163 results about "Wet cleaning" patented technology

The utility model discloses a combined belt conveyor wet-type cleaning device with water mist assistance, which is applied to a belt conveyor body, vertical rods are symmetrically arranged at the top of the belt conveyor body, adjusting mechanisms are arranged on one sides of the vertical rods, a concave frame is arranged between the adjusting mechanisms, a conveying mechanism is arranged in an inner cavity of the concave frame, and the conveying mechanism is connected with the belt conveyor body. A conveying mechanism is arranged on the front surface of the vertical rod, a cleaning mechanism is arranged below the conveying mechanism, a spraying mechanism is arranged in the middle of the front surface of the vertical rod, and the multiple mechanisms such as the adjusting mechanism, the conveying mechanism, the cleaning mechanism, the spraying mechanism, the supplying and conveying mechanism and the scraping mechanism are matched in an assisting mode; the cleaning efficiency is remarkably improved, the combined cleaning structure enables the cleaning efficiency to be improved to 99% or above, the residue amount is smaller than 50 g / m < 2 >, the efficiency is far higher than 85% of a traditional cleaning device, adaptability is high, various viscous materials (such as wet coal and ore pulp) can be treated, and the problem that the traditional cleaning device cannot thoroughly clean the high-humidity and high-viscosity materials is solved.

The application discloses a typeable soft shaft electric cleaning brush and a control method, relates to the technical field of cleaning tools, and the cleaning brush comprises a handle, a typeable soft shaft waterproof sealing structure and a quick-change brush head; the handle is internally provided with a lithium battery, a driving motor and a control module, and an outer wall is provided with a button switch; the typeable soft shaft is internally provided with a steel wire transmission soft shaft, is matched with a double-layer waterproof sleeve and a front end sealing head, and can be arbitrarily bent and shaped; the conversion head and the brush head are respectively locked and transmitted through a jacking screw, and each component is modularized and can be disassembled; the control method comprises the steps of matching and assembling the brush head, bending and shaping the soft shaft, single-key starting and stopping and speed adjusting and washing, and long-pressing stopping, disassembling, washing and maintaining. The application can be extended into a special-shaped small cavity for dry and wet cleaning, the whole machine is waterproof, convenient to disassemble and assemble, and can effectively adapt to multiple complex cleaning scenes.

Device (1), preferably in the form of a wet scrubber, for cleaning a gas stream of gaseous, liquid and solid impurities, which has a gas inlet (3), at least one first washing section (6) for cleaning the gas stream with a washing liquid, a gas outlet (5) and gas supply lines (24), characterized in that the device (1) further has several gas inlets (3) for different gas streams, wherein the supply lines (24) connected to the gas inlets (3) have a continuous gradient towards the device (1) and preferably a liquid trap (14) upstream of the gas inlets (3), and the device (1) has a pre-wash chamber (16) with at least one spray nozzle (10) and, between a first washing section (6) and a second washing section (7) in the connecting line or after the washing section (6), at least one packing (9) with a specific surface area of ​​at least 400 m² / m³, preferably in the form of a textile packing.and has a spray nozzle (10) above the packing (9), whereby the washing liquid for the packing (9) and the gas flowing through the packing (9) flow in the same direction, and wherein the gas flow is directed from the upper end of the first washing section (6) via the preferably textile packing (9) downwards in the connecting line to the lower end of the second washing section (7) or to the gas outlet (5).

A cleaning robot includes a main body; a wheel to move the main body; a pad holder, the pad holder being rotatable and to which a wet cleaning pad is attachable; a motor to rotate the pad holder; a floor sensor; a controller connected to the wheel, the motor, and the floor sensor; and a lifting assembly to lower the pad holder toward the floor, or to raise the pad holder toward the main body, wherein the controller is to: identify a type of the floor based on a detection signal transmitted from the floor sensor, determine whether a dry cleaning is required based on the type of the floor, and control the motor to rotate the pad holder in the reverse direction such that the pad holder is raised toward the main body, by the lifting assembly, based on the dry cleaning being determined as required.

Embodiments of the present disclosure provide a wet cleaning device and a wet cleaning system, which relate to the technical field of semiconductor equipment and are used for saving liquid consumption of lubricating devices. The display panel comprises a conveying device, a cleaning device and a liquid storage device. The conveying device is used for conveying target objects. The cleaning device comprises a cleaning port and a liquid discharge port. The cleaning port is used for outputting a first liquid to the target objects to clean the target objects. The liquid discharge port is used for discharging a second liquid, which is formed after the target objects are cleaned by the first liquid. The liquid storage device is connected with the liquid discharge port of the cleaning device to store the second liquid. The liquid storage device can also output the second liquid to the conveying device to lubricate the conveying device. The wet cleaning device is used for recycling the liquid used for cleaning the target objects.

The invention provides surface cleaning equipment. The surface cleaning equipment comprises a main body part, a handle part, an electric suction source, a supply tank, a recovery tank and a ground brush assembly, the floor brush assembly is pivotally connected with the main body part, and the to-be-cleaned surface is cleaned through the floor brush assembly; the floor brush assembly comprises a shell assembly, a containing cavity is defined by the shell assembly, and a stirrer is arranged in the containing cavity. Cleaning liquid stored in the supply tank is distributed to the stirrer through the liquid distributor so as to perform wet cleaning on the surface to be cleaned through rotation of the stirrer, and sewage after the surface to be cleaned is cleaned is recycled and stored in the recycling tank; the floor brush assembly further comprises a cleaning head assembly, and the cleaning head assembly is driven to move between a rising position and a lowering position. The cleaning head assembly is farther from the surface to be cleaned in the raised position than in the lowered position; moreover, at the lowered position, the working range of the cleaning head assembly is outside the horizontal plane projection of the housing assembly.

Provided is a wet cleaning device (100) for removing liquid from a surface. The wet cleaning device comprises a user-moveable portion (102) that is moveable by a user, and an underpressure generator system comprising a resiliently deformable assembly (104, 110). The resiliently deformable assembly is deformable, via the user's movement of the user-moveable portion, to store potential energy. The underpressure generator system is arranged to use the potential energy stored by the deformed resiliently deformable assembly to generate an underpressure for drawing liquid from the surface into the wet cleaning device. The liquid drawn into the wet cleaning device is correspondingly removed from the surface. Further provided is a cleaning assembly comprising a surface cleaning appliance, e.g. a vacuum cleaner, and the wet cleaning device. Additionally provided is a method for removing liquid from a surface using such a wet cleaning device.

The present application relates to a kind of infrared thermal imaging MEMS wafer cutting protection method and wafer cutting protection structure, the wafer surface has photoresist protection, and surface is hydrophobic state simultaneously, the particle introduced when wafer is cut by blade, it is extremely easy to be washed away by cooling water, effectively curb wafer surface particle pollution, while the introduced protective layer does not change the material characteristics of MEMS structure itself, and the protective layer is removed together with the step of infrared chip sacrificial layer dry release.Compared with prior art, the wet cleaning process of single chip after cutting can be omitted, the yield is improved, and a large amount of organic solvent can also be avoided, to reduce the harm to the environment.

The invention relates to the technical field of semiconductor materials, and particularly discloses an atomization cleaning method for an indium phosphide wafer. The atomization cleaning method comprises the following steps that an indium phosphide wafer rotating at a constant speed is sequentially subjected to atomization cleaning through a first acid solution and deionized water and then subjected to nitrogen purging drying; carrying out atomization cleaning with an alkaline peroxide solution and deionized water, and then carrying out nitrogen purging drying; and finally, carrying out atomization cleaning by using a second acid solution and deionized water, and carrying out nitrogen purging drying to obtain the clean indium phosphide wafer. According to the method, based on an acid-alkali-acid three-step synergistic mechanism, full-spectrum pollutant removal of oxides, organic matters, particles and metal ions is realized; the indium phosphide wafer rotating at a high speed can immediately strip reaction products and waste liquid through centrifugal force, and secondary adsorption is avoided; the technical defects that a traditional RCA wet cleaning process is prone to corroding the wafer, the surface roughness of the wafer is degraded, and secondary pollution is caused are effectively overcome.

The present disclosure relates to a cleaning station 11 for a vacuum cleaner 1 The cleaning station 11 comprises a vacuum cleaner 2 comprising a dust collecting device 3 and a wet cleaning tool 23,24. The cleaning station 11 being configured to remove dust particles from the dust collecting device 2 in the vacuum cleaner 1. The cleaning station comprises a housing 11 having an air inlet 12, for connection to the dust collecting device 3, a dust compartment 15, and an air exhaust 13,13a,13b. The housing 11 also comprises a motor / fan unit 17,30 adapted to create an air flow 40,41 from an air inlet 12,32 to the air exhaust 13,13a,13b. The housing 11 comprises a receiver 20 comprising a holder 21 configured to receive the wet cleaning tool 23,24. Said holder 21 being arranged in the air flow 40,41 and / or close to the air exhaust 13,13a,13b. Intended for publication:

Methods and apparatus for protecting parts of a process chamber from thermal cycling effects of deposited material. In some embodiments, a method of protecting parts of a process chamber includes the steps of wet etching the parts using a weak base or weak acid; cleaning the parts by sandblasting; coating at least a portion of a surface of the parts using a stress release layer. The stress release layer forms a continuous layer of about 50 microns to about 250 microns thick and is configured to maintain structural integrity of the parts from thermal cycling of aluminum deposited on the parts. The method also includes wet cleaning the parts after forming the stress release layer using a heated deionized water rinse.

The invention discloses the field of wafer wet cleaning, and particularly relates to a Malangei drying method compatible with multi-size wafers, which is applied to a drying machine comprising a lifting mechanism and a controller, and the method is executed by the controller and comprises the following steps of: firstly, receiving a wafer size specification signal, driving the lifting mechanism to adjust a wafer bracket to a corresponding preset process height, and adjusting the wafer bracket to a preset process height; the upper edges of the wafers with different sizes are all located in a preset drying working area at the top of the cavity, then isopropanol steam is guided in in an immersion state to construct a surface tension gradient, finally, a drain valve is controlled to be opened to enable the liquid level to be slowly lowered, and moisture is removed through the Malangori effect. Through physical position compensation of the lifting mechanism, it is ensured that the upper edges of wafers of different diameters can be accurately aligned to the preset drying working area at the top of the drying cavity, compatibility of single equipment to the wafers of different specifications is achieved, uniformity of chemical atmosphere concentration and a temperature field is ensured, and the drying quality and the flexibility of a production line are improved.

Provided is a wet cleaning apparatus (100) having a porous cleaning material (104) that includes a front side (108) for contacting a surface to be cleaned (158), and a back side (106) that faces away from the front side. The wet cleaning apparatus further includes a cleaning liquid tank (152) for containing cleaning liquid (154), and a pump assembly. The pump assembly is configured to operate in an underpressure generating mode and in a cleaning liquid wetting mode, e.g. a cleaning liquid wetting mode that is implementable prior to the pump assembly being operated in the underpressure generating mode. When the pump assembly is operating in the underpressure generating mode, a liquid pick-up region (161) of the porous cleaning material is exposed, at the back side, to an underpressure generated by the pump assembly to enable liquid on the surface to be cleaned to be drawn into pores of the porous cleaning material. When the pump assembly is operating in the cleaning liquid wetting mode, cleaning liquid is delivered by the pump assembly from the cleaning liquid tank to the liquid pick-up region, at the back side, to wet the pores of the porous cleaning material with the cleaning liquid.

A wet cleaning device includes a body and a cleaning head pivotally connected to the body. The wet cleaning device also includes a suction motor and a recovery tank. The suction motor is configured to generate a suction airflow. The recovery tank is configured to receive liquid recovered from a surface to be cleaned by the suction airflow. The wet cleaning device also includes a detection assembly disposed on the cleaning head and configured to detect whether the cleaning head is in a liquid environment. A controller of the wet cleaning device is configured to control the suction motor to be inoperable or to stop operating when the detection assembly detects that the cleaning head is in the liquid environment. The detection assembly disposed on the cleaning head to detect the liquid can effectively avoid a large amount of liquid being sucked into the recovery tank.

The invention provides a wet cleaning process and a testing method thereof. Wherein in the wet cleaning process, the acid solution cleaning process is divided into two or more times to be implemented, so that the surface of the wafer is etched and cleaned successively. According to the method, the total etching amount of the current station can be effectively controlled, excessive etching is avoided, the problem of water mark defects appearing on the surface of the wafer can be greatly solved, and the process effect of wet cleaning is improved. And in the test method of the wet cleaning process, the thicknesses of the first test pieces removed for at least one time in the at least two acid solution cleaning processes are set to be different by setting the different first test pieces, so that multiple wet cleaning process formulas are obtained. And according to the detection result of the number of the water marks corresponding to the various wet cleaning process formulas, screening out the wet cleaning process formula meeting the first preset standard, so that the formula is utilized to realize the consideration of controlling the total etching amount and improving the water mark defect problem, and the cleaning effect is improved.

The utility model relates to the technical field of cleaning tool storage, and discloses a cleaning tool storage assembly for an electric cleaning vehicle, which comprises a storage bin, a bin cover is arranged on one side of the storage bin, a limiting groove hole is fixedly formed in the outer side of the storage bin, a partition plate is arranged in the storage bin, and a baffle is arranged in the partition plate. A first dry appliance placement area is fixedly arranged on the left side of the partition plate, and a second wet appliance placement area is fixedly arranged on the right side of the partition plate. According to the cleaning tool storage assembly for the electric cleaning vehicle, the first dry tool placement area is used for placing dry cleaning articles such as dry cleaning cloth, the second wet tool placement area is used for placing wet cleaning articles such as wet cleaning cloth, and the ultraviolet disinfection lamp is turned on, so that breeding of bacteria in the second wet tool placement area can be inhibited; when the ultraviolet disinfection lamp is turned off, the semicircular baffle can be rotated to one side of the circular groove, and the air holes are exposed, so that water vapor in the second wet appliance placement area is conveniently discharged.

The application discloses a manufacturing method of a zero-layer through hole, comprising the following steps: providing a bottom layer structure, the bottom layer structure is formed with a metal zero layer, a first pad layer and a first layer interlayer film, the material of the metal zero layer comprises Co; sequentially etching the first layer interlayer film and the first pad layer in the formation area of the zero-layer through hole to form a zero-layer through hole opening, F-containing polymer and a Co damage layer are generated in the process of forming the zero-layer through hole opening; performing a first wet cleaning to remove the Co damage layer in the metal zero layer, the removal effect of the Co damage layer is increased by using the F in the reserved F-containing polymer; performing a second wet cleaning to remove the F-containing polymer, the Co damage layer is removed in advance, and the feature is used to prevent the formation of Co residue defects in the second wet cleaning; and tungsten is selectively grown to form the zero-layer through hole. The application can prevent the loss of selectivity and thus prevent the generation of tungsten loss defects in the process of tungsten selective growth of the zero-layer through hole.

The present disclosure provides a sensor mounting structure and a cleaning device, the cleaning device comprising a main body, a liquid storage box and a wet cleaning structure, the liquid storage box is used to store cleaning liquid, the liquid storage box includes a bottom shell, the bottom shell and the main body are integrally formed, and the liquid storage box is used to supply cleaning liquid to the wet cleaning structure.

1. Name of the designed product: wet cleaning tool. 2. Use of the designed product: floor wet mop tool for vacuum cleaner. 3. Design points of the designed product: in shape. 4. Picture or photo best indicating the design points: perspective view.

The embodiment of the utility model provides wet cleaning equipment. The wet cleaning equipment comprises a wet cleaning chamber; the rotatable Bernoulli table disc is positioned in the wet cleaning chamber and is used for placing a wafer; the wafer is adsorbed on the Bernoulli table disc, and the front surface of the wafer faces the Bernoulli table disc; the recycling cup assembly is arranged around the Bernoulli table disc so as to collect liquid thrown out when the wafer rotates; wherein the recycling cup assembly comprises a plurality of layers of cup bodies, and the surface, for receiving the liquid, of part of the top or all the top of each layer of cup body is provided with a concave part and / or a convex part. By the adoption of the technical scheme, the problem that chemical liquid splashes to the recycling cup to form reverse splashing can be effectively solved.

This invention discloses a mobile photovoltaic panel water-saving cleaning system, comprising: a mobile component serving as the system's mobile carrier; a cleaning component installed on the mobile component for cleaning the photovoltaic panel surface; and a water-saving circulation component for collecting, filtering, and recycling wastewater generated during the cleaning process. The cleaning component sequentially performs air-wash pre-cleaning, dry cleaning, wet cleaning, and air-wash drying processes on the photovoltaic panel surface. This invention employs a multi-stage cleaning process of "air-wash-dry-wet cleaning-air-drying," first removing hard particles through airflow pre-cleaning, and then combining dry cleaning and high-pressure atomized wet cleaning to effectively protect the photovoltaic panel surface and improve the cleaning effect.

An adhesive layer removing method comprises the steps that a substrate is provided, and an adhesive layer to be removed is arranged on the substrate; carrying out first wet cleaning treatment on the adhesive layer; carrying out dry-method photoresist removing treatment on the adhesive layer subjected to the first wet-method cleaning treatment by adopting a dry-method photoresist removing process; and carrying out second wet cleaning treatment on the adhesive layer after the dry photoresist removal treatment. According to the method, the severity of collodion silk contamination can be reduced, the influence of a carbonization phenomenon is reduced, and the removal efficiency and the cleanliness are improved by combining the alternate action of a wet method, a dry method and a wet method.

The application discloses a cleaning base and surface cleaning, the cleaning base comprising: a base body defining a first agitating cavity and a second agitating cavity; a wet cleaning roller rotatably mounted to the first agitating cavity; a liquid distributor for distributing cleaning liquid to the wet cleaning roller; a dry wiping roller rotatably mounted to the second agitating cavity; and a dryer configured for drying the dry wiping roller, the dryer comprising a heating body capable of converting electrical energy into heat energy; wherein the cleaning base is configured to clean a surface to be cleaned using the wet cleaning roller and the dry wiping roller in the same working process. The application makes the surface to be cleaned by the cleaning base nearly free of residual liquid by means of the action of the dry wiping roller, and the moisture absorbed by the dry wiping roller can be quickly evaporated by means of the heating action of the dryer on the dry wiping roller, so that the cleaning element of the dry wiping roller always remains dry and has strong liquid absorption capacity.

The invention discloses a method for improving residual defects. The method comprises the following steps: 1, disassembling a shielding cover and a BB nozzle at the top of wet cleaning equipment into each component of minimum units; 2, wiping crystals and smudginess of each disassembled minimum unit by using an organic solvent; thirdly, all the disassembled minimum units are put into an ultrasonic cleaning machine to be cleaned; step 4, assembling each minimum unit which finishes washing back to the single chip microcomputer, and then washing by adopting liquid; step 5, carrying out cycle operation by using a Dummy control wafer; and 6, operating the wafer with the residual impurities in the wet cleaning equipment, and monitoring the impurity cleaning performance. According to the method, through the improved cleaning technological process, self-accumulated impurity pollution sources of wet cleaning equipment of a production line can be remarkably reduced, the impurity residue defect on the surface of the wafer is reduced, and the product yield is increased.

This disclosure provides a method for maintaining a surface cleaning device on a base station, the surface cleaning device itself, and the base station. The method for maintaining the surface cleaning device on a base station includes: acquiring operational status, including the docking status between the surface cleaning device and the base station; receiving environmental data, wherein the environmental data includes wide-area environmental data and / or local environmental data of the location of the base station; determining the type of wet cleaning environmental factor in response to the environmental data; generating a maintenance decision based on the type of wet cleaning environmental factor; and performing maintenance on the wet cleaning module based on the maintenance decision.

The invention provides a method for improving the quality of the back surface of a wafer. The method aims at solving the problem that focusing spots are generated in a photoetching process due to the damage of the back surface of the wafer. The method comprises the following steps: firstly, carrying out wet cleaning on the back surface of a wafer to remove particles on the surface; and then, performing ion implantation on the dielectric layer on the back surface of the cleaned wafer to improve the hardness of the dielectric layer. Preferably, the dielectric layer is a silicon nitride layer, and the injected ions are argon ions. Through ion implantation, the hardness of the dielectric layer can be improved by 10% to 30%. According to the method, the wear resistance of the film on the back surface of the wafer is actively enhanced before the key process, particles and scratches caused by mechanical contact in the process are reduced from the source, and the formation of focusing spots is effectively avoided, so that the manufacturing yield and the process stability are remarkably improved.

The utility model relates to the technical field of disinfecting and cleaning wet tissues, and discloses a cleaning wet tissue with a disinfecting function, which comprises a sponge layer, a disinfection structure is arranged in the sponge layer, a warm and moist layer is arranged on the inner side of the sponge layer, a cotton layer is arranged on the outer side of the sponge layer, a reinforcing layer is arranged on the outer side of the cotton layer, and a skin-friendly layer is arranged on the outer side of the reinforcing layer. The disinfection structure is arranged, the liquid storage bag is arranged in the sponge layer, and a pull strip is pulled open, so that disinfectant in the liquid storage bag flows out, wet tissue disinfection is facilitated, time and time are saved, convenience and rapidness are achieved, practicability is greatly improved, the disinfectant can be prevented from volatilizing when not used by arranging the liquid storage bag, and the disinfection effect is good. The loss of wet cleaning liquid and disinfectant is greatly reduced, the practical requirement is met, the liquid storage bags can be opened in different numbers or can be opened at the same time according to the actual requirement by arranging the pull strip, and the liquid storage bags do not need to be squeezed to be broken in sequence.

A handheld wet cleaning device includes a main body, a handle, and a cleaning head. The main body has a first end distal from a surface to be cleaned and a second end proximal to the surface to be cleaned in an axial direction thereof. The handle is disposed at the first end of the main body, and a control button is disposed on the handle for switching a cleaning mode of the handheld wet cleaning device. The cleaning head is pivotably disposed at the second end of the main body, and the cleaning head defines a suction port and a cleaning element disposed within the suction port. A dirty recovery system includes a suction motor for generating a suction airflow, a suction line for the suction airflow to flow, and a recovery tank for recovering dirt. A cleaning fluid supply system includes a cleaning fluid tank, a cleaning line, a water pump, and a liquid distributor in fluid communication with the cleaning line. A controller is configured to control the suction motor and the water pump to control the handheld wet cleaning device to clean in different cleaning modes to adapt to different areas.

A control method for a cleaning apparatus, and a cleaning apparatus. The cleaning apparatus comprises a frame, a rotary cleaning member and a shielding mechanism, wherein the rotary cleaning member has a first rotation direction and a second rotation direction, and the rotary cleaning member comprises a first connector; and the shielding mechanism comprises a shielding member, which can retract and extend under the driving of the shielding mechanism, and the shielding member comprises a second connector. The control method comprises: controlling the shielding mechanism to lower the shielding member, such that the second connector is connected to the first connector on the movement path of the first connector; and driving the rotary cleaning member to move in the first rotation direction, and by means of the connection between the first connector and the second connector, driving the shielding member to continue lowering, so as to shield the side of the rotary cleaning member facing a surface to be cleaned, wherein the second rotation direction is a rotation direction in which the rotary cleaning member performs a wet cleaning task, and is opposite to the first rotation direction. The present invention can ameliorate the technical problem of a cleaning apparatus being prone to contaminating a traversed area when passing over a specific obstacle.

A wet cleaning robot includes a body configured to be movable on a surface to be cleaned; a rotational wet pad arranged on a bottom of the body and including a wettable surface configured to contact the surface to wet clean the surface; an electrostatic adsorption pad arranged in front of the rotational wet pad and configured to electrostatically adsorb a foreign substance on the surface under the electrostatic adsorption pad; and a foreign substance barrier wall arranged between the rotational wet pad and the electrostatic adsorption pad to prevent the foreign substance adsorbed on the electrostatic adsorption pad from moving to the rotational wet pad.