230 results about "Wet cleaning" patented technology

The present embodiment relates to a control method for a cleaning robot and a related device. The method comprises: acquiring a contaminant type and a contaminated area of a floor to be cleaned, wherein the contaminant type comprises a liquid contaminant; when there is the contaminated area having the liquid contaminant on the floor to be cleaned, turning a body of the cleaning robot around and driving the cleaning robot to perform a cleaning operation in a reversing posture, so as to use a wet cleaning member to clean the liquid contaminant in the contaminated area. The present invention solves the problem that a dry cleaning member of the cleaning robot is easily wetted when cleaning the liquid contaminant, improving the cleaning effect on the floor having the liquid contaminant.

The embodiment of the invention provides a control method of a cleaning robot and the cleaning robot, and the method comprises the steps that in the process that the cleaning robot executes a cleaning task in a first cleaning mode along a preset cleaning path, the cleaning robot judges whether at least one part of a wet type target object is in contact with a dry type cleaning assembly of the cleaning robot or not; if the cleaning robot judges that at least one part of the wet type target object is in contact with the dry type cleaning assembly of the cleaning robot, the cleaning robot stops executing the cleaning task along the original preset cleaning path; the cleaning robot is controlled to execute a first cleaning strategy, and the first cleaning strategy comprises the steps that at least one part of the wet type target object is cleaned in a wet type cleaning mode or the cleaning robot is made to bypass the wet type target object. According to the cleaning robot, the current cleaning mode can be stopped in time when an emergency occurs in the cleaning path and the cleaning assembly is in contact with the unmatched target object, an emergency cleaning strategy is switched, and secondary pollution accidents are avoided.

A handheld extraction cleaner system includes a wet cleaning head including a wet suction nozzle, a dry cleaning head including a dry suction nozzle. A handheld base includes a modular receiver configured to interchangeably couple to the wet cleaning head and the dry cleaning head. A suction source is configured to generate a suction air stream through the wet suction nozzle when the wet cleaning head is coupled to the modular receiver and through the dry suction nozzle when the dry cleaning head is coupled to the modular receiver. A fluid delivery system includes a fluid distributor configured to dispense a cleaning solution on a surface to be cleaned, where at least one of the handheld base and the dry cleaning head is configured to at least partially prevent the fluid delivery system from dispensing the cleaning solution when the dry cleaning head is coupled to the modular receiver.

The invention discloses a wet drying method for a wafer with a graphic structure, which comprises the following steps of: carrying out wet cleaning on the wafer with the graphic structure, and after the wet cleaning is finished, filling a cleaning solution in an interval region between the graphic structures. The flowing supercritical gas is adopted to dry the wafer, and in the drying process, the included angle between the flowing direction of the supercritical gas and the extending direction of the graphic structure ensures that the supercritical gas can smoothly flow from one side of the interval area to the other opposite side, so that the cleaning liquid in the interval area is completely replaced. According to the method, the effect of replacing the cleaning liquid in the interval areas between the pattern structures can be improved, complete replacement of the cleaning liquid is achieved, and meanwhile it is guaranteed that the pattern structures are not collapsed or damaged.

The utility model discloses a combined belt conveyor wet-type cleaning device with water mist assistance, which is applied to a belt conveyor body, vertical rods are symmetrically arranged at the top of the belt conveyor body, adjusting mechanisms are arranged on one sides of the vertical rods, a concave frame is arranged between the adjusting mechanisms, a conveying mechanism is arranged in an inner cavity of the concave frame, and the conveying mechanism is connected with the belt conveyor body. A conveying mechanism is arranged on the front surface of the vertical rod, a cleaning mechanism is arranged below the conveying mechanism, a spraying mechanism is arranged in the middle of the front surface of the vertical rod, and the multiple mechanisms such as the adjusting mechanism, the conveying mechanism, the cleaning mechanism, the spraying mechanism, the supplying and conveying mechanism and the scraping mechanism are matched in an assisting mode; the cleaning efficiency is remarkably improved, the combined cleaning structure enables the cleaning efficiency to be improved to 99% or above, the residue amount is smaller than 50 g / m < 2 >, the efficiency is far higher than 85% of a traditional cleaning device, adaptability is high, various viscous materials (such as wet coal and ore pulp) can be treated, and the problem that the traditional cleaning device cannot thoroughly clean the high-humidity and high-viscosity materials is solved.

The application discloses a typeable soft shaft electric cleaning brush and a control method, relates to the technical field of cleaning tools, and the cleaning brush comprises a handle, a typeable soft shaft waterproof sealing structure and a quick-change brush head; the handle is internally provided with a lithium battery, a driving motor and a control module, and an outer wall is provided with a button switch; the typeable soft shaft is internally provided with a steel wire transmission soft shaft, is matched with a double-layer waterproof sleeve and a front end sealing head, and can be arbitrarily bent and shaped; the conversion head and the brush head are respectively locked and transmitted through a jacking screw, and each component is modularized and can be disassembled; the control method comprises the steps of matching and assembling the brush head, bending and shaping the soft shaft, single-key starting and stopping and speed adjusting and washing, and long-pressing stopping, disassembling, washing and maintaining. The application can be extended into a special-shaped small cavity for dry and wet cleaning, the whole machine is waterproof, convenient to disassemble and assemble, and can effectively adapt to multiple complex cleaning scenes.

Device (1), preferably in the form of a wet scrubber, for cleaning a gas stream of gaseous, liquid and solid impurities, which has a gas inlet (3), at least one first washing section (6) for cleaning the gas stream with a washing liquid, a gas outlet (5) and gas supply lines (24), characterized in that the device (1) further has several gas inlets (3) for different gas streams, wherein the supply lines (24) connected to the gas inlets (3) have a continuous gradient towards the device (1) and preferably a liquid trap (14) upstream of the gas inlets (3), and the device (1) has a pre-wash chamber (16) with at least one spray nozzle (10) and, between a first washing section (6) and a second washing section (7) in the connecting line or after the washing section (6), at least one packing (9) with a specific surface area of ​​at least 400 m² / m³, preferably in the form of a textile packing.and has a spray nozzle (10) above the packing (9), whereby the washing liquid for the packing (9) and the gas flowing through the packing (9) flow in the same direction, and wherein the gas flow is directed from the upper end of the first washing section (6) via the preferably textile packing (9) downwards in the connecting line to the lower end of the second washing section (7) or to the gas outlet (5).

A cleaning robot includes a main body; a wheel to move the main body; a pad holder, the pad holder being rotatable and to which a wet cleaning pad is attachable; a motor to rotate the pad holder; a floor sensor; a controller connected to the wheel, the motor, and the floor sensor; and a lifting assembly to lower the pad holder toward the floor, or to raise the pad holder toward the main body, wherein the controller is to: identify a type of the floor based on a detection signal transmitted from the floor sensor, determine whether a dry cleaning is required based on the type of the floor, and control the motor to rotate the pad holder in the reverse direction such that the pad holder is raised toward the main body, by the lifting assembly, based on the dry cleaning being determined as required.

Embodiments of the present disclosure provide a wet cleaning device and a wet cleaning system, which relate to the technical field of semiconductor equipment and are used for saving liquid consumption of lubricating devices. The display panel comprises a conveying device, a cleaning device and a liquid storage device. The conveying device is used for conveying target objects. The cleaning device comprises a cleaning port and a liquid discharge port. The cleaning port is used for outputting a first liquid to the target objects to clean the target objects. The liquid discharge port is used for discharging a second liquid, which is formed after the target objects are cleaned by the first liquid. The liquid storage device is connected with the liquid discharge port of the cleaning device to store the second liquid. The liquid storage device can also output the second liquid to the conveying device to lubricate the conveying device. The wet cleaning device is used for recycling the liquid used for cleaning the target objects.

The invention provides surface cleaning equipment. The surface cleaning equipment comprises a main body part, a handle part, an electric suction source, a supply tank, a recovery tank and a ground brush assembly, the floor brush assembly is pivotally connected with the main body part, and the to-be-cleaned surface is cleaned through the floor brush assembly; the floor brush assembly comprises a shell assembly, a containing cavity is defined by the shell assembly, and a stirrer is arranged in the containing cavity. Cleaning liquid stored in the supply tank is distributed to the stirrer through the liquid distributor so as to perform wet cleaning on the surface to be cleaned through rotation of the stirrer, and sewage after the surface to be cleaned is cleaned is recycled and stored in the recycling tank; the floor brush assembly further comprises a cleaning head assembly, and the cleaning head assembly is driven to move between a rising position and a lowering position. The cleaning head assembly is farther from the surface to be cleaned in the raised position than in the lowered position; moreover, at the lowered position, the working range of the cleaning head assembly is outside the horizontal plane projection of the housing assembly.

Provided is a wet cleaning device (100) for removing liquid from a surface. The wet cleaning device comprises a user-moveable portion (102) that is moveable by a user, and an underpressure generator system comprising a resiliently deformable assembly (104, 110). The resiliently deformable assembly is deformable, via the user's movement of the user-moveable portion, to store potential energy. The underpressure generator system is arranged to use the potential energy stored by the deformed resiliently deformable assembly to generate an underpressure for drawing liquid from the surface into the wet cleaning device. The liquid drawn into the wet cleaning device is correspondingly removed from the surface. Further provided is a cleaning assembly comprising a surface cleaning appliance, e.g. a vacuum cleaner, and the wet cleaning device. Additionally provided is a method for removing liquid from a surface using such a wet cleaning device.

The utility model discloses a preposed filtering device applied to an N-methyl pyrrolidone circulating pipeline in the field of wet cleaning, which comprises a barrel body and a cover body detachably arranged at the top of the barrel body, a containing cavity with an opening at the top is arranged in the barrel body, the size of the containing cavity is gradually reduced along the vertical direction, and the cover body is arranged in the containing cavity. A containing cavity is formed in the cover body, at least two horizontal ladder surfaces are formed in the inner wall of the containing cavity in the vertical direction, at least two filter screens different in size are installed in the containing cavity and fixed through the horizontal ladder surfaces at the corresponding positions, and a glass sheet which can be seen into the containing cavity is installed in the middle of the cover body. Three filter screens with different sizes are arranged in the big-end-up accommodating cavity for filtering in sequence, so that the filtering effect is improved, and the organic medicine liquid is prevented from staying in the accommodating cavity; the filter screen is fixed through the horizontal ladder surface on the inner wall of the accommodating cavity, so that the filter screen is convenient to mount and dismount; and the cover body is provided with the glass sheet for directly viewing the interior of the accommodating cavity, so that the accumulation condition of photoresist and a film layer on the filter screen can be conveniently observed, and timely cleaning is realized.

The present application relates to a kind of infrared thermal imaging MEMS wafer cutting protection method and wafer cutting protection structure, the wafer surface has photoresist protection, and surface is hydrophobic state simultaneously, the particle introduced when wafer is cut by blade, it is extremely easy to be washed away by cooling water, effectively curb wafer surface particle pollution, while the introduced protective layer does not change the material characteristics of MEMS structure itself, and the protective layer is removed together with the step of infrared chip sacrificial layer dry release.Compared with prior art, the wet cleaning process of single chip after cutting can be omitted, the yield is improved, and a large amount of organic solvent can also be avoided, to reduce the harm to the environment.

To provide an automatic cleaning device having a high cleaning function, a wide application range, and strong cleaning capability, capable of collecting dirty water, and having a lifting adjustment function.SOLUTION: An automatic cleaning device includes a mobile platform, a lifting table, a wet cleaning module, a liquid supplying module, and a collecting module. The mobile platform is configured to automatically move in a target direction on a surface to be cleaned. The lifting table is connected to the mobile platform and is configured to move upwards or downwards with respect to the mobile platform. The wet cleaning module is connected to the lifting table and configured to clean the surface to be cleaned using cleaning liquid. The liquid supplying module is connected to the mobile platform and configured to provide the cleaning liquid to the surface to be cleaned. The collecting module is connected to the mobile platform and configured to collect the cleaning liquid.SELECTED DRAWING: Figure 1

The invention relates to the technical field of semiconductor materials, and particularly discloses an atomization cleaning method for an indium phosphide wafer. The atomization cleaning method comprises the following steps that an indium phosphide wafer rotating at a constant speed is sequentially subjected to atomization cleaning through a first acid solution and deionized water and then subjected to nitrogen purging drying; carrying out atomization cleaning with an alkaline peroxide solution and deionized water, and then carrying out nitrogen purging drying; and finally, carrying out atomization cleaning by using a second acid solution and deionized water, and carrying out nitrogen purging drying to obtain the clean indium phosphide wafer. According to the method, based on an acid-alkali-acid three-step synergistic mechanism, full-spectrum pollutant removal of oxides, organic matters, particles and metal ions is realized; the indium phosphide wafer rotating at a high speed can immediately strip reaction products and waste liquid through centrifugal force, and secondary adsorption is avoided; the technical defects that a traditional RCA wet cleaning process is prone to corroding the wafer, the surface roughness of the wafer is degraded, and secondary pollution is caused are effectively overcome.

The present disclosure relates to a cleaning station 11 for a vacuum cleaner 1 The cleaning station 11 comprises a vacuum cleaner 2 comprising a dust collecting device 3 and a wet cleaning tool 23,24. The cleaning station 11 being configured to remove dust particles from the dust collecting device 2 in the vacuum cleaner 1. The cleaning station comprises a housing 11 having an air inlet 12, for connection to the dust collecting device 3, a dust compartment 15, and an air exhaust 13,13a,13b. The housing 11 also comprises a motor / fan unit 17,30 adapted to create an air flow 40,41 from an air inlet 12,32 to the air exhaust 13,13a,13b. The housing 11 comprises a receiver 20 comprising a holder 21 configured to receive the wet cleaning tool 23,24. Said holder 21 being arranged in the air flow 40,41 and / or close to the air exhaust 13,13a,13b. Intended for publication:

Methods and apparatus for protecting parts of a process chamber from thermal cycling effects of deposited material. In some embodiments, a method of protecting parts of a process chamber includes the steps of wet etching the parts using a weak base or weak acid; cleaning the parts by sandblasting; coating at least a portion of a surface of the parts using a stress release layer. The stress release layer forms a continuous layer of about 50 microns to about 250 microns thick and is configured to maintain structural integrity of the parts from thermal cycling of aluminum deposited on the parts. The method also includes wet cleaning the parts after forming the stress release layer using a heated deionized water rinse.

The utility model discloses a cleaning head and surface cleaning equipment, the cleaning head comprises a shell, and the shell defines a cavity. The rolling brush is used for wiping the surface to be cleaned and arranged in the cavity. The scraping piece is arranged in front of the rolling brush in the advancing direction and can move between a first position and a second position. The driving device is used for driving the scraping piece to move between a first position and a second position, the driving device drives the scraping piece through a transmission mechanism, and the scraping piece is configured to be not in contact with the surface to be cleaned at the first position and is configured to be in contact with the surface to be cleaned at the second position. The driving device is arranged behind the rolling brush in the advancing direction, and the transmission mechanism stretches across the rolling brush. When the cleaning head moves forwards, the scraping piece is located at the first position, and the cleaning effect is not affected. When the cleaning head moves backwards, the front opening can be sealed through descending of the scraping piece, and suction force is increased. And when the cleaning equipment is wet type cleaning equipment, the water spots remaining on the ground can be scraped clean through descending of the scraping piece.

The invention discloses the field of wafer wet cleaning, and particularly relates to a Malangei drying method compatible with multi-size wafers, which is applied to a drying machine comprising a lifting mechanism and a controller, and the method is executed by the controller and comprises the following steps of: firstly, receiving a wafer size specification signal, driving the lifting mechanism to adjust a wafer bracket to a corresponding preset process height, and adjusting the wafer bracket to a preset process height; the upper edges of the wafers with different sizes are all located in a preset drying working area at the top of the cavity, then isopropanol steam is guided in in an immersion state to construct a surface tension gradient, finally, a drain valve is controlled to be opened to enable the liquid level to be slowly lowered, and moisture is removed through the Malangori effect. Through physical position compensation of the lifting mechanism, it is ensured that the upper edges of wafers of different diameters can be accurately aligned to the preset drying working area at the top of the drying cavity, compatibility of single equipment to the wafers of different specifications is achieved, uniformity of chemical atmosphere concentration and a temperature field is ensured, and the drying quality and the flexibility of a production line are improved.

Provided is a wet cleaning apparatus (100) having a porous cleaning material (104) that includes a front side (108) for contacting a surface to be cleaned (158), and a back side (106) that faces away from the front side. The wet cleaning apparatus further includes a cleaning liquid tank (152) for containing cleaning liquid (154), and a pump assembly. The pump assembly is configured to operate in an underpressure generating mode and in a cleaning liquid wetting mode, e.g. a cleaning liquid wetting mode that is implementable prior to the pump assembly being operated in the underpressure generating mode. When the pump assembly is operating in the underpressure generating mode, a liquid pick-up region (161) of the porous cleaning material is exposed, at the back side, to an underpressure generated by the pump assembly to enable liquid on the surface to be cleaned to be drawn into pores of the porous cleaning material. When the pump assembly is operating in the cleaning liquid wetting mode, cleaning liquid is delivered by the pump assembly from the cleaning liquid tank to the liquid pick-up region, at the back side, to wet the pores of the porous cleaning material with the cleaning liquid.

A wet cleaning device includes a body and a cleaning head pivotally connected to the body. The wet cleaning device also includes a suction motor and a recovery tank. The suction motor is configured to generate a suction airflow. The recovery tank is configured to receive liquid recovered from a surface to be cleaned by the suction airflow. The wet cleaning device also includes a detection assembly disposed on the cleaning head and configured to detect whether the cleaning head is in a liquid environment. A controller of the wet cleaning device is configured to control the suction motor to be inoperable or to stop operating when the detection assembly detects that the cleaning head is in the liquid environment. The detection assembly disposed on the cleaning head to detect the liquid can effectively avoid a large amount of liquid being sucked into the recovery tank.

The invention provides a wet cleaning process and a testing method thereof. Wherein in the wet cleaning process, the acid solution cleaning process is divided into two or more times to be implemented, so that the surface of the wafer is etched and cleaned successively. According to the method, the total etching amount of the current station can be effectively controlled, excessive etching is avoided, the problem of water mark defects appearing on the surface of the wafer can be greatly solved, and the process effect of wet cleaning is improved. And in the test method of the wet cleaning process, the thicknesses of the first test pieces removed for at least one time in the at least two acid solution cleaning processes are set to be different by setting the different first test pieces, so that multiple wet cleaning process formulas are obtained. And according to the detection result of the number of the water marks corresponding to the various wet cleaning process formulas, screening out the wet cleaning process formula meeting the first preset standard, so that the formula is utilized to realize the consideration of controlling the total etching amount and improving the water mark defect problem, and the cleaning effect is improved.

The utility model relates to the technical field of cleaning tool storage, and discloses a cleaning tool storage assembly for an electric cleaning vehicle, which comprises a storage bin, a bin cover is arranged on one side of the storage bin, a limiting groove hole is fixedly formed in the outer side of the storage bin, a partition plate is arranged in the storage bin, and a baffle is arranged in the partition plate. A first dry appliance placement area is fixedly arranged on the left side of the partition plate, and a second wet appliance placement area is fixedly arranged on the right side of the partition plate. According to the cleaning tool storage assembly for the electric cleaning vehicle, the first dry tool placement area is used for placing dry cleaning articles such as dry cleaning cloth, the second wet tool placement area is used for placing wet cleaning articles such as wet cleaning cloth, and the ultraviolet disinfection lamp is turned on, so that breeding of bacteria in the second wet tool placement area can be inhibited; when the ultraviolet disinfection lamp is turned off, the semicircular baffle can be rotated to one side of the circular groove, and the air holes are exposed, so that water vapor in the second wet appliance placement area is conveniently discharged.

The application discloses a manufacturing method of a zero-layer through hole, comprising the following steps: providing a bottom layer structure, the bottom layer structure is formed with a metal zero layer, a first pad layer and a first layer interlayer film, the material of the metal zero layer comprises Co; sequentially etching the first layer interlayer film and the first pad layer in the formation area of the zero-layer through hole to form a zero-layer through hole opening, F-containing polymer and a Co damage layer are generated in the process of forming the zero-layer through hole opening; performing a first wet cleaning to remove the Co damage layer in the metal zero layer, the removal effect of the Co damage layer is increased by using the F in the reserved F-containing polymer; performing a second wet cleaning to remove the F-containing polymer, the Co damage layer is removed in advance, and the feature is used to prevent the formation of Co residue defects in the second wet cleaning; and tungsten is selectively grown to form the zero-layer through hole. The application can prevent the loss of selectivity and thus prevent the generation of tungsten loss defects in the process of tungsten selective growth of the zero-layer through hole.

The present disclosure provides a sensor mounting structure and a cleaning device, the cleaning device comprising a main body, a liquid storage box and a wet cleaning structure, the liquid storage box is used to store cleaning liquid, the liquid storage box includes a bottom shell, the bottom shell and the main body are integrally formed, and the liquid storage box is used to supply cleaning liquid to the wet cleaning structure.

1. Name of the designed product: wet cleaning tool. 2. Use of the designed product: floor wet mop tool for vacuum cleaner. 3. Design points of the designed product: in shape. 4. Picture or photo best indicating the design points: perspective view.

The embodiment of the utility model provides wet cleaning equipment. The wet cleaning equipment comprises a wet cleaning chamber; the rotatable Bernoulli table disc is positioned in the wet cleaning chamber and is used for placing a wafer; the wafer is adsorbed on the Bernoulli table disc, and the front surface of the wafer faces the Bernoulli table disc; the recycling cup assembly is arranged around the Bernoulli table disc so as to collect liquid thrown out when the wafer rotates; wherein the recycling cup assembly comprises a plurality of layers of cup bodies, and the surface, for receiving the liquid, of part of the top or all the top of each layer of cup body is provided with a concave part and / or a convex part. By the adoption of the technical scheme, the problem that chemical liquid splashes to the recycling cup to form reverse splashing can be effectively solved.

A cartridge (100) attachable to a wet cleaning device, in particular a wet floor cleaning device, is provided. The wet cleaning apparatus has a volume displacement device (102) for dosing the surface treatment agent from the cartridge when the cartridge is attached to the wet cleaning apparatus. The cartridge includes a chamber (106) for containing a surface treatment agent. The cartridge also has an interface portion (107) for interfacing with the volume displacement device during attachment of the cartridge to define a dosing assembly (108). At least one one-way valve (116, 120) is configured to allow fluid to exit the chamber and / or dosing assembly by operation of the volume displacement device and restrict passage of the surface treatment agent therethrough prior to attachment of the cartridge. A cleaning assembly is also provided that includes a cartridge and a wet cleaning device.

The invention provides a control method of cleaning equipment, the cleaning equipment and a computer readable storage medium, the cleaning equipment comprises a rack, a rotary cleaning piece and a shielding mechanism, the rotary cleaning piece has a first rotating direction and a second rotating direction, and the rotary cleaning piece comprises a first connecting piece; the shielding mechanism comprises a shielding piece which can be folded and unfolded under the driving of the shielding mechanism; the shielding piece comprises a second connecting piece; the control method comprises the steps that the shielding mechanism is controlled to lower the shielding piece, so that the second connecting piece is connected with the first connecting piece on the motion path of the first connecting piece; the rotary cleaning piece is driven to move in the first rotating direction, and the shielding piece is driven to continue to descend through connection of the first connecting piece and the second connecting piece so as to shield the side, facing the to-be-cleaned surface, of the rotary cleaning piece; the second rotation direction is the rotation direction when the rotary cleaning piece executes the wet cleaning task and is opposite to the first rotation direction. The technical problem that when the cleaning equipment passes through a specific obstacle, pollution is likely to be caused to a passing area can be solved.

The invention provides a method for etching metal film layers, which comprises the following steps of: sequentially etching each metal film layer from top to bottom through a first etching gas, and stopping etching until the lowest metal film layer is etched; performing dry etching on a part of the lowermost metal film layer by using a second etching gas, and then stopping etching; removing a photoresist and a polymer generated in the etching process by using a conventional dry photoresist removing method and a wet cleaning method; and taking the metal film layer which is penetrated by etching as a mask, and rapidly removing the residual part of the metal film layer by adopting wet etching. The method has the advantages that post corrosion of the metal side wall is prevented, the wet etching time is shortened, and the defects of metal residues of the TiW film layer, overlarge undercut of the TiW film layer and the like are overcome.