62results about How to "Avoid excessive height" patented technology

An electronic assembly includes a semiconductor device mounted on a printed circuit board, a leaf spring and a cooling plate. A plurality of fasteners pass through co-axial apertures of the leaf spring, the printed circuit board and the cooling plate, such that a contact surface of the leaf spring imparts a force on the semiconductor device to retain the semiconductor device in a thermally conductive position with respect to the cooling plate. A positive cooling effect is achieved regardless of mounting conditions including orientation of the electronic assembly, and the position of the semiconductor device on the cooling plate.

The present invention discloses a folding bicycle, wherein a folding joint is installed on the beam, and the rear fork is hinged with the frame via a hinge axle, on the rear fork is installed a support bar which rests against the frame; and wherein the beam is S-shaped, and the hinge axle is tilted by an acute angle with respect to the central axle of the frame. When the bicycle is folded, the front and rear wheels are located separately, each at one side of the beam and within the concave section of the S-shaped beam, so that the bicycle is more compact and has a less width after being folded.

A strip is provided with a series of housings for a like number of terminals to which conductor wires accede thrust by a tool in order to establish a connection, by means of displacing the conductor wires over the terminals. Each housing or chamber is independent of those adjacent, the separation being constituted by means of transversal partitions, which makes possible the pouring of a sealing gel into the respective housing chamber up to a level which is at a height lower than the entrance step of the conductor wires and above the edge of the terminals, with the objective that both said terminals and the connections thereof with the conductors be immersed in the sealing gel in order to prevent oxidation on the connections.

A one-piece dental implant having a longitudinal axis comprises a head portion at a first end of the implant, a tip portion at a second end of the implant and a body portion between the head portion and the tip portion. The body portion has a first portion proximate the head portion with a plurality of longitudinal grooves substantially parallel to the longitudinal axis and a second portion proximate the tip portion having a substantially circumferential groove, wherein the outer diameter of the first portion is greater than the outer diameter of the second portion. The first and second portions are for being embedded in the jaw bone. The dental implant is preferably dimensioned to conform to the natural shape of the cervical ⅓ of the root of the tooth being replaced, and to the natural relationship between the cemento-enamel junction of the tooth being replaced and to minimize adverse immunological responses by the jaw bone during healing, thereby improving the aesthetic appearance of the implant and prosthetic tooth attached thereto. A dental implant and prosthetic tooth system is also disclosed, wherein the prosthetic tooth conforms to the shape of the cervical ⅓ of the crown of the tooth being replaced. A method for implanting a dental implant through use of a reference, is also disclosed.

A floor panel and method of manufacturing wherein each panel comprises a sheet having at least two stiffening members extending from the lower surface and substantially the length of the sheet. A bead is defined along one of the stiffening members while a tab is defined along the other stiffening member. Clips are provided to fasten the bead and tab in a locking relationship to hold the sheet in position. A flange formed at one end of the panel is received within a recess formed at an opposite end of another panel to automatically space one panel from another.

A semiconductor package is disclosed that bonds a semiconductor chip to a leadframe using a flip chip technology. An exemplary semiconductor package includes a semiconductor chip having a plurality of input-output pads at an active surface thereof. A plurality of leads are superimposed by the bond pads and active surface of the semiconductor chip. The leads have at least one exposed surface at a bottom surface of the package body. A plurality of conductive connecting means electrically connect the input-output pads of the chip to the leads. A package body is formed over the semiconductor chip and the conductive connecting means. The bottom surface portions of the leads are exposed to the outside.

A generator of time-variable magnetic fields of a magnetic resonance device having an examination space for registering at least one area to be examined of an item being examined has the following features:the conductors of a gradient coil arrangement of the generator define an area at least partially surrounding the examination space,said area contains at least a partial area which is free from conductors of the gradient coil arrangement and which contains conductors of a radio frequency antenna of the generator, anda field flowback space, inter alia for fields of the radio frequency antenna, extends proceeding from the partial area away from the examination space and is delimited beyond said partial area by a radio frequency shield.

The invention provides a drilling system for drilling subsea wells from a floating mobile offshore drilling unit (MODU), the system comprising a subsea BOP. The system is distinctive in that the subsea BOP has relative small weight and size, the system includes no marine riser but the system comprises: flexible choke and kill lines arranged between the subsea BOP and the MODU, means for drill string guidance and cleaning, for guiding when inserting or taking out a drill string from the BOP and for drill string cleaning when pulling the drill string out from the BOP, means for controlled leakage of seawater into a recovery funnel arranged below the means for drill string cleaning but above the BOP, and means for return from the recovery funnel to the MODU of drilling fluid and seawater leaked into the recovery funnel.