16results about How to "Uniform removal" patented technology

The invention discloses a processing method for a copper-clad ceramic substrate, which relates to the technical field of copper-clad ceramic substrate processing, and comprises the following steps of: taking a pre-treated copper-clad ceramic substrate, introducing nitrogen, and carrying out layered progressive micropore processing on an exposed aluminum oxide ceramic substrate of the pre-treated copper-clad ceramic substrate through picosecond laser to form micropores; each micropore is divided into an inlet layer, a middle layer and an outlet layer from top to bottom; the layer number of the micropores, the thickness of each layer of the micropores and the pulse width are controlled, and a light spot and long-focal-depth lens is adopted; adjusting monopulse energy and frequency parameters of picosecond laser, and punching an inlet layer; adjusting monopulse energy and frequency parameters of picosecond laser, and punching the middle layer; and adjusting monopulse energy and frequency parameters of the picosecond laser, and punching the outlet layer to obtain the copper-clad ceramic substrate. In the middle layer, the monopulse energy is gradually increased, and it is ensured that the material is evenly removed; at the inlet layer and the outlet layer, energy is reduced, and cracks caused by stress generated instantly when the material is punctured are avoided.

The utility model provides a pickling passivation device for metal surface treatment, which relates to the technical field of metal treatment and comprises a base, a pickling tank is fixedly mounted on the upper surface of the base, a plurality of vertical frames are fixedly mounted on two sides of the upper surface of the base, and a top plate is jointly and fixedly mounted at the upper ends of the vertical frames. An air cylinder is fixedly installed in the middle of the upper surface of the top plate, and the output end of the air cylinder penetrates through the top plate and is fixedly provided with a support. A worker starts the motor to enable the output shaft of the motor to drive the worm to rotate, the rotating worm is matched with the worm gear, the worm gear drives the rotating rod and the connecting rod to rotate, the connecting rod drives the hook to rotate, and therefore a workpiece can rotate in the pickling tank with the connecting rod as the reference. The workpiece rotates to enable all parts of the surface to be alternately exposed in acid liquor, dead angles are avoided, and it is guaranteed that an oxide layer or rust is evenly removed.

The invention relates to the technical field of electronic component processing, in particular to an electronic component pin forming device which comprises a forming unit which comprises a machine body, a cutting assembly and a polishing assembly, and the cutting assembly and the polishing assembly are arranged at the top of the machine body. The feeding unit comprises a conveying assembly arranged on the top of the machine body. The device has the beneficial effects that through cooperation of the forming unit and the feeding unit, pin forming and grinding integrated machining is achieved, bending forming and fixed-length cutting are completed at the same time through one-time punching by means of cooperation of a waste discharge notch formed in a female die and a male die cutter, positioning errors and efficiency losses caused by step-by-step machining are avoided, meanwhile, a first air bag is arranged on the inner wall of a grinding frame, and machining efficiency is improved. The air bag pressing block on the back face of the adsorption assembly synchronously extrudes the second air bag, the friction piece is driven to be attached to the pin in a self-adaptive mode, the polishing pressure can be automatically adjusted without a motor, the structure is simplified, energy consumption and cost are reduced, multi-face synchronous polishing can be achieved, and it is ensured that burrs are evenly removed.

The utility model relates to the technical field of automobile skylight guide rails, in particular to high-precision metal cutting equipment which is used for cutting the automobile skylight guide rails and comprises a main machine body, a clamping device is arranged in the center of the main machine body, and a cutting device capable of cutting the automobile skylight guide rails is arranged on the back of the clamping device. The clamping device comprises at least two clamping assemblies capable of synchronously getting close to or getting away from each other, the cutting device comprises a cutting assembly capable of moving up and down, the cutting assembly comprises a cutting piece and a polishing piece, and the cutting assembly further comprises a switching device for switching the positions of the cutting piece and the polishing piece. According to the automobile skylight guide rail burr removing device, the cutting piece and the polishing piece are arranged, and the positions of the cutting piece and the polishing piece are switched through the switching device, so that burrs of a notch can be removed after an automobile skylight guide rail is cut.

The application relates to the technical field of precision machining, and provides a fixed-inclination annular circular-arc grinding wheel grinding spherical surface and a compensation method, which comprises the following steps: arranging a cylindrical workpiece to be machined on a rotary table to make the cylindrical workpiece rotate around the axis of the cylindrical workpiece, arranging an annular circular-arc grinding wheel on a main shaft of a machine tool, and arranging the axis of the main shaft and the axis of the cylindrical workpiece to be at an angle; wherein the motion track of the main shaft is controlled to make the machining surface of the annular circular-arc grinding wheel contact the end surface of the cylindrical workpiece, so that the end surface of the cylindrical workpiece is ground into a spherical surface; after one grinding process is completed, the spherical workpiece machined is detected in terms of surface shape precision, the position deviation of the annular circular-arc grinding wheel is determined according to the detected surface shape error; the motion track of the main shaft is compensated and corrected according to the position deviation, and the next grinding process is carried out. In this way, the forces of all contact positions in the machining process are uniform, the workpiece material is uniformly removed, and then the machining consistency and stability are improved, and the precision and tool durability are improved.

The invention belongs to the technical field of intelligent grinding and polishing control, and particularly discloses a layered grinding and polishing process method and system for repairing the damaged surface of an aircraft radome. Comprising the following steps: determining repair boundaries and thickness changes of coatings with different functions in a damaged area of the aircraft radome; a layered grinding and polishing track is planned, and initial process parameters are set for each coating; layered grinding and polishing operation is executed, mechanical parameters, surface parameters and energy parameters are collected in real time in the grinding and polishing process, and an improved layered grinding and polishing contact force model is constructed to conduct local compensation control on grinding and polishing contact force; evaluating the surface quality, the repair integrity and the interlayer consistency of the current grinding and polishing layer in real time; and constructing a multi-target quality evaluation and process parameter collaborative optimization mechanism, and dynamically adjusting subsequent grinding and polishing process parameters according to the deviation between a real-time evaluation result and a preset quality target. According to the method, the material removal accuracy is remarkably improved, the problem of excessive grinding or non-uniform removal is avoided, and it is ensured that the quality of the repaired coating meets the standard.

This utility model discloses a wrinkle-removing device for underwear production, belonging to the field of underwear production technology. It includes a worktable, a connecting plate, a top plate, and a steam scraper. A reciprocating component is arranged between the connecting plate and the top plate, and a smoothing component is arranged above the worktable. The reciprocating component includes a motor, which is fixedly connected to the connecting plate. In this utility model, by adding a reciprocating component to the underwear wrinkle-removing device, a smooth reciprocating wrinkle-removing motion is achieved, eliminating the need for multiple repetitive operations to remove wrinkles from the underwear. This improves the overall efficiency of the production line, comprehensively and evenly removing wrinkles and preventing uneven areas from remaining on the underwear surface, thus ensuring the product's appearance quality. Furthermore, by adding a smoothing component to the underwear wrinkle-removing device, the angle of the steam scraper can be easily adjusted, ensuring even steam distribution on the underwear surface and preventing excessive or insufficient steam in certain areas, thereby guaranteeing the wrinkle-removing effect.

This invention relates to the field of precision machining technology for semiconductor materials, and in particular to a chemical mechanical polishing (CMP) slurry, its preparation method, and its application. The CMP slurry comprises the following components by mass percentage: 6-12% composite abrasive, 3-7% composite oxidant, 2-5% complexing agent, 0.5-2% phosphine detoxifier, 0.3-1.5% dispersant stabilizer, 0.1-1% pH adjuster, and water as the balance. The composite abrasive is a composite material of alumina and silicon dioxide. The composite oxidant includes sodium hypochlorite solution and hydrogen peroxide solution. This invention, through the rational proportioning and synergistic effect of the composite abrasive, composite oxidant, complexing agent, phosphine detoxifier, dispersant stabilizer, and pH adjuster, is not only suitable for single substrates but also compatible with the CMP polishing of three typical third-generation semiconductor materials: indium phosphide, gallium arsenide, and germanium. It exhibits good versatility and process adaptability, helping to reduce production costs and process changeover complexity.

The application relates to the technical field of steel pipe grinding, and discloses automatic rotary polishing equipment for high-precision stainless steel pipe surface treatment, which comprises a polisher main body and a clamping mechanism arranged on the top of the polisher main body. The clamping mechanism comprises a supporting plate arranged on the top of the polisher main body, a circular groove arranged on the top of the supporting plate, a rotating drum arranged on one side of the supporting plate close to the circular groove, one side of the rotating drum close to the supporting plate being rotationally connected with the circular groove, an annular groove arranged on one side of the rotating drum close to the circular groove, a driving ring arranged in the annular groove, a worm arranged on the rotating drum close to the driving ring, three annular arrayed special-shaped holes arranged on one side of the rotating drum away from the circular groove, a sleeve arranged on the inner wall of one side of the special-shaped hole away from the circular groove, and a driving groove arranged on the inner wall of the sleeve. The clamping mechanism can meet the clamping requirements of the inner wall and the outer wall of the stainless steel pipe, and the contact points between the clamping mechanism and the stainless steel pipe are increased to enhance the clamping stability.

The application discloses a kind of efficient ship ballast water nitrogen filling deoxidation processing equipment and method thereof, it is related to ship ballast water processing technical field, including frame, the top of the frame is fixedly installed with top ring, the bottom of the top ring is fixedly installed with inner package frame, the inner side of the inner package frame is fixedly installed with tank body.The application adopts the above structure, when the device is running, start drive motor, motor drives driving gear to rotate, driving gear engages driven gear to make it synchronous rotation, this transmission sequentially drives connecting pipe, cross pipe, annular pipe, side pipe and pipe frame to rotate, bend pipe is connected with nitrogen pipeline, nitrogen passes through pipe frame with equal-interval arrangement and with aeration nozzle, uniformly fills into tank body, a large number of small bubbles rapidly fill up everywhere in tank body, make nitrogen uniformly remove oxygen in ballast water, simultaneously, exhaust pipe is used to discharge floating gas, external pipe facilitates to add ballast water, and provides convenience for the operation of the device.

The present scheme relates to the field of precision machining technology, and specifically relates to a guide rail surface conformal polishing control method and system. The method comprises: obtaining process parameter data; based on the geometric parameters, calculating the spatial shear rate distribution generated by the concentric circular micro groove array, and calculating the micro groove area shear rate and the platform area shear rate based on the geometric parameters; wherein the concentric circular micro groove array is arranged on the working surface of the profiling polishing tool, and the concentric circular micro groove array is composed of alternating micro groove areas and platform areas; comparing the critical shear rate with the micro groove area shear rate and the platform area shear rate, and determining the current working state as stable competition state, critical saturation state or critical missing state according to the comparison result; when the current working state is not stable competition state, a control instruction is generated to adjust the critical shear rate or the spatial shear rate distribution, so that the current working state enters the stable competition state.

The invention relates to the technical field of bamboo processing, in particular to a bamboo green and tabasheer protruding joint removing method and device which comprises a bamboo green joint removing device, a tabasheer joint removing device and a bamboo tube clamping device. The bamboo green joint removing device is used for removing bamboo green protruding parts outside the bamboo tube. The tabasheer section removing device is used for removing tabasheer interval protrusions in the bamboo tube; the bamboo tube clamping device is used for clamping the bamboo tube in the milling process; the bamboo green joint removing device comprises a frame, a first-stage air pressure rod is connected to the frame through bolts, and the movable end of the first-stage air pressure rod is fixedly connected with the connecting plate and drives the connecting plate to be in sliding connection with the frame. The protrusions on the bamboo green face of the bamboo tube are milled so that the bamboo tube can become smooth, and the bamboo yellow intervals and protrusions of the bamboo tube can be milled so that the bamboo tube can become smooth; the bamboo tube primary processing device is simple in structure and convenient to operate, facilitates next-step processing of bamboo tubes, replaces traditional manual green protrusion removal and yellow protrusion removal, avoids the problem of non-uniform material removal caused by manual processing, meanwhile, greatly increases the processing speed, and improves the primary processing efficiency of the bamboo tubes.

The invention discloses a wafer and a processing method thereof. The wafer processing method comprises the following steps: placing a wafer at a first environment temperature T1, and carrying out surface modification on the wafer to obtain a surface-modified wafer; spin-coating photoresist on the wafer subjected to surface modification to obtain a wafer coated with the photoresist; placing the wafer coated with the photoresist at a second environment temperature T2 to cure the photoresist to obtain a wafer with cured photoresist; and cleaning the wafer on which the photoresist is cured by adopting an edge cleaning solution so as to remove at least part of the photoresist. According to the method, the wafer coated with the photoresist is placed at the second environment temperature T2 to cure the photoresist, so that the viscosity and the adhesive force of the photoresist can be reduced, the problem of irregular edge washing caused by too high viscosity of the liquid photoresist is avoided, the photoresist at the edge of the wafer is uniformly removed, no residual photoresist is left, and the subsequent production efficiency and the final chip yield are improved.

This invention provides a turbine blade tipping fixture and tipping method. The tipping fixture includes a support unit, a clamping unit, a locking unit, and an angle adjustment unit. The support unit includes a column, and the clamping unit includes a carrier and a blade clamping member that accommodates and clamps the turbine blade. A pressure plate is detachably connected to the carrier. The pressure plate and set screw of the locking unit limit and press the blade clamping member into the U-shaped portion of the carrier. The angle adjustment unit includes a rotating shaft and a knob. The rotating shaft passes through the column, and the knob is connected to one end of the rotating shaft on one side of the column. The carrier is connected to the other end of the rotating shaft on the other side of the column. The rotating shaft drives the carrier and the blade clamping member to rotate. Using this tipping fixture and method, the turbine blade is fixed and the grinding wheel position is moved back and forth during tipping repair, improving the tipping field of vision. During the tipping process, the condition of the blade tip thin blade area can be accurately judged, and the relative position of the blade and the grinding wheel can be adjusted at any time to remove material evenly, thus improving the repair quality and efficiency.

The invention relates to the technical field of fusion firing processes, in particular to a multi-color purple sand pottery printing layering-free fusion firing process based on a special mineral material, which comprises the following steps: a raw material pretreatment step: crushing colorful purple sand raw ore, removing impurities, and screening to 200 meshes to obtain colorful purple sand raw ore pug; the special mineral material is finely ground and screened to 500 meshes, and the superfine special mineral material is obtained; and a precise mixing step. According to the invention, special mineral materials and colorful purple sand raw ore pug are scientifically proportioned, so that the shrinkage ratio difference of purple sand pug with different colors in the firing process is adjusted, the internal stress concentration of a green body is reduced, the phenomena of layering and cracking in the firing process are reduced, and the yield is increased; through the control steps of stepped drying, segmented heating firing, gradient cooling and the like, uniform removal of moisture in the green body and effective release of stress are ensured, and the texture stability and color uniformity of the multicolor purple sand ceramic seal are improved.

The invention relates to the technical field of semiconductors, and discloses a semiconductor structure and a preparation method thereof, and the method comprises the steps: providing a substrate with a gate structure layer, and the gate structure layer comprises a plurality of gates which are arranged at intervals; forming a sacrificial layer between the gates on one side, deviating from the substrate, of the gate structure layer; forming a first oxide layer covering the sacrificial layer and the gate structure layer on one side, away from the substrate, of the sacrificial layer; etching the first oxide layer to expose the upper surface of the sacrificial layer; and removing the sacrificial layer and the first oxide layer and the gate structure layer located in the self-aligned source-drain contact region to form a self-aligned metal layer. According to the technical scheme, through preparation and removal of the sacrificial layer, the depth-to-width ratio of dry etching is reduced, the reaction space of wet etching is improved, the oxide layer between the grids can be fully etched, it is ensured that the oxide layer on the surface of the substrate can be completely removed, the quality of the self-aligned metal layer is improved, and the yield of the self-aligned metal layer is improved. And the contact resistance of the self-aligned metal layer is reduced.