and rotating a substrate are provided. In one embodiment, a support assembly for supporting a substrate includes an upper base plate and a lower base plate. The substrate is floated on a thin layer of air over the upper base plate. A positioning assembly includes a plurality of air bearing edge rollers or air flow pockets used to position the substrate in a desired orientation inside above the upper base plate. A plurality of slanted apertures or air flow pockets are configured in the upper base plate for flowing gas therethrough to rotate the substrate to ensure uniform heating during processing.

Disclosed is an anchoring element for an implantable prosthesis that includes a barb, wherein the anchoring element, which includes a basal portion, comprises a thin layer of material, such as a cannula or sheet of metal, that extends or wraps at least partially around the strut of the prosthesis to which it is attached. The barb is configured to extend outward from the basal portion to penetrate adjacent tissue. The anchoring element is either permanently affixed to the strut, such as by laser or spot welding, crimping, or some other method of bonding, or allowed to slide longitudinally over the strut between two points or stops in order to relieve any excessive loads placed upon the barb that could cause fracture. The anchoring element and strut may be configured to limit axial rotation of the barb, while still allowing longitudinal movement. In another embodiment, the slidable anchoring element may be manipulated following initial deployment to reorient the barb toward the implantation site.

Embodiments relate to depositing a layer of material on a permeable substrate by passing the permeable substrate between a set of reactors. The reactors may inject source precursor, reactant precursor, purge gas or a combination thereof onto the permeable substrate as the permeable substrate passes between the reactors. Part of the gas injected by a reactor penetrates the permeable substrate and is discharged by the other reactor. The remaining gas injected by the reactor moves in parallel to the surface of the permeable substrate and is discharged via an exhaust portion formed on the same reactor.

Thin-film micro-electrochemical energy storage cells (MEESC) such as microbatteries and double-layer capacitors (DLC) are provided. The MEESC comprises two thin layer electrodes, an intermediate thin layer of a solid electrolyte and optionally, a fourth thin current collector layer; said layers being deposited in sequence on a surface of a substrate. The MEESC is characterized in that the substrate is provided with a plurality of through cavities of arbitrary shape, with high aspect ratio. By using the substrate volume, an increase in the total electrode area per volume is accomplished.

An organic EL device having a low driving voltage and exhibiting high luminous brightness and superior durability, and a method of manufacturing the same. The organic EL device has an anode layer, an organic light-emitting layer, and a cathode layer. An inorganic thin layer, comprising an inorganic compound of Ge, Sn, Zn, Cd, etc. and an inorganic compound of an element of Group 5A to Group 8 in the periodic table in combination, is provided between the anode layer and the organic light-emitting layer and between the cathode layer and the organic light-emitting layer, or the anode layer or the cathode layer comprises a chalcogenide of Si, Ge, Sn, Pb, Ga, In, Zn, Cd, Mg, etc. and an inorganic compound of an element of Group 5A to Group 8 in the periodic table in combination.

In a substrate processing apparatus for forming thin layers on a substrate used for an organic light emitting diode, the apparatus includes a mask attaching chamber, a deposition chamber and a mask detaching chamber. The mask attaching chamber, the deposition chamber and the mask detaching chamber are provided with a transferring guide installed thereinside, and a substrate supporter for supporting the substrate moves along the transferring guide in or between the chambers. Thus, a time for processing the substrate and an area for the apparatus may be reduced. Also, the chambers are grouped in one or more, and a gate valve is installed between the grouped chambers for opening and closing a path between the grouped chambers. Accordingly, the chambers may be continuously maintained in a vacuum state when any one of the chambers is repaired.

Thin films are formed by atomic layer deposition, whereby the composition of the film can be varied from monolayer to monolayer during cycles including alternating pulses of self-limiting chemistries. In the illustrated embodiments, varying amounts of impurity sources are introduced during the cyclical process. A graded gate dielectric is thereby provided, even for extremely thin layers. The gate dielectric as thin as 2 nm can be varied from pure silicon oxide to oxynitride to silicon nitride. Similarly, the gate dielectric can be varied from aluminum oxide to mixtures of aluminum oxide and a higher dielectric material (e.g., ZrO₂) to pure high k material and back to aluminum oxide. In another embodiment, metal nitride (e.g., WN) is first formed as a barrier for lining dual damascene trenches and vias. During the alternating deposition process, copper can be introduced, e.g., in separate pulses, and the copper source pulses can gradually increase in frequency, forming a graded transition region, until pure copper is formed at the upper surface. Advantageously, graded compositions in these and a variety of other contexts help to avoid such problems as etch rate control, electromigration and non-ohmic electrical contact that can occur at sharp material interfaces.

A pit (52) is formed in a substrate comprising a silicon wafer (51) on a surface of which a silicon oxide thin layer (53) is formed. A sandwich structure (60) comprising a piezoelectric layer (62) and lower and upper electrodes (61, 63) joined to both surfaces of the piezoelectric layer is disposed so as to stride over the pit (52). The upper surface of the lower electrode (61) and the lower surface of the piezoelectric layer (62) joined to the upper surface of the lower electrode are treated so that the RMS variation of the height thereof is equal to 25 nm or less. The thickness of the lower electrode (61) is set to 150 nm or less. According to such a structure, there is provided a high-performance thin film bulk acoustic resonator which are excellent in electromechanical coupling coefficient and acoustic quality factor.

Disclosed herein is a reduced graphene oxide doped with a dopant, and a thin layer, a transparent electrode, a display device and a solar cell including the reduced graphene oxide. The reduced graphene oxide doped with a dopant includes an organic dopant and/or an inorganic dopant.

A laser consolidation methodology and apparatus for manufacturing precise three dimensional structures are disclosed. In the disclosed process, a plurality of beams of laser energy are arranged to impinge a circular area on a substrate, at an angle in the range of 25° to 30° to the normal to the substrate, melting a hemispherical region of the substrate. Powdered material is supplied to the melted region of the substrate in a direction substantially normal to the substrate. The rate of material feed is controlled so that the added material melts and forms together with underlying material a molten zone maintained spherical under the influence of surface tension. The substrate is moved relative to laser beams and material feed at a controlled rate so as to create a ridge of desired shape on the substrate, the top surface of which has a semicircular cross-section. Subsequent passes re-melt a thin layer of the ridge and further material is injected and melted so that the height of the ridge is increased by a precise amount, creating a uniform wall having smooth sides.

Solid free form fabrication techniques such as fused deposition modeling and three-dimensional printing are used to create a dental restoration. Three-dimensional printing comprises inkjet printing a binder into selected areas of sequentially deposited layers of powder. Each layer is created by spreading a thin layer of powder over the surface of a powder bed. Instructions for each layer may be derived directly from a CAD representation of the restoration. The area to be printed is obtained by computing the area of intersection between the desired plane and the CAD representation of the object. All the layers required for an aesthetically sound restoration can be deposited concurrently slice after slice and sintered/cured simultaneously. The amount of green body oversize is equivalent to the amount of shrinkage which occurs during sintering or curing. While the layers become hardened or at least partially hardened as each of the layers is laid down, once the desired final shaped configuration is achieved and the layering process is complete, in some applications it may be desirable that the form and its contents be heated or cured at a suitably selected temperature to further promote binding of the powder particles.

A CVD method deposits conformal metal layers on small features of a substrate surface. The method includes three principal operations: depositing a thin conformal layer of precursor over some or all of the substrate surface; oxidizing the precursor to convert it to a conformal layer of metal oxide; and reducing some or all of the metal oxide to convert it to a conformal layer of the metal itself. The conformal layer of precursor may form a “monolayer” on the substrate surface. Examples of metals for deposition include copper, cobalt, ruthenium, indium, and rhodium.

The present invention relates to a lithium-ion battery anode or cathode pole piece and a spreading method of the anode pole piece or the cathode pole piece, wherein, the anode pole piece and the cathode pole piece consists of a foil, a conducting adhesive thin layer and an electrode active material layer in turn; the thickness of the conducting adhesive thin layer is five to ten microns. The electrode pole piece is made in the procedures that a layer of conducting adhesive thin layer in the thickness of five to ten microns are pre-coated on the surface of the foil before the sizing agent is spread, so that a conducting adhesive thin layer having good adhesive force, good conductivity and compact structure is formed on the surface of the foil. Then the electrode active material sizing agent is spread on the conducting adhesive thin layer, and is dried under an appropriate temperature to produce a required pole piece. The present invention can reduce the surface of the foil, and can improve the wetting quality of the sizing agent, thereby improving the adhesion performance of the anode material and the collecting body (aluminum foil) so as to reduce the powder-dropping of the battery during the cycling process, and to prolong the cycling service life of the battery; moreover, the present invention can reduce the content of the adhesive agent in the sizing agent, and improve the utilization rate of the active substance, and the method of the present invention does not produce negative influence on the performance of the battery.

A field emission device having bundles of aligned parallel carbon nanotubes on a substrate. The carbon nanotubes are oriented perpendicular to the substrate. The carbon nanotube bundles may be up to 300 microns tall, for example. The bundles of carbon nanotubes extend only from regions of the substrate patterned with a catalyst material. Preferably, the catalyst material is iron oxide. The substrate is preferably porous silicon, as this produces the highest quality, most well-aligned nanotubes. Smooth, nonporous silicon or quartz can also be used as the substrate. The method of the invention starts with forming a porous layer on a silicon substrate by electrochemical etching. Then, a thin layer of iron is deposited on the porous layer in patterned regions. The iron is then oxidized into iron oxide, and then the substrate is exposed to ethylene gas at elevated temperature. The iron oxide catalyzes the formation of bundles of aligned parallel carbon nanotubes which grow perpendicular to the substrate surface. The height of the nanotube bundles above the substrate is determined by the duration of the catalysis step. The nanotube bundles only grow from the patterned regions.

An apparatus and method for performing nucleic acid (DNA and/or RNA) sequencing on a single molecule. The genetic sequence information is obtained by probing through a DNA or RNA molecule base by base at nanometer scale as though looking through a strip of movie film. This DNA sequencing nanotechnology has the theoretical capability of performing DNA sequencing at a maximal rate of about 1,000,000 bases per second. This enhanced performance is made possible by a series of innovations including: novel applications of a fine-tuned nanometer gap for passage of a single DNA or RNA molecule; thin layer microfluidics for sample loading and delivery; and programmable electric fields for precise control of DNA or RNA movement. Detection methods include nanoelectrode-gated tunneling current measurements, dielectric molecular characterization, and atomic force microscopy/electrostatic force microscopy (AFM/EFM) probing for nanoscale reading of the nucleic acid sequences.

The present invention advantageously provides for, in different embodiments, low-cost deposition techniques to form high-quality, dense, well-adhering Group IBIIIAVIA compound thin films with macro-scale as well as micro-scale compositional uniformities. In one embodiment, there is provided a method of growing a Group IBIIIAVIA semiconductor layer on a base, and includes the steps of depositing on the base a film of Group IB material and at least one layer of Group IIIA material, intermixing the film of Group IB material and the at least one layer of Group IIIA material to form an intermixed layer, and forming over the intermixed layer a metallic film comprising at least one of a Group IIIA material sub-layer and a Group IB material sub-layer. Other embodiments are also described.

Composite cards formed in accordance with the invention include a security layer comprising a hologram or diffraction grating formed at, or in, the center, or core layer, of the card. The hologram may be formed by embossing a designated area of the core layer with a diffraction pattern and depositing a thin layer of metal on the embossed layer. Additional layers may be selectively and symmetrically attached to the top and bottom surfaces of the core layer. A laser may be used to remove selected portions of the metal formed on the embossed layer, at selected stages of forming the card, to impart a selected pattern or information to the holographic region. The cards may be “lasered” when the cards being processed are attached to, and part of, a large sheet of material, whereby the “lasering” of all the cards on the sheet can be done at the same time and relatively inexpensively. Alternatively, each card may be individually “lasered” to produce desired alpha numeric information, bar codes information or a graphic image, after the sheets are die-cut into cards.

The present invention provides a method and apparatus for fabricating densely stacked ball-grid-array packages into a three-dimensional multi-package array. Integrated circuit packages are stacked on one another to form a module. Lead carriers provide an external point of electrical connection to buried package leads. Lead carriers are formed with apertures that partially surround each lead and electrically and thermally couple conductive elements or traces in the lead carrier to each package lead. Optionally thin layers of thermally conductive adhesive located between the lead carrier and adjacent packages facilitates the transfer of heat between packages and to the lead carrier. Lead carriers may be formed of custom flexible circuits having multiple layers of conductive material separated by a substrate to provide accurate impedance control and providing high density signal trace routing and ball-grid array connection to a printed wiring board.

A golf club head includes a golf club head body, an elastically deformable thin layer, a striking plate and a club weight portion. The golf club head body includes a crown portion, a toe-side wall portion, a sole portion and a heel-side wall portion. The elastically deformable thin layer is provided on the golf club head body and arranged between the toe-side wall portion and the heel-side wall portion. The elastically deformable thin layer has a thickness thinner than that of other portions of the golf club head body. Mounted on a front portion of the striking plate is the striking plate along which the elastically deformable thin layer has a direction of extension so as to absorb a striking stress transmitted from the striking plate. The club weight portion is arranged on the golf club head body to adjust the center of gravity and the moment of inertia.

The invention has an active touch-sensitive transparent layer over a display screen (LCD) in which an electrically responsive material, such as silicon oil or the above-described material is trapped in a very thin layer with a diode at the top part of the layer and an anode at the bottom. The electrically responsive material changes form by expanding when a current passes through the material from the anode part of the layer to the diode. The expanded material stretches part the top layer to create raised portions of the display screen. The raised portions can be used in the following capacities: to assist a vision impaired viewer, enhance night viewing, allowing for reduced attention or resources to touch-screen manipulation, or change the optical properties of the display by creating a three-dimensional optical property in the surface of the flexible material covering the expanding layer.

An endoscopic tissue resection device and related method is used in conjunction with a flexible or rigid endoscope. Tissue is resected by shaving thin layers of tissue for diagnostic and therapeutic purposes.

The present invention makes use of geometry of grooves formed in a substrate, to allow a dielectric layer to be deposited with some regions of the grooves having a substantially thinner layer deposited than top surfaces of the substrate. These regions of reduced thickness dielectric within the grooves are then prematurely etched by an appropriate chemical, or other, etchant capable of controllably etching away the dielectric layer, with the result that in these regions the silicon surface can be exposed and plated by a metallization while the top surface remains protected by the dielectric material. The remaining dielectric material can optionally be required to act as an anti-reflective coating. The invention is applicable in making buried contact solar cells.