This invention discloses an ultrasonic cleaning process for ultrathin SiC aluminum
alloy plates, comprising pre-washing, main washing,
passivation rinsing, and
drying steps. It achieves low-damage cleaning by using a gradient
cleaning agent in conjunction with staged ultrasonic parameters and a dedicated thin-plate holder. The pre-washing, main washing, and
passivation rinsing processes employ appropriate pH, temperature, ultrasonic frequency, and
power density, respectively, with each washing solution containing specific proportions of surfactants, cleaning agents, and passivating agents. This process effectively solves the problems of thin-plate deformation, SiC-Al interface damage, and SiC particle detachment caused by traditional
cleaning methods through the synergistic effect of the gradient
cleaning agent and staged ultrasonic cleaning. After cleaning, the thin-plate exhibits minimal reduction in
interfacial bonding force,
high surface cleanliness, good flatness, and improved
corrosion resistance. It is suitable for ultrathin SiC aluminum
alloy plates with thicknesses
ranging from 0.1 to 1 mm, has a short cleaning cycle, and can meet the low-damage, high-cleanliness cleaning requirements of
mass production.